Slide glass device with assembled structure

Abstract

The utility model discloses a slide glass device with an assembled structure, which belongs to the field of slide glass equipment and comprises a bottom frame and one or more trays arranged on the bottom frame, a plurality of grooves are processed on the upper surface of each tray, and support columns and vent holes are arranged at the bottoms of the grooves. According to the utility model, a split type splicing structure of the bottom frame and the tray is adopted, and the tray adopts a solid structure, so that not only is the cost reduced, but also the deformation is reduced, and the winding plating phenomenon is avoided; the bottom of the groove is provided with the supporting column and the deflation hole, the supporting column avoids a substrate taking fault caused by sinking deformation of the substrate during substrate taking, the deflation hole can discharge air into the groove, vacuum is prevented from being formed between the substrate and the groove, and substrate taking is smooth.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of carrier film equipment technology, and specifically relates to a carrier film device with a splicing structure. BACKGROUND

[0002] The substrate used by the silicon-based solar cell is a silicon wafer, and the carrier film device is used to horizontally load multiple silicon wafers that have been pretreated during the production of the silicon-based solar cell, and the silicon wafers are held by a transmission wheel and then transferred into a vacuum coating chamber, the transmission bearing device drives the silicon wafers to be transferred between various process chambers, and different film layers are deposited in accordance with the process sequence, so that the silicon wafers can be processed in large quantities and continuously.

[0003] Most of the current carrier film devices use graphite trays, and the whole block of the hollow graphite tray is expensive and has a high cost. There are also graphite trays that are spliced by graphite strips, and multiple metal hooks are arranged around the grooves to hold the silicon wafers. Such a graphite tray structure is complex and is prone to deformation. After heating, there is a gap between the silicon wafers and the frame of the groove, which may cause the phenomenon of around plating and affect the coating quality. INVENTION CONTENTS

[0004] The utility model aims to provide a carrier film device with a splicing structure to solve at least one problem in the background technology.

[0005] The utility model provides a carrier film device with a splicing structure, which comprises a bottom frame and a tray placed on the bottom frame, and the tray is provided with one or more than one groove on the upper surface, and the bottom of the groove is provided with a supporting column and a gas release hole.

[0006] Further scheme: the upper surface of the tray is also provided with a plurality of uniform heating grooves.

[0007] Further scheme: the inner wall of the groove is provided with a second step.

[0008] Further scheme: the bottom frame is a quadrangular frame with a first step arranged on the inner periphery, which comprises two oppositely arranged long side frame rib plates and two oppositely arranged end side frame rib plates, the bottom of each of the two end side frame rib plates is provided with an end bottom plate, the end bottom plate extends towards the side close to the other end side frame rib plate, and one or more than one middle rib plate is arranged inside the bottom frame, and the two ends of the middle rib plate are arranged on the two end bottom plates.

[0009] Further scheme: the two ends of the middle rib plate are provided with a lap joint groove with the same thickness as the end bottom plate, one side of the middle rib plate with the groove is flush with the bottom surface of the end bottom plate, and the two sides of the other side of the middle rib plate opposite to the lap joint groove are provided with circular arc chamfers.

[0010] Further scheme: the bottom surface of the end bottom plate is subjected to surface treatment to increase the surface roughness.

[0011] Further scheme: one or more connecting shafts are arranged between the long side frame rib plate and the adjacent middle rib plate and / or between the adjacent two middle rib plates.

[0012] Further scheme: the center lines of the connecting shafts and the adjacent two connecting shafts are located on different straight lines in the same horizontal plane.

[0013] Further scheme: threaded holes are arranged at two ends of the connecting shaft, and connecting holes corresponding to the threaded holes are arranged on the long side frame rib plate and the middle rib plate.

[0014] Further scheme: the connecting shaft is in a cylindrical shape, and the surface of the connecting shaft is lower than the two sides of the middle rib plate provided with arc chamfered surfaces.

