Semi-packaged heat dissipation inductor assembly

Abstract

The utility model discloses a semi-packaged heat dissipation inductor assembly which comprises a packaging bottom plate and an inductor assembly body, a packaging groove is formed in the upper side of the packaging bottom plate, the inductor assembly body is filled in the packaging groove through a heat dissipation glue layer, the depth of the packaging groove is half of the height of the inductor assembly body, reinforcing ribs are further arranged in the packaging groove, and the height of the reinforcing ribs is larger than the height of the inductor assembly body. Due to the fact that the inductor assembly body is filled in the packaging groove through the heat dissipation glue layer, and the depth of the packaging groove is half of the height of the inductor assembly body, the overall thickness of the packaging structure is reduced by adopting a semi-packaging structure, investment of packaging material cost is saved, and the packaging structure is simple in structure, convenient to manufacture, low in cost and high in reliability. And moreover, the semi-exposed part of the inductor assembly body can directly and naturally dissipate heat through air, so that heat dissipation treatment is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of inductance component, specifically to a semi-packaging heat dissipation inductance assembly. BACKGROUND

[0002] Inductance component is a kind of energy storage component, and the original model of inductance component is wire wound into cylindrical coil.When current i is passed in the coil, magnetic flux Φ will be generated in the coil, and energy is stored.The parameter representing the ability of inductance component (inductor for short) to generate magnetic flux and store magnetic field is also called inductance, represented by L, which is equal to the magnetic flux generated by unit current in value.Inductance component refers to inductor (inductor coil) and various transformers.Each household inverter emits electricity, which needs to be stored, and inductance stores photovoltaic power generation as a key energy storage component, which can be used when needed, and has wide market application prospect.

[0003] In the prior art with application number 202321518197.9, a PCB packaging structure with compatible two inductances includes a metal base, a watch case arranged on one side of the metal base, a double inductance assembly arranged between the watch case and the metal base, a gold wire arranged on the surface of the metal base, a metal base arranged on the metal base and tightly attached to the gold wire, a solder pad arranged on the metal base, a solder hole arranged on the solder pad, a main inductor composed of two single inductors and connected, a feedback inductor composed of a single inductor and a wire, an external output inductor composed of a single inductor and a wire arranged on one side of the main inductor and the feedback inductor, the main inductor, the feedback inductor and the external output inductor are arranged in a rectangular shape, the double inductance assembly passes through the solder hole and is connected with the metal base through the solder pad.The utility model solves the problem of large working heat accumulation and thick product packaging thickness caused by inductance stacking in the prior art, but the use of full packaging structure leads to serious material consumption, which is not energy-saving and is not conducive to the heat dissipation of inductance assembly. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a semi-packaging heat dissipation inductance assembly to solve the problem of serious material consumption, inconvenient energy saving and poor heat dissipation of inductance assembly caused by full packaging structure in the prior art.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a semi-packaging heat dissipation inductance assembly, which comprises a packaging bottom plate and an inductance assembly body, the packaging bottom plate is provided with a packaging groove on the upper side, the inductance assembly body is filled in the packaging groove through a heat dissipation glue layer, the depth of the packaging groove is half of the height of the inductance assembly body, and a reinforcing rib is further arranged in the packaging groove and crosses the packaging bottom plate and is provided with a heat dissipation through hole.

[0006] Further, mounting columns are arranged at four corners of the packaging bottom plate, and mounting holes are arranged in the mounting columns.

[0007] Further, the packaging base plate and the heat dissipation glue layer are provided with limiting grooves, and the wiring pins on the outer side of the inductor assembly body are fixedly clamped in the limiting grooves.

[0008] Further, a plurality of groups of limiting grooves are provided in parallel, and the inner walls of the limiting grooves are further provided with sealing glue layers.

[0009] Further, the reinforcing rib comprises a center rib rod, and the center rib rod is provided with a second side rib on one side through a first side rib.

[0010] Further, a plurality of second side ribs are provided at equal intervals, and the lengths of the plurality of second side ribs gradually decrease outward from the center rib rod.

[0011] Further, a first heat dissipation hole is arranged in the middle of the center rib rod, a second heat dissipation hole is arranged in the first side rib, and a third heat dissipation hole is arranged in the second side rib, and the third heat dissipation hole is in communication with the first heat dissipation hole through the second heat dissipation hole.

