Dust removal device for silicon wafer thinning

Abstract

The utility model discloses a dust removal device for silicon wafer thinning, which comprises a device body, a thinning bin and a transmission bin are formed in the device body, a dust removal assembly is arranged in the thinning bin and comprises an upper dust cover, a lower dust cover, a lifting plate and an air guide pipe, and the upper dust cover is arranged between the lifting plate and the lower dust cover. A thinning cavity is formed between the upper dust cover and the lower dust cover, and a thinning disc and a supporting plate are arranged in the thinning cavity. The dust removal assembly is used for absorbing scraps, when a silicon wafer is thinned, the silicon wafer is placed on the supporting plate, then the upper dust cover moves downwards and is attached to the lower dust cover, a relatively closed thinning cavity is formed in the upper dust cover, the scraps generated after the thinning disc is attached to the silicon wafer and rotates are sucked out through the dust removal holes, the scraps can be prevented from being scattered all around, and the silicon wafer thinning efficiency is improved. And meanwhile, after the thinning work is completed, the upper dustproof cover moves upwards, the air guide holes are exposed after the sealing strips are separated from the sealing grooves, and continuous dust collection is carried out, so that the dust removal efficiency is further improved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer thinning technology, specifically to a dust removal device for silicon wafer thinning. Background Technology

[0002] Solar energy is the most important clean energy source in the 21st century. It has become an important part of human energy use and continues to develop. Solar cells are devices that directly convert light energy into electrical energy through the photoelectric effect or photochemical effect. As long as they are exposed to light, they can output voltage and current instantly. The materials required in the production process of solar cells are silicon wafers. When the silicon wafers meet the process requirements, they need to be polished to make them thinner. Therefore, a device for rapid thinning of silicon wafers is needed.

[0003] In the existing silicon wafer thinning process, debris will be scattered in all directions. Current dust removal devices only absorb and remove dust from the outside of the silicon wafer, but debris is still scattered, which affects the working environment. Therefore, a dust removal device for silicon wafer thinning is proposed. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this utility model provides a dust removal device for silicon wafer thinning, which solves the problem that existing dust removal devices only absorb dust from the outside of the silicon wafer during the silicon wafer thinning process, but dust still scatters and affects the working environment.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: a dust removal device for silicon wafer thinning, comprising a device body, the interior of which forms a thinning chamber and a transmission chamber. A dust removal assembly is installed inside the thinning chamber, comprising an upper dust cover, a lower dust cover, a lifting plate, and an air guide pipe. The upper dust cover is positioned between the lifting plate and the lower dust cover, forming a thinning cavity between them. A thinning disc and a support plate are installed within the thinning cavity. A fixing frame and a motor are mounted on the top of the lifting plate. The motor is positioned inside the fixing frame, and a transmission column is connected to the motor's power output end. The end of the transmission column penetrates the upper dust cover and is fixedly connected to the thinning disc. The support plate is positioned inside the lower dust cover. Air guide holes are provided inside both the upper and lower dust covers, and several dust removal holes communicating with the air guide holes are provided on the inner walls of both the upper and lower dust covers.

[0008] As a further preferred embodiment of the present invention, the two side walls of the device body are provided with longitudinal grooves, and a dust collector is installed on the outer wall of the device body below the grooves. The dust collector is connected to a duct and an air duct. The two ends of the lifting plate pass through the grooves and are connected to the duct.

[0009] As a further preferred embodiment of the present invention, a telescopic hose is installed at the bottom of the lifting plate, and the end of the telescopic hose is connected to the top edge of the upper dust cover. The telescopic hose is connected to the air guide hole of the upper dust cover. A spring is also installed in the middle of the top surface of the upper dust cover, and the spring is sleeved on the transmission column.

[0010] As a further preferred embodiment of this utility model, the air duct extends into the transmission compartment and a second telescopic hose is installed at the top of the air duct. The second telescopic hose is connected to the air duct of the lower dust cover, and the upper end of the second telescopic hose is connected to the bottom edge of the lower dust cover.

