Industrial data automatic access dimension reduction decoupling converter convenient for heat dissipation

Abstract

The utility model relates to the technical field of data processing equipment, in particular to an industrial data automatic access dimension reduction decoupling converter convenient for heat dissipation, which comprises a bottom shell, the bottom shell comprises a bottom plate, the center of the top surface of the bottom plate is used for installing a main board, the upper part of the main board is wrapped by a shell, and a heat conduction assembly is arranged between the inside of the shell and the main board. According to the utility model, the heat of the mainboard is transferred to the second heat-conducting fin through the heat-conducting pipe, the third heat-conducting fin is cooled through the air flow generated by the operation of the third fan, hot air is blown among the heat-dissipating fins, and the heat is transferred to the shell body through the heat-dissipating fins, so that the heat transfer efficiency is improved; the third fan works to increase internal air flow and improve the heat transfer efficiency of the air; the first fan works to suck cold air, the air is blown into the first heat dissipation groove through the flow guide cover, heat dissipation of the bottom plate is improved, and the heat dissipation efficiency of the bottom of the device is improved.

Description

Technical Field

[0001] This utility model relates to the field of data processing equipment technology, specifically to a dimension reduction and decoupling converter for automatic access to industrial data that facilitates heat dissipation. Background Technology

[0002] A dimensionality reduction and decoupling converter is a device that extracts the most important features from complex heterogeneous data and processes the different variables and features of the data separately, thereby transforming complex data into simpler information that can then be input into a computer for rapid processing. It is commonly used in image processing, natural language processing, and feature extraction, and is also used in sensor data processing.

[0003] Data decoupling requires a lot of computation and generates a lot of heat, so timely heat dissipation is necessary to prevent overheating from slowing down the decoupling speed and affecting efficiency.

[0004] In existing technologies, metal is typically used as the casing of decoupling converters to improve heat dissipation efficiency. However, since the internal chips are not in close contact with the casing and heat is conducted through air, and air has a lower thermal conductivity than metal, this limits the power output of the converter in practical applications. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a dimension reduction and decoupling converter for automatic industrial data access that facilitates heat dissipation.

[0006] The technical solution of this utility model is:

[0007] A dimension reduction and decoupling converter for automatic industrial data access that facilitates heat dissipation, comprising:

[0008] The bottom shell includes a base plate, the center of the top surface of the base plate is used to mount the motherboard, the motherboard is wrapped by an outer shell, and a heat-conducting component is provided between the inside of the outer shell and the motherboard.

[0009] Preferably, the bottom plate has a front panel and a tail plate at both ends of the top front and rear sides. The front of the front panel has several interfaces, which pass through the panel and connect to the main board.

[0010] Preferably, the bottom surface of the base plate is provided with a plurality of first heat dissipation grooves, which extend laterally through the bottom surface of the base plate.

[0011] Preferably, the tail plate has a plurality of first fans on its back side, and the air outlet of the first fan is connected to the end of the first heat dissipation slot through a guide shroud.

[0012] Preferably, the outer casing includes a shell body, and a plurality of heat dissipation fins are evenly arranged laterally on the inner and outer sides of the shell body, and a plurality of internal mounting slots are provided on the right side of the inner side of the shell body.

[0013] Preferably, the heat-conducting component includes a third fan, which is installed in the inner mounting slot, with the air outlet of the third fan facing upward and perpendicular to the inner heat dissipation fins.

[0014] Preferably, the air inlet of the third fan is connected to a heat pipe via a second heat-conducting plate, and the tail end of the heat pipe is connected to the motherboard via a first heat-conducting plate.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] This invention utilizes heat pipes to transfer heat from the motherboard to the second heat-conducting plate. A third fan generates airflow to cool the third heat-conducting plate and blows hot air between the heat dissipation fins, which then transfer heat to the casing, improving heat transfer efficiency. The third fan also increases internal airflow, further enhancing air heat transfer efficiency. The first fan draws in cool air, which is then blown into the first heat dissipation slot by a shroud, increasing heat dissipation from the base plate and improving the overall heat dissipation efficiency at the bottom of the device. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the bottom shell structure of this utility model;

[0019] Figure 3 This is a second schematic diagram of the bottom shell structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the outer shell structure in this utility model;

[0021] Figure 5 This is a schematic diagram of the internal heat-conducting component structure in this utility model.

