Supercritical cleaning and drying system
By setting the cleaning machine and the drying machine adjacent to each other in the wafer cleaning and drying equipment, and by adopting a swing seat and locking component structure, the problems of low efficiency and contamination of existing equipment are solved, and high-efficiency and low-cost wafer processing is achieved.
Patent Information
- Application Number
- CN202422767096.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-13
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-11-13
AI Technical Summary
Existing wafer cleaning and drying equipment suffers from low efficiency, high energy consumption, and significant material damage. In particular, the drying process is prone to particulate contamination, which affects the yield of wafer processing.
A supercritical cleaning and drying system is designed, in which the cleaning machine and the drying machine are arranged adjacent to each other on the same side of the conveying component. The system adopts a swing seat and locking component structure to reduce the impact of vibration, improve sealing performance, and reduce the risk of wafer contamination.
Effectively control wafer yield, improve production efficiency, reduce processing costs, enhance competitiveness, and ensure wafer processing quality.
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Figure CN223513914U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to wafer cleaning and drying technical field, more specifically, relate to a supercritical cleaning and drying system. BACKGROUND
[0002] In the semiconductor industry, the traditional cleaning and drying method often has problems such as low efficiency, high energy consumption and great damage to materials, especially when processing nanomaterials, biological samples and porous structure materials. Supercritical fluid technology has shown remarkable advantages such as high efficiency, environmental protection and economy in the cleaning and drying process due to its unique physical and chemical properties. With the continuous reduction of the feature size of integrated circuits, the tiny particles generated in the process flow may seriously affect the process yield of the wafer. In the prior art, the integration scheme of the cleaning and drying platform is uneven, and there are deficiencies in safety, cleanliness and functionality.
[0003] Especially in the drying process of the wafer after cleaning, the existing drying equipment generally adopts an up-down opening or pull-out type structure to take and place the wafer. Although the up-down opening type is convenient to take and place, it is easy to cause particle pollution risk, which affects the overall cleaning and drying quality of the wafer. UTILITARY MODEL
[0004] The utility model aims at providing a supercritical cleaning and drying system, which can meet the wafer cleaning and drying demand, improve the wafer process yield and reduce the production cost.
[0005] To achieve the above-mentioned purpose, the utility model adopts the technical scheme of providing a supercritical cleaning and drying system, which comprises a workbench, a conveying assembly, a cleaning machine, a supercritical fluid preparation machine and a drying machine. The conveying assembly is arranged on the workbench, the cleaning machine and the drying machine are located on the same side of the conveying assembly, a plurality of liquid inlet pipes are connected to the side of the cleaning machine away from the conveying assembly, the drying machine has a drying cavity for drying the wafer, the supercritical fluid preparation machine is in communication with the drying cavity and is used for supplying supercritical gas into the drying cavity, a swing seat capable of swinging horizontally to drive the wafer into the drying cavity is rotatably connected to the drying machine, the swing seat is provided with a containing cavity with an upward opening and used for placing the wafer, and a locking assembly is further arranged between the swing seat and the drying machine.
[0006] In a possible implementation manner, the swing seat is rotatably connected to the side of the drying machine close to the conveying assembly through a rotating shaft extending in the up-down direction, and the drying machine is provided with a rotating motor used for driving the swing seat to rotate around the rotating shaft.
[0007] In a possible implementation manner, the locking assembly comprises a locking pull rod, the locking pull rod is arranged perpendicularly to the axial direction of the rotating shaft, an outer side wall of the swing seat is provided with an inclined guide slope extending outward and downward, and an outer end of the locking pull rod is provided with a tensioning plate used for abutting against the inclined guide slope to tension the swing seat inward of the drying machine.
[0008] In a possible implementation, the locking assembly further comprises a locking pin arranged below the outer side of the swing seat in the up-down direction, the locking pin being capable of moving upward and pressing against the outer sidewall of the swing seat.
[0009] In some embodiments, the drying machine further comprises a first air cylinder connected to the locking pull rod on the side away from the conveying assembly, and a second air cylinder connected below the locking pin, the first air cylinder being used to drive the locking pull rod to rotate so that the tensioning plate presses against the guide slope, and the second air cylinder being used to drive the locking pin to move up and down.
