Wafer baking material box

Abstract

The utility model relates to a wafer baking material box which comprises a frame and a material placing disc, the interior of the frame is hollow, the front side and the rear side of the frame are open, a plurality of groups of horizontal bearing frames which are opposite left and right are correspondingly arranged on the inner walls of the two sides of the frame in the height direction of the frame, and a gap is formed between every two adjacent horizontal bearing frames in the vertical direction; a profiling groove used for placing wafers is formed in the surface of the material placing disc, the material placing disc can be movably arranged in the frame, and the two side ends of the material placing disc can be placed on the pair of horizontal bearing frames respectively; the front portions of the two sides of the frame are each provided with a blocking shaft capable of rotating inwards, the blocking shafts can move up and down, and limiting grooves used for limiting rotation of the blocking shafts are formed in the top of the frame. The wafer baking device is compact in structure and high in practicability, can bake wafers in batches, is more uniform in baking effect, and can protect the wafers.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, specifically, it shows a wafer baking material box. BACKGROUND

[0002] Wafer is the silicon chip used for making silicon semiconductor integrated circuit, is called wafer because its shape is circular.Wafer raw material is silicon, high-purity polycrystalline silicon is dissolved and then is doped into silicon crystal seed, then slowly pulls out, forms cylindrical monocrystalline silicon, after grinding, polishing, slicing, forms silicon wafer.

[0003] In the process of producing wafer, often needs to place wafer into baking device, carries out physical or chemical transformation to photoresist and the like on wafer through the proper temperature of baking, for example, heat curing and the like.

[0004] Current wafer heating baking device commonly heating mode is to set heating disc at the bottom of a cavity, heating disc provides heat by heat source, places the wafer to be processed on the heating disc and carries out baking.But this heating mode can only bake single wafer, has great limitation, and the efficiency is low, and even can bake batch wafer, but the stacked wafer can appear the phenomenon that single product is not baked uniformly, thereby affecting the production quality of wafer. INNOVATION CONTENT

[0005] The utility model aims at providing a wafer baking material box, simple structure is practical, heating baking consistency is good, and batch wafer can be baked.

[0006] Technical scheme as follows:

[0007] A wafer baking material box, including frame and material tray, the inside of the frame is hollow and the front and rear sides are open, a plurality of groups of horizontal bearing frames are correspondingly arranged on the inner walls of the two sides of the frame along the height direction thereof, and the adjacent upper and lower horizontal bearing frames have a spacing; the surface of the material tray is formed with a profiling groove for placing a wafer, the material tray is movably arranged in the frame, and the two side ends of the material tray are respectively capable of being placed on a pair of horizontal bearing frames; the front parts of the two sides of the frame are each provided with a stop shaft that can rotate inward, the stop shaft is movable up and down, and the top of the frame is provided with a limiting groove for limiting the rotation of the stop shaft.

[0008] Further, the frame includes two vertically symmetrical vertical side plates, a horizontal top plate is connected between the tops of the two vertical side plates, and a horizontal rod is arranged between the bottoms of the two vertical side plates. During the baking process, heat is transmitted from bottom to top, therefore, the lower part of the frame is designed as a thin horizontal rod, avoiding the lower part of the frame being seriously blocked, and ensuring that heat can be transmitted upward to the frame.

[0009] Further, the upper and lower ends of the blocking shaft are symmetrically provided with L-shaped rotating parts perpendicular to the blocking shaft, the ends of the L-shaped rotating parts are movably inserted into the vertical side plate, and the top of the vertical side plate is recessed to form an inclined limiting slot, and the inclined direction of the limiting slot points to the frame.

[0010] Further, the vertical side plate is provided with pull ring handles, and the two pull ring handles are symmetrically arranged on the left and right sides.

[0011] Further, the outer side of the vertical side plate is recessed to form an inner groove.

[0012] Further, the vertical side plate is provided with an enclosing plate protruding from the surface of the vertical side plate on one side of the blocking shaft, and the enclosing plate is used to block one side end of the horizontal carrier.

