Exposure equipment

Abstract

The utility model relates to exposure equipment which comprises a target light projection module, a workpiece to be exposed, a focusing light processing module and a focusing module, and the target light projection module is used for forming a target focusing light beam and a target exposure light beam on the workpiece to be exposed; the focusing module comprises a one-dimensional second linear image sensor for receiving the first target projection beam to form a first focusing pattern and for receiving the second target projection beam to form a second focusing pattern; the target projection light beam is obtained by processing a target focusing light beam reflected by the to-be-exposed workpiece based on the focusing module, and the focus position of the target focusing light beam on the to-be-exposed workpiece is determined based on the light and shade contrast of the first focusing pattern and the second focusing pattern. The to-be-exposed workpiece is subjected to exposure processing at the focus position based on the target exposure light beam. According to the scheme, the one-dimensional linear image sensor only needs to process one-dimensional data, and the algorithm and the processing process are relatively simple, so that the overall focusing speed of the exposure equipment is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to exposure equipment technical field, concretely relates to a kind of exposure equipment. BACKGROUND

[0002] Photolithography is widely used in the manufacture of semiconductor devices and displays, such as liquid crystal displays (LCDs) and organic light-emitting diode displays (OLEDs). A photolithography machine is a device that projects a mask pattern onto a substrate surface, glass substrate, or LED through a projection objective lens. It is an exposure technology that exposes and sensitizes a photosensitive layer on the surface of an object. It is a major technology for photolithography and is actively used in the formation of various fine circuits or fine structures. A representative exposure technology is a technique in which light is irradiated onto a mask with the same pattern as the exposure pattern, and the image of the mask is projected onto the surface of the object. As a result, the light of the exposure pattern is irradiated onto the object.

[0003] To ensure that the exposure pattern is accurately exposed, the substrate surface must be accurately controlled by the focus leveling device to be at the specified position. The substrate surface on the workpiece table is located at the best focal plane of the projection objective lens.

[0004] Japanese Patent No. 5007070 uses a coaxial focus position detection method. An exposure apparatus is provided, which includes a focus light source that outputs light that does not expose a photoresist during autofocusing, and a digital microprocessor that modulates the output light of the photoresist. During the period, the light projection optical system includes a micromirror device and an objective lens, and the focus position determination device is configured to set the front focus position at a position optically conjugate to the surface of the substrate. The focus position of the light projection optical system is focused according to the contrast of the light and dark pattern between the focus positions on the back side of the surface. The focus of the light projection optical system is determined between the back sides of the surface. The distance between the projection optical system and the substrate is matched, and in the focus optical system and the light projection optical system. The micromirror device is used for autofocusing, so that the light of the focus light and dark pattern is projected onto the substrate. The focus light source and the exposure light source of the focus optical system are mixed and incident on the substrate, and are switched between autofocusing and exposure. The exposure device of this patent is as follows Figure 1As shown, including the projection optical system 3 which projects the exposure pattern onto the substrate 2 during exposure and the bright-dark pattern for focusing which projects the exposure pattern onto the substrate 2 during exposure. The CCD 20 and the CCD 21 are photoelectric conversion components which receive light from the focusing optical system 4 and convert it into an electrical signal. Since the detection speed (frequency) of the CCD camera will be limited by the CCD and only tens to hundreds of times per second, there is a risk that the high-speed direct drawing exposure method will not be able to detect in time or that the film movement speed of the direct drawing lithography machine will be limited by the detection speed (frequency). In addition, since the CCD camera needs to send the image to the back-end industrial computer or server for image processing and algorithm analysis after capturing the image, the calculation speed of this part will also affect the overall film speed. Practical new content

[0005] The technical problem to be solved by the present application is the low pattern conversion efficiency and slow focusing speed of the exposure equipment provided in the prior art.

