Wafer memory

Abstract

The utility model relates to the field of semiconductor manufacturing, and provides a wafer memory for solving the problems of low space utilization rate and low carrying efficiency of a conventional wafer memory. The wafer storage device comprises a storage bin wall, a plurality of bearing tables, a moving device and a carrying device. A storage bin is arranged in the storage bin wall, and the multiple bearing tables are arranged in the storage bin and used for bearing wafer boxes. The moving device is arranged in the storage bin and is driven to ascend and descend. The carrying device is supported on the moving device so as to lift along with the moving device and is used for carrying the wafer box among the plurality of bearing tables, the plurality of bearing tables comprise a movable bearing table, and the movable bearing table is supported on the moving device so as to lift along with the moving device. According to the wafer storage device, the mobile bearing platform is arranged on the mobile device, so that the mobile bearing platform ascends and descends along with the mobile device, and the carrying efficiency is improved while the space utilization rate of the wafer storage device is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of semiconductor manufacturing, and more particularly, to a wafer storage. BACKGROUND

[0002] In the semiconductor industry, a wafer storage is used as an automated storage device to realize the flow of wafers between different processes through cooperation with an automated material handling system. The wafer storage is provided with a handling device and a plurality of carrying tables in a storage compartment. The plurality of carrying tables are used to carry wafer boxes. In order to make full use of the vertical space, i.e. the space in the height direction, the plurality of carrying tables are arranged as multiple layers spaced along the height direction, and each layer includes one or more carrying tables. The handling device carries wafer boxes between the plurality of carrying tables. However, the space utilization and handling efficiency of the conventional wafer storage are low. SUMMARY

[0003] Therefore, the present disclosure provides a wafer storage to improve the problem of low space utilization and handling efficiency of the conventional wafer storage.

[0004] The wafer storage includes a storage compartment wall, a plurality of carrying tables, a moving device, and a handling device. The storage compartment wall is provided with a storage compartment. The plurality of carrying tables are arranged in the storage compartment and used to carry wafer boxes. The moving device is arranged in the storage compartment and is driven to ascend and descend. The handling device is supported on the moving device to ascend and descend with the moving device and is used to carry wafer boxes between the plurality of carrying tables. The plurality of carrying tables include a moving carrying table supported on the moving device to ascend and descend with the moving device.

[0005] As a possible implementation, the storage compartment wall includes a front wall and a rear wall, the front wall is provided with a front compartment opening, and the rear wall is provided with a rear compartment opening. A direction perpendicular to the front-rear direction is defined as a width direction. The moving carrying table is located on one side of the handling device in the width direction.

[0006] As a possible implementation, the central axis of the handling device and the moving carrying table are not aligned in the front-rear direction.

[0007] As a possible implementation, the moving device includes a first platform, a second platform, and a frame. The first platform and the second platform are fixed to the frame. The handling device is supported on the first platform, and the moving carrying table is supported on the second platform.

[0008] As a possible implementation, the handling device includes a main body and an arm mechanism. The main body is supported on the first platform, and the arm mechanism is located above the main body. The first platform is lower than the second platform, so that the main body is lower than the moving carrying table.

[0009] As a possible implementation, the wafer storage further includes a driving device fixed to the first platform.

[0010] As one possible implementation, the drive device includes a guide rail and a slider, with the guide rail guiding the slider to move up and down, and the slider fixed to the first platform.

[0011] In one possible implementation, the first platform includes a base plate and multiple side panels fixed to the base plate. A transport device is supported on the base plate, and the multiple side panels are arranged around the transport device. The multiple side panels include a first side panel, and a drive device is fixed to the first side panel.

[0012] As one possible implementation, the multiple enclosures also include a second enclosure to which the frame is fixed.

[0013] As one possible implementation, the conveying device includes a main body and an arm mechanism, with the arm mechanism located above the main body and driven to rise and fall relative to the main body.

[0014] This disclosure improves the space utilization of the chip memory and increases handling efficiency by setting a mobile carrier on the mobile device, so that the mobile carrier moves up and down with the mobile device. Attached Figure Description

[0015] It should be understood that the accompanying drawings only illustrate certain embodiments of this disclosure and should not be construed as limiting the scope.

[0016] It should be understood that the same or similar reference numerals are used in the accompanying drawings to denote the same or similar elements.

[0017] It should be understood that the accompanying drawings are only schematic, and the dimensions and scales of the elements in the drawings are not necessarily precise.