[0013] Further, the middle part of one side of the material placing disc is provided with a notch.

[0014] Further, the middle part of the surface of the profiling groove on the material placing disc is provided with a plurality of annular protruding parts with different diameters.

[0015] Compared with the prior art, the present application has the advantages of compact structure, high practicability, realization of batch wafer baking, more uniform baking effect, wafer protection, stability of the placed wafers in the baking box during moving, and avoidance of wafer displacement. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a structural schematic view of a wafer baking box according to an embodiment of the present application;

[0017] Figure 2 is a schematic view of the blocking shaft and the limiting slot according to an embodiment of the present application.

[0018] Figure 3 is a structural schematic view of a frame according to an embodiment of the present application;

[0019] Figure 4 is a structural schematic view of a material placing disc according to an embodiment of the present application;

[0020] Corresponding marks in the drawings: 1-frame, 2-material placing disc, 3-horizontal bearing frame, 4-stop shaft, 5-pull ring handle, 6-enclosing plate, 11-vertical side plate, 12-horizontal top plate, 13-horizontal rod, 111-limiting slot, 112-internal recess, 21-profiling groove, 22-notch, 221-annular protruding part, 41-L-shaped rotating part. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application

[0022] The embodiments of the present application provide a wafer baking material box for solving the technical problems proposed in the background art.

[0023] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 . Specifically, it mainly comprises a frame and a plurality of independent material placing discs. The frame is in a cuboid structure. The inside of the frame is hollow and the front and back sides are open. A plurality of left and right opposite horizontal bearing frames are arranged on the inner walls of the two sides of the frame along the height direction. There is a space between the adjacent upper and lower horizontal bearing frames. The left and right two horizontal bearing frames constitute an area for placing the material placing disc. A profiling groove for placing a wafer is formed on the surface of the material placing disc. The size of the profiling groove is adjusted according to the size of the wafer. The material placing disc can be movably placed in the frame in a horizontal posture. The two side ends of the material placing disc can be placed on a pair of horizontal bearing frames. A stop shaft that can rotate inward is arranged on the front part of the two sides of the frame. The stop shaft can also move up and down. A limiting slot for limiting the rotation of the stop shaft is arranged on the top of the frame.

[0024] The wafer baking box has compact structure and high practicability, and can realize baking of batch wafers through multiple groups of horizontal bearing frames in the frame, multi-layer baking, and more uniform baking effect; through flexible cooperation of the blocking shaft and the limiting groove, the side of the wafers in the frame can be protected, so that the stability of the wafer group placed in the wafer baking box during moving and taking the wafer baking box is ensured, and the left and right displacement of the wafers is avoided.

[0025] The frame comprises two vertically symmetrical vertical side plates, a horizontal top plate connected between the top portions of the two vertical side plates, and a horizontal rod arranged between the bottom portions of the two vertical side plates, and the vertical side plates, the horizontal top plate and the horizontal rod form a cuboid structure. During the baking process, heat is transferred from bottom to top, so the lower part of the frame is designed as a thin horizontal rod to avoid the lower part of the frame being seriously blocked and ensure that heat can be transmitted upward to the multiple layer material placing plates in the frame.

[0026] The L-shaped rotating part at the end of the blocking shaft is movably inserted into the vertical side plate, the connecting position of the L-shaped rotating part and the vertical side plate does not disengage, the top portion of the vertical side plate is recessed to form an inclined limiting groove, and the inclined direction of the limiting groove points to the inside of the frame.

[0027] In this way, the blocking shaft can be pulled upward and rotated until the front part of the L-shaped rotating part is just above the limiting groove, at which time the blocking shaft is loosened, the front part of the L-shaped rotating part falls into the limiting groove, the blocking shaft is limited, the blocking shaft cannot rotate, and the blocking shaft is directed to the side of the material placing plate in the frame, thereby protecting the wafers on the material placing plate and ensuring the stability of the wafers in the wafer baking box during moving the wafer baking box.