[0006] According to one aspect of the present application, an exposure equipment is disclosed, which comprises a target light projection module, a workpiece to be exposed, a focusing light processing module and a focusing module, the target light projection module is used to form a target light beam on the workpiece to be exposed, the target light beam comprises a target focusing light beam and a target exposure light beam;

[0007] The focusing light processing module is used to process the target focusing light beam reflected by the workpiece to be exposed to obtain a first target projection light beam and a second target projection light beam, the focusing module comprises a one-dimensional first linear image sensor and a one-dimensional second linear image sensor, the one-dimensional first linear image sensor is used to receive the first target projection light beam to form a first focusing pattern, and the one-dimensional second linear image sensor is used to receive the second target projection light beam to form a second focusing pattern; the focal point position of the target focusing light beam on the workpiece to be exposed is determined based on the light-dark contrast of the first focusing pattern and the second focusing pattern, and after the focal point position is determined, the workpiece to be exposed is exposed based on the target exposure light beam at the focal point position.

[0008] In some examples, the exposure device further comprises a light source processing module, the light source processing module comprises an exposure light source device, a focusing light source device, a first collimating lens, a second collimating lens, a first half mirror, an internal total reflection mirror and a spatial light modulator, the first collimating lens is arranged between the exposure light source device and the first half mirror, the second collimating lens is arranged between the focusing light source device and the first half mirror, the exposure light source device is configured to provide an exposure light source, the focusing light source device is configured to provide a focusing light source, the exposure light source sequentially passes through the first collimating lens, the parallel exposure light beam formed after the first half mirror, and the parallel focusing light beam coaxial with the focusing light source sequentially passing through the second collimating lens and the first half mirror, the internal total reflection mirror is arranged on one side of the first half mirror, the internal total reflection mirror is configured to reflect the parallel exposure light beam and the parallel focusing light beam, and the spatial light modulator is arranged on one side of the internal total reflection mirror, the spatial light modulator is configured to reflect the target light beam to provide a target projection light for the target light projection module after passing through the internal total reflection mirror.

[0009] In some examples, the target light projection module is arranged on one side of the workpiece to be exposed, and the target light projection module comprises a plane mirror, a third collimating lens, a second half mirror and a projection objective arranged in sequence close to the workpiece to be exposed, the target projection light sequentially reflects through the plane mirror, collimates through the third collimating lens and forms the target light beam projected onto the workpiece to be exposed after passing through the projection objective.

[0010] In some examples, the focusing light processing module comprises a filter, an imaging lens and a third half mirror, the filter is arranged between the second half mirror and the imaging lens, the imaging lens is arranged between the filter and the third half mirror, the target focusing light beam sequentially passes through the filter and the imaging lens, and is split by the third half mirror to provide the first target projection light beam for the one-dimensional first linear image sensor and the second target projection light beam for the one-dimensional second linear image sensor.

[0011] In some examples, the exposure device further comprises a first magnifying objective and a second magnifying objective, the first magnifying objective is arranged between the third half mirror and the one-dimensional first linear image sensor, and the second magnifying objective is arranged between the third half mirror and the one-dimensional second linear image sensor.

[0012] In some examples, the focusing light source device is configured to provide a focusing light source that does not expose photoresist during auto-focusing.

[0013] In some examples, the one-dimensional first linear image sensor is configured to identify the first target projection light beam at a recognition rate of KHz level after receiving the first target projection light beam, and the one-dimensional second linear image sensor is configured to identify the second target projection light beam at a recognition rate of KHz level after receiving the second target projection light beam.

[0014] In some examples, the spatial light modulator is configured as any one of a DMD spatial light modulator, a liquid crystal panel, or a light emitting diode array.

[0015] According to another aspect of the present application, an exposure method is also disclosed, which is implemented based on any one of the exposure apparatuses described above, and the method comprises the following steps:

[0016] Turning on the focusing light source device, and adjusting the focusing positions of the one-dimensional first linear image sensor and the one-dimensional second linear image sensor respectively to determine the focal point position of the focusing light source output by the focusing light source device on the workpiece to be exposed;

[0017] Turning off the focusing light source device;

[0018] Turning on the exposure light source device to complete the exposure process of the workpiece to be exposed at the focal point position after the focal point position is determined.