[0012] Compared with the prior art, the utility model has the advantages that:

[0013] 1、the inductor assembly body is filled in the packaging groove through the heat dissipation glue layer, the depth of the packaging groove is half of the height of the inductor assembly body, the overall thickness of the packaging structure is reduced by adopting the half packaging structure, the packaging material cost investment is saved, good energy-saving effect is achieved, the half-naked part of the inductor assembly body can directly heat to the natural heat dissipation through the air, heat dissipation treatment is facilitated, and the shell formed by the packaging base plate can improve the anti-collision effect of the inductor body.

[0014] 2、the packaging groove is further provided with a reinforcing rib, the reinforcing rib comprises a center rib rod, the center rib rod is provided with a second side rib on one side through a first side rib, a plurality of second side ribs are provided at equal intervals, and the lengths of the plurality of second side ribs gradually decrease outward from the center rib rod, so that the structural strength of the packaging base plate and the heat dissipation glue layer is increased, and the anti-collision ability of the shell formed by the packaging base plate is improved.

[0015] 3、the reinforcing rib crosses the packaging base plate and is provided with a heat dissipation through hole, the heat dissipation through hole comprises a first heat dissipation hole arranged in the middle of the center rib rod, a second heat dissipation hole arranged in the first side rib, and a third heat dissipation hole arranged in the second side rib, and the third heat dissipation hole is in communication with the first heat dissipation hole through the second heat dissipation hole, so that the inside of the packaging base plate and the heat dissipation glue layer can be ventilated and heat dissipated, and the heat dissipation ability of the unpacked part of the inductor assembly body is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings are used to provide further understanding of the present application and form a part of the specification, and are used together with the embodiments of the present application to explain the present application, and do not constitute a limitation on the present application. In the drawings:

[0017] Figure 1 It is a whole structure schematic view of the present application;

[0018] Figure 2 It is a structure schematic view of the present application without the heat dissipation glue layer;

[0019] Figure 3 It is a structure schematic view of the present application with the reinforcing rib.

[0020] In the drawings: 1, encapsulation bottom plate; 2, encapsulation groove; 3, heat dissipation glue layer; 4, mounting column; 5, inductance component body; 6, wiring pin; 7, limiting groove; 8, sealing glue layer; 9, center rib; 10, second side rib; 11, first heat dissipation hole; 12, third heat dissipation hole; 13, first side rib; 14, mounting hole; 15, second heat dissipation hole. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0022] Please refer to Figure 1 , Figure 2 , Figure 3 In the embodiments of the present application, a semi-encapsulated heat dissipation inductance component comprises an encapsulation bottom plate 1 and an inductance component body 5. The upper side of the encapsulation bottom plate 1 is provided with an encapsulation groove 2, and the four corners of the encapsulation bottom plate 1 are provided with mounting columns 4, and the inside of the mounting columns 4 is provided with mounting holes 14, so that the encapsulation bottom plate 1 can be conveniently installed and fixed by screws. The inductance component body 5 is filled in the encapsulation groove 2 by a heat dissipation glue layer 3, and the depth of the encapsulation groove 2 is half the height of the inductance component body 5. The semi-encapsulated structure reduces the overall thickness of the encapsulation structure, saves the investment of encapsulation material cost, has a good energy-saving effect, and the semi-naked part of the inductance component body 5 can directly dissipate heat through air, so that heat dissipation treatment is facilitated. Meanwhile, the shell formed by the encapsulation bottom plate 1 can also improve the anti-collision effect of the inductance component body 5.

[0023] For example Figure 2 and Figure 3As shown in the figure, in order to improve the anti-collision ability of the package base plate 1 forming the shell, a reinforcing rib is further arranged in the package groove 2, the reinforcing rib comprises a center rib 9, a second side rib 10 is arranged on one side of the center rib 9 through a first side rib 13, a plurality of second side ribs 10 are arranged at equal intervals, and the lengths of the plurality of second side ribs 10 gradually decrease from the center rib 9 outward, so that the structural strength of the package base plate 1 and the heat dissipation glue layer 3 is increased, thereby improving the anti-collision ability of the package base plate 1 forming the shell.