[0011] As a further preferred embodiment of this utility model, a sealing strip is installed at the bottom of the upper dust cover, and a sealing groove is provided at the top of the lower dust cover to cooperate with the sealing strip. The sealing strip and the sealing groove are respectively connected to the air guide hole.

[0012] As a further preferred embodiment of this utility model, a lower electric push rod is vertically installed inside the transmission chamber, and the telescopic rod of the lower electric push rod is connected to the support plate.

[0013] As a further preferred embodiment of the present invention, an upper electric push rod is installed on the top of the device body, and the telescopic rod of the upper electric push rod is connected to the top of the fixed frame.

[0014] (III) Beneficial Effects

[0015] This invention provides a dust removal device for silicon wafer thinning. It has the following beneficial effects:

[0016] This invention uses a dust removal component to absorb debris. When thinning a silicon wafer, it is placed on a tray, and then the upper dust cover is lowered and fitted with the lower dust cover to form a relatively sealed thinning cavity. The debris generated after the thinning disc rotates against the silicon wafer is sucked out through the dust removal holes, which can prevent the debris from scattering. At the same time, after the thinning work is completed, the upper dust cover is moved up, the sealing strip separates from the sealing groove, and the air guide hole is exposed for continuous dust suction, further improving the dust removal efficiency. Attached Figure Description

[0017] Figure 1 This is an external structural diagram of the dust removal device for silicon wafer thinning described in this utility model;

[0018] Figure 2 This is an internal structural diagram of the dust removal device for silicon wafer thinning described in this utility model;

[0019] Figure 3 This is a diagram showing the internal structure of the upper and lower dust covers of this utility model.

[0020] In the diagram: 1. Device body; 2. Upper electric push rod; 3. Slide groove; 4. Lifting plate; 5. Dust removal assembly; 6. Air guide hose; 7. Dust collector; 8. Telescopic hose one; 9. Fixing frame; 10. Motor; 11. Spring; 12. Transmission column; 13. Upper dust cover; 14. Lower dust cover; 15. Telescopic hose two; 16. Air guide pipe; 17. Lower electric push rod; 18. Support plate; 19. Thinning plate; 20. Dust removal hole; 21. Sealing strip; 22. Sealing groove; 23. Air guide hole. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-3 This utility model provides a technical solution: a dust removal device for silicon wafer thinning, comprising a device body 1, the inside of which forms a thinning chamber and a transmission chamber. A dust removal assembly 5 is installed inside the thinning chamber. The dust removal assembly 5 includes an upper dust cover 13, a lower dust cover 14, a lifting plate 4, and an air guide pipe 16. The upper dust cover 13 is disposed between the lifting plate 4 and the lower dust cover 14, forming a thinning cavity between them. A thinning plate 19 and a support plate 18 are disposed within the thinning cavity. A fixing frame 9 and a motor 1 are installed on the top of the lifting plate 4. 0. The motor 10 is placed inside the fixed frame 9 and the power output end of the motor 10 is connected to the transmission column 12. The end of the transmission column 12 passes through the upper dust cover 13 and is fixedly connected to the thinning disk 19. The motor 10 drives the thinning disk 19 through the transmission column 12. After the thinning disk 19 is attached to the silicon wafer, it performs a thinning operation. The support plate 18 is placed inside the lower dust cover 14. The upper dust cover 13 and the lower dust cover 14 are both provided with air guide holes 23. The inner walls of the upper dust cover 13 and the lower dust cover 14 are provided with several dust removal holes 20 that communicate with the air guide holes 23.

