Rotary plane grinding equipment

Abstract

The utility model provides rotating plane polishing equipment, and belongs to the technical field of semiconductor polishing equipment. Comprising a grinding machine table, a grinding disc is rotationally arranged on the grinding machine table, a mounting stand column is vertically and rotationally connected to the position, located on one side of a water retaining frame, of the grinding machine table, a clamping assembly is arranged on the mounting stand column in a lifting mode, the water retaining frame is arranged on the outer side of the grinding disc, and a plurality of spraying heads facing the grinding disc are arranged on the upper edge of the water retaining frame; a liquid collecting tank with a water outlet is arranged between the water retaining frame and the polishing disc, a mirror surface observation platform is arranged on the portion, located on one side of the water retaining frame, of the polishing machine table, and a workpiece moves between the mirror surface observation platform and the polishing disc by rotating the installation stand column. The grinding disc is washed through the spraying head, grinding scraps are prevented from flying, the surface of the silicon substrate can be kept transparent as much as possible, after the silicon substrate is moved to the position above the mirror surface observation platform, a worker can observe the grinding condition of the end face of the silicon substrate through the mirror surface observation platform, and the effect of improving observation convenience of the ground end face of the silicon substrate is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor polishing equipment technical field especially relates to a rotary plane polishing equipment. BACKGROUND

[0002] The photovoltaic industry is a new industry, with the rapid development of the photovoltaic industry, the requirement of solar power generation for semiconductor materials such as single and polycrystalline silicon increases, and the processing equipment for single and polycrystalline silicon is required to be higher.

[0003] When processing silicon wafers and silicon blocks, the semiconductor material needs to be polished to different degrees according to customer product requirements, so that the product meets the process needs and is convenient for subsequent production and processing of semiconductor materials.

[0004] The patent with publication number CN223071121U discloses a power semiconductor chip silicon-based oxide layer polishing device, which comprises an operating table, a rotating connection shaft is rotatably connected through the surface of one side of the operating table, a polishing disc is fixedly connected to the top of the rotating connection shaft, a first power assembly is installed on the lower surface of the operating table to drive the rotating connection shaft to rotate, a lifting connecting frame is arranged on one side of the polishing disc, and a feeding disc is arranged on the lifting connecting frame.

[0005] However, a large amount of waste is generated during polishing, which affects the timely observation of the polishing state of the silicon-based surface oxide layer. UTILITY MODEL CONTENT

[0006] In view of the above problems, the utility model provides a rotary plane polishing equipment.

[0007] In order to achieve the above utility model purposes, the utility model adopts the following technical solutions:

[0008] The application provides a rotary plane polishing device, which comprises a polishing machine table, a polishing disc arranged on the polishing machine table and rotating, a first driving element arranged in the polishing machine table and used for driving the polishing disc to rotate, a clamping assembly arranged above the polishing disc and used for clamping a silicon substrate, a mounting column vertically and rotatably connected to one side of a water baffle frame on the polishing machine table, the clamping assembly being arranged on the mounting column and being arranged in a lifting manner, a second driving element arranged on the mounting column and used for driving the clamping assembly to lift, a water baffle frame arranged on the polishing machine table and located on the outer side of the polishing disc, a plurality of spray heads arranged on the upper edge of the water baffle frame and facing the polishing disc, a liquid supply assembly arranged on the polishing machine table and connected with the spray heads and used for supplying flushing liquid to the spray heads, a liquid collecting groove arranged on the polishing machine table and located between the water baffle frame and the polishing disc, a water outlet arranged in the liquid collecting groove, a collecting assembly connected with the water outlet and used for collecting the flushing liquid, a mirror observation platform arranged on one side of the water baffle frame on the polishing machine table, and a limiting element arranged on the polishing machine table and used for limiting the rotation of the mounting column.

[0009] Further, the liquid supply assembly comprises a water tank and a water pump, the water tank is used for containing the flushing liquid, the top of the water baffle frame is provided with an annular flushing pipe, the spray head is arranged on the flushing pipe, the water tank is connected with the flushing pipe through a liquid inlet pipe, and the water pump is arranged on the liquid inlet pipe.

