Angle adjusting mechanism for automatic polishing of wafer cutting blade

Abstract

The utility model discloses an angle adjusting mechanism for automatic polishing of a wafer cutting blade, and relates to the technical field of wafer cutting blade polishing, the angle adjusting mechanism comprises a bottom plate, a lifting mechanism, a clamping rotating mechanism, a top plate, a guide mechanism and a polishing mechanism; the clamping rotating mechanism comprises a first adjusting motor which is fixedly connected to the outer surface of the right side of the first threaded block, a first rotating rod is installed on the right side face of the first adjusting motor, a fixing rod is fixedly connected to the end, away from the first adjusting motor, of the first rotating rod, and a first positioning block is fixedly connected to the outer surface of the fixing rod. A threaded rod is fixedly connected to the end, away from the first rotating rod, of the fixing rod, a second positioning block is in threaded connection with the outer surface of the threaded rod, four threaded through holes are formed in the outer surface of the second positioning block, and threaded fixing rods are in threaded connection with the inner surfaces of the threaded through holes. Through cooperation of the structures, the wafer cutting blade can be rotated by 360 degrees, the whole wafer cutting blade can be polished conveniently, and the polishing effect is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer cutting blade polishing technical field, concretely is a kind of angle adjusting mechanism of wafer cutting blade automatic polishing. BACKGROUND

[0002] Wafer cutting blade is the tool that wafer is carried out physical cutting using diamond blade. Diamond blade is moved along cutting path when high speed rotates, and wafer is cut completely. When polishing wafer cutting blade, the main target is to ensure the surface smoothness and performance consistency of entire blade. Therefore, it is usually needed to polish entire blade uniformly.

[0003] When polishing wafer cutting blade in traditional technology, chemical polishing method removes material using chemical reaction, and usually uses such as HN03-HF (nitric acid, hydrofluoric acid) etching liquid. This method can rapidly dissolve microcosmic convex part on the surface of silicon chip, so polishing speed is relatively fast. Although chemical polishing method is fast, due to its reaction property, it often leads to that the surface flatness of silicon chip after polishing is not as good as mechanical polishing method. Chemical polishing is more inclined to partial dissolution, rather than overall uniform grinding, so uneven surface phenomenon can be generated, and polishing effect is poor.

[0004] Therefore, an angle adjusting mechanism of wafer cutting blade automatic polishing is provided. CONTENT OF UTILITY MODEL

[0005] The utility model aims at: in order to can carry out 360 degree rotation to wafer cutting blade, it is convenient to polish entire wafer cutting blade, improve polishing effect, and an angle adjusting mechanism of wafer cutting blade automatic polishing is provided.

[0006] The technical scheme adopted by the utility model is as follows:

[0007] An angle adjusting mechanism of wafer cutting blade automatic polishing, including bottom plate, lifting mechanism, clamping rotating mechanism, top plate, guide mechanism and polishing mechanism, the right end upper surface of the bottom plate is fixedly connected with right side plate, the lifting mechanism is set on the right end upper surface of the bottom plate, the lifting mechanism includes left side plate, the top plate is fixedly connected between the side face of the left side plate and the right side plate close to one side, the left side plate is fixedly connected on the left end upper surface of the bottom plate, the right side face of the left side plate is equipped with side groove, the inner side face of the side groove is equipped with lower slide groove, the inner bottom surface of the side groove is fixedly connected with motor one, the output end of the motor one is fixedly connected with screw rod one, the end of the screw rod one away from the motor one is rotatably connected with the top end inner wall of the side groove through bearing, the outer surface of the screw rod one is screw-connected with screw block one;

[0008] The clamping rotating mechanism comprises an adjusting motor one, the adjusting motor one is fixedly connected to the right outer surface of the threaded block one, a rotating rod one is installed on the right side surface of the adjusting motor one, a fixed rod is fixedly connected to the end of the rotating rod one away from the adjusting motor one, a positioning block one is fixedly connected to the outer surface of the fixed rod, a threaded rod is fixedly connected to the end of the fixed rod away from the rotating rod one, a positioning block two is threadedly connected to the outer surface of the threaded rod, four threaded through holes are formed in the outer surface of the positioning block two, and a threaded fixed rod is threadedly connected to the inner surface of the threaded through hole.

[0009] Further, the guide mechanism comprises a motor two, the motor two is fixedly connected to the right side surface of the upper end of the left side plate, a lead screw two is fixedly connected to the output end of the motor two, the end of the lead screw two away from the motor two is rotatably connected to the left side surface of the right side plate through a bearing, and a threaded block two is threadedly connected to the outer surface of the lead screw two.