[0010] In some embodiments, two locking pull rods are symmetrically arranged on both sides of the central axis of the swing seat, and two locking pins are also symmetrically arranged on both sides of the central axis of the swing seat.
[0011] In a possible implementation, the liquid inlet pipe is connected to the upper part of the cleaning machine on the side away from the conveying assembly, and the bottom of the cleaning machine is provided with a liquid outlet opening downward.
[0012] In a possible implementation, the liquid inlet pipes are respectively connected to the SC1 chemical liquid supply cabinet, the LALA5000 chemical liquid supply cabinet, the DHF chemical liquid supply cabinet, the IPA chemical liquid supply cabinet, the carbon dioxide functional water generator, and the ozone water generator one by one.
[0013] In some embodiments, the supercritical cleaning and drying system further comprises a carbon dioxide fire extinguisher, which is used to perform fire extinguishing treatment on the IPA chemical liquid supply cabinet and the supercritical fluid preparation machine.
[0014] In a possible implementation, the supercritical fluid preparation machine is provided with a water chiller, which is used to cool the supercritical fluid preparation machine.
[0015] Compared with the prior art, the supercritical cleaning and drying system provided in the embodiments of the present application can effectively control the wafer yield, improve the production efficiency, reduce the processing cost, and enhance the competitiveness. BRIEF DESCRIPTION OF DRAWINGS
[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a top view of the supercritical cleaning and drying system provided in an embodiment of the present invention.
[0018] Figure 2 A simplified diagram showing the component connections of the supercritical cleaning and drying system provided in this embodiment of the utility model;
[0019] Figure 3 A schematic diagram of the structure of the swing seat and locking assembly provided in the embodiment of this utility model;
[0020] Figure 4 Provided for embodiments of this utility model Figure 1 A partial top-view cross-sectional structural diagram of the intermediate dryer;
[0021] Figure 5 Provided for embodiments of this utility model Figure 4 Right view structural diagram of the swing seat and tensioning lever;
[0022] Figure 6 Provided for embodiments of this utility model Figure 4 A schematic diagram of the main structure of the swing seat and the tensioning locking rod.
[0023] The following are the labeling elements in the figure:
[0024] 1. Workbench; 11. Feeding box; 12. Receiving box; 2. Conveying assembly; 21. Robotic arm; 3. Cleaning machine; 31. SC1 chemical supply cabinet; 32. LALA5000 chemical supply cabinet; 33. DHF chemical supply cabinet; 34. IPA chemical supply cabinet; 35. Carbon dioxide functional water generator; 36. Ozone water generator; 37. Carbon dioxide fire extinguisher; 38. Inlet pipe; 39. Drain outlet; 4. Supercritical fluid generator; 41. Chiller; 5. Dryer; 51. Drying chamber; 6. Swing seat; 61. Rotating shaft; 62. Rotary motor; 63. Tensioning hole; 64. Guide slope; 7. Locking assembly; 71. Locking rod; 72. Locking pin; 73. First cylinder; 74. Second cylinder; 75. Tensioning plate; 8. Wafer. Detailed Implementation
[0025] In order to make the technical problems, technical solutions and beneficial effects of the utility model clearer and more apparent, the utility model will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model and not to limit the utility model.
[0026] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or indirectly on the other element. It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. The terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or several features. In the description of the utility model, the meaning of "several" is two or more than two, unless otherwise explicitly and specifically limited.
[0027] Please refer to Figures 1 to 6 , the supercritical cleaning and drying system provided by the utility model will be described. The supercritical cleaning and drying system comprises a workbench 1, a conveying assembly 2, a cleaning machine 3, a supercritical fluid preparation machine 4 and a drying machine 5, the conveying assembly 2 is arranged on the workbench 1, the cleaning machine 3 and the drying machine 5 are located on the same side of the conveying assembly 2, a plurality of liquid inlet pipes 38 are connected to the side of the cleaning machine 3 away from the conveying assembly 2, the drying machine 5 has a drying cavity 51 for drying wafers 8, the supercritical fluid preparation machine 4 is in communication with the drying cavity 51 and is used for supplying supercritical gas into the drying cavity 51, the drying machine 5 is rotatably connected with a swing seat 6 capable of swinging horizontally to drive the wafers 8 into the drying cavity 51, the swing seat 6 is provided with a containing cavity with an upward opening and used for placing the wafers 8, and a locking assembly 7 is further arranged between the swing seat 6 and the drying machine 5.