[0022] The meanings of the labels in the diagram are as follows:

[0023] 1. Bottom shell; 11. Base plate; 12. First heat sink; 13. Front panel; 14. Rear panel; 15. First fan; 16. shroud; 17. Motherboard; 18. Interface;

[0024] 2. Outer casing; 21. Shell body; 22. Heat dissipation fins; 23. Internal mounting slot; 24. External mounting slot; 25. Airflow guide plate; 26. Second fan;

[0025] 3. Heat-conducting components; 31. Heat-conducting pipe; 32. First heat-conducting plate; 33. Second heat-conducting plate; 34. Third fan. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Example 1:

[0028] Please see Figure 1-5 The present invention will describe the above technical solution in detail through the following embodiments:

[0029] A dimension reduction and decoupling converter for automatic industrial data access that facilitates heat dissipation, comprising:

[0030] The bottom shell 1 includes a bottom plate 11. The top center of the bottom plate 11 is used to install the motherboard 17. The motherboard 17 is covered by the outer shell 2. A heat-conducting component 3 is provided between the inside of the outer shell 2 and the motherboard 17.

[0031] The base plate 11 is made of aluminum alloy and is molded in one piece. The motherboard 17 is used for data processing.

[0032] The front and rear ends of the top of the base plate 11 are fixedly installed with a panel 13 and a tail plate 14 by screws. Several interfaces 18 are snapped on the front of the panel 13. The interfaces 18 pass through the panel 13 and are connected to the main board 17 by wires.

[0033] Interface 18 is used to connect data input devices. Front panel 13 and tail panel 14 are used to cooperate with housing 2 to protect main board 17.

[0034] The bottom surface of the base plate 11 is evenly provided with a plurality of first heat dissipation grooves 12, which transversely penetrate the bottom surface of the base plate 11.

[0035] The first heat dissipation slot 12 can increase the contact area between the base plate 11 and the air, thereby improving the heat dissipation efficiency of the base plate 11.

[0036] Two first fans 15 are symmetrically fixed on the back of the tail plate 14 by screws. The air outlet of the first fan 15 is connected to the end of the first heat sink 12 through the air guide shroud 16.

[0037] The first fan 15 is a miniature turbine fan powered by 5V. The air outlet of the first fan 15 faces downward. When the first fan 15 is working, it can draw in external air and then discharge it from the exhaust port. The discharged air enters the first heat dissipation slot 12 through the guide shroud 16, thereby increasing the air flow speed in the first heat dissipation slot 12 and thus improving the heat dissipation efficiency of the base plate 11.

[0038] The outer shell 2 includes a shell body 21. Several heat dissipation fins 22 are evenly arranged on the inner and outer sides of the shell body 21. Three internal mounting slots 23 are provided on the right side of the inner shell body 21.

[0039] The bottom of the shell 21 is fixedly connected to the base plate 11 by screws.

[0040] The housing 21 and heat dissipation fins 22 are made of aluminum alloy in one piece. The heat dissipation fins 22 inside the housing 21 can be plated with copper to increase thermal conductivity.

[0041] The heat conduction component 3 includes a third fan 34, which is installed in the inner mounting slot 23. The air outlet of the third fan 34 faces upward and is perpendicular to the heat dissipation fins 22 on the inner side.

[0042] The third fan 34 can be a miniature turbine fan powered by 5V. When the third fan 34 is working, it can draw in internal air and blow it into the space between the internal heat dissipation fins 22, thereby increasing the internal airflow and the airflow speed within the heat dissipation fins 22, and thus improving the heat transfer efficiency between the internal air and the casing 21.

[0043] The air inlet of the third fan 34 is connected to a heat pipe 31 via a second heat-conducting plate 33, and the tail of the heat pipe 31 is connected to the motherboard 17 via a first heat-conducting plate 32.

[0044] The heat pipe 31 is a known flat copper heat pipe that absorbs heat by evaporating the internal heat-conducting agent. The first heat-conducting plate 32 and the second heat-conducting plate 33 are made of copper sheets. The first heat-conducting plate 32 is welded to the heat pipe 31 and is used to transfer heat from the main board 17 to the heat pipe 31. The second heat-conducting plate 33 is perpendicular to the heat pipe 31 and welded to it and is used to absorb the heat transferred by the heat pipe 31.

[0045] The outer left bottom of the housing 21 has three external mounting slots 24. The second fan 26 is fixedly installed in the external mounting slots 24 by screws. The air outlet of the second fan 26 faces upward and is perpendicular to the heat dissipation fins 22.

