Wafer carrier cleaning equipment

Abstract

The utility model discloses wafer carrier cleaning equipment, and relates to the technical field of semiconductors, the wafer carrier cleaning equipment comprises a base, a cleaning tank and a telescopic assembly, the cleaning tank and the telescopic assembly are arranged on the base at intervals, a support is fixed to the end, away from the base, of the telescopic assembly, and the lower surface of the support is connected with a plurality of placement plates and ultrasonic assemblies; each placing plate is provided with a plurality of placing positions used for placing the to-be-cleaned wafer carriers, when the telescopic assembly contracts, the placing plates and the ultrasonic assembly are immersed in the cleaning liquid of the cleaning tank, and the ultrasonic assembly generates ultrasound to enable the cleaning liquid to vibrate so as to clean the to-be-cleaned wafer carriers. According to the wafer carrier cleaning equipment provided by the invention, the cleaning effect and efficiency of the wafer carrier can be improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically, to a wafer carrier cleaning device. Background Technology

[0002] A wafer carrier is a specialized container or device used in semiconductor manufacturing to load, store, transfer, and transport wafers. Wafer carriers ensure the safety of wafers during manufacturing, reduce contamination, and facilitate the operation of automated equipment. A wafer refers to a silicon wafer used in the fabrication of silicon semiconductor integrated circuits; it is called a wafer because of its circular shape. As integrated circuit feature sizes enter the deep submicron stage, the cleanliness requirements for wafer surfaces in integrated circuit wafer manufacturing processes are becoming increasingly stringent. To improve the efficiency of wafer cleaning, wafer carriers and wafers are typically cleaned simultaneously.

[0003] In existing technologies, deionized water rinsing is commonly used to clean individual wafer carriers. In this method, deionized water is applied at a high flow rate to the wafer carrier, washing away impurities and contaminants both inside the carrier and on the wafer, thus achieving a cleaning effect. However, due to the structural limitations of the carrier, this existing cleaning method cannot clean the entire outer surface of the wafer, and its cleaning efficiency is low. Utility Model Content

[0004] The purpose of this application is to provide a wafer carrier cleaning device that can improve the cleaning effect and efficiency of wafer carriers.

[0005] One embodiment of this application provides a wafer carrier cleaning device, including a base and a cleaning tank and a telescopic assembly spaced apart on the base. A bracket is fixed to one end of the telescopic assembly away from the base. Multiple placement plates and an ultrasonic component are connected to the lower surface of the bracket. Each placement plate has multiple placement positions for placing wafer carriers to be cleaned. When the telescopic assembly retracts, the placement plates and the ultrasonic components are immersed in the cleaning fluid in the cleaning tank. The ultrasonic components generate ultrasound to cause the cleaning fluid to vibrate in order to clean the wafer carriers to be cleaned.

[0006] As one feasible approach, the wafer carrier cleaning equipment also includes a housing that snaps into the base, with an air inlet and an air outlet respectively provided at opposite ends of the housing. When the telescopic component extends, the placement plate is located in the air duct formed by the air inlet and the air outlet to blow and dry the wafer carrier to be cleaned.

[0007] As one feasible approach, a drive source is also fixedly installed on the side of the bracket away from the base, and multiple placement plates are connected to the drive source through a transmission assembly, and the placement plates rotate under the action of the drive source.

[0008] As one feasible approach, multiple placement plates are arranged in a row and column, and the transmission assembly includes a screw connected to a drive source. The screw extends in a direction close to the base, and multiple placement plates in the same column are sequentially connected by shafts to form a plate group, with each plate group connected to the screw.

[0009] As one feasible approach, a clamping assembly is provided at the placement position, which clamps the clamping part of the wafer carrier to be cleaned to fix the wafer carrier to be cleaned.

[0010] As one feasible approach, the clamping assembly includes a base plate and clamping members spaced apart on the outer periphery of the base plate. The clamping members are elastically connected to the base plate. When the clamping part is on the base plate, the clamping members clamp the clamping part under the action of the elastic member.