[0023] Further improvements include longitudinally extending grooves 3 on both side walls of the device body 1. A dust collector 7 is installed on the outer wall of the device body 1 below the grooves 3. The dust collector 7 is connected to a flexible air duct 6 and an air duct 16. Both ends of the lifting plate 4 pass through the grooves 3 and are connected to the flexible air duct 6. A telescopic flexible hose 8 is installed at the bottom of the lifting plate 4, and the end of the telescopic flexible hose 8 is connected to the top edge of the upper dust cover 13. The telescopic flexible hose 8 communicates with the air duct 23 of the upper dust cover 13. A spring 11 is also installed in the middle of the top surface of the upper dust cover 13, and the spring 11 is sleeved on the transmission column 12. The air duct 16 extends into the transmission chamber and a telescopic hose 15 is installed on the top of the air duct 16. The telescopic hose 15 is connected to the air duct 23 of the lower dust cover 14. The upper end of the telescopic hose 15 is connected to the bottom edge of the lower dust cover 14. Debris is sucked in from the dust removal hole 20 and guided into the telescopic hose 8 and the telescopic hose 15 through the air duct 23. The telescopic hose 8 guides the air into the air duct 6 through the lifting plate 4. The telescopic hose 15 guides the air into the air duct 16 and finally into the dust collector 7.

[0024] Further improvements include a sealing strip 21 installed at the bottom of the upper dust cover 13 and a sealing groove 22 for use with the sealing strip 21 at the top of the lower dust cover 14. The sealing strip 21 and the sealing groove 22 are respectively connected to the air guide hole 23. After the upper dust cover 13 continues to move downward, the sealing strip 21 is embedded in the sealing groove 22, so that a relatively sealed thinning cavity is formed between the upper dust cover 13 and the lower dust cover 14, which can prevent debris from flying out during the thinning process.

[0025] In a further improvement, a lower electric push rod 17 is vertically installed inside the transmission compartment. The telescopic rod of the lower electric push rod 17 is connected to the support plate 18. After the lower electric push rod 17 is started, it drives the support plate 18 to move vertically and adjust the thinning amount.

[0026] In a further improvement, an upper electric push rod 2 is installed on the top of the device body 1. The telescopic rod of the upper electric push rod 2 is connected to the top of the fixed frame 9. After the upper electric push rod 2 is started, it drives the fixed frame 9 and the various components connected below the fixed frame 9 to move.

[0027] Working principle: Place the silicon wafer on the tray 18, then turn on the upper electric push rod 2. The electric push rod drives the fixing frame 9 to move down, and the upper dust cover 13 and the lower dust cover 14 fit together. The sealing strip 21 is embedded in the sealing groove 22. Turn on the dust collector 7 and the motor 10. The motor 10 drives the transmission column 12 to rotate. The thinning disc 19 thins the silicon wafer. The debris generated during the thinning process is sucked in through the dust removal hole 20 and enters the dust collector 7 through the first telescopic hose 8, the lifting plate 4, the air guide hose 6, the second telescopic hose 15, and the air guide pipe 16. After the thinning is completed, the upper dust cover 13 moves up, and the silicon wafer can be removed.