[0015] Compared with the prior art, the utility model has the beneficial effects that:

[0016] 1. The utility model adopts the split type assembling structure of the bottom frame and the tray, the tray adopts the solid structure, reduces the cost, reduces the deformation, and prevents the winding plating phenomenon; the support column and the air release hole are arranged at the groove bottom, the support column avoids the wafer taking failure caused by the wafer sinking deformation when taking the wafer, and the air release hole can release air into the groove, avoids the vacuum between the wafer and the groove, and makes the wafer taking smooth.

[0017] 2. The tray is also processed with the uniform heating groove, and the uniformity of the wafer temperature is ensured.

[0018] 3. The arc chamfered structure of the middle rib plate reduces the blocked area of the tray, improves the heating speed and the uniformity of heating, and reduces the damage of the middle rib plate to the tray.

[0019] 4. The connecting shaft is in a cylindrical shape, is lower than the height of the middle rib plate after being connected, and has a certain gap between the connecting shaft and the tray, so that the heating speed and the uniformity of heating are improved. DRAWINGS

[0020] In order to facilitate the understanding of those skilled in the art, the utility model is further described below with reference to the drawings.

[0021] Figure 1 It is a structural schematic view of the utility model embodiment;

[0022] Figure 2 It is a structural schematic view of the bottom frame in the utility model embodiment;

[0023] Figure 3 It is a structural schematic view of the tray in the utility model embodiment;

[0024] Figure 4 It is a partial side sectional view of the utility model embodiment;

[0025] Figure 5 It isFigure 2 enlarged view of part I in Fig.

[0026] Figure 6 is Figure 2 enlarged view of part II in Fig.

[0027] In the figure: 1 - bottom frame; 11 - long side frame rib plate; 12 - middle rib plate; 13 - connecting shaft; 14 - end side frame rib plate; 15 - end bottom plate; 16 - connecting hole; 17 - assembly screw; 18 - first step; 2 - tray; 21 - groove; 22 - second step; 23 - uniform heating groove; 24 - support column; 25 - air release hole; 3 - base sheet. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the utility model clearer and more apparent, the utility model will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model and are not used to limit the utility model, that is, the described examples are only a part of the examples of the utility model, but not all the examples. The components of the utility model embodiments described and shown in the drawings herein can be arranged and designed in various different configurations.

[0029] Therefore, the detailed description of the embodiments of the utility model provided in the drawings below is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the utility model.

[0030] Please refer to Figure 1 , Figure 3 It is shown that the embodiment provides a spliced structure slide device, which comprises a bottom frame 1 and a tray 2 placed on the bottom frame 1, the tray 2 is provided with one or more than one, and a plurality of grooves 21 are processed on the upper surface of the tray 2, and the bottom of the groove 21 is provided with a support column 24 and an air release hole 25.

[0031] Further, the air release hole 25 is arranged around the support column 24, and the air release is performed when the slide is taken.

[0032] Specifically, the bottom frame 1 is made of metal material, such as heat-resistant stainless steel or titanium alloy and other high-temperature-resistant metal materials, which is firm, durable, low in cost and prolongs the service life of the slide device. The tray 2 is made of graphite material, which has the characteristics of wear resistance, high temperature resistance, high strength, not easy to deform, stable chemical properties and the like.

[0033] The embodiment adopts the split assembling structure of the bottom frame 1 and the tray 2, the groove 21 is used for horizontally containing the substrate 3, the assembling gap between the bottom frame 1 and the tray 2 is small, about 0.1-0.2mm, avoiding the tray 2 shaking in the bottom frame 1 when driving and taking the substrate. The tray 2 adopts the solid graphite tray structure, which reduces the cost and the deformation, ensures the uniformity of the film, and prevents the phenomenon of around plating. The groove 21 is provided with a supporting column 24 and a gas releasing hole 25 at the bottom, the supporting column 24 provides the supporting action for the substrate 3 contained in the groove 21, avoiding the taking failure caused by the substrate 3 sinking and deforming when taking the substrate. After the substrate 3 is horizontally placed on the groove 21, a closed space is formed between the substrate 3 and the groove 21, which will affect the taking of the substrate 3 due to the vacuum adsorption force in the moment of taking the substrate. At this time, the gas releasing hole 25 can release the gas into the groove 21, avoiding the vacuum between the substrate 3 and the groove 21, so as to smoothly take the substrate.