[0011] As one possible implementation, the clamping member includes a supporting portion and a latch connected to the supporting portion, the supporting portion being used to abut against the side of the clamping portion, and the latching portion being used to restrict the surface of the clamping portion.

[0012] As one feasible approach, the cleaning tank includes an inner tank and an outer tank surrounding the outer perimeter of the inner tank. The sidewalls separating the inner and outer tanks are lower than the outer sidewalls of the outer tank, so that the cleaning fluid in the outer tank can enter the inner tank. A flow channel is also formed between the inner and outer tanks, through which the cleaning fluid in the inner tank enters the outer tank. A water pump and a filter screen are installed on the flow channel.

[0013] As an feasible approach, a detector is also installed inside the inner tank to detect the parameters of the cleaning fluid in the inner tank, and the test results are used to determine whether the cleaning fluid meets the requirements.

[0014] As an alternative approach, a cover is also provided on top of the cleaning tank to seal the top of the cleaning tank after cleaning is completed.

[0015] The beneficial effects of the embodiments of this application include:

[0016] The wafer carrier cleaning equipment provided in this application includes a base and cleaning tanks and a telescopic assembly spaced apart on the base. A support is fixed to the end of the telescopic assembly away from the base. Multiple placement plates and an ultrasonic component are connected to the lower surface of the support. Each placement plate has multiple placement positions for placing wafer carriers to be cleaned. When the telescopic assembly retracts, the placement plates and ultrasonic components are immersed in the cleaning fluid in the cleaning tank. The ultrasonic components generate ultrasound, causing the cleaning fluid to vibrate and clean the wafer carriers. Specifically, the support moves multiple wafer carriers to be cleaned toward the base, immersing the placement plates and ultrasonic components in the cleaning fluid. At this time, the ultrasonic components start working, causing the cleaning fluid to vibrate. Simultaneously, the wafer carriers to be cleaned on the placement plates are also immersed in the cleaning fluid, and the vibration of the cleaning fluid cleans the wafer carriers. This application utilizes the vibrations generated by an ultrasonic component to clean the wafer carrier. Since the ultrasonic component is immersed in the cleaning solution, the solution vibrates. Because both the wafer carrier and the wafer within it are submerged in the cleaning solution, both can be effectively cleaned, thus improving the cleaning effect. Furthermore, multiple wafer carriers can be cleaned in a single process, thereby increasing cleaning efficiency. Therefore, the wafer carrier cleaning equipment described in this application improves both the cleaning effect and efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is one of the structural schematic diagrams of a wafer carrier cleaning device provided in an embodiment of this application;

[0019] Figure 2 This is a second schematic diagram of a wafer carrier cleaning device provided in an embodiment of this application;

[0020] Figure 3 This is the third schematic diagram of a wafer carrier cleaning device provided in the embodiments of this application;

[0021] Figure 4 A schematic diagram of the air duct of a wafer carrier cleaning device provided in an embodiment of this application;

[0022] Figure 5 This is a schematic diagram of the structure of a cleaning tank in a wafer carrier cleaning device provided in an embodiment of this application;

[0023] Figure 6This is a schematic diagram of the structure of a placement plate for a wafer carrier cleaning device provided in an embodiment of this application;

[0024] Figure 7 This is one of the structural schematic diagrams of a clamping component of a wafer carrier cleaning device provided in an embodiment of this application;

[0025] Figure 8 This is a second schematic diagram of the structure of a clamping component of a wafer carrier cleaning device provided in an embodiment of this application.