[0010] The collecting assembly comprises a backflow pipe, two partitions are vertically arranged in the water tank, the water tank is sequentially divided into a backflow area, a sedimentation area and a clean water area through the two partitions, the bottom of the partition between the backflow area and the sedimentation area is provided with an opening, the top of the partition between the sedimentation area and the clean water area is provided with a filter cloth, one end of the backflow pipe is connected with the water outlet, and the other end of the backflow pipe is connected with the backflow area, and the flushing pipe is connected with the clean water area.

[0011] Further, the clamping assembly comprises a mounting rod and a mounting frame, one end of the mounting rod is vertically and movably connected to the mounting column, the other end of the mounting rod is fixedly connected with the mounting frame, a plurality of positioning bolts are arranged on the mounting frame in a circumferential direction of the mounting frame, and one end of the positioning bolt close to the center of the mounting frame is rotatably provided with an abutting seat used for contacting the side wall and the top wall of the silicon substrate.

[0012] Further, the second driving element comprises a second driving motor, the second driving motor is fixedly arranged at the top end of the mounting column, a screw rod is rotatably arranged on the mounting column, the second driving motor is used for driving the screw rod to rotate, and the screw rod penetrates through the mounting rod and is threadedly matched with the mounting rod.

[0013] Further, the mirror observation platform comprises a support plate and an observation mirror, the support plate is made of transparent material, the support plate is fixedly arranged on the polishing machine table, and the observation mirror is arranged below the support plate.

[0014] Further, the limiting piece comprises an elastic piece and a limiting pin, the polishing machine table is provided with a mounting seat, the bottom end of the mounting column is rotationally connected with the mounting column, at least one limiting slot is formed on the mounting column along the circumferential direction of the mounting column, the limiting pin is radially slidably arranged on the side wall of the mounting seat, the elastic piece is arranged in the mounting seat and is used for driving the limiting pin to move towards the mounting column so that the limiting pin is inserted and matched with the limiting slot, and the limiting pin is inserted and connected with the limiting slot when the mounting column is rotated to the position that the workpiece is above the polishing disc.

[0015] The utility model discloses the beneficial effects are: when polishing the silicon base end face oxide layer, through the spray head to the polishing disc, avoid polishing waste flying, and can make silicon base surface keep as bright as possible, and the spray head can also carry out simple washing to the silicon base end face when the silicon base is lifted from the water baffle frame, after the silicon base is moved to the mirror surface observation platform top, the staff can conveniently observe the polishing condition of the silicon base end face through the mirror surface observation platform. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is the whole structure schematic diagram of the rotating plane polishing equipment of the embodiment of the application.

[0017] Figure 2 It is Figure 1 It is the partial enlarged schematic diagram of part A.

[0018] Figure 3 It is the sectional structure schematic diagram of the water baffle frame and the water tank of the embodiment of the application.

[0019] Figure 4 It is the partial sectional structure schematic diagram of the mounting seat of the embodiment of the application.

[0020] 1, polishing machine table;11, mirror surface observation platform;111, support plate;112, observation mirror;12, mounting seat;121, elastic piece;122, limiting pin;2, polishing disc;21, first driving piece;31, mounting column;311, limiting slot;32, mounting rod;33, mounting frame;34, positioning bolt;35, abutment seat;36, screw rod;37, second driving motor;4, water baffle frame;41, spray head;42, liquid collecting tank;51, water tank;52, water pump;53, flushing pipe;54, liquid inlet pipe;61, partition;62, backflow area;63, sedimentation area;64, clear water area;65, opening;66, filter cloth. DETAILED DESCRIPTION

[0021] In order to better understand the above technical solutions, the above technical solutions will be described in detail below in combination with the drawings in the specification and specific embodiments.