[0034] It should be noted that the tray 2 can adopt a whole graphite, but the graphite plate material of large size is expensive, in order to save the cost, two or more trays 2 can be placed on the bottom frame 1.

[0035] In some embodiments, referring to Figure 3 As shown, the upper surface of the tray 2 is also processed with a plurality of uniform heating grooves 23. Since two or more trays 2 are placed on the bottom frame 1, the tray 2 located between the two trays 2 is only processed with the uniform heating grooves 23 on the two sides, and the tray 2 located at the two ends is processed with the uniform heating grooves 23 on the three sides, so that the uniform heating grooves 23 are arranged around the collection of all the grooves 21, reducing the edge effect and being beneficial to improving the uniformity of the heating of the substrate 3.

[0036] In some embodiments, referring to Figure 3 As shown, the inner wall of the groove 21 is provided with a second step 22, and the substrate 3 is horizontally placed on the second step 22.

[0037] Specifically, the tray 2 is a solid graphite tray with a thickness of about 5mm, the upper surface of the tray 2 is milled with a groove 21 with a depth of about 3.5mm, and the inner circumferential wall of the groove 21 is further left with a second step 22 with a height of about 0.5mm higher than the bottom of the groove 21, which is used for placing the substrate 3. The tray 2 is milled with uniform heating grooves 23 with the same depth as the groove 21, reducing the edge effect and being beneficial to improving the uniformity of the heating of the silicon wafer. The bottom center of the groove 21 is left with a supporting column 24 with a height of about 0.5mm, which provides the supporting action for the substrate 3, avoiding the taking failure caused by the substrate 3 sinking and deforming when taking the substrate.

[0038] In some embodiments, referring to Figure 2As shown, the bottom frame 1 is a quadrilateral frame with a first step 18 at the inner periphery, and the tray 2 is horizontally placed on the first step 18. The quadrilateral frame forms a retaining edge, and the assembly gap between the retaining edge and the tray 2 is small, which prevents the tray 2 from shaking in the bottom frame 1 during transmission and picking and placing. The bottom frame 1 includes two oppositely arranged long side frame rib plates 11 and two oppositely arranged end side frame rib plates 14. The two end side frame rib plates 14 are each provided with an end bottom plate 15 extending towards the other end side frame rib plate 14. One or more than one middle rib plate 12 is arranged inside the bottom frame 1, and the two ends of the middle rib plate 12 are arranged on the two end bottom plates 15.

[0039] Further, the two ends of the middle rib plate 12 are provided with overlapping grooves with the same thickness as the end bottom plate 15. The side of the middle rib plate 12 with the grooves is flush with the bottom surface of the end bottom plate 15, and the two sides of the side opposite to the overlapping grooves are provided with circular arc chamfers, which reduces the shielding of the heat radiation of the heating plate, improves the heating speed and heating uniformity of the tray 2, and eliminates the existence of the corner line on the side of the middle rib plate 12 in contact with the tray 2, thereby reducing the damage to the tray 2.

[0040] Specifically, the two ends of the middle rib plate 12 are provided with internal thread holes, and the end side frame rib plate 14 is provided with assembly holes corresponding to the internal thread holes. The metal screw is screwed into the internal thread hole through the assembly hole, so as to connect the two ends of the middle rib plate 12 to the end side frame rib plate 14. The two ends of the long side frame rib plate 11 are also connected to the end side frame rib plate 14 by metal screws, and the end bottom plate 15 is also connected to the long side frame rib plate 11 and the end side frame rib plate 14 by metal screws. The material of the metal screw is preferably the same as that of the bottom frame 1.

