Tank body for semiconductor cleaning equipment
By introducing multiple sets of liquid inlet pipes and power mechanisms into the semiconductor cleaning equipment to drive the mesh basket to rotate, and combined with the design of stirring blades, the problem of uneven flow of cleaning fluid was solved, achieving a comprehensive cleaning effect for wafers.
Patent Information
- Application Number
- CN202422883840.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-11-26
AI Technical Summary
In existing semiconductor cleaning equipment, the cleaning fluid flow pattern results in poor cleaning performance on the side of the wafer furthest from the inlet pipe, failing to meet high-standard cleaning requirements.
Multiple sets of liquid inlet pipes and power mechanisms were designed. The drive mechanism drives the basket to rotate. Combined with the structural design of the stirring blades, the cleaning liquid is uniformly impacted and stirred, thus improving the cleaning effect.
This achieves uniform impact of the cleaning solution on all parts of the wafer, significantly improving the cleaning effect and ensuring comprehensive cleaning.
Smart Images
Figure CN223505757U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor cleaning, more particularly, the utility model relates to a groove for semiconductor cleaning equipment. BACKGROUND
[0002] Semiconductor refers to the material of the conductivity between conductor and insulator at normal temperature, in the semiconductor manufacturing field, cleaning process as the key step of ensuring wafer surface high cleanliness, to the performance and yield of final chip has decisive effect, and the core component of semiconductor cleaning equipment is groove, it is the container of bearing semiconductor cleaning.
[0003] The existing groove is composed of a cleaning tank, a net basket, a valve port, a liquid inlet pipe and a circulating pump, the valve port and the liquid inlet port are arranged on the outer side of the cleaning tank, and the two ends of the circulating pump are connected with the valve port and the liquid inlet pipe respectively, and the working process is as follows: firstly, a certain amount of cleaning liquid is added into the cleaning tank, then the wafer to be cleaned is placed in the net basket, the net basket is controlled to move up and down by the mechanical hand, when the net basket is in the cleaning tank and immersed in the cleaning liquid, the cleaning liquid cleans the wafer, and the circulating pump draws the cleaning liquid in the cleaning tank through the valve port and inputs the cleaning liquid through the liquid inlet pipe, so that the circulation function is realized, the liquid in the cleaning tank flows, and the liquid impacts the wafer, so that the cleaning effect is better.
[0004] However, the existing cleaning tank has a significant problem in design: because the position of the liquid inlet pipe is fixed, the cleaning liquid presents a regular mode when flowing, and the flowing mode causes an adverse consequence, that is, the impact force of the cleaning liquid on the side of the wafer far from the liquid inlet pipe is small, and the wafer cannot be effectively impacted at all, therefore, the cleaning effect of the area is relatively poor, and the high-standard cleaning requirement cannot be met. CONTENT
[0005] In order to overcome the above-mentioned defects of the prior art, the utility model provides a groove for semiconductor cleaning equipment.
[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical scheme: a groove for semiconductor cleaning equipment, including a cleaning tank, a valve port is installed on the outer side of the cleaning tank, three groups of liquid inlet pipes are installed on the side, away from the valve port, of the cleaning tank, a collecting pipe is arranged on the outer side of the cleaning tank, the collecting pipe is fixedly connected with the three groups of liquid inlet pipes, a net basket is arranged in the cleaning tank, and the groove further comprises:
[0007] A connecting rod is fixedly connected to the top end of the net basket, a first spur gear is fixedly connected to the outer side of the connecting rod, a driving mechanism is arranged on the periphery of the first spur gear, and the driving mechanism is used for rotating the connecting rod.
[0008] A transmission rod is arranged outside the collecting pipe, and a power mechanism is arranged on the periphery of the transmission rod and cooperates with the driving mechanism.
[0009] Further, the power mechanism comprises a transmission groove, an isolation box and an impeller, the transmission groove is arranged outside the collecting pipe, the isolation box is fixedly connected to the outside of the collecting pipe and corresponds to the transmission groove, the impeller is arranged inside the isolation box and the collecting pipe, the transmission rod penetrates one side of the isolation box and is rotatably connected to the inner wall of the isolation box, and the impeller is fixedly connected to the outside of the transmission rod.
[0010] Further, the driving mechanism comprises a first sprocket, a second sprocket, a rotating rod, a fixed plate, a chain and a second spur gear, the first sprocket is fixedly connected to the outside of the transmission rod, the inside of the second sprocket is fixedly connected to the rotating rod, the fixed plate is fixedly connected to the top end of the cleaning box, the bottom end of the rotating rod is rotatably connected to the fixed plate, the chain is engaged outside the first sprocket and the second sprocket, and the second spur gear is fixedly connected to the outside of the rotating rod and engaged with the first spur gear.