[0022] The embodiment of the application discloses a rotating plane polishing equipment, which refers to Figure 1 And Figure 2, including the polishing machine table 1, the polishing disc 2 is rotatably installed on the polishing machine table 1, and the first driving member 21 is arranged in the polishing machine table 1 and used for driving the polishing disc 2 to rotate. Specifically, the first driving member 21 can be a first driving motor, and the first driving motor is used for driving the polishing disc 2 to rotate. A clamping assembly for clamping the silicon base is arranged on the polishing machine table 1 above the polishing disc 2, and the clamping assembly is connected to the working machine table through a second driving member. After the silicon base is clamped and fixed by the clamping assembly, the clamping assembly is driven to descend, so that the silicon base is in contact with the rotating polishing disc 2, and the polishing of the oxide layer on the bottom surface of the silicon base is realized.

[0023] Specifically, a mounting column 31 is vertically arranged on the polishing machine table 1, the clamping assembly includes a mounting rod 32 and a mounting frame 33, a sliding groove is vertically arranged on the mounting column 31, one end of the mounting rod 32 is slidably connected in the sliding groove, and the other end of the mounting rod 32 is fixedly connected with the mounting frame 33. The second driving member can be a second driving motor 37, a vertical screw rod 36 is arranged on the mounting column 31, the screw rod 36 is rotatably connected to the mounting column 31, the second driving motor 37 is fixedly arranged on the top end of the mounting column 31 through bolts, the output shaft of the second driving motor 37 is connected with the screw rod 36 through a shaft coupling, and the second driving motor 37 is a servo motor, so as to drive the screw rod 36 to rotate in opposite directions. A screw rod sleeve is fixedly arranged on the mounting rod 32, the screw rod sleeve is sleeved on the screw rod 36 and threadedly matched with the screw rod 36, and the mounting frame 33 on the mounting rod 32 is vertically lifted through the cooperation of the screw rod 36 and the screw rod sleeve and the cooperation of the mounting rod 32 and the sliding groove.

[0024] A plurality of positioning bolts 34 are arranged on the mounting frame 33 and spaced apart along the circumferential direction of the mounting frame 33, and the positioning bolts 34 are threadedly connected with the mounting frame 33 in the radial direction of the mounting frame 33. An abutting seat 35 is rotatably arranged on one end of the positioning bolt 34 extending into the mounting frame 33, and an abutting groove is arranged on the end of the abutting seat 35 away from the positioning bolt 34. By rotating the positioning bolt 34, the abutting seat 35 abuts against the side surface and the top surface of the silicon base, and at least three abutting seats 35 abut against the silicon base in the circumferential direction, so that the silicon base is effectively fixed in the mounting frame 33.

[0025] Referring to Figure 3 A water retaining frame 4 is coaxially arranged on the polishing machine table 1 and located outside the polishing disc 2, a plurality of spray heads 41 are arranged on the top of the water retaining frame 4 and face the polishing disc 2 in the circumferential direction of the water retaining frame 4, the spray heads 41 are connected with a liquid supply assembly for supplying washing liquid to the spray heads 41, and a liquid collecting groove 42 is arranged between the water retaining frame 4 and the polishing disc 2 on the polishing machine table 1. A water outlet is arranged in the liquid collecting groove 42, and a collecting assembly for collecting the washing liquid is connected with the water outlet. By continuously spraying the washing liquid on the polishing disc 2 during the polishing of the silicon base, the generated waste can be effectively removed, and the polished area of the silicon base can be clearly observed after being lifted from the polishing disc 2.

[0026] Referring to Figure 4 , in order to facilitate the observation of the silicon substrate wall, in the embodiment, the mounting column 31 is rotatably mounted on the workbench, and a mirror observation platform 11 is arranged on one side of the water baffle 4 on the polishing machine 1. The silicon substrate can be rotated from above the polishing disc 2 to above the mirror observation platform 11 by rotating the mounting column 31. The mirror observation platform 11 is provided with a mirror with a certain angle, and the worker can observe the silicon substrate wall reflected on the mirror 112 from the front side of the polishing machine 1, thereby eliminating the work of the worker bending over to observe the polishing degree of the silicon substrate wall from above.