[0041] Further, the bottom surface of the end bottom plate 15 is surface treated to increase the surface roughness, thereby avoiding transmission slip. The surface treatment can be shot blasting and / or etching, for example, 300 mesh or so of glass sand is sprayed on the bottom surface of the end bottom plate 15.

[0042] In some embodiments, one or more than one connecting shaft 13 is arranged between the long side frame rib plate 11 and the adjacent middle rib plate 12 and / or between the two adjacent middle rib plates 12. The two ends of the connecting shaft 13 are provided with thread holes, and the long side frame rib plate and the middle rib plate are provided with connecting holes 16 corresponding to the thread holes. The assembly screw 17 is screwed into the thread hole through the connecting hole 16. The material of the assembly screw 17 is preferably the same as that of the bottom frame 1.

[0043] Further, the connecting shaft 13 is in a cylindrical shape, and the surface of the connecting shaft 13 is lower than the side of the middle rib plate 12 provided with the circular arc chamfer. When the tray 2 is installed on the first step 18, the side of the middle rib plate 12 provided with the circular arc chamfer supports the tray 2, and the tray 2 does not contact the connecting shaft 13, which reduces the shielding of the heat radiation of the heating plate and improves the heating speed and heating uniformity of the tray 2.

[0044] Further, the center lines of the connecting shafts 13 and the adjacent two connecting shafts 13 are located on different straight lines in the same horizontal plane.

[0045] In the description of the utility model, it needs to explain, unless another explicit stipulation and limit, the term " install " " link " " connection " and so on should do the broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected, can be mechanical connection, also can be electrical connection, can be directly connected, also can indirectly connect through the intermediate medium, can be the communication inside two elements. For the ordinary skilled person in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

[0046] The above content is merely an example and description of the structure of the utility model, and the skilled person in the art can make various modifications or supplements or adopt similar ways to replace the described specific embodiments, as long as it does not deviate from the structure of the utility model or exceed the scope defined by the present claims, which shall belong to the protection scope of the utility model.

Claims

1. A modular structure carrier device, characterized in that, The device includes a base frame and a tray placed on the base frame. One or more trays are provided. The upper surface of the tray is machined with several grooves. The bottom of the grooves is provided with support columns and vent holes. The base frame is a quadrilateral frame with a first step on the inner circumference. It includes two long side frame stiffeners arranged opposite each other and two end side frame stiffeners arranged opposite each other. The bottom of each end side frame stiffener is provided with an end base plate. The end base plate extends towards the side closer to the other end side frame stiffener. The interior of the base frame is provided with one or more middle stiffeners. The two ends of the middle stiffeners are attached to the end base plates.

2. The assembled structural carrier device according to claim 1, characterized in that, The upper surface of the tray is also machined with several heat-spreading grooves.

3. The assembled structural carrier device according to claim 1, characterized in that, The inner wall of the groove is provided with a second step.

4. The assembled structural carrier device according to claim 1, characterized in that, The central stiffener plate has overlapping grooves at both ends, which are the same thickness as the end base plate. The side of the central stiffener plate with the grooves is flush with the bottom surface of the end base plate, and the sides of the side opposite to the overlapping grooves are provided with rounded chamfers.

5. The assembled structural carrier device according to claim 1, characterized in that, The bottom surface of the end plate is surface treated to increase surface roughness.

6. The assembled structural carrier device according to claim 1, characterized in that, One or more connecting shafts are provided between the long frame stiffener and the adjacent middle stiffener and / or between two adjacent middle stiffeners.

7. The assembled structural carrier device according to claim 6, characterized in that, The center lines of the connecting shaft and the connecting shafts on the adjacent sides are located on different straight lines on the same horizontal plane.

8. The assembled structural carrier device according to claim 6, characterized in that, The connecting shaft has threaded holes at both ends, and the long frame rib plate and the middle rib plate have connecting holes corresponding to the threaded holes.

9. The assembled structural carrier device according to claim 6, characterized in that, The connecting shaft is cylindrical, and its surface is lower than the rounded chamfered surfaces on both sides of the central stiffener plate.

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