[0026] Icons: 100-Wafer carrier cleaning equipment; 110-Base; 120-Cleaning tank; 121-Inner tank; 122-Outer tank; 123-Water pump; 124-Filter screen; 125-Detector; 126-Cover plate; 130-Telescopic component; 140-Bracket; 150-Placement plate; 151-Placement position; 160-Ultrasonic component; 170-Housing shell; 171-Air inlet; 172-Air outlet; 180-Drive source; 181-Transmission component; 190-Clamping component; 191-Base plate; 192-Clamping part; 193-Supporting part; 194-Snap; 195-Elastic element; 200-Clamping part. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0030] This application provides a wafer carrier cleaning device 100, such as... Figure 1As shown, the device includes a base 110 and a cleaning tank 120 and a telescopic assembly 130 spaced apart on the base 110. A bracket 140 is fixed to one end of the telescopic assembly 130 away from the base 110. Multiple placement plates 150 and an ultrasonic component 160 are connected to the lower surface of the bracket 140. Each placement plate 150 has multiple placement positions 151 for placing wafer carriers to be cleaned. When the telescopic assembly 130 retracts, the placement plates 150 and the ultrasonic component 160 are immersed in the cleaning fluid of the cleaning tank 120. The ultrasonic component 160 generates ultrasound to cause the cleaning fluid to vibrate in order to clean the wafer carriers to be cleaned.

[0031] The wafer carrier cleaning equipment 100 provided in this application embodiment is used to clean wafer carriers containing wafers. Specifically, the wafer carrier cleaning equipment 100 includes a base 110, on which cleaning tanks 120 and telescopic components 130 are spaced apart. A bracket 140 is fixed to one end of the telescopic component 130 away from the base 110. When the telescopic component 130 extends, the bracket 140 moves away from the base 110; conversely, when the telescopic component 130 retracts, the bracket 140 moves closer to the base 110. The lower surface of the support 140 is connected to multiple placement plates 150 and an ultrasonic component 160. Each placement plate 150 has multiple placement positions 151 for placing wafer carriers to be cleaned. Each placement position 151 can hold one wafer carrier to be cleaned, so that multiple wafer carriers to be cleaned can be connected to the lower surface of the support 140. When the telescopic component 130 extends, the support 140 moves away from the cleaning tank 120, making it easier to place the wafer carriers to be cleaned on the placement positions 151. After placement, the telescopic component 130 retracts. At this time, the support 140 moves multiple wafer carriers to be cleaned toward the base 110 and immerses the placement plates 150 and ultrasonic components 160 into the cleaning fluid. At this time, the ultrasonic component 160 starts to work, causing the cleaning fluid to vibrate. At this time, the wafer carriers to be cleaned on the placement plates 150 are also immersed in the cleaning fluid, and the cleaning fluid vibrates to clean the wafer carriers to be cleaned.

[0032] In the above cleaning process, the vibration generated by the ultrasonic component 160 is used to clean the wafer carrier to be cleaned. Since the ultrasonic component 160 is immersed in the cleaning solution, the cleaning solution vibrates. Since both the wafer carrier to be cleaned and the wafers within it are immersed in the cleaning solution, both the wafer carrier and the wafers can be effectively cleaned, thus improving the cleaning effect. Furthermore, multiple wafer carriers can be cleaned in a single cleaning process, thereby improving cleaning efficiency. Therefore, the wafer carrier cleaning equipment 100 of this application embodiment can improve both the cleaning effect and cleaning efficiency.

[0033] In addition, compared with the existing deionized water rinsing method, this method can improve the utilization rate of deionized water and reduce the waste of water resources.

[0034] The specific structure and function of the shrinkage component are not limited in the embodiments of this application. For example, it may be as follows: Figure 1 The diagram shows two nested columns, with limiting components at their ends. When the smaller diameter column is pulled upwards, the telescopic component 130 extends, and the limiting components restrict the movement of the smaller diameter column. When the limiting components are released, the smaller diameter column retracts into the larger diameter column, and the telescopic component 130 retracts. Alternatively, the electrode can be connected to a transmission mechanism, which is connected to a support 140. The electrode, through the transmission mechanism, causes the support 140 to move up and down. Those skilled in the art can customize the specific structure of the telescopic component 130 according to actual conditions.

[0035] In addition, to improve the stability of the support 140 during movement, the telescopic assembly 130 may include multiple support columns to increase the contact points between the telescopic assembly 130 and the support 140.