[0028] Compared with the prior art, the supercritical cleaning and drying system provided by the embodiment can maximize the reduction of the influence of the shaking and height lifting in the conveying process from the cleaning process to the drying process on the uniformity of the liquid film on the surface of the wafers 8, the structure that the swing seat 6 drives the wafers 8 to swing open and is locked by the locking assembly 7 can not only reduce the pollution of the wafers 8 but also facilitate the subsequent maintenance operation, can effectively control the yield of the wafers 8, improve the production efficiency, facilitate the reduction of the processing cost and the enhancement of the competitiveness.
[0029] In this embodiment, the cleaning machine 3 and the drying machine 5 are arranged along the conveying direction of the conveying assembly 2, and the ends of the platform are provided with the feeding box 11 and the receiving box 12. The feeding box 11 and the receiving box 12 can be located at the same end of the conveying assembly 2 or one-to-one at the two ends of the conveying assembly 2, and the arrangement position is subject to the requirements of wafer 8 feeding and discharging position. When the wafer 8 changes position between the conveying assembly 2, the cleaning machine 3 and the drying machine 5, the height is approximately the same, avoiding the influence of height adjustment on the uniformity of the liquid film on the wafer 8 surface, and improving the processing quality of the wafer 8.
[0030] It should be noted that the conveying assembly 2 includes a mechanical hand 21 for grabbing the wafer 8. The mechanical hand 21 can clamp the wafer 8 and transfer the wafer 8 to the conveying assembly 2 or transfer the wafer 8 on the conveying assembly 2 to the drying machine 5 or the cleaning machine 3. At the same time, the mechanical hand 21 should be arranged correspondingly for the unwashed wafer 8 and the washed wafer 8 to realize the separate transfer of different types of wafers 8.
[0031] As a specific embodiment, the feeding box 11 and the receiving box 12 are arranged close to the drying machine 5. The wafers 8 in the feeding box 11 are conveyed to the cleaning machine 3 by the conveying assembly 2 for cleaning, and then conveyed to the drying machine 5 by the conveying assembly 2 for drying, and finally conveyed to the receiving box 12 by the conveying assembly 2. The height of the conveying assembly 2 is consistent with the height of the position for receiving the wafer 8 in the cleaning machine 3 and the drying machine 5, avoiding the influence of height adjustment on the uniformity of the liquid film on the wafer 8 surface, effectively reducing the wafer 8 shaking problem, and improving the processing quality of the wafer 8.
[0032] The temperature range of the supercritical medium provided by the supercritical fluid preparation machine 4 is 90-120℃, the flow range is 0.6-0.9L / min, and the pressure range is 17-21Mpa.
[0033] It should be noted that the supercritical fluid preparation machine 4 is in communication with the inside of the drying cavity 51, and different arrangement modes can be adopted. Referring to Figure 1 , the supercritical fluid preparation machine 4 is integrally arranged with the drying machine 5 and located outside the drying cavity 51 of the supercritical fluid preparation machine 4 and inside the drying machine 5.
[0034] As a parallel embodiment, the supercritical fluid preparation machine 4 can also be arranged separately from the drying machine 5, as long as the supercritical fluid prepared by the supercritical fluid preparation machine 4 can be smoothly sent into the drying cavity 51.
[0035] Specifically, the inner cavity depth of the accommodating cavity of the drying machine 5 is greater than the thickness of the wafer 8. The inner cavity height of the accommodating cavity is 2-4 mm higher than the height of the wafer 8, and the side wall of the accommodating cavity plays a blocking role, which facilitates reducing the impact of the fluid (gas) at the inlet of the drying machine 5 on the wafer 8.
[0036] In some possible implementation manners, the swing seat 6 adopts the structure as shown in Figures 1 to 6 . Please refer to Figures 1 to 6 , the swing seat 6 is rotationally connected to one side of the drying machine 5 close to the conveying assembly 2 in the up-down direction through the rotating shaft 61, and the drying machine 5 is provided with a rotating motor 62 for driving the swing seat 6 to rotate around the rotating shaft 61.