[0011] Further, the bottom end of the mesh basket is provided with stirring blades, and the bottom end of the mesh basket is provided with a stirring mechanism matched with the stirring blades.
[0012] Further, the stirring mechanism comprises an outer toothed rod and an inner groove rod, the outer toothed rod is fixedly connected to the bottom end of the mesh basket, the inner groove rod is fixedly connected to the inside of the stirring blades, and the inside of the inner groove rod is engaged with the outside of the outer toothed rod.
[0013] Further, the outside of the transmission rod is sleeved with a limiting ring, the outside of the limiting ring is fixedly connected with a limiting rod, and the end of the limiting rod away from the limiting ring is fixedly connected to the outside of the cleaning box.
[0014] The technical effects and advantages of the groove body for the semiconductor cleaning equipment are as follows:
[0015] (1) Through the structural design of the power mechanism, the driving mechanism, the connecting rod and the first spur gear, when the cleaning liquid circulates and flows, the power mechanism is driven to operate, the driving mechanism is driven to operate through the transmission rod when the power mechanism operates, and the mesh plate is driven to rotate through the first spur gear and the connecting rod when the driving mechanism operates, so that the multi-dimensional rotation of the wafer is realized, the cleaning effect is significantly improved, the impact force of the cleaning liquid is uniformly applied to each part of the wafer, and comprehensive cleaning is realized.
[0016] (2) Through the structural design of the stirring blades and the stirring mechanism, the stirring blades are driven to rotate through the stirring mechanism when the mesh basket rotates, and the stirring blades impact the cleaning liquid in the cleaning box when the stirring blades rotate, so that the stirring function is realized. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is the first overall structure schematic view of the utility model.
[0018] Figure 2 It is the second overall structure schematic view of the utility model.
[0019] Figure 3 It is the driving mechanism structure schematic view in the utility model.
[0020] Figure 4 It is the isolation box section view schematic view in the utility model.
[0021] Figure 5 It is the cleaning tank and inner groove rod section view schematic view in the utility model.
[0022] In the drawing:
[0023] 1, cleaning tank;2, valve port;3, liquid inlet pipe;4, collecting pipe;5, basket;7, connecting rod;8, first spur gear;9, transmission rod;10, transmission groove;11, isolation box;12, impeller;13, first sprocket;14, second sprocket;15, rotating rod;16, fixed plate;17, chain;18, second spur gear;19, stirring blade;20, outer tooth rod;21, inner groove rod;22, limit ring;23, limit rod. DETAILED DESCRIPTION
[0024] The technical scheme in the embodiments of the utility model will be described clearly and completely below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.
[0025] Please refer to Figure 1 - Figure 4 As shown in the figure, a kind of groove for semiconductor cleaning equipment, including cleaning tank 1, the outer side of the cleaning tank 1 is equipped with valve port 2, the side of the cleaning tank 1 away from valve port 2 is equipped with three groups of liquid inlet pipe 3, the outer side of the cleaning tank 1 is provided with collecting pipe 4, the collecting pipe 4 is all fixedly connected with three groups of liquid inlet pipe 3, the inside of the cleaning tank 1 is provided with basket 5, further including:
[0026] Connecting rod 7, connecting rod 7 is fixedly connected at the top of basket 5, the outer side of connecting rod 7 is fixedly connected with first spur gear 8, the periphery of first spur gear 8 is provided with driving mechanism, and the driving mechanism is used to rotate connecting rod 7;
[0027] Transmission rod 9, transmission rod 9 is arranged at the outer side of collecting pipe 4, the periphery of transmission rod 9 is provided with power mechanism matched with driving mechanism.