[0027] A limiting piece is arranged on the polishing machine 1 to limit the rotation of the mounting column 31, so that the mounting column 31 can be kept in a stable and fixed state during polishing of the silicon substrate. Specifically, the limiting piece can be an elastic piece 121 and a limiting pin 122. The mounting column 31 is rotatably connected to a mounting seat 12 fixed on the polishing machine 1. An active hole is formed in the side wall of the mounting seat 12 along the radial direction thereof, and the limiting pin 122 is arranged in the active hole. The end of the limiting pin 122 extending out of the mounting seat 12 is linked with a pull ring or a handle. A limiting groove 311 adapted to the limiting pin 122 is formed in the outer wall of the mounting column 31. The elastic piece 121, which can be a spring, is sleeved on the limiting pin 122. One end of the spring abuts against the limiting pin 122, and the other end abuts against the mounting seat 12. When the mounting column 31 is rotated to align the limiting groove 311 with the limiting pin 122, the limiting pin 122 is pushed to align with the limiting groove 311 under the action of the spring to limit the rotation of the mounting column 31. The limiting pin 122 on the mounting column 31 is provided with at least one limiting groove 311. When the silicon substrate is moved to above the polishing disc 2 for polishing of the end surface of the silicon substrate, the limiting pin 122 is aligned with one limiting groove 311.

[0028] In the embodiment of the present application, the liquid supply assembly comprises a water tank 51 and a water pump 52, the water tank 51 is used for containing the washing liquid, the top of the water retaining frame 4 is coaxially fixed with an annular flushing pipe 53, the spray head 41 is installed on the flushing pipe 53 and communicates with the flushing pipe 53. The water tank 51 is connected with the flushing pipe 53 through a liquid inlet pipe 54, the water pump 52 is installed on the liquid inlet pipe 54 and used for pumping the washing liquid to the flushing pipe 53. Two partitions 61 are arranged in the water tank 51, the partitions 61 are vertically arranged in the water tank 51, the water tank 51 is divided into a reflux zone 62, a sedimentation zone 63 and a clean water zone 64 by the two partitions 61, the liquid inlet pipe 54 is connected with the clean water zone 64 in the water tank 51, one end of the reflux pipe is connected with the liquid collecting tank 42 and the other end is connected with the reflux zone 62, the bottom of the partition 61 between the reflux zone 62 and the sedimentation zone 63 is provided with an opening 65, the top of the partition 61 between the sedimentation zone 63 and the clean water zone 64 is provided with a filter cloth 66, the upper edge height of the filter cloth 66 should be not higher than the upper edge height of the other partition 61. The washing liquid flowing out from the liquid collecting tank 42 is received by the reflux zone 62, after sedimentation, the upper clear liquid in the sedimentation zone 63 is filtered by the filter cloth 66 and then enters the clean water zone 64, and finally is pumped again to the polishing disc 2 to supply the silicon substrate with washing liquid, so that the washing liquid is reused.

[0029] Further, the mirror observation platform 11 comprises a support plate 111 and an observation mirror 112, the support plate 111 is made of transparent material, such as glass or PC plate, and the observation mirror 112 is installed in the polishing machine table 1 and located below the support plate 111, the observation mirror 112 is installed in the polishing machine table 1 by damping hinged mode, the angle of the observation mirror 112 can be conveniently adjusted, and the silicon substrate can be supported above the observation mirror 112 by the support plate 111, so that the observation effect of the observation mirror 112 is not affected by the friction of the silicon substrate.

[0030] Those skilled in the art will appreciate that although the preferred embodiments of the present application have been described, once the basic creative concept is known, those skilled in the art can make further changes and modifications to the embodiments. Therefore, the appended claims are intended to include the preferred embodiments and all changes and modifications falling within the scope of the present application. Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application also intends to include these modifications and variations.