[0010] Further, a limiting sliding rod is fixedly connected to the upper surface of the threaded block two, an upper sliding groove is formed in the lower surface of the top plate, and the outer surface of the end of the limiting sliding rod away from the threaded block two is slidably connected to the inner surface of the upper sliding groove.

[0011] Further, an electric cylinder is fixedly connected to the lower surface of the threaded block two, and a piston rod is installed on the lower surface of the electric cylinder.

[0012] Further, the polishing mechanism comprises an adjusting motor two, the adjusting motor two is fixedly connected to the lower surface of the piston rod, a rotating rod two is fixedly connected to the lower surface output end of the adjusting motor two, a polishing motor is fixedly connected to the lower surface of the rotating rod two, a rotating rod three is fixedly connected to the left side output end of the polishing motor, and a grinding wheel is fixedly connected to the end of the rotating rod three away from the polishing motor.

[0013] Further, a limiting sliding plate is fixedly connected to the outer surface of the threaded block one, and the end of the limiting sliding plate away from the threaded block one is slidably connected to the inner surface of the lower sliding groove.

[0014] As the above technical scheme is adopted, the present application has the following beneficial effects:

[0015] 1. In this utility model, when polishing a wafer dicing blade, the through hole in the middle of the wafer dicing blade can be passed through the threaded rod and fitted onto the outer surface of the right end of the fixing rod, and the left side of the wafer dicing blade can be attached to the positioning block one. Then, the positioning block two is threaded onto the outer surface of the threaded rod, and the positioning block two is rotated to move closer to the positioning block one. When the positioning block two abuts against the right side of the fixing rod, the four threaded fixing rods are rotated and inserted into the threaded through hole until the left side of the four threaded fixing rods presses against the wafer dicing blade. Then, when polishing the wafer dicing blade using the guiding mechanism and the polishing mechanism, the adjusting motor one can be started to make the rotating rod one drive the fixing rod to rotate, thereby driving the clamped wafer dicing blade to rotate, so that the wafer dicing blade can be rotated 360 degrees, which is convenient for adjusting the polishing position of the wafer dicing blade. Through the cooperation of the above structures, the wafer dicing blade can be rotated 360 degrees, which is convenient for polishing the entire wafer dicing blade and improving the polishing effect.

[0016] 2. In this utility model, when adjusting the polishing height of the wafer dicing blade, the motor can be started to rotate the lead screw. At this time, the threaded block will move up or down under the rotation of the lead screw, thereby driving the clamping rotation mechanism and the clamped wafer dicing blade to move up or down, thereby adjusting the polishing height of the wafer dicing blade. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 In this utility model Figure 1 Enlarged view of point A;

[0019] Figure 3 This is a schematic diagram showing the connection between the guiding mechanism and the polishing mechanism in this utility model;

[0020] Figure 4 This is a cross-sectional view of the lifting mechanism in this utility model;

[0021] Figure 5 This is a cross-sectional view of the top plate in this utility model.

[0022] Marked in the figure: 1 - bottom plate, 2 - lifting mechanism, 3 - clamping rotating mechanism, 4 - top plate, 5 - guide mechanism, 6 - polishing mechanism, 11 - right side plate, 21 - left side plate, 22 - side groove, 23 - lower sliding groove, 24 - motor one, 25 - screw rod one, 26 - threaded block one, 27 - limiting sliding plate, 31 - adjusting motor one, 32 - rotating rod one, 33 - fixed rod, 34 - threaded rod, 35 - positioning block one, 36 - positioning block two, 37 - threaded through hole, 38 - threaded fixing rod, 41 - upper sliding groove, 51 - motor two, 52 - screw rod two, 53 - threaded block two, 54 - electric cylinder, 55 - piston rod, 56 - limiting sliding rod, 61 - adjusting motor two, 62 - rotating rod two, 63 - polishing motor, 64 - rotating rod three, 65 - grinding wheel. DETAILED DESCRIPTION

[0023] To make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model. EMBODIMENT