[0028] In addition, the vertical side plate is provided with a pull ring handle, and the two pull ring handles are left-right symmetrical. The pair of pull ring handles can facilitate the operator to carry the wafer baking box from both sides of the device, which is more labor-saving.

[0029] Moreover, the outer side of the vertical side plate is recessed to form an inner groove. The inner groove does not affect the structural strength of the vertical side plate, and can also reduce the material of the frame to some extent, thereby reducing the weight of the wafer baking box, meeting the lightweight requirement, and reducing the carrying pressure of the operator.

[0030] The vertical side plate is provided with an enclosing plate protruding from the surface of the vertical side plate on the side opposite to the blocking shaft, and the enclosing plate is used to block one side end of the horizontal bearing frames. In this way, the wafer can be inserted into the left and right horizontal bearing frames in the frame without accidentally escaping from the other side of the frame, and the stability of the wafer placement is ensured.

[0031] A notch is provided in the middle of one side of the wafer tray, and the notch communicates with the contour groove. This allows the operator to quickly pick up the wafer from the notch on the side of the wafer tray after baking.

[0032] Furthermore, the surface of the conformal groove on the wafer tray has several annular protrusions of different diameters, which are nearly concentric. The wafer is placed on these annular protrusions, which slightly lift the wafer upwards by a certain distance. These annular protrusions prevent the wafer from excessively contacting the surface of the wafer tray, thus preventing excessive friction and ensuring uniform heating during wafer baking.

[0033] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A wafer baking material box, characterized in that, The frame (1) includes a frame (1) and a wafer tray (2). The frame (1) is hollow inside and open at the front and back. Several sets of horizontal support frames (3) are arranged on the inner walls of both sides of the frame (1) along its height direction. There is a gap between two adjacent upper and lower horizontal support frames (3). The surface of the wafer tray (2) is formed with a contour groove (21) for placing wafers. The wafer tray (2) can be movably placed inside the frame (1), and the two ends of the wafer tray (2) can be placed on a pair of horizontal support frames (3). Both sides of the front of the frame (1) are provided with inwardly rotating baffles (4). The baffles (4) can move up and down, and the top of the frame (1) is provided with a limiting groove (111) for limiting the rotation of the baffles (4).

2. The wafer baking tray according to claim 1, characterized in that, The frame (1) includes two vertical side plates (11) arranged symmetrically on the left and right, a horizontal top plate (12) is connected between the tops of the two vertical side plates (11), and a horizontal bar (13) is provided between the bottoms of the two vertical side plates (11).

3. A wafer baking tray according to claim 2, characterized in that, The upper and lower ends of the stop shaft (4) are symmetrically provided with L-shaped rotating parts (41) perpendicular to it. The end of the L-shaped rotating part (41) can be inserted into the vertical side plate (11) in a vertically movable manner. The top of the vertical side plate (11) is recessed and provided with the inclined limiting groove (111). The inclined direction of the limiting groove (111) points into the frame (1).

4. A wafer baking tray according to claim 2, characterized in that, The vertical side plate (11) is provided with a pull ring handle (5), and the two pull ring handles (5) are symmetrical to each other.

5. A wafer baking tray according to claim 2, characterized in that, The outer surface of the vertical side plate (11) is recessed with an inner groove (112).

6. A wafer baking tray according to claim 2, characterized in that, The vertical side plate (11) is provided with a sealing plate (6) protruding from the surface of the vertical side plate (11) on one side relative to the stop shaft (4), and the sealing plate (6) is used to block one end of several of the horizontal support frames (3).

7. A wafer baking tray according to claim 1, characterized in that, A notch (22) is provided in the middle of one side of the material tray (2).

8. A wafer baking tray according to claim 7, characterized in that, The surface of the contour groove (21) on the material tray (2) is provided with several annular protrusions (221) of different diameters.

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