[0028] First, a measured amount of cleaning solution is added to the cleaning tank 1. Then, the wafer to be cleaned is placed inside the mesh basket 5. An external robotic arm controls the mesh basket 5 to move up and down (the robotic arm in this invention is existing technology and mature, but is not shown in this invention and will not be described in detail). When the robotic arm moves the mesh basket 5 inside the cleaning tank 1 and it is immersed in the cleaning solution, the cleaning solution cleans the wafer. At this time, an external circulation pump draws out the cleaning solution from inside the cleaning tank through valve port 2 (the circulation pump in this invention is existing technology and mature, but is not shown in this invention and will not be described in detail), and distributes it through the manifold 4 to the three sets of inlet pipes 3, and then inputs it into the cleaning tank 1 through the three sets of inlet pipes 3, thereby achieving circulation. The function ensures the internal liquid flow of the cleaning tank, allowing the liquid to impact the wafers for better cleaning results. The internal flow of cleaning fluid in the collection pipe 4 drives the power mechanism, which in turn rotates the transmission rod 9. The rotation of the transmission rod 9 then drives the drive mechanism, which in turn drives the first spur gear 8. The rotation of the first spur gear 8 ultimately drives the mesh basket 5 to rotate via the connecting rod 7. At this time, the wafers inside the mesh basket 5 rotate continuously, aligning different positions with the liquid inlet pipe 3, allowing the impact force of the cleaning fluid to reach different parts of the wafers, improving the cleaning effect. Furthermore, the rotation of the mesh basket 5 in the cleaning fluid also causes the wafers inside to rotate and impact the cleaning fluid, thus achieving a dual cleaning function.
[0029] like Figure 3 and Figure 4 As shown, the power mechanism includes a transmission groove 10, an isolation box 11, and an impeller 12. The transmission groove 10 is opened on the outside of the collecting pipe 4. The isolation box 11 is fixed to the outside of the collecting pipe 4 and corresponds to the transmission groove 10. The impeller 12 is disposed inside the isolation box 11 and the collecting pipe 4. The transmission rod 9 passes through one side of the isolation box 11 and is rotatably connected to the inner wall of the isolation box 11. The impeller 12 is fixed to the outside of the transmission rod 9.
[0030] Under the action of the external circulating pump, the cleaning fluid flows inside the collecting pipe 4. During the flow, the cleaning fluid will continuously impact the impeller 12. The impeller 12 will rotate due to the force, and the rotation of the impeller 12 will drive the transmission rod 9 to rotate, thereby providing a power source for the drive mechanism. The isolation box 11 can prevent the cleaning fluid flowing inside the collecting pipe 4 from flowing out directly through the transmission groove 10.
[0031] like Figure 2 and Figure 3As shown, the drive mechanism includes a first sprocket 13, a second sprocket 14, a rotating rod 15, a fixed plate 16, a chain 17, and a second spur gear 18. The first sprocket 13 is fixed to the outside of the transmission rod 9, the inside of the second sprocket 14 is fixed to the rotating rod 15, the fixed plate 16 is fixed to the top of the cleaning tank 1, the bottom end of the rotating rod 15 is rotatably connected to the fixed plate 16, the chain 17 meshes with the outside of the first sprocket 13 and the second sprocket 14, and the second spur gear 18 is fixed to the outside of the rotating rod 15 and meshes with the first spur gear 18.
[0032] When the transmission rod 9 rotates, it drives the first sprocket 13 to rotate. The rotation of the first sprocket 13 drives the second sprocket 14 to rotate via the chain 17. The rotation of the second sprocket 14 then drives the second spur gear 18 to rotate via the rotating rod 15. Since the second spur gear 18 is in a meshing state with the first spur gear 8, the rotation of the second spur gear 18 drives the connecting rod 7 to rotate via the first spur gear 8. Finally, when the connecting rod 7 rotates, it can drive the wafer inside the basket 5 to rotate. It should be noted that when the external robotic arm controls the connecting rod 7 to move up and down, the first spur gear 8 and the second spur gear 18 are always in a meshing state.
[0033] like Figure 5 As shown, the bottom end of the basket 5 is provided with a stirring blade 19, and the bottom end of the basket 5 has a stirring mechanism that cooperates with the stirring blade 19.
[0034] In order to improve the stirring efficiency of the cleaning liquid inside the cleaning tank 1, in this embodiment of the invention, the mesh basket 5 rotates during the rotation process, which drives the stirring blade 19 to rotate through the stirring mechanism. When the stirring blade 19 rotates, it will hit the cleaning liquid inside the cleaning tank 1, thereby playing a stirring role.
[0035] like Figure 5 As shown, the stirring mechanism includes an outer toothed rod 20 and an inner grooved rod 21. The outer toothed rod 20 is fixedly connected to the bottom end of the basket 5, and the inner grooved rod 21 is fixedly connected to the inside of the stirring blade 19, and the inner side of the inner grooved rod 21 meshes with the outer side of the outer toothed rod 20.