[0024] Referring to Figures 1-5 A kind of angle adjusting mechanism of wafer cutting blade automatic polishing, including bottom plate 1, lifting mechanism 2, clamping rotating mechanism 3, top plate 4, guide mechanism 5 and polishing mechanism 6, right end upper surface of bottom plate 1 is fixedly connected with right side plate 11, lifting mechanism 2 is arranged on the right end upper surface of bottom plate 1, lifting mechanism 2 includes left side plate 21, and top plate 4 is fixedly connected between the side face of left side plate 21 and right side plate 11 close to one side, left side plate 21 is fixedly connected on the left end upper surface of bottom plate 1, the right side face of left side plate 21 is provided with side groove 22, the inner side of side groove 22 is provided with lower sliding groove 23, the inner bottom of side groove 22 is fixedly connected with motor one 24, the output end of motor one 24 is fixedly connected with screw rod one 25, the one end of screw rod one 25 away from motor one 24 is rotatably connected with the top end inner wall of side groove 22 by bearing, the outer surface of screw rod one 25 is threadedly connected with threaded block one 26, the outer surface of threaded block one 26 is fixedly connected with limiting sliding plate 27, the one end of limiting sliding plate 27 away from threaded block one 26 is slidably connected with the inner surface of lower sliding groove 23;Specifically, after wafer cutting blade is clamped using clamping rotating mechanism 3, motor one 24 can be started to make screw rod one 25 rotate, at this time, threaded block one 26 will be moved upwards or downwards under the rotation of screw rod one 25, in turn drive clamping rotating mechanism 3 and the wafer cutting blade clamped to move upwards or downwards, so as to adjust the polishing height of wafer cutting blade.

[0025] With reference to Figures 1-5 , the clamping and rotating mechanism 3 comprises an adjusting motor 31 fixedly connected to the right outer surface of the threaded block 26, a rotating rod 32 installed on the right side of the adjusting motor 31, a fixed rod 33 fixedly connected to the end of the rotating rod 32 away from the adjusting motor 31, a positioning block 35 fixedly connected to the outer surface of the fixed rod 33, a threaded rod 34 fixedly connected to the end of the fixed rod 33 away from the rotating rod 32, a positioning block 36 threadedly connected to the outer surface of the threaded rod 34, four threaded through holes 37 formed in the outer surface of the positioning block 36, and four threaded fixing rods 38 threadedly connected to the inner surface of the threaded through holes 37. Specifically, the through hole in the middle of the wafer cutting blade is sleeved on the right end outer surface of the fixed rod 33 after passing through the threaded rod 34, and the left side of the wafer cutting blade is attached to the positioning block 35. Then the positioning block 36 is threadedly connected to the outer surface of the threaded rod 34, and the positioning block 36 is rotated to approach the positioning block 35. When the positioning block 36 abuts against the right side of the fixed rod 33, the four threaded fixing rods 38 are rotated and inserted into the inside of the threaded through holes 37 until the left side of the four threaded fixing rods 38 abuts against the wafer cutting blade. Then, when the wafer cutting blade is polished by the guiding mechanism 5 and the polishing mechanism 6, the adjusting motor 31 is started to drive the rotating rod 32 to rotate the fixed rod 33, thereby driving the clamped wafer cutting blade to rotate, so that the wafer cutting blade can be rotated by 360 degrees, and the polishing position of the wafer cutting blade can be adjusted conveniently. Through the cooperation of the above structure, the wafer cutting blade can be rotated by 360 degrees, the entire wafer cutting blade can be polished conveniently, and the polishing effect is improved.

[0026] With reference to Figures 1-5 , the guiding mechanism 5 comprises a motor 51 fixedly connected to the right side of the upper end of the left side plate 21, a lead screw 52 fixedly connected to the output end of the motor 51, the end of the lead screw 52 away from the motor 51 being rotatably connected to the left side of the right side plate 11 through a bearing, a threaded block 53 threadedly connected to the outer surface of the lead screw 52, a limiting slide rod 56 fixedly connected to the upper surface of the threaded block 53, an upper sliding groove 41 formed in the lower surface of the top plate 4, and the outer surface of the end of the limiting slide rod 56 away from the threaded block 53 being slidably connected to the inner surface of the upper sliding groove 41. Specifically, during the polishing of the wafer cutting blade by the guiding mechanism 5 and the polishing mechanism 6, the motor 51 can be started to drive the lead screw 52 to rotate. At this time, the threaded block 53 can move horizontally under the rotating action of the lead screw 52, and the moving threaded block 53 also drives the upper end of the limiting slide rod 56 to slide on the inner surface of the upper sliding groove 41, thereby avoiding the threaded block 53 from rotating in the same direction as the limiting slide rod 56.