[0019] This utility model includes, but is not limited to, the following beneficial effects: (1) This solution is based on a one-dimensional linear image sensor to process the received target projection beam. Since the one-dimensional linear image sensor only captures light information on one line, it only needs to process one-dimensional data. The algorithm and processing process are relatively simple, and image analysis and focus detection can be performed more quickly. Compared with the existing CCD camera that needs to process every pixel of the entire image, the amount of data is smaller and the processing speed is faster, thereby improving the overall focusing speed of the exposure equipment; (2) This solution can monitor the status of the workpiece to be exposed in real time based on a one-dimensional linear image sensor, quickly feedback the change of focus position, and ensure that the focus can be adjusted in time during the production process, reducing the error caused by inaccurate focusing; (3) This solution uses an internal total reflection mirror to reflect the parallel exposure beam and the parallel focusing beam, which can effectively guide the beam to a specific direction. By using the principle of total reflection, the loss of light can be reduced, so that more light energy can be effectively utilized. Compared with traditional reflectors, internal total reflection mirrors can provide higher reflectivity in certain wavelength ranges and reduce light scattering and distortion, improve imaging quality and beam quality, thereby improving the image recognition quality of the focusing module and improving focusing accuracy; (4) In this scheme, multiple optical elements (such as collimating lenses, semi-reflective mirrors and internal total reflection mirrors) work together to form parallel exposure beams and focusing beams, reducing scattering and loss during beam propagation, improving beam quality, and thus improving focusing accuracy; (5) In this scheme, the focusing light source device does not expose the photoresist during autofocus, effectively avoiding unnecessary light damage. (6) In this scheme, the recognition rate of the one-dimensional linear image sensor can reach the KHz level, ensuring the fast and accurate processing of the target beam and improving the system's response speed and stability. (7) In this scheme, by placing a magnifying lens in front of the one-dimensional linear image sensor, the resolution of the imaging system can be improved, enabling the one-dimensional linear image sensor to capture more detailed image details and improve the imaging quality. The magnifying lens can effectively focus the beam, increase the light intensity received by the one-dimensional linear image sensor, thereby improving the signal quality, reducing noise impact, and further improving the imaging quality. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0021] Figure 1 This is a schematic diagram of the structure of an exposure device in the prior art;

[0022] Figure 2 This is a schematic diagram of the structure of the exposure device according to an embodiment of the present invention;

[0023] Figure 3 is a distribution diagram of light intensity received by a focusing module of an exposure device according to an embodiment of the present application;

[0024] Figure 4 is a focal point detection system architecture diagram of a one-dimensional linear image sensor according to an embodiment of the present application;

[0025] Figure 5 is a focusing position determination principle diagram according to an embodiment of the present application;

[0026] Figure 6 is a flow chart of an exposure method according to an embodiment of the present application;

[0027] In the figure, 1 is a workpiece to be exposed, 2 is a target light projection module, 21 is a plane mirror, 22 is a third collimating lens, 23 is a second half mirror, 24 is a projection objective lens, 3 is a focusing light processing module, 31 is a filter, 32 is an imaging lens, 33 is a third half mirror, 4 is a focusing module, 41 is a one-dimensional first linear image sensor, 42 is a one-dimensional second linear image sensor, 5 is a light source processing module, 51 is an exposure light source device, 52 is a focusing light source device, 53 is a first collimating lens, 54 is a second collimating lens, 55 is a first half mirror, 56 is an inner total reflection mirror, 57 is a spatial light modulator, 6 is a first magnification objective lens, and 7 is a second magnification objective lens. DETAILED DESCRIPTION

[0028] In order to make the person skilled in the art better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application.

[0029] The term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. In the description of the present invention, it should be understood that the terms "upper," "inner," "lower," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the present invention described herein can be implemented in orders other than those illustrated or described herein.

[0030] To address the problems existing in the prior art, this application provides an exposure device, specifically, such as... Figure 2 As shown, the exposure device includes a target light projection module 2, a workpiece to be exposed 1, a focusing light processing module 3, and a focusing module 4. The target light projection module 2 is used to form a target beam on the workpiece to be exposed 1. The target beam includes a target focusing beam and a target exposure beam.