[0036] When the basket 5 rotates, it will drive the outer toothed rod 20 fixed at its bottom to rotate synchronously. Since the outer toothed rod 20 and the inner groove rod 21 are in a meshing state, when the outer toothed rod 20 rotates, it will drive the inner groove rod 21 to rotate. The rotation of the inner groove rod 21 will drive the stirring blade 19 to rotate, thereby stirring the inside of the cleaning tank 1. It should be noted that when the basket 5 moves upward, it will also drive the inner groove rod 21 to move upward synchronously. However, the upward movement of the inner groove rod 21 will not affect the meshing with the outer toothed rod 20, and when the inner groove rod 21 moves to the top, it will not disengage from the meshing with the outer toothed rod 20.
[0037] like Figure 2 and Figure 3 As shown, a limiting ring 22 is sleeved on the outer side of the transmission rod 9, and a limiting rod 23 is fixedly connected to the outer side of the limiting ring 22. The end of the limiting rod 23 away from the limiting ring 22 is fixedly connected to the outer side of the cleaning tank 1.
[0038] Because the transmission rod 9 is quite long, it is prone to wobbling due to its connection with the isolation box 11. In this embodiment, a limiting ring 22 is fitted onto the upper part of the center of the transmission rod 9, and the limiting ring 22 is fixed by the limiting rod 23 to ensure its stability. At this time, when the transmission rod 9 rotates, it is not only supported by the isolation box 11, but also limited by the limiting ring 22, ensuring the stability of the transmission rod 9 during rotation.
[0039] Working principle: First, a measured amount of cleaning solution is added to the cleaning tank 1. Then, the wafer to be cleaned is placed inside the mesh basket 5. An external robotic arm controls the mesh basket 5 to move up and down (the robotic arm in this invention is existing technology and mature, and is not shown in this invention, so it will not be described in detail). When the robotic arm moves the mesh basket 5 inside the cleaning tank 1 and immerses it in the cleaning solution, the cleaning solution cleans the wafer. At this time, an external circulation pump draws out the cleaning solution from inside the cleaning tank through valve port 2 (the circulation pump in this invention is existing technology and mature, and is not shown in this invention, so it will not be described in detail), and distributes it through the manifold 4 to the three sets of inlet pipes 3, and then inputs it into the cleaning tank 1 through the three sets of inlet pipes 3, thereby achieving circulation. The ring function ensures the internal liquid flow of the cleaning tank, allowing the liquid to impact the wafers for better cleaning results. When the cleaning fluid flows inside the collecting pipe 4, it drives the power mechanism, which in turn drives the transmission rod 9 to rotate. The rotation of the transmission rod 9 in turn drives the drive mechanism, which in turn drives the first spur gear 8 to rotate continuously. The rotation of the first spur gear 8 eventually drives the mesh basket 5 to rotate through the connecting rod 7. At this time, the wafers inside the mesh basket 5 will rotate continuously, aligning different positions with the liquid inlet pipe 3, so that the impact force of the cleaning fluid can hit different positions of the wafers, improving the cleaning effect. Furthermore, when the mesh basket 5 rotates in the cleaning fluid, it can also drive the wafers inside to rotate and impact the cleaning fluid, thus achieving a dual cleaning function.
[0040] Under the action of the external circulating pump, the cleaning fluid will flow inside the collecting pipe 4. During the flow, the cleaning fluid will continuously hit the impeller 12. The impeller 12 will rotate under the force. The rotation of the impeller 12 will drive the transmission rod 9 to rotate, thereby providing a power source for the drive mechanism. The isolation box 11 can prevent the cleaning fluid flowing inside the collecting pipe 4 from flowing out directly through the transmission groove 10.
[0041] When the transmission rod 9 rotates, it drives the first sprocket 13 to rotate. The rotation of the first sprocket 13 drives the second sprocket 14 to rotate through the chain 17. The rotation of the second sprocket 14 then drives the second spur gear 18 to rotate through the rotating rod 15. Since the second spur gear 18 is in a meshing state with the first spur gear 8, the rotation of the second spur gear 18 drives the connecting rod 7 to rotate through the first spur gear 8. Finally, when the connecting rod 7 rotates, it can drive the wafer inside the basket 5 to rotate. It should be noted that when the external robotic arm controls the connecting rod 7 to move up and down, the first spur gear 8 and the second spur gear 18 are always in a meshing state.
[0042] In order to improve the stirring efficiency of the cleaning liquid inside the cleaning tank 1, in this embodiment of the invention, the mesh basket 5 rotates during the rotation process, and the stirring blade 19 rotates through the stirring mechanism. When the stirring blade 19 rotates, it will hit the cleaning liquid inside the cleaning tank 1, thereby playing a stirring function.