[0036] The wafer carrier cleaning equipment 100 provided in this application includes a base 110 and a cleaning tank 120 and a telescopic assembly 130 spaced apart on the base 110. A bracket 140 is fixed to one end of the telescopic assembly 130 away from the base 110. A plurality of placement plates 150 and an ultrasonic component 160 are connected to the lower surface of the bracket 140. Each placement plate 150 has a plurality of placement positions 151 for placing wafer carriers to be cleaned. When the telescopic assembly 130 retracts, the placement plates 150 and the ultrasonic component 160 are immersed in the cleaning fluid in the cleaning tank 120. The ultrasonic component 160 generates ultrasound to cause the cleaning fluid to vibrate in order to clean the wafer carriers to be cleaned. Specifically, the support 140 moves multiple wafer carriers to be cleaned toward the base 110, immersing the placement plate 150 and the ultrasonic component 160 in the cleaning solution. At this time, the ultrasonic component 160 operates, causing vibration in the cleaning solution. The wafer carriers on the placement plate 150 are also immersed in the cleaning solution, and the vibration cleans the wafer carriers. This application utilizes the vibration generated by the ultrasonic component 160 to clean the wafer carriers. Because the ultrasonic component 160 is immersed in the cleaning solution, the solution vibrates, and since both the wafer carriers and the wafers within them are submerged, both can be effectively cleaned, thus improving the cleaning effect. Furthermore, multiple wafer carriers can be cleaned in a single cleaning process, thereby improving cleaning efficiency. Therefore, the wafer carrier cleaning equipment 100 of this application embodiment can improve both the cleaning effect and cleaning efficiency.

[0037] Optional, such as Figure 2As shown, the wafer carrier cleaning equipment 100 also includes a housing 170 that is fastened to the base 110. An air inlet and an air outlet 172 are respectively provided at opposite ends of the housing 170. When the telescopic component 130 is extended, the placement plate 150 is located in the air duct formed by the air inlet 171 and the air outlet 172 to blow dry the wafer carrier to be cleaned.

[0038] After the wafer carrier to be cleaned is completed, the support 140 moves upward, driving the cleaned wafer carrier upward and away from the cleaning solution. At this time, there is still cleaning solution on the wafer carrier. In order to accelerate the rapid drying of the cleaning solution on the wafer carrier, the wafer carrier cleaning equipment 100 of this application embodiment also includes a housing 170. The housing 170 is fastened to the base 110. An air inlet 171 and an air outlet 172 are provided at opposite ends of the housing 170. Drying gas enters the space enclosed by the housing 170 and the base 110 through the air inlet 171 and is blown out through the air outlet 172. In this process, the cleaning solution on the surface of the wafer carrier is carried away, thereby improving the drying efficiency.

[0039] The number of air inlets 171 and air outlets 172 is not limited in this embodiment of the application, such as... Figure 2 and Figure 4 As shown, the air inlet 171 and the air outlet 172 can be staggered in the vertical direction. This increases the contact time between the drying gas and the wafer carrier, thereby improving drying efficiency. Specifically, the drying gas can be nitrogen, because nitrogen does not readily react with the wafer.

[0040] like Figure 2 and Figure 4 As shown, in order to further improve drying efficiency, air inlets 171 can be provided at both ends of the outer casing 170, and the air inlets at both ends are staggered to avoid mutual interference. This will form two air ducts and improve drying efficiency.

[0041] When the telescopic component 130 is manually telescopic, an operation port can be opened on the outer casing 170 to facilitate the operation of the telescopic component 130.

[0042] In one possible implementation of the embodiments of this application, such as Figure 2 As shown, a drive source 180 is also fixedly installed on the side of the bracket 140 away from the base 110. Multiple placement plates 150 are connected to the drive source 180 through a transmission assembly 181, and the placement plates 150 rotate under the action of the drive source 180.