[0027] With reference to Figures 1-5The lower surface of the second transverse moving threaded block 53 is fixedly connected with an electric cylinder 54, the lower surface of the electric cylinder 54 is installed with a piston rod 55, the polishing mechanism 6 comprises an adjusting motor two 61, the adjusting motor two 61 is fixedly connected to the lower surface of the piston rod 55, the lower surface output end of the adjusting motor two 61 is fixedly connected with a rotating rod two 62, the lower surface of the rotating rod two 62 is fixedly connected with a polishing motor 63, the left side output end of the polishing motor 63 is fixedly connected with a rotating rod three 64, one end of the rotating rod three 64 away from the polishing motor 63 is fixedly connected with a grinding wheel 65; Specifically, the second transverse moving threaded block 53 will drive the polishing mechanism 6 to move transversely through the electric cylinder 54 and the piston rod 55 until the grinding wheel 65 approaches the position of the right side of the wafer cutting blade that needs to be polished, then the polishing motor 63 can be started to make the rotating rod three 64 drive the grinding wheel 65 to rotate, so as to polish one side of the wafer cutting blade, and when the left side needs to be polished, the electric cylinder 54 can be started to make the piston rod 55 drive the polishing mechanism 6 to move upward, then the adjusting motor two 61 is started to make the rotating rod two 62 drive the polishing motor 63 to rotate, so that the direction of the grinding wheel 65 changes from left to right, thereby adjusting the grinding angle of the grinding wheel 65, then the transverse movement of the second transverse moving threaded block 53 is used to move the polishing mechanism 6 to the left side of the wafer cutting blade, the electric cylinder 54 and the piston rod 55 are used to make the grinding wheel 65 adhere to the polishing position of the left side of the wafer cutting blade, then the polishing motor 63 is started again to make the rotating rod three 64 drive the grinding wheel 65 to rotate, so as to polish the left side of the wafer cutting blade, through the cooperation of the above structure, the grinding position of the grinding wheel 65 on the wafer cutting blade can be adjusted, the wafer cutting blade can be polished conveniently, and the polishing effect is improved.

[0028] The implementation principle of the wafer cutting blade automatic polishing angle adjusting mechanism embodiment of the application is as follows:

[0029] When the wafer cutting blade is polished by using the device, first, the external power supply is connected, then the through hole in the middle of the wafer cutting blade is sleeved on the outer surface of the right end of the fixed rod 33 through the threaded rod 34, and the left side of the wafer cutting blade is attached to the positioning block one 35, then the positioning block two 36 is threadedly connected to the outer surface of the threaded rod 34, and the positioning block two 36 is rotated to approach the positioning block one 35, when the positioning block two 36 abuts against the right side of the fixed rod 33, the four threaded fixing rods 38 are rotated and inserted into the threaded through holes 37, until the left side of the four threaded fixing rods 38 abuts against the wafer cutting blade, then when the wafer cutting blade is polished by using the guide mechanism 5 and the polishing mechanism 6, the adjusting motor one 31 can be started to drive the rotating rod one 32 to rotate the fixed rod 33, and then drive the clamped wafer cutting blade to rotate, so that the wafer cutting blade can rotate 360 degrees, and the polishing position of the wafer cutting blade can be adjusted conveniently. Through the cooperation of the above structure, the wafer cutting blade can rotate 360 degrees, and the polishing of the whole wafer cutting blade is facilitated, and the polishing effect is improved.

[0030] During the polishing of the wafer cutting blade by using the guide mechanism 5 and the polishing mechanism 6, the motor two 51 can be started to rotate the screw rod two 52, at this time the threaded block two 53 can move horizontally under the rotating action of the screw rod two 52, the horizontally moving threaded block two 53 drives the polishing mechanism 6 to move horizontally through the electric cylinder 54 and the piston rod 55, until the grinding wheel 65 approaches the position on the right side of the wafer cutting blade that needs to be polished, then the polishing motor 63 can be started to drive the rotating rod three 64 to rotate the grinding wheel 65, so as to polish one side of the wafer cutting blade, when the left side needs to be polished, the electric cylinder 54 can be started to drive the piston rod 55 to move the polishing mechanism 6 upward, then the adjusting motor two 61 is started to drive the rotating rod two 62 to rotate the polishing motor 63, so that the direction of the grinding wheel 65 changes from left to right, thereby adjusting the polishing angle of the grinding wheel 65, then the horizontal movement of the threaded block two 53 moves the polishing mechanism 6 to the left side of the wafer cutting blade, and the grinding wheel 65 is attached to the polishing position of the left side of the wafer cutting blade by cooperation of the electric cylinder 54 and the piston rod 55, then the polishing motor 63 is started again to drive the rotating rod three 64 to rotate the grinding wheel 65, so as to polish the left side of the wafer cutting blade. Through the cooperation of the above structure, the polishing position of the wafer cutting blade by the grinding wheel 65 can be adjusted, the polishing of the whole wafer cutting blade is facilitated, and the polishing effect is improved.