Claims

1. A rotary planar polishing apparatus, characterized by: The polishing machine table (1) is provided with a polishing disc (2) rotatingly arranged thereon, a first driving member (21) is arranged in the polishing machine table (1) for driving the polishing disc (2) to rotate, a clamping assembly for clamping a silicon substrate is arranged above the polishing disc (2), a mounting column (31) is vertically and rotatably connected to one side of a water baffle (4) on the polishing machine table (1), the clamping assembly is arranged on the mounting column (31) in a lifting manner, a second driving member for driving the clamping assembly to lift is arranged on the mounting column (31), a water baffle (4) is arranged on the polishing machine table (1) outside the polishing disc (2), a plurality of spray heads (41) are arranged on the upper edge of the water baffle (4) on the polishing machine table (1) and face the polishing disc (2), a liquid supply assembly connected with the spray heads (41) for supplying flushing liquid to the spray heads (41) is arranged on the polishing machine table (1), a liquid collecting groove (42) is arranged between the water baffle (4) and the polishing disc (2) on the polishing machine table (1), a water outlet is arranged in the liquid collecting groove (42), and a collecting assembly for collecting flushing liquid is connected with the water outlet, a mirror observation platform (11) is arranged on one side of the water baffle (4) on the polishing machine table (1), and the workpiece is moved between the mirror observation platform (11) and the polishing disc (2) by rotating the mounting column (31), and a limiting member for limiting rotation of the mounting column (31) is arranged on the polishing machine table (1).

2. A rotary planar polishing apparatus according to claim 1, wherein The liquid supply assembly comprises a water tank (51) and a water pump (52), the water tank (51) is used for containing flushing liquid, a ring-shaped flushing pipe (53) is arranged on the top of the water baffle (4), the spray heads (41) are arranged on the flushing pipe (53), the water tank (51) is connected with the flushing pipe (53) through a liquid inlet pipe (54), and the water pump (52) is arranged on the liquid inlet pipe (54); The collecting assembly comprises a backflow pipe, two partitions (61) are vertically arranged in the water tank (51), the water tank (51) is sequentially divided into a backflow area (62), a sedimentation area (63) and a clean water area (64) by the two partitions (61), an opening (65) is arranged at the bottom of the partition (61) between the backflow area (62) and the sedimentation area (63), a filter cloth (66) is arranged at the top of the partition (61) between the sedimentation area (63) and the clean water area (64), one end of the backflow pipe is connected with the water outlet, and the other end of the backflow pipe is connected with the backflow area (62), and the flushing pipe (53) is connected with the clean water area (64).

3. A rotary planar polishing apparatus according to claim 1, wherein The clamping assembly comprises a mounting rod (32) and a mounting frame (33), one end of the mounting rod (32) is vertically and liftingly connected to the mounting column (31), the other end of the mounting rod (32) is fixedly connected with the mounting frame (33), a plurality of positioning bolts (34) are arranged on the mounting frame (33) in a circumferential direction, and an abutting seat (35) for contacting the side wall and the top wall of the silicon substrate is rotatably arranged at one end of the positioning bolt (34) close to the center of the mounting frame (33).

4. A rotary planar polishing apparatus according to claim 3, wherein The second driving member comprises a second driving motor (37) fixedly arranged at the top end of the mounting column (31), a screw rod (36) is rotatably arranged on the mounting column (31), the second driving motor (37) is used for driving the screw rod (36) to rotate, and the screw rod (36) penetrates through the mounting rod (32) and is in threaded cooperation with the mounting rod (32).

5. A rotary planar polishing apparatus according to claim 1, wherein The mirror observation platform (11) comprises a support plate (111) and an observation mirror (112), the support plate (111) is made of transparent material, the support plate (111) is fixedly arranged on the grinding machine table (1), and the observation mirror (112) is arranged below the support plate (111).

6. A rotary planar polishing apparatus according to claim 5, wherein The limiting member comprises an elastic member (121) and a limiting pin (122), the grinding machine table (1) is provided with a mounting seat (12), the bottom end of the mounting column (31) is rotatably connected with the mounting column (31), at least one limiting groove (311) is formed on the mounting column (31) along the circumferential direction of the mounting column (31), the limiting pin (122) is slidably arranged on the side wall of the mounting seat (12) in the radial direction of the mounting seat (12), the elastic member (121) is arranged in the mounting seat (12) and is used for driving the limiting pin (122) to move towards the mounting column (31) so that the limiting pin (122) is in plug-in cooperation with the limiting groove (311), and the limiting pin (122) is in plug-in connection with the limiting groove (311) when the mounting column (31) is rotated to the position that the workpiece is above the grinding disc (2).

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