[0028] The present invention comprises: 1. Device body; 2. Upper electric push rod; 3. Slide groove; 4. Lifting plate; 5. Dust removal assembly; 6. Air guide hose; 7. Dust collector; 8. Telescopic hose one; 9. Fixing frame; 10. Motor; 11. Spring; 12. Transmission column; 13. Upper dust cover; 14. Lower dust cover; 15. Telescopic hose two; 16. Air guide pipe; 17. Lower electric push rod; 18. Support plate; 19. Thinning disc; 20. Dust removal hole; 21. Sealing strip; 22. Sealing groove; 23. Air guide hole. All components are general standard parts or parts known to those skilled in the art. Their structure and principle can be learned by those skilled in the art through technical manuals or conventional experimental methods. The problem solved by this invention is the existing limitations in the thinning process of silicon wafers. During the process, debris will scatter in all directions. Current dust removal devices only absorb and remove dust from the outside of the silicon wafer, but debris still scatters and affects the working environment. This utility model uses the combination of the above-mentioned components to absorb debris through the dust removal component 5. When thinning the silicon wafer, it is placed on the support plate 18, and then the upper dust cover 13 is moved down and attached to the lower dust cover 14 to form a relatively sealed thinning cavity. The debris generated after the thinning disk 19 is attached to the silicon wafer and rotates is sucked out through the dust removal hole 20, which can prevent debris from scattering. At the same time, after the thinning work is completed, the upper dust cover 13 is moved up, the sealing strip 21 separates from the sealing groove 22, and the air guide hole 23 is exposed for continuous dust suction, further improving the dust removal efficiency.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0030] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A dust removal device for silicon wafer thinning, comprising a device body (1), characterized in that: The device body (1) has a thinning chamber and a transmission chamber inside. A dust removal assembly (5) is installed inside the thinning chamber. The dust removal assembly (5) includes an upper dust cover (13), a lower dust cover (14), a lifting plate (4), and an air guide pipe (16). The upper dust cover (13) is located between the lifting plate (4) and the lower dust cover (14). A thinning cavity is formed between the upper dust cover (13) and the lower dust cover (14), and a thinning plate (19) and a support plate (18) are installed inside the thinning cavity. A fixing frame (9) and a transmission chamber are installed on the top of the lifting plate (4). The motor (10) is placed inside the fixed frame (9) and a transmission column (12) is connected to the power output end of the motor (10). The end of the transmission column (12) passes through the upper dust cover (13) and is fixedly connected to the thinning plate (19). The tray (18) is placed inside the lower dust cover (14). Both the upper dust cover (13) and the lower dust cover (14) have air guide holes (23) inside. Several dust removal holes (20) communicating with the air guide holes (23) are opened on the inner walls of the upper dust cover (13) and the lower dust cover (14).

2. The dust removal device for silicon wafer thinning according to claim 1, characterized in that: The device body (1) has longitudinally opened sliding grooves (3) on both sides. A dust collector (7) is installed on the outer wall of the device body (1) and below the sliding grooves (3). A duct hose (6) and an air duct (16) are connected to the dust collector (7). The two ends of the lifting plate (4) pass through the sliding grooves (3) and are connected to the duct hoses (6).

3. The dust removal device for silicon wafer thinning according to claim 1, characterized in that: The bottom of the lifting plate (4) is equipped with a telescopic hose (8), and the end of the telescopic hose (8) is connected to the top edge of the upper dust cover (13). The telescopic hose (8) is connected to the air guide hole (23) of the upper dust cover (13). A spring (11) is also installed in the middle of the top surface of the upper dust cover (13). The spring (11) is sleeved on the transmission column (12).

4. The dust removal device for silicon wafer thinning according to claim 1, characterized in that: The air duct (16) extends into the transmission compartment and a telescopic hose (15) is installed on the top of the air duct (16). The telescopic hose (15) is connected to the air duct (23) of the lower dust cover (14). The upper end of the telescopic hose (15) is connected to the bottom edge of the lower dust cover (14).

5. The dust removal device for silicon wafer thinning according to claim 1, characterized in that: The bottom of the upper dust cover (13) is equipped with a sealing strip (21), and the top of the lower dust cover (14) is provided with a sealing groove (22) that works in conjunction with the sealing strip (21). The sealing strip (21) and the sealing groove (22) are respectively connected to the air guide hole (23).

6. The dust removal device for silicon wafer thinning according to claim 1, characterized in that: The transmission compartment is vertically installed with a lower electric push rod (17), and the telescopic rod of the lower electric push rod (17) is connected to the support plate (18).

7. The dust removal device for silicon wafer thinning according to claim 1, characterized in that: The device body (1) is equipped with an upper electric push rod (2) on its top, and the telescopic rod of the upper electric push rod (2) is connected to the top of the fixed frame (9).

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