[0024] As shown in the figure, Figure 1 and Figure 3 As shown in the figure, in order to improve the heat dissipation ability of the sub-packaged part of the inductor assembly body 5, the reinforcing rib is further arranged to cross the package base plate 1 and is provided with a heat dissipation through hole, a first heat dissipation hole 11 is arranged in the center of the center rib 9, a second heat dissipation hole 15 is arranged in the first side rib 13, and a third heat dissipation hole 12 is arranged in the second side rib 10, and the third heat dissipation hole 12 is communicated with the first heat dissipation hole 11 through the second heat dissipation hole 15, so that the package base plate 1 and the heat dissipation glue layer 3 inside can be ventilated and heat dissipated, thereby improving the heat dissipation ability of the sub-packaged part of the inductor assembly body 5.

[0025] As shown in the figure, Figure 1 and Figure 2 As shown in the figure, in order to install and fix the wiring pin 6, a limiting groove 7 is arranged in the package base plate 1 and the heat dissipation glue layer 3, the lower side of the wiring pin 6 on the outer side of the inductor assembly body 5 is fixedly clamped in the limiting groove 7, a plurality of groups of limiting grooves 7 are arranged in parallel, and a sealing glue layer 8 is further arranged on the inner wall of the limiting groove 7, so that the wiring pin 6 can be conveniently installed and fixed, and the stability of installation and fixation is high.

[0026] The working principle and use process of the utility model are as follows: when in use, since the package base plate 1 is provided with the package groove 2, the inductor assembly body 5 is filled in the package groove 2 through the heat dissipation glue layer 3, and the depth of the package groove 2 is half of the height of the inductor assembly body 5, the half-encapsulation structure reduces the overall thickness of the encapsulation structure, saves the investment of encapsulation material cost, has a good energy-saving effect, the half-bare part of the inductor assembly body 5 can directly dissipate heat through air, heat dissipation is convenient, and the shell formed by the package base plate 1 can improve the anti-collision effect of the inductor assembly body 5.

[0027] Finally, it should be pointed out that: the above-mentioned is only the preferred embodiment of the utility model, and is not used for limiting the utility model, although the utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art, still can modify the technical scheme recorded in the foregoing each embodiment, or make equivalent replacement to part of the technical features. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A semi-encapsulated heat dissipating inductor assembly comprising an encapsulation base plate (1) and an inductor assembly body (5), characterized in that: The packaging bottom plate (1) is provided with a packaging groove (2) on the upper side, the inductance assembly body (5) is filled in the packaging groove (2) through a heat dissipation glue layer (3), and the depth of the packaging groove (2) is half of the height of the inductance assembly body (5).

2. A semi-encapsulated heat sink inductor component according to claim 1, wherein: The packaging bottom plate (1) is provided with mounting columns (4) at four corners, and the mounting columns (4) are internally provided with mounting holes (14).

3. A semi-encapsulated heat sink inductor component according to claim 1, wherein: The packaging bottom plate (1) and the heat dissipation glue layer (3) are both internally provided with limiting grooves (7), and the wiring pins (6) on the outer side of the inductance assembly body (5) are fixedly clamped in the limiting grooves (7).

4. A semi-encapsulated heat sinked inductor assembly as claimed in claim 3, wherein: Multiple groups of limiting grooves (7) are parallelly arranged, and the inner walls of the limiting grooves (7) are further provided with sealing glue layers (8).

5. A semi-encapsulated heat sink inductor component according to claim 1, wherein: The packaging groove (2) is further provided with reinforcing ribs, the reinforcing ribs cross the packaging bottom plate (1) and are provided with heat dissipation through holes, the reinforcing ribs comprise a center rib (9), and the center rib (9) is provided with a second side rib (10) on one side through a first side rib (13).

6. A semi-encapsulated heat sink inductor component according to claim 5, wherein: Multiple second side ribs (10) are equidistantly arranged, and the lengths of the multiple second side ribs (10) gradually decrease from the center rib (9) outward.

7. A semi-encapsulated heat sink inductor component according to claim 5, wherein: A first heat dissipation hole (11) is arranged in the center rib (9), a second heat dissipation hole (15) is arranged in the first side rib (13), and a third heat dissipation hole (12) is arranged in the second side rib (10), and the third heat dissipation hole (12) is in communication with the first heat dissipation hole (11) through the second heat dissipation hole (15).

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