[0037] In the embodiment, the swing seat 6 adopts a rotary opening and closing mode, and the swing seat 6 can swing horizontally to the outside of the drying machine 5, so as to facilitate the placing or removing of the wafer 8. The swing seat 6 is driven to open or close by the rotating motor 62, and then the swing seat 6 is positionally locked by the locking assembly 7, which greatly guarantees the overall sealing performance of the drying machine 5.
[0038] In some embodiments, the locking assembly 7 can adopt the structure as shown in Figures 1 to 6 . Please refer to Figures 1 to 6 , the locking assembly 7 includes a locking pull rod 71, the locking pull rod 71 is arranged perpendicularly to the axial direction of the rotating shaft 61, the outer side wall of the swing seat 6 is provided with an inclined guide slope 64 extending outward and downward, and the outer end of the locking pull rod 71 is provided with a tension plate 75 for abutting against the inclined guide slope 64 to pull the swing seat 6 inward of the drying machine 5.
[0039] In the embodiment, the locking pull rod 71 is located outside the drying cavity 51, the swing seat 6 is provided with a tension hole 63 horizontally penetrating to extend the locking pull rod 71 and the tension plate 75, the inclined guide slope 64 on the outer side wall of the swing seat 6 gradually increases in thickness from top to bottom, the pressing force between the tension plate 75 and the inclined guide slope 64 gradually increases when the tension plate 75 rotates with the locking pull rod 71, the outer side wall of the swing seat 6 is effectively clamped, and the swing seat 6 and the drying machine 5 are effectively sealed.
[0040] When the swing seat 6 is swung to the closed state by the rotating motor 62, the locking pull rod 71 and the tension plate 75 extend to the outside of the swing seat 6 through the tension hole 63, the locking pull rod 71 drives the tension plate 75 to rotate to make the tension plate 75 abut against the inclined guide slope 64, so that the swing seat 6 is tightly attached to the outer wall of the drying machine 5, then the locking pin 72 is moved upward and clamped on the outer side wall of the swing seat 6, the swing seat 6 is further locked, and the swing seat 6 and the drying machine 5 have good sealing effect.
[0041] On this basis, the locking assembly 7 further comprises a locking pin 72 arranged below the outer side of the swing seat 6 in the up-down direction, which can move upwards and press against the outer side wall of the swing seat 6. The drying machine 5 further comprises a first air cylinder 73 connected to the side of the locking pull rod 71 away from the conveying assembly 2, which is used to drive the locking pull rod 71 to rotate so that the tensioning plate 75 presses against the guide slope 64, and a second air cylinder 74 connected below the locking pin 72, which is used to drive the locking pin 72 to move up and down. The first air cylinder 73 is a rotary air cylinder, which can drive the locking pull rod 71 and the tensioning plate 75 to rotate circumferentially, and the second air cylinder 74 is a telescopic air cylinder, which can extend outwardly upwards to drive the locking pin 72 to move upwards, so that the locking pin 72 presses against the outer side wall of the swing seat 6, further ensuring the effective sealing between the swing seat 6 and the drying machine 5.
[0042] On this basis, two locking pull rods 71 are symmetrically arranged on both sides of the central axis of the swing seat 6, and two locking pins 72 are also symmetrically arranged on both sides of the central axis of the swing seat 6. By arranging two locking pull rods 71 and two locking pins 72, the two sides of the swing seat 6 are effectively position-locked, the overall sealing performance of the drying machine 5 is ensured, the drying efficiency of the wafer 8 is improved, and the drying quality of the wafer 8 is ensured.
[0043] In some possible implementation manners, the liquid inlet pipe 38 adopts the structure as shown in Figures 1 to 6 . Please refer to Figures 1 to 6 together, the liquid inlet pipe 38 is connected to the upper side of the cleaning machine 3 away from the conveying assembly 2, and the bottom of the cleaning machine 3 is provided with a liquid discharge port 39 opening downward. The liquid inlet pipe 38 is used to supply fluid medium into the cleaning tank, and the arrangement position of the liquid inlet pipe 38 can effectively avoid affecting the loading and unloading of the wafer 8 into the cleaning machine 3.
