Heat dissipation structure of parallel multi-channel optical module

Abstract

The utility model discloses a heat dissipation structure of a parallel multichannel optical module, the heat dissipation structure comprises a first heat dissipation part, the first heat dissipation part comprises a first heat dissipation plate, and the first heat dissipation plate is fixed on a circuit board and contacts with the surface of a function module on the surface of the circuit board; the third heat dissipation part comprises a third heat dissipation plate, the third heat dissipation plate is connected with the first heat dissipation plate, a plurality of heat dissipation partition plates are arranged on the surface of the third heat dissipation plate, the heat dissipation partition plates are linearly arranged at equal intervals, and the heat dissipation partition plates are perpendicular to the third heat dissipation plate; a heat dissipation channel used for containing a single light emitter is formed between the adjacent heat dissipation partition plate and the third heat dissipation plate, and the inner side face of the heat dissipation channel makes contact with the light emitter. Aiming at the characteristics of the existing parallel multi-channel optical module, the parallel multi-channel optical module provided by the utility model transfers and dissipates heat generated when the parallel multi-channel optical module works, thereby improving the heat dissipation efficiency of the parallel multi-channel optical module and improving the heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, and in particular to a heat dissipation structure for a parallel multi-channel optical module. Background Technology

[0002] In the field of optical fiber communication technology, optical modules play a crucial role as key components for converting electrical signals to optical signals. They are widely used in data communication, telecommunications networks, data centers, and various high-speed data transmission systems, ensuring efficient, long-distance, and low-loss transmission of information. The basic working principle of an optical module is that at the transmitting end, electrical signals are converted into optical signals and transmitted through optical fiber, a highly efficient transmission medium; at the receiving end, the optical signals are converted back into electrical signals for subsequent processing or analysis. This process not only requires efficient and accurate signal conversion but also poses a significant challenge to the thermal management capabilities of the optical module.

[0003] Optical modules inevitably generate heat during operation, primarily due to energy losses during electro-optical and opto-electrical conversion. To ensure stable operation and long-term reliability, their operating temperature must be strictly controlled within a certain range. Typically, the maximum operating temperature of an optical module should not exceed 85 degrees Celsius. Exceeding this temperature limit will not only lead to performance degradation but may also cause equipment failure and shorten its lifespan.

[0004] However, industrial environments are often filled with dust, making traditional air-cooling solutions impractical, as dust accumulation quickly clogs airflow and reduces heat dissipation efficiency. Therefore, current technologies primarily improve heat dissipation by modifying the optical module's casing material, such as using aluminum, which has good thermal conductivity. While aluminum casings can accelerate heat dissipation to some extent compared to other materials, their overall heat dissipation efficiency is relatively low.

[0005] Especially for parallel multi-channel optical modules, these modules integrate multiple optical transmitters, each of which generates additional heat when it is working, and existing heat dissipation structures are unable to dissipate this heat. Utility Model Content

[0006] Therefore, in order to overcome the above-mentioned shortcomings, this utility model provides a heat dissipation structure for a parallel multi-channel optical module, the heat dissipation structure comprising:

[0007] The first heat dissipation part is disposed on the surface of the circuit board of the optical module. The first heat dissipation part includes a first heat dissipation plate, which is fixed on the circuit board and contacts the surface of the functional module on the surface of the circuit board.

[0008] The third heat dissipation section is disposed on the surface of the optical transmitter of the optical module. The third heat dissipation section includes a third heat dissipation plate, which is connected to the first heat dissipation plate. Multiple heat dissipation partitions are provided on the surface of the third heat dissipation plate. The multiple heat dissipation partitions are arranged linearly and equidistantly. The heat dissipation partitions are arranged perpendicularly to the third heat dissipation plate. A heat dissipation channel for accommodating a single optical transmitter is formed between adjacent heat dissipation partitions and the third heat dissipation plate. The inner side of the heat dissipation channel is in contact with the optical transmitter.

[0009] This invention features a third heat sink installed at the optical transmitter position, enclosing each group of optical transmitters within a corresponding heat dissipation channel. When the optical transmitter generates heat during operation, the heat can be promptly transferred to the first heat sink via the third heat sink and heat dissipation partition. Simultaneously, when the functional modules of the circuit board generate heat, the heat is transferred outward through the first heat sink, thus achieving heat dissipation. This invention addresses the characteristics of existing parallel multi-channel optical modules by transferring and dissipating the heat generated during operation, thereby improving the heat dissipation efficiency and effectiveness of the parallel multi-channel optical module.