[0043] To further increase the relative motion between the wafer carrier and the cleaning fluid, this embodiment of the application also provides a drive source 180 on the upper surface of the support 140. Multiple placement plates 150 are connected to the drive source 180 through a transmission assembly 181, so that the placement plates 150 rotate under the action of the drive source 180, thereby causing the wafer carrier located on the placement plate 150 to rotate relative to the cleaning fluid. This causes the cleaning fluid to flow relative to the wafer carrier, thus increasing the friction between the cleaning fluid and the wafer carrier and improving the cleaning effect.

[0044] Optional, such as Figure 2 and Figure 3 As shown, multiple placement plates 150 are arranged in a row and column. The transmission assembly 181 includes a screw connected to the drive source 180. The screw extends in the direction close to the base 110. Multiple placement plates 150 in the same column are sequentially connected by shafts to form a plate group. The plate group is connected to the screw respectively.

[0045] Specifically, the transmission assembly 181 includes a screw with multiple rotating parts spaced apart on it. When the drive source 180 drives the screw to rotate, the multiple rotating parts rotate and are connected to the placement plate 150, thereby driving the placement plate 150 to rotate.

[0046] The use of a screw and rotating parts allows one screw to drive multiple rotating parts, thereby causing multiple placement plates 150 to rotate.

[0047] The screw can include one or two screws arranged opposite each other, with the two screws driven by the same 180° drive source, so that the rotation speed is the same and the rotation of each shift is more stable.

[0048] In one possible implementation of the embodiments of this application, such as Figure 6 As shown, a clamping assembly 190 is provided on the placement position 151. The clamping assembly 190 clamps the clamping part 200 of the wafer carrier to be cleaned to fix the wafer carrier to be cleaned.

[0049] In order to ensure that the wafer carrier can be stably connected to the placement plate 150 during the cleaning process, the present application embodiment provides a clamping component 190 on each placement position 151. The clamping component 190 clamps the clamping part 200 of the wafer carrier to fix the wafer carrier on the placement plate 150.

[0050] Optional, such as Figure 7 and Figure 8 As shown, the clamping assembly 190 includes a base plate 191 and clamping members 192 spaced apart on the outer periphery of the base plate 191. The clamping members 192 are elastically connected to the base plate 191. When the clamping part 200 is located on the base plate 191, the clamping members 192 clamp the clamping part 200 under the action of the elastic member 195.

[0051] The clamping member 192 is connected to the base plate 191 by the elastic member 195. When installing or removing the wafer carrier, simply pull the clamping member 192 outward to release the clamping member 192 from the clamping part 200, which is convenient for operation.

[0052] In one possible implementation of the embodiments of this application, such as Figure 7 and Figure 8 As shown, the clamping member 192 includes a supporting portion 193 and a latch 194 connected to the supporting portion 193. The supporting portion 193 is used to abut against the side of the clamping portion 200, and the latch 194 is used to restrict the surface of the clamping portion 200.

[0053] The clamping member 192 includes a supporting part 193 and a latch 194. The clamping part 200 and the base plate 191 work together to limit the various surfaces of the clamping part 200, thereby improving the clamping stability of the clamping member 192.

[0054] Optional, such as Figure 5 As shown, the cleaning tank 120 includes an inner tank 121 and an outer tank 122 surrounding the outer periphery of the inner tank 121. The sidewalls of the inner tank 121 and the outer tank 122 are lower than the outer sidewalls of the outer tank 122, so that the cleaning fluid in the outer tank 122 can enter the inner tank 121. A flow channel is also formed between the inner tank 121 and the outer tank 122, through which the cleaning fluid in the inner tank 121 enters the outer tank 122. A water pump 123 and a filter screen 124 are provided on the flow channel.

[0055] To improve the utilization rate of the cleaning fluid, an inner tank 121 and an outer tank 122 are provided, and a passage is formed between the inner tank 121 and the outer tank 122, such as... Figure 5 As shown, a water pump 123 and a filter screen 124 are provided, which increases the purity of the cleaning fluid flowing into the inner tank 121, allowing the cleaning fluid to be reused and thus improving the utilization rate of the cleaning fluid.