[0044] In this embodiment, the fluid medium used by the cleaning machine 3 enters from the side of the cleaning machine 3 away from the conveying assembly 2, which avoids affecting the normal loading and unloading of the wafer 8, and the fluid medium discharge port is a lower inclined port. The bottom wall of the cleaning machine 3 has an inclined surface capable of draining the fluid medium through the liquid discharge port 39, which can smoothly discharge the fluid medium and avoid accumulation in the cleaning machine 3.
[0045] In some possible implementation manners, the feature B adopts the structure as shown in Figures 1 to 6 . Please refer to Figures 1 to 6 together, the plurality of liquid inlet pipes 38 are connected to the SC1 chemical liquid supply cabinet 31, the LALA5000 chemical liquid supply cabinet 32, the DHF chemical liquid supply cabinet 33, the IPA chemical liquid supply cabinet 34, the carbon dioxide functional water maker 35, and the ozone water maker 36 one by one.
[0046] In the embodiment, multiple fluid media are required in the cleaning process, including SC1 chemical solution, LALA5000 chemical solution, DHF chemical solution, and IPA chemical solution. The flow rate of the SC1 chemical solution supply tank 31 is 10-30 L / min, preferably 15-25 L / min; the flow rate of the LALA5000 chemical solution supply tank 32 is 10-30 L / min, preferably 15-25 L / min; the flow rate of the DHF chemical solution supply tank 33 is 10-30 L / min, preferably 15-25 L / min; and the flow rate of the IPA chemical solution supply tank 34 is 10-25 L / min, preferably 15-20 L / min. The selection of the above flow rate range can effectively ensure the cleaning quality of the wafer 8 and improve the cleaning efficiency of the wafer 8.
[0047] In some embodiments, referring to Figures 1 to 6 , the supercritical cleaning and drying system further comprises a carbon dioxide fire extinguisher 37 for extinguishing the IPA chemical solution supply tank 34 and the supercritical fluid preparation machine 4.
[0048] In the embodiment, in order to prevent the risk of fire of the IPA chemical solution supply tank 34 and the cleaning machine 3 and reduce the cleaning cost after the fire triggers the fire extinguisher to extinguish the fire, the carbon dioxide fire extinguisher 37 is provided, which is configured to have a capacity of 10-20 kg (carbon dioxide medium).
[0049] In some possible implementations, the supercritical fluid preparation machine 4 has the structure as shown in Figures 1 to 6 . Referring to , the supercritical fluid preparation machine 4 is provided with a water chiller 41 for cooling the supercritical fluid preparation machine 4. Specifically, the medium temperature of the supercritical fluid preparation machine 4 is 90-120℃, the pressure range is 17-21 Mpa, and the flow rate range is 45-55 L / h. The water chiller 41 supplies water at a flow rate of 20-30 L / min at -20℃, preferably 25 L / min.
[0050] On this basis, the deionized water heater, carbon dioxide functional water preparation device 35 and ozone water preparation device 36 are also provided, the deionized water heater is used for supplying 25-70 DEG C hot water to the stable cleaning machine 3, when the hot water temperature is 45-65 DEG C, the liquid flow range is 10-30 L / min, preferably 15-25 L / min. The carbon dioxide functional water preparation device 35 can fully mix carbon dioxide gas and deionized water and stably supply to the cleaning machine 3, the flow range of the mixed liquid is 1-3 L / min, preferably 2 L / min. The ozone water preparation device 36 can stably supply ozone water to the cleaning machine 3, the ozone water flow range is 5-20 L / min, preferably 10-15 L / min. It should be noted that the drying machine 5 and the cleaning machine 3 can be correspondingly provided with two or more groups, so as to improve the cleaning and drying efficiency of the wafer 8.
[0051] The above-mentioned supercritical cleaning and drying system, the cleaning machine 3 and the drying machine 5 are arranged adjacent to the same side of the conveying assembly 2, which can minimize the influence of the swing and the height lifting during the conveying process from the cleaning process to the drying process on the uniformity of the liquid film on the wafer 8 surface, the structure that the swing seat 6 drives the wafer 8 to swing open and is locked through the locking assembly 7 can reduce the pollution of the wafer 8, and is convenient for subsequent maintenance operation, can effectively control the yield of the wafer 8, improve the production efficiency, facilitate to reduce the processing cost, enhance the competitiveness.