[0010] Furthermore, the four corners of the first heat sink are recessed along a first preset direction to form a first connecting portion, where the first preset direction is perpendicular to the circuit board.

[0011] The first connecting part contacts the substrate of the circuit board and is fixed to the substrate by the connecting component. A heat dissipation interlayer that can accommodate the functional modules of the circuit board is formed between the first heat sink and the substrate.

[0012] The first connecting part contacts the substrate, thereby supporting the first heat sink and improving the connection stability between the first heat sink and the substrate. At the same time, due to the support of the first connecting part, there is a certain gap between the first heat sink and the substrate, thereby providing space for the functional module.

[0013] Furthermore, a second connecting portion is provided on one side of the third heat sink, which is inserted between adjacent first connecting portions, and a heat-conducting column is provided on the surface of the second connecting portion;

[0014] The first heat sink plate has a socket corresponding to the heat conduction column, and the heat conduction column and the socket are interference fit.

[0015] By inserting the second connecting part between the adjacent first connecting parts and inserting the heat-conducting column into a socket, the connection between the first heat sink and the third heat sink can be achieved, making disassembly and assembly convenient. At the same time, the heat transfer between the third heat sink and the first heat sink can be achieved through the interference fit between the heat-conducting column and the socket.

[0016] Furthermore, the surface of the first heat sink is also provided with heat dissipation teeth, which are distributed longitudinally and laterally on the surface of the first heat sink to form a heat dissipation tooth array.

[0017] By setting up a heat dissipation tooth array, the contact area with the air can be increased, thereby improving the heat exchange efficiency between the first heat dissipation plate and the air, and increasing the heat dissipation speed.

[0018] Furthermore, the optical module, the first heat dissipation unit, and the second heat dissipation unit are all installed inside the housing. The housing includes an upper shell, one side of which has a mounting cavity that partially accommodates the first heat dissipation unit. The upper shell also has a heat exchange channel that linearly runs through the entire upper shell. The heat exchange channel communicates with the mounting cavity, and the connection between the heat exchange channel and the mounting cavity matches the heat dissipation tooth array.

[0019] By setting up heat exchange channels, the heat exchange fins exchange heat with the air within the channels, thus preventing the heat exchange fin array from being directly exposed and protecting it without affecting heat dissipation.

[0020] Furthermore, the heat dissipation structure also includes a second heat dissipation part, which is integrally disposed within the heat exchange channel. The second heat dissipation part includes a second heat dissipation plate, which is disposed around the heat exchange channel. The heat exchange channel is provided with a mounting groove that matches the second heat dissipation plate at the position corresponding to the heat dissipation tooth array. The second heat dissipation plate is embedded in the mounting groove, and the outer surface of the second heat dissipation plate is in contact with the surface of the heat dissipation teeth.

[0021] The second heat sink is arranged around the heat exchange channel. Heat is exchanged with the air through the second heat sink in the heat exchange channel. Compared with the heat exchange of the first heat sink in the heat exchange channel, the second heat sink can achieve heat exchange in multiple directions in the heat exchange channel, resulting in higher heat dissipation efficiency.

[0022] Furthermore, the inner surface of the second heat sink is provided with a plurality of heat sink columns, which are evenly distributed on the upper and lower surfaces of the inner side of the second heat sink.

[0023] By setting heat dissipation columns on the inner surface of the second heat sink, the contact area with air can be increased, thereby improving heat dissipation efficiency.

[0024] Furthermore, the heat dissipation column is hollow inside.

[0025] The heat dissipation column is designed to be hollow, allowing heat exchange between the inside of the column and the air, further increasing the contact area with the air and improving heat dissipation efficiency.

[0026] This utility model has the following advantages:

[0027] This invention features a third heat sink installed at the optical transmitter position, enclosing each group of optical transmitters within a corresponding heat dissipation channel. When the optical transmitter generates heat during operation, the heat can be promptly transferred to the first heat sink via the third heat sink and heat dissipation partition. Simultaneously, when the functional modules of the circuit board generate heat, the heat is transferred outward through the first heat sink, thus achieving heat dissipation. This invention addresses the characteristics of existing parallel multi-channel optical modules by transferring and dissipating the heat generated during operation, thereby improving the heat dissipation efficiency and effectiveness of the parallel multi-channel optical module. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the heat dissipation structure;

[0029] Figure 2 yes Figure 1 An exploded view of the heat dissipation structure shown.