[0031] When the polishing height of the wafer cutting blade is adjusted, the motor 24 is started to rotate the lead screw 25, and at this time, the threaded block 26 moves up or down under the rotating action of the lead screw 25, thereby driving the clamping rotating mechanism 3 and the clamped wafer cutting blade to move up or down, so as to adjust the polishing height of the wafer cutting blade.

[0032] The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A kind of angle adjusting mechanism of wafer cutting blade automatic polishing, including bottom plate (1), lifting mechanism (2), clamping rotating mechanism (3), top plate (4), guide mechanism (5) and polishing mechanism (6), it is characterized in that: A right side plate (11) is fixedly connected to the upper right surface of the base plate (1). The lifting mechanism (2) is set on the upper right surface of the base plate (1). The lifting mechanism (2) includes a left side plate (21). A top plate (4) is fixedly connected between the side of the left side plate (21) and the side of the right side plate (11) that are close to each other. The left side plate (21) is fixedly connected to the upper left surface of the base plate (1). A side groove (22) is opened on the right side of the left side plate (21). A sliding groove (23) is opened on the inner side of the side groove (22). A motor (24) is fixedly connected to the inner bottom surface of the side groove (22). A lead screw (25) is fixedly connected to the output end of the motor (24). The end of the lead screw (25) away from the motor (24) is rotatably connected to the inner wall of the top of the side groove (22) through a bearing. A threaded block (26) is threadedly connected to the outer surface of the lead screw (25). The clamping and rotating mechanism (3) includes an adjusting motor (31), which is fixedly connected to the outer right side of the threaded block (26). A rotating rod (32) is installed on the right side of the adjusting motor (31). A fixing rod (33) is fixedly connected to the end of the rotating rod (32) away from the adjusting motor (31). A positioning block (35) is fixedly connected to the outer surface of the fixing rod (33). A threaded rod (34) is fixedly connected to the end of the fixing rod (33) away from the rotating rod (32). A positioning block (36) is threadedly connected to the outer surface of the threaded rod (34). Four threaded through holes (37) are opened on the outer surface of the positioning block (36). A threaded fixing rod (38) is threadedly connected to the inner surface of the threaded through holes (37).

2. The angle adjustment mechanism for automatic polishing of wafer dicing blade according to claim 1, wherein: The guiding mechanism (5) includes a second motor (51), which is fixedly connected to the upper right side of the left side plate (21). The output end of the second motor (51) is fixedly connected to a second lead screw (52). The end of the second lead screw (52) away from the second motor (51) is rotatably connected to the left side of the right side plate (11) through a bearing. The outer surface of the second lead screw (52) is threaded with a second threaded block (53).

3. The angle adjustment mechanism for automatic polishing of wafer dicing blade according to claim 2, wherein: The upper surface of the threaded block 2 (53) is fixedly connected to a limiting slide rod (56), and the lower surface of the top plate (4) is provided with an upper sliding groove (41). The outer surface of the end of the limiting slide rod (56) away from the threaded block 2 (53) is slidably connected to the inner surface of the upper sliding groove (41).

4. The angle adjustment mechanism for automatic polishing of wafer dicing blade according to claim 3, wherein: An electric cylinder (54) is fixedly connected to the lower surface of the threaded block 2 (53), and a piston rod (55) is installed on the lower surface of the electric cylinder (54).

5. The angle adjustment mechanism for automatic polishing of wafer dicing blade according to claim 4, wherein: The polishing mechanism (6) includes an adjusting motor 2 (61), which is fixedly connected to the lower surface of the piston rod (55). A rotating rod 2 (62) is fixedly connected to the lower output end of the adjusting motor 2 (61). A polishing motor (63) is fixedly connected to the lower surface of the rotating rod 2 (62). A rotating rod 3 (64) is fixedly connected to the left output end of the polishing motor (63). A grinding wheel (65) is fixedly connected to the end of the rotating rod 3 (64) away from the polishing motor (63).

6. An angle adjustment mechanism for automatic polishing of wafer dicing blades as defined in claim 1, wherein: The outer surface of the threaded block (26) is fixedly connected to a limiting slide plate (27), and the end of the limiting slide plate (27) away from the threaded block (26) is slidably connected to the inner surface of the sliding groove (23).

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