[0031] The focusing light processing module 3 is used for processing the target focusing light beam reflected by the workpiece 1 to be exposed to obtain a first target projection light beam and a second target projection light beam. The focusing module 4 includes a one-dimensional first linear image sensor 41 and a one-dimensional second linear image sensor 42. The one-dimensional first linear image sensor 41 is used for receiving the first target projection light beam to form a first focusing pattern. The one-dimensional second linear image sensor 42 is used for receiving the second target projection light beam to form a second focusing pattern. The focal point position of the target focusing light beam on the workpiece 1 to be exposed is determined based on the light-dark contrast of the first focusing pattern and the second focusing pattern. After the focal point position is determined, the workpiece 1 to be exposed is exposed at the focal point position based on the target exposure light beam. It can be understood that the technical solution processes the received target projection light beam based on the one-dimensional linear image sensor. Since the one-dimensional linear image sensor only captures light information on a line, only one-dimensional data needs to be processed, the algorithm and processing process are relatively simple, image analysis and focal point detection can be performed more quickly, compared with the CCD camera in the prior art which needs to process each pixel of the entire image, the data amount is smaller, the processing speed is faster, and thus the overall focusing speed of the exposure equipment is improved. Further, the technical solution can monitor the state of the workpiece 1 to be exposed in real time based on the one-dimensional linear image sensor, quickly feedback the change of the focal point position, and ensure that the focal point can be adjusted in time during the production process, thereby reducing the error caused by inaccurate focusing.

[0032] In some examples, the exposure device further comprises a light source processing module 5, the light source processing module 5 comprises an exposure light source device 51, a focusing light source device 52, a first collimating lens 53, a second collimating lens 54, a first half mirror 55, an internal total reflection mirror 56 and a spatial light modulator 57, the first collimating lens 53 is arranged between the exposure light source device 51 and the first half mirror 55, the second collimating lens 54 is arranged between the focusing light source device 52 and the first half mirror 55, the exposure light source device 51 is configured to provide an exposure light source, the focusing light source device 52 is configured to provide a focusing light source, the exposure light source sequentially passes through the first collimating lens 53 and the parallel exposure light beam formed after the first half mirror 55, and the focusing light source sequentially passes through the second collimating lens 54 and the parallel focusing light beam formed after the first half mirror 55. The internal total reflection mirror 56 is arranged on one side of the first half mirror 55, and the internal total reflection mirror 56 is configured to reflect the parallel exposure light beam and the parallel focusing light beam. The spatial light modulator 57 is arranged on one side of the internal total reflection mirror 56, and the spatial light modulator 57 is configured to reflect the target light beam and provide the target projection light for the target light projection module 2 after passing through the internal total reflection mirror 56. In some preferred embodiments, the focusing light source device 52 is configured to provide a focusing light source that does not expose the photoresist during auto-focusing, i.e., the focusing light source device 52 outputs a light source that is not sensitive to the photoresist. In some examples, the focusing light source device 52 can be composed of a red light-emitting diode. It can be understood that the focusing light source device 52 does not expose the photoresist during auto-focusing, effectively avoiding unnecessary light damage and improving material utilization and product quality. Further, in the structure of the present application, based on the reflection of the parallel exposure light beam and the parallel focusing light beam by the internal total reflection mirror 56, the light beams can be effectively directed in a specific direction, and by using the principle of total reflection, the loss of light can be reduced, so that more light energy can be effectively utilized. Compared with traditional mirrors, the internal total reflection mirror 56 can provide higher reflectivity in certain wavelength ranges, and can reduce light scattering and distortion, improve imaging quality and light beam quality, and thus improve the identification quality of the focusing module 4 for the image and improve the focusing accuracy; and by the cooperation of multiple optical elements (such as collimating lenses, half mirrors and internal total reflection mirrors), parallel exposure light beams and focusing light beams are formed, scattering and loss during light beam propagation are reduced, light beam quality is improved, and thus focusing accuracy is improved.