[0030] Figure 3 yes Figure 2 A schematic diagram of the optical module in the heat dissipation structure shown;

[0031] Figure 4 yes Figure 2 A schematic diagram of the upper shell in the heat dissipation structure shown;

[0032] Figure 5 yes Figure 2 A schematic diagram of the first heat dissipation part in the heat dissipation structure shown;

[0033] Figure 6 yes Figure 2 A schematic diagram of the third heat dissipation section in the heat dissipation structure shown;

[0034] Figure 7 yes Figure 2 A schematic diagram of the second heat dissipation section in the heat dissipation structure shown;

[0035] Figure 8 yes Figure 7 An enlarged schematic diagram of a portion of structure A in the second heat dissipation section shown;

[0036] Figure 9 yes Figure 1 A schematic diagram of the internal structure of the heat dissipation structure shown.

[0037] In the picture:

[0038] 100. Upper shell; 110. Mounting groove; 120. Heat exchange channel; 130. Mounting cavity;

[0039] 200. Lower housing;

[0040] 300. Optical module; 310. Circuit board; 320. Optical transmitter;

[0041] 400, First heat dissipation part; 410, First heat dissipation plate; 420, First connecting part; 430, Heat dissipation teeth; 440, Insertion hole;

[0042] 500. Second heat dissipation unit; 510. Second heat dissipation plate; 520. Heat dissipation column;

[0043] 600, Third heat dissipation section; 610, Third heat dissipation plate; 620, Heat-conducting column; 630, Second connecting part; 640, Heat dissipation partition. Detailed Implementation

[0044] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0045] In this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, without necessarily requiring or implying any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0046] As described in the background section, existing technologies primarily improve heat dissipation performance by modifying the housing material of optical modules, such as using aluminum, which has good thermal conductivity. Although aluminum housings can accelerate heat dissipation to some extent compared to other materials, their heat dissipation efficiency is relatively low. This is especially true for parallel multi-channel optical modules, which integrate multiple optical transmitters, each of which generates additional heat during operation, and existing heat dissipation structures are insufficient to dissipate this heat.

[0047] Example 1:

[0048] Therefore, in order to solve the above-mentioned technical problems existing in the prior art, this embodiment provides a heat dissipation structure for a parallel multi-channel optical module, such as... Figure 2 As shown, the heat dissipation structure includes:

[0049] First heat dissipation section 400, such as Figure 9 As shown, the first heat dissipation part 400 is disposed on the surface of the circuit board 310 of the optical module 300, such as... Figure 5As shown, the first heat dissipation part 400 includes a first heat dissipation plate 410, which is fixed on the circuit board and contacts the surface of the functional module on the surface of the circuit board.

[0050] The third heat dissipation unit 600, such as Figure 9 As shown, the third heat dissipation part 600 is disposed on the surface of the light emitter of the optical module, such as... Figure 6 As shown, the third heat dissipation part includes a third heat dissipation plate 610, which is connected to the first heat dissipation plate. Multiple heat dissipation partitions 640 are provided on the surface of the third heat dissipation plate. The multiple heat dissipation partitions are arranged linearly and equidistantly. The heat dissipation partitions are arranged perpendicularly to the third heat dissipation plate. A heat dissipation channel for accommodating a single light emitter is formed between adjacent heat dissipation partitions and the third heat dissipation plate. The inner side of the heat dissipation channel is in contact with the light emitter.

[0051] In this embodiment, a third heat sink is installed at the position of the light emitter so that each group of light emitters is enclosed in the corresponding heat dissipation channel. When the light emitter generates heat during operation, the heat can be transferred to the first heat sink in a timely manner through the third heat sink and the heat dissipation partition. At the same time, when the functional modules of the circuit board generate heat, the heat will be transferred outward through the first heat sink, thereby achieving heat dissipation.

[0052] This embodiment addresses existing parallel multi-channel optical modules (such as...). Figure 3 The features shown in the figure are used to transfer and dissipate the heat generated by the parallel multi-channel optical module during operation, thereby improving the heat dissipation efficiency and heat dissipation effect of the parallel multi-channel optical module.