[0056] The cleaning solution can be deionized water.

[0057] In one possible implementation of this application embodiment, a detector 125 is also provided in the inner tank 121. The detector 125 detects the parameters of the cleaning fluid in the inner tank 121, and determines whether the cleaning fluid meets the requirements based on the test results of the detector 125.

[0058] Specifically, the detector 125 can be a conductivity meter. The conductivity measured by the conductivity meter is used to determine whether the cleaning solution can continue to be used. When the cleaning solution is no longer usable, it can be removed in time and new cleaning solution can be injected. In this way, the cleaning effect is ensured while saving resources.

[0059] Optional, such as Figure 5As shown, a cover plate 126 is also provided on the top of the cleaning tank 120. The cover plate 126 is used to close the top of the cleaning tank 120 after cleaning is completed.

[0060] As can be seen from the above, after cleaning, the material needs to be dried. In order to prevent the drying gas from carrying away the cleaning liquid during the drying process, a cover plate 126 is installed on the top of the cleaning tank 120. During cleaning, the cover plate 126 is removed, and after cleaning, the cover plate 126 closes the top of the cleaning tank 120.

[0061] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer carrier cleaning device, characterized in that, The device includes a base, a cleaning tank and a telescopic assembly spaced on the base, a support fixed to one end of the telescopic assembly away from the base, and multiple placement plates and an ultrasonic component connected to the lower surface of the support. Each placement plate has multiple placement positions for placing wafer carriers to be cleaned. When the telescopic assembly retracts, the placement plates and the ultrasonic components are immersed in the cleaning fluid in the cleaning tank. The ultrasonic components generate ultrasound to cause the cleaning fluid to vibrate and clean the wafer carriers to be cleaned. A drive source is also fixedly installed on the side of the bracket away from the base. Multiple placement plates are connected to the drive source via a transmission assembly, and the placement plates rotate under the action of the drive source. Multiple placement plates are arranged in a row and column. The transmission assembly includes a screw connected to a drive source. The screw extends in a direction close to the base. Multiple placement plates in the same column are sequentially connected by a shaft to form a plate group. The plate group is connected to the screw respectively. A clamping component is provided on the placement position, and the clamping component clamps the clamping part of the wafer carrier to be cleaned to fix the wafer carrier to be cleaned. The clamping assembly includes a base plate and clamping members spaced apart on the outer periphery of the base plate. The clamping members are elastically connected to the base plate. When the clamping part is on the base plate, the clamping members clamp the clamping part under the action of the elastic member. The cleaning tank includes an inner tank and an outer tank surrounding the outer perimeter of the inner tank. A detector is also installed in the inner tank to detect the parameters of the cleaning fluid in the inner tank. The detector determines whether the cleaning fluid meets the requirements based on the test results of the detector.

2. The wafer carrier cleaning equipment according to claim 1, characterized in that, It also includes a housing that snaps into the base, with an air inlet and an air outlet respectively provided at opposite ends of the housing. When the telescopic component extends, the placement plate is located in the air duct formed by the air inlet and the air outlet to blow air and dry the wafer carrier to be cleaned.

3. The wafer carrier cleaning equipment according to claim 1, characterized in that, The clamping member includes a supporting portion and a buckle connected to the supporting portion. The supporting portion is used to abut against the side of the clamping portion, and the buckle is used to restrict the surface of the clamping portion.

4. The wafer carrier cleaning equipment according to claim 1, characterized in that, The partition wall between the inner tank and the outer tank is lower than the outer wall of the outer tank, so that the cleaning fluid in the outer tank can enter the inner tank. A flow channel is also formed between the inner tank and the outer tank, through which the cleaning fluid in the inner tank enters the outer tank. A water pump and a filter screen are provided on the flow channel.

5. The wafer carrier cleaning equipment according to claim 1, characterized in that, The top of the cleaning tank is also provided with a cover plate, which is used to close the top of the cleaning tank after cleaning is completed.

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