[0043] When the basket 5 rotates, it will drive the outer toothed rod 20 fixed at its bottom to rotate synchronously. Since the outer toothed rod 20 and the inner groove rod 21 are in a meshing state, when the outer toothed rod 20 rotates, it will drive the inner groove rod 21 to rotate. The rotation of the inner groove rod 21 will drive the stirring blade 19 to rotate, thereby stirring the inside of the cleaning tank 1. It should be noted that when the basket 5 moves upward, it will also drive the inner groove rod 21 to move upward synchronously. However, the upward movement of the inner groove rod 21 will not affect the meshing with the outer toothed rod 20, and when the inner groove rod 21 moves to the top, it will not disengage from the meshing with the outer toothed rod 20.
[0044] Because the transmission rod 9 is quite long, it is prone to wobbling due to its connection with the isolation box 11. In this embodiment, a limiting ring 22 is fitted onto the upper part of the center of the transmission rod 9, and the limiting ring 22 is fixed by the limiting rod 23 to ensure its stability. At this time, when the transmission rod 9 rotates, it is not only supported by the isolation box 11, but also limited by the limiting ring 22, ensuring the stability of the transmission rod 9 during rotation.
[0045] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A tank for a semiconductor cleaning device, comprising a cleaning chamber (1), wherein a valve port (2) is installed on the outside of the cleaning chamber (1), three sets of liquid inlet pipes (3) are installed on the side of the cleaning chamber (1) away from the valve port (2), a collecting pipe (4) is provided on the outside of the cleaning chamber (1), the collecting pipe (4) is fixedly connected to the three sets of liquid inlet pipes (3), and a mesh basket (5) is provided inside the cleaning chamber (1), characterized in that, Also includes: A connecting rod (7) is fixed to the top of the basket (5). A first spur gear (8) is fixed to the outside of the connecting rod (7). A driving mechanism is provided around the first spur gear (8). The driving mechanism is used to rotate the connecting rod (7). The transmission rod (9) is located on the outside of the manifold (4), and a power mechanism that cooperates with the drive mechanism is provided around the transmission rod (9).
2. The tank for semiconductor cleaning equipment according to claim 1, characterized in that, The power mechanism includes a transmission groove (10), an isolation box (11), and an impeller (12). The transmission groove (10) is located on the outside of the collecting pipe (4). The isolation box (11) is fixed to the outside of the collecting pipe (4) and corresponds to the transmission groove (10). The impeller (12) is located inside the isolation box (11) and the collecting pipe (4). The transmission rod (9) passes through one side of the isolation box (11) and is rotatably connected to the inner wall of the isolation box (11). The impeller (12) is fixed to the outside of the transmission rod (9).
3. The tank for semiconductor cleaning equipment according to claim 2, characterized in that, The drive mechanism includes a first sprocket (13), a second sprocket (14), a rotating rod (15), a fixed plate (16), a chain (17), and a second spur gear (18). The first sprocket (13) is fixed to the outside of the transmission rod (9). The inside of the second sprocket (14) is fixed to the rotating rod (15). The fixed plate (16) is fixed to the top of the cleaning tank (1). The bottom end of the rotating rod (15) is rotatably connected to the fixed plate (16). The chain (17) meshes with the outside of the first sprocket (13) and the second sprocket (14). The second spur gear (18) is fixed to the outside of the rotating rod (15) and meshes with the first spur gear (8).
4. The tank for semiconductor cleaning equipment according to claim 3, characterized in that, The bottom end of the basket (5) is provided with a stirring blade (19), and the bottom end of the basket (5) has a stirring mechanism that cooperates with the stirring blade (19).
5. The tank for semiconductor cleaning equipment according to claim 4, characterized in that, The stirring mechanism includes an outer toothed rod (20) and an inner grooved rod (21). The outer toothed rod (20) is fixed to the bottom end of the basket (5), and the inner grooved rod (21) is fixed to the inside of the stirring blade (19). The inner side of the inner grooved rod (21) meshes with the outer side of the outer toothed rod (20).
6. The tank for semiconductor cleaning equipment according to claim 5, characterized in that, A limiting ring (22) is sleeved on the outside of the transmission rod (9), and a limiting rod (23) is fixedly connected to the outside of the limiting ring (22). The end of the limiting rod (23) away from the limiting ring (22) is fixedly connected to the outside of the cleaning box (1).