[0053] In this embodiment, as Figure 5 As shown, the four corners of the first heat sink are recessed along a first preset direction to form a first connecting portion 420, and the first preset direction is a direction perpendicular to the circuit board.

[0054] The first connecting part contacts the substrate of the circuit board and is fixed to the substrate by the connecting component. A heat dissipation interlayer that can accommodate the functional modules of the circuit board is formed between the first heat sink and the substrate.

[0055] The first connecting part contacts the substrate, thereby supporting the first heat sink and improving the connection stability between the first heat sink and the substrate. At the same time, due to the support of the first connecting part, there is a certain gap between the first heat sink and the substrate, thereby providing space for the functional module.

[0056] In this embodiment, the connecting component may be a connecting screw, connecting pin, connecting bolt, or other connecting component that can be used to fix the first connecting part to the substrate.

[0057] In this embodiment, as Figure 6As shown, a second connecting part 630 is provided on one side of the third heat sink plate. The second connecting part is inserted between adjacent first connecting parts, and a heat-conducting column 620 is provided on the surface of the second connecting part.

[0058] The first heat sink plate has a socket 440 corresponding to the heat conduction column, and the heat conduction column and the socket are interference fit.

[0059] By inserting the second connecting part between the adjacent first connecting parts and inserting the heat-conducting column into a socket, the connection between the first heat sink and the third heat sink can be achieved, making disassembly and assembly convenient. At the same time, the heat transfer between the third heat sink and the first heat sink can be achieved through the interference fit between the heat-conducting column and the socket.

[0060] Furthermore, such as Figure 5 As shown, the surface of the first heat sink is also provided with heat dissipation teeth 430, which are distributed longitudinally and laterally on the surface of the first heat sink to form a heat dissipation tooth array.

[0061] By setting up a heat dissipation tooth array, the contact area with the air can be increased, thereby improving the heat exchange efficiency between the first heat dissipation plate and the air, and increasing the heat dissipation speed.

[0062] In this embodiment, as Figure 1 As shown, the heat dissipation structure may further include a housing, in which the optical module, the first heat dissipation unit, and the second heat dissipation unit are integrally installed. The housing includes an upper housing 100, as shown in the figure. Figure 4 As shown, the upper housing has a mounting cavity 130 on one side that partially accommodates the first heat dissipation part. The upper housing also has a heat exchange channel 120 that linearly runs through the entire upper housing. The heat exchange channel communicates with the mounting cavity, and the communication port between the heat exchange channel and the mounting cavity matches the heat dissipation tooth array.

[0063] The outer casing may also include a lower casing 200, in which the optical module is fixedly installed. The upper casing and the lower casing are fixedly connected by snap-fit, plug-in, screw connection or other detachable connection methods.

[0064] In this embodiment, a heat exchange channel is provided inside the upper shell, so that the heat exchange fins can exchange heat with the air in the heat exchange channel, thereby avoiding the direct exposure of the heat exchange fin array and protecting it without affecting heat dissipation.

[0065] Example 2:

[0066] To further improve heat dissipation efficiency, this embodiment proposes improvements based on Embodiment 1, such as... Figure 2 As shown, the heat dissipation structure may further include a second heat dissipation section 500, such as... Figure 9 As shown, the second heat dissipation unit is entirely disposed within the heat exchange channel, as... Figure 7As shown, the second heat dissipation part includes a second heat dissipation plate 510, which is arranged around the heat exchange channel. The heat exchange channel is provided with a mounting groove 110 that matches the second heat dissipation plate at the position of the heat dissipation tooth array. The second heat dissipation plate is embedded in the mounting groove 110, and the outer surface of the second heat dissipation plate is in contact with the surface of the heat dissipation tooth.

[0067] The second heat sink is arranged around the heat exchange channel. Heat is exchanged with the air through the second heat sink in the heat exchange channel. Compared with the heat exchange of the first heat sink in the heat exchange channel, the second heat sink can achieve heat exchange in multiple directions in the heat exchange channel, resulting in higher heat dissipation efficiency.

[0068] In addition, such as Figure 7 As shown, the inner surface of the second heat sink is provided with a plurality of heat sink columns 520, which are evenly distributed on the upper and lower surfaces of the inner side of the second heat sink.

[0069] By setting heat dissipation columns on the inner surface of the second heat sink, the contact area with air can be increased, thereby improving heat dissipation efficiency.