[0033] In some examples, the target light projection module 2 is arranged on one side of the workpiece to be exposed 1, and the target light projection module 2 comprises a plane mirror 21, a third collimating lens 22, a second half mirror 23 and a projection objective 24 arranged in sequence close to the workpiece to be exposed 1. The target projection light is reflected by the plane mirror 21, collimated by the third collimating lens 22 and the projection objective 24 in sequence to form a target light beam and project onto the workpiece to be exposed 1.

[0034] In some examples, the focusing light processing module 3 comprises a filter 31, an imaging lens 32 and a third half mirror 33, the filter 31 is arranged between the second half mirror 23 and the imaging lens 32, the imaging lens 32 is arranged between the filter 31 and the third half mirror 33, the target focusing light beam passes through the filter 31 and the imaging lens 32 in sequence and is split by the third half mirror 33 to provide a first target projection light beam for the one-dimensional first linear image sensor 41 and a second target projection light beam for the one-dimensional second linear image sensor 42.

[0035] In some examples, the exposure device further comprises a first magnifying objective lens 6 and a second magnifying objective lens 7, the first magnifying objective lens 6 is arranged between the third half mirror 33 and the one-dimensional first linear image sensor 41, and the second magnifying objective lens 7 is arranged between the third half mirror 33 and the one-dimensional second linear image sensor 42. It can be understood that by arranging the magnifying objective lens before the one-dimensional linear image sensor, the resolution of the imaging system can be improved, so that the one-dimensional linear image sensor can capture more detailed image details, improve the imaging quality, and the magnifying objective lens can effectively focus the light beam, improve the light intensity received by the sensor, thereby improving the quality of the signal, reducing the influence of noise, and further improving the imaging quality.

[0036] In some examples, the one-dimensional first linear image sensor 41 performs identification processing on the first target projection light beam after receiving the first target projection light beam, and the identification rate is KHz level, and the one-dimensional second linear image sensor 42 performs identification processing on the second target projection light beam after receiving the second target projection light beam, and the identification rate is KHz level. It can be understood that the identification rate of the one-dimensional linear image sensor can reach KHz level, which ensures the rapid and accurate processing of the target light beam and improves the response speed and stability of the system.

[0037] In some examples, the spatial light modulator 57 is configured as any one of a DMD spatial light modulator, a liquid crystal panel or a light-emitting diode array.

[0038] For the convenience of understanding, the working principle of the exposure device is further introduced as follows:

[0039] Specifically, before exposing the workpiece 1 to be exposed, the exposure focus position of the workpiece 1 to be exposed needs to be determined. First, the focusing light source device 52 is started. After the focusing light source device 52 is started, the focusing light source device 52 outputs a focusing light source. The focusing light source enters the first half mirror 55 after passing through the second collimating lens 54, is reflected by the first half mirror 55, and then enters the internal total reflection mirror 56 to continue reflection to the spatial light modulator 57. The target projection light is then provided to the target light projection module 2 after the target projection light is processed by the spatial light modulator 57, reflected by the internal total reflection mirror 56 again, and then reflected by the plane mirror 21 of the target light projection module 2, collimated by the third collimating lens, and passed through the projection objective lens 24 to form a target focusing light beam to be projected onto the workpiece 1 to be exposed. Further, the target focusing light beam passes through the filter 31 and the imaging lens 32 in sequence, and is split by the third half mirror 33 to provide the first target projection light beam to the one-dimensional first linear image sensor 41 and the second target projection light beam to the one-dimensional second linear image sensor 42. Further, the focusing positions of the one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor 42 are adjusted to determine the focus position of the workpiece 1 to be exposed. Specifically, the following is explained in combination with Figure 2 、 Figure 3 and Figure 4 as follows:

[0040] The one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor 42 are photoelectric conversion components that convert the target projection light beam into an electrical signal after receiving the target projection light beam.