[0052] The above is only a preferred embodiment of the present application, and is not used to limit the present application, any modification, equivalent replacement and improvement within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims
1. A supercritical cleaning and drying system, characterized in that, The system includes a workbench (1), a conveying assembly (2), a cleaning machine (3), a supercritical fluid preparation machine (4), and a dryer (5). The conveying assembly (2) is mounted on the workbench (1). The cleaning machine (3) and the dryer (5) are located on the same side of the conveying assembly (2). The side of the cleaning machine (3) away from the conveying assembly (2) is connected to several liquid inlet pipes (38). The dryer (5) has a drying chamber (51) for drying wafers (8). The supercritical fluid preparation machine (4) is connected to the drying chamber (51) and is used to supply supercritical gas into the drying chamber (51). The dryer (5) is rotatably connected to a swing seat (6) that can swing horizontally to drive the wafers (8) into the drying chamber (51). The swing seat (6) has an upward-opening accommodating cavity for placing the wafers (8). A locking assembly (7) is also provided between the swing seat (6) and the dryer (5).
2. The supercritical cleaning and drying system as described in claim 1, characterized in that, The swing seat (6) is rotatably connected to the side of the dryer (5) near the conveying assembly (2) via a rotating shaft (61) extending in the vertical direction. The dryer (5) is provided with a rotary motor (62) for driving the swing seat (6) to rotate around the rotating shaft (61).
3. The supercritical cleaning and drying system as described in claim 2, characterized in that, The locking assembly (7) includes a locking rod (71) which is arranged perpendicular to the axial direction of the rotating shaft (61). The outer side wall of the swing seat (6) is provided with a guide slope (64) that extends outward and downward. The outer end of the locking rod (71) is provided with a tensioning plate (75) for abutting against the guide slope (64) to pull the swing seat (6) into the dryer (5).
4. The supercritical cleaning and drying system as described in claim 3, characterized in that, The locking assembly (7) further includes a locking pin (72) disposed on the lower outer side of the swing seat (6) in the vertical direction, the locking pin (72) being able to move upward and press against the outer side wall of the swing seat (6).
5. The supercritical cleaning and drying system as described in claim 4, characterized in that, The dryer (5) further includes a first cylinder (73) and a second cylinder (74). The first cylinder (73) is connected to the side of the locking rod (71) away from the conveying assembly (2). The first cylinder (73) is used to drive the locking rod (71) to rotate so that the tensioning plate (75) presses against the guide slope (64). The second cylinder (74) is connected below the locking pin (72) and is used to drive the locking pin (72) to move up and down.
6. The supercritical cleaning and drying system as described in claim 5, characterized in that, Two locking rods (71) and two locking pins (72) are provided respectively. The two locking rods (71) are symmetrically arranged on both sides of the central axis of the swing seat (6), and the two locking pins (72) are also symmetrically arranged on both sides of the central axis of the swing seat (6).
7. The supercritical cleaning and drying system according to any one of claims 1-6, characterized in that, The inlet pipe (38) is connected to the upper part of the side of the cleaning machine (3) away from the conveying assembly (2), and the bottom of the cleaning machine (3) is provided with a downward-facing drain port (39).
8. The supercritical cleaning and drying system according to any one of claims 1-6, characterized in that, Several of the aforementioned inlet pipes (38) are respectively connected to the SC1 chemical supply cabinet (31), the LALA5000 chemical supply cabinet (32), the DHF chemical supply cabinet (33), the IPA chemical supply cabinet (34), the carbon dioxide functional water generator (35), and the ozone water generator (36).
9. The supercritical cleaning and drying system as described in claim 8, characterized in that, The supercritical cleaning and drying system also includes a carbon dioxide fire extinguisher (37), which is used to extinguish the fire in the IPA chemical supply cabinet (34) and the supercritical fluid preparation machine (4).
10. The supercritical cleaning and drying system according to any one of claims 1-6, characterized in that, The supercritical fluid preparation machine (4) is equipped with a chiller (41), which is used to cool the supercritical fluid preparation machine (4).