[0070] like Figure 8 As shown, the heat dissipation column is hollow inside.

[0071] The heat dissipation column is designed to be hollow, allowing heat exchange between the inside of the column and the air, further increasing the contact area with the air and improving heat dissipation efficiency.

[0072] Specifically, the heat generated by the optical module's optical transmitter is promptly transferred to the first heat sink through the third heat sink and the heat dissipation partition. At the same time, when the functional modules of the circuit board generate heat, the heat is transferred outward through the first heat sink. The heat transferred to the first heat sink is transferred to the second heat sink through the heat dissipation teeth, and then dispersed to the heat dissipation column through the second heat sink. The heat dissipation column exchanges heat with the air in the heat exchange channel to achieve heat dissipation.

[0073] This embodiment has a simple structure, high heat dissipation efficiency, and good heat dissipation effect.

[0074] In this invention, the first, second, and third heat dissipation parts are all made of materials with high heat transfer efficiency, preferably copper.

[0075] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation structure for a parallel multi-channel optical module, characterized in that, The heat dissipation structure includes: The first heat dissipation part is disposed on the surface of the circuit board of the optical module. The first heat dissipation part includes a first heat dissipation plate, which is fixed on the circuit board and contacts the surface of the functional module on the surface of the circuit board. The third heat dissipation section is disposed on the surface of the optical transmitter of the optical module. The third heat dissipation section includes a third heat dissipation plate, which is connected to the first heat dissipation plate. Multiple heat dissipation partitions are provided on the surface of the third heat dissipation plate. The multiple heat dissipation partitions are arranged linearly and equidistantly. The heat dissipation partitions are arranged perpendicularly to the third heat dissipation plate. A heat dissipation channel for accommodating a single optical transmitter is formed between adjacent heat dissipation partitions and the third heat dissipation plate. The inner side of the heat dissipation channel is in contact with the optical transmitter.

2. The heat dissipation structure of a parallel multi-channel optical module according to claim 1, characterized in that, The four corners of the first heat sink are recessed along a first preset direction to form a first connecting portion, and the first preset direction is a direction perpendicular to the circuit board. The first connecting part contacts the substrate of the circuit board and is fixed to the substrate by the connecting component. A heat dissipation interlayer that can accommodate the functional modules of the circuit board is formed between the first heat sink and the substrate.

3. The heat dissipation structure of a parallel multi-channel optical module according to claim 2, characterized in that, The third heat sink is provided with a second connecting part on one side, which is inserted between adjacent first connecting parts, and has heat-conducting pillars on its surface; The first heat sink plate has a socket corresponding to the heat conduction column, and the heat conduction column and the socket are interference fit.

4. The heat dissipation structure of a parallel multi-channel optical module according to claim 1, characterized in that, The surface of the first heat sink is also provided with heat dissipation teeth, which are distributed longitudinally and laterally on the surface of the first heat sink to form a heat dissipation tooth array.

5. The heat dissipation structure of a parallel multi-channel optical module according to claim 4, characterized in that, The optical module, the first heat dissipation unit, and the second heat dissipation unit are installed as a whole inside the housing. The housing includes an upper shell. One side of the upper shell has a mounting cavity that partially accommodates the first heat dissipation unit. The upper shell also has a heat exchange channel that linearly runs through the entire upper shell. The heat exchange channel communicates with the mounting cavity, and the connection port between the heat exchange channel and the mounting cavity matches the heat dissipation tooth array.

6. The heat dissipation structure of a parallel multi-channel optical module according to claim 5, characterized in that, The heat dissipation structure further includes a second heat dissipation part, which is integrally disposed within the heat exchange channel. The second heat dissipation part includes a second heat dissipation plate, which is disposed around the heat exchange channel. The heat exchange channel is provided with a mounting groove that matches the second heat dissipation plate at the position corresponding to the heat dissipation tooth array. The second heat dissipation plate is embedded in the mounting groove, and the outer surface of the second heat dissipation plate is in contact with the surface of the heat dissipation teeth.

7. The heat dissipation structure of a parallel multi-channel optical module according to claim 6, characterized in that, The inner surface of the second heat sink is provided with a plurality of heat sink columns, which are evenly distributed on the upper and lower surfaces of the inner side of the second heat sink.

8. The heat dissipation structure of a parallel multi-channel optical module according to claim 7, characterized in that, The heat dissipation column is hollow inside.

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