[0041] The one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor 42 are placed at positions that are offset by an equal distance from a position (line B) that is conjugate to the focal position of the projection objective lens 24 along the optical axis. That is, as shown in Figure 2 , the one-dimensional first linear image sensor 41 is installed such that the photocathode is focused at a front focal position (line A) in front of a focal plane that is optically conjugate to the surface of the workpiece 1 to be exposed. The cathode of the one-dimensional second linear image sensor 42 is focused at a position behind the focal point (line C), which is located behind the focal plane. As shown in Figure 4 , the one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor 42 convert the received target projection light beam into an electrical signal, convert the analog signal to a digital signal based on an analog / digital converter, and then perform filter processing. Finally, the signals from the one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor 42 are compared by a comparator and then transmitted to a focusing operation unit module for calculation of the focusing position. As shown in Figure 3 Figure 3 ​A schematic diagram showing that the one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor 42 receive the light intensity distribution. The line a where the photocathode of the one-dimensional first linear image sensor 41 is located is conjugated with the position C on the back focal point side of the projection objective 24. When the workpiece 1 to be exposed is located at the position of the line C, the line a obtains the maximum contrast at the one-dimensional first linear image sensor 41, and the contrast gradually decreases as the position of the workpiece 1 to be exposed moves from C to A. On the other hand, the line c where the photocathode of the one-dimensional second linear image sensor 42 is located is conjugated with the front focal point position A of the projection objective 24, and obtains the maximum contrast when the workpiece 1 to be exposed is located at the position of the line A, and the contrast gradually decreases as the position of the workpiece 1 to be exposed moves from A to C.

[0042] Next, the focal position of the workpiece 1 to be exposed is determined based on the respective contrasts of the focus patterns obtained by the one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor. Figure 5 As shown in the graph, Figure 5 The horizontal axis of the graph shown is the position of the workpiece 1 to be exposed, and the curve C1 and the curve C2 respectively represent the changes in the contrast values obtained by the one-dimensional first linear image sensor 41 and the one-dimensional second linear image sensor. In addition, the curve C3 is obtained by taking the difference between the curve C2 and the curve C1, and is a signal (error signal) that changes in an S shape according to the positional deviation of the workpiece 1 to be exposed. Therefore, by driving the platform to find the position on the workpiece 1 to be exposed where the error signal becomes zero, the focal alignment position can be detected. In addition, by paying attention to the sign of the curve C3, it can be immediately judged whether the workpiece 1 to be exposed is before or after the focal position, so that high-speed automatic focusing control can be realized.

[0043] Further, after the focal position is determined, the focusing light source device 52 is turned off, and the exposure light source device 51 is turned on, so that the exposure light source provided by the exposure light source device 51 passes through the optical element first collimating lens 53, the first half mirror 55, the internal total reflection mirror 56, the spatial light modulator, and then enters the target light projection module 2 again, so that the target light projection module 2 provides a target exposure light beam to the workpiece 1 to be exposed, and exposes the workpiece 1 to be exposed at the focal position.

[0044] According to another aspect of the present application, an exposure method is also disclosed, as shown in Figure 6 The method is realized based on any one of the exposure apparatuses described above, and the method comprises the following steps:

[0045] S100, turn on the focusing light source device, adjust the respective focusing positions of the one-dimensional first linear image sensor and the one-dimensional second linear image sensor, to determine the focal position of the focusing light source output by the focusing light source device on the workpiece to be exposed.

[0046] S102, turn off the focusing light source device.

[0047] S104, turn on the exposure light source device to complete the exposure process at the focus position after the focus position is determined.

[0048] The above is only the preferred embodiment of the present application, and is not used to limit the present application, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

[0049] The basic principle, connection mode, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principle of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application.

Claims

1. An exposure apparatus, characterized in that, The exposure device includes a target light projection module (2), a workpiece to be exposed (1), a focusing light processing module (3), and a focusing module (4). The target light projection module (2) is used to form a target beam on the workpiece to be exposed (1). The target beam includes a target focusing beam and a target exposure beam. The focusing light processing module (3) is used to process the target focusing beam reflected by the workpiece (1) to obtain a first target projection beam and a second target projection beam. The focusing module (4) includes a one-dimensional first linear image sensor (41) and a one-dimensional second linear image sensor (42). The one-dimensional first linear image sensor (41) is used to receive the first target projection beam to form a first focusing pattern, and the one-dimensional second linear image sensor (42) is used to receive the second target projection beam to form a second focusing pattern. The focal position of the target focusing beam on the workpiece (1) to be exposed is determined based on the brightness contrast of the first focusing pattern and the second focusing pattern, so that after the focal position is determined, the workpiece (1) to be exposed is exposed at the focal position based on the target exposure beam.