[0046] The top left and right sides of the external heat dissipation fins 22 are welded with air guide plates 25. The air guide plates 25 are arc-shaped and have a gap between them and the shell 21.

[0047] The air deflector 25 is used to change the direction of airflow inside the external heat dissipation fins 22.

[0048] The second fan 26 can be a miniature turbine fan powered by 5V. When the second fan 26 is working, it can draw in external air and blow it into the space between the external heat dissipation fins 22, thereby increasing the airflow speed in the external heat dissipation fins 22 and thus improving the heat transfer efficiency between the shell 21 and the external air.

[0049] In this embodiment, when the operator uses this device, the data input device is connected to the interface 18, and the data is input from the interface 18 and processed by the motherboard 17.

[0050] Part of the heat generated by the motherboard 17 is transferred to the heat pipe 31 by the first heat-conducting plate 32, and then transferred to the second heat-conducting plate 33 by the heat pipe 31.

[0051] The third fan 34 is controlled to operate, using airflow to cool the second heat-conducting fin 33. The heated air is exhausted from the exhaust port of the third fan 34 and blown into the space between the internal heat dissipation fins 22, transferring heat to the heat dissipation fins 22 and the shell 21. At the same time, the airflow speed inside the heat dissipation fins 22 and the shell 21 is increased, thereby improving the heat transfer efficiency between the internal air and the shell 21.

[0052] The shell 21 transfers heat to the external heat dissipation fins 22, and finally to the outside air, thus achieving heat dissipation.

[0053] The second fan 26 is controlled to operate, drawing in external air and then blowing it between the external heat dissipation fins 22, thereby increasing the airflow speed within the external heat dissipation fins 22 and thus improving the heat transfer efficiency between the casing 21 and the external air.

[0054] The base plate 11 can also absorb some of the heat generated by the motherboard 17, and then exchange heat with the air through the first heat sink 12 to achieve heat dissipation.

[0055] The first fan 15 is controlled to operate, drawing in external air and then expelling it from the exhaust port. The expelled air passes through the guide shroud 16 and enters the first heat dissipation slot 12, thereby increasing the airflow speed in the first heat dissipation slot 12 and thus improving the heat dissipation efficiency of the base plate 11.

[0056] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A dimension-reducing and decoupling converter for automatic industrial data access that facilitates heat dissipation, characterized in that, include: The bottom shell (1) includes a bottom plate (11), the top surface of which is used to install a motherboard (17). The motherboard (17) is covered by a shell (2), and a heat-conducting component (3) is provided between the inside of the shell (2) and the motherboard (17).

2. The dimension reduction and decoupling converter for automatic industrial data access that facilitates heat dissipation, as described in claim 1, is characterized in that: The bottom plate (11) has a front panel (13) and a tail plate (14) at the front and rear ends of the top. The front of the panel (13) has several interfaces (18), which pass through the panel (13) and connect to the main board (17).

3. The dimension reduction and decoupling converter for automatic industrial data access that facilitates heat dissipation, as described in claim 2, is characterized in that: The bottom surface of the base plate (11) is uniformly provided with a plurality of first heat dissipation grooves (12), and the first heat dissipation grooves (12) penetrate the bottom surface of the base plate (11) laterally.

4. The dimension reduction and decoupling converter for automatic industrial data access that facilitates heat dissipation, as described in claim 3, is characterized in that: The tail plate (14) has several first fans (15) on its back side. The air outlet of the first fan (15) is connected to the end of the first heat dissipation groove (12) through the air guide shroud (16).

5. The dimension reduction and decoupling converter for automatic industrial data access that facilitates heat dissipation, as described in claim 1, is characterized in that: The outer shell (2) includes a shell body (21), and a plurality of heat dissipation fins (22) are evenly arranged on the inner and outer sides of the shell body (21). A plurality of internal mounting slots (23) are provided on the right side of the inner side of the shell body (21).

6. The dimension reduction and decoupling converter for automatic industrial data access that facilitates heat dissipation, as described in claim 5, is characterized in that: The heat-conducting component (3) includes a third fan (34), which is installed in the inner mounting slot (23). The air outlet of the third fan (34) faces upward and is perpendicular to the heat dissipation fins (22) on the inner side.

7. The dimension reduction and decoupling converter for automatic industrial data access that facilitates heat dissipation, as described in claim 4, is characterized in that: The air inlet of the third fan (34) is connected to a heat pipe (31) via a second heat-conducting plate (33), and the tail of the heat pipe (31) is connected to the motherboard (17) via a first heat-conducting plate (32).

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