2. The exposure apparatus according to claim 1, characterized in that, The exposure device further includes a light source processing module (5), which includes an exposure light source device (51), a focusing light source device (52), a first collimating lens (53), a second collimating lens (54), a first semi-reflecting mirror (55), an inner total reflection mirror (56), and a spatial light modulator (57). The first collimating lens (53) is disposed between the exposure light source device (51) and the first semi-reflecting mirror (55), and the second collimating lens (54) is disposed between the focusing light source device (52) and the first semi-reflecting mirror (55). The exposure light source device (51) is used to provide an exposure light source, and the focusing light source device (52) is used to provide a focusing light source. The parallel exposure beam formed by the light source passing through the first collimating lens (53) and the first half-reflecting mirror (55) in sequence is coaxial with the parallel focusing beam formed by the focusing light source passing through the second collimating lens (54) and the first half-reflecting mirror (55) in sequence. The inner total reflection mirror (56) is disposed on one side of the first half-reflecting mirror (55). The inner total reflection mirror (56) is used to reflect the parallel exposure beam and the parallel focusing beam. The spatial light modulator (57) is disposed on one side of the inner total reflection mirror (56). The spatial light modulator (57) is used to reflect the target beam and then provide target projection light to the target light projection module (2) after passing through the inner total reflection mirror (56).

3. The exposure apparatus according to claim 1, characterized in that, The target light projection module (2) is disposed on one side of the workpiece (1) to be exposed. The target light projection module (2) includes a plane mirror (21), a third collimating lens (22), a second semi-reflecting mirror (23), and a projection lens (24) arranged in sequence close to the workpiece (1) to be exposed. The target projection light is reflected by the plane mirror (21), collimated by the third collimating lens, and projected onto the workpiece (1) to be exposed after being reflected by the plane mirror (21), collimated by the third collimating lens, and projected onto the workpiece (1) by the projection lens (24).

4. The exposure apparatus according to claim 3, characterized in that, The focusing light processing module (3) includes a filter (31), an imaging lens (32), and a third half-reflector (33). The filter (31) is disposed between the second half-reflector (23) and the imaging lens (32). The imaging lens (32) is disposed between the filter (31) and the third half-reflector (33). The target focusing beam passes through the filter (31) and the imaging lens (32) in sequence and is then split by the third half-reflector (33) so that the third half-reflector (33) provides the first target projection beam to the one-dimensional first linear image sensor (41) and the second target projection beam to the one-dimensional second linear image sensor (42).

5. The exposure apparatus according to claim 4, characterized in that, The exposure device further includes a first magnifying objective (6) and a second magnifying objective (7). The first magnifying objective (6) is disposed between the third half-reflecting mirror (33) and the one-dimensional first linear image sensor (41), and the second magnifying objective (7) is disposed between the third half-reflecting mirror (33) and the one-dimensional second linear image sensor (42).

6. The exposure apparatus according to claim 2, characterized in that, The focusing light source device (52) is used to provide a focusing light source that is not exposed to the photoresist during autofocus.

7. The exposure apparatus according to claim 1, characterized in that, After receiving the first target projection beam, the one-dimensional first linear image sensor (41) performs recognition processing on the first target projection beam, with a recognition rate of KHz level; and after receiving the second target projection beam, the one-dimensional second linear image sensor (42) performs recognition processing on the second target projection beam, with a recognition rate of KHz level.

8. The exposure apparatus according to claim 2, characterized in that, The spatial light modulator (57) is configured as either a DMD spatial light modulator (57), a liquid crystal panel, or an array of light-emitting diodes.

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