[0018] Figure 1a This is a schematic top view of a chip memory according to an embodiment of the present disclosure.

[0019] Figure 1b for Figure 1a A schematic right view of the chip memory.

[0020] Figure 2 for Figure 1a A schematic diagram of the structure of the chip memory transport device.

[0021] Figure 3 for Figure 1a A schematic diagram showing the position of the moving support platform for the chip memory.

[0022] Figure 4 for Figure 1a A schematic diagram of the moving and transporting device for the chip memory.

[0023] Figure 5 for Figure 1aA schematic diagram of the structure of the handling device, moving device and driving device of the chip memory.

[0024] Figure 6 for Figure 1a A schematic diagram of the structure of the handling device, moving device and driving device of the chip memory.

[0025] Figure 7 for Figure 1a A schematic diagram of the structure of the chip memory transport device.

[0026] Figure 8 for Figure 1a A schematic diagram of a portion of the chip memory.

[0027] Figures 1a to 8 Explanation of reference numerals in the attached figures:

[0028] 1-Storage compartment wall, 11-Front wall, 111-Front compartment opening, 12-Rear wall, 121-Rear compartment opening, 13-Side wall, 2-Bearing platform, 3-Moving device, 31-First platform, 311-First enclosure, 312-Second enclosure, 313-Base plate, 32-Second platform, 33-Frame, 4-Transportation device, 41-Central axis, 42-Main body, 43-Arm mechanism, 44-Axis, 5-Storage compartment, 2a-Moving bearing platform, 7-Three-axis robot, 71-Mechanical arm, 72-Actuator, 8-Chip box, 9-Drive device, 91-Guide rail, 92-Slider. Detailed Implementation

[0029] Numerous specific details are set forth below to provide an understanding of the structure, function, and use of the embodiments described and illustrated in the specification and figures. It is to be understood that the embodiments described and illustrated herein are non-limiting examples, and thus it will be appreciated that the particular structural and functional details disclosed herein are representative and exemplary. Variations and changes may be made to these embodiments without departing from the scope of the claims.

[0030] In the semiconductor industry, wafer memory, as an automated storage device, facilitates the transfer of wafers between different processes through collaboration with automated material handling systems. The wafer memory's storage compartment contains a handling unit and multiple carrier platforms to hold wafer cassettes. To fully utilize vertical space, i.e., space along the height direction, the carrier platforms are arranged in multiple layers spaced apart along the height, with each layer including one or more carrier platforms. The handling unit moves the wafer cassettes between the multiple carrier platforms.

[0031] However, the applicant found that the handling device in traditional chip memory requires a lot of vertical space during the lifting process. This space is not used effectively, resulting in low space utilization and small storage capacity of chip memory.

[0032] In addition, the carrier platform is usually far away from the handling device. Each time the device is handled, it needs to travel a long distance to pick up the wafer cassette, which reduces the handling efficiency.

[0033] In addition, when traditional chip memory is transported between carrier stages, the carrier stage where the chip cassette is being transported and the target carrier stage that receives the chip cassette are usually not at the same height.

[0034] Furthermore, the transport device first removes the wafer cassette horizontally from the carrier platform and moves it to a safe position where the orthographic projection of the wafer cassette on the horizontal plane does not coincide with the orthographic projection of the carrier platform on the horizontal plane. This avoids interference and collision between the wafer cassette and the carrier platform when the moving device raises or lowers. The moving device then drives the transport device to raise or lower, bringing the wafer cassette to the height of the target carrier platform. Finally, the transport device places the wafer cassette onto the target carrier platform. Therefore, in traditional chip memory systems, when transporting wafer cassettes between carrier platforms of different heights, the wafer cassette must be removed first, then raised or lowered, and finally placed. Performing these three actions—removing, raising, and placing—in separate steps results in low transport efficiency.

[0035] To address the aforementioned issues of low space utilization and low handling efficiency of wafer memory, embodiments of this disclosure provide a mobile platform mounted on a mobile device, which moves up and down with the mobile device. This configuration effectively utilizes the vertical space occupied by the handling device during lifting and lowering, thus improving space utilization. Furthermore, the mobile platform is located close to the handling device, further enhancing handling efficiency. Additionally, this configuration allows the handling device to directly move wafer cassettes from one platform to another, without further lifting or lowering, further improving handling efficiency. Moreover, this configuration allows wafer cassettes to be lifted and lowered simultaneously with the mobile device while being placed or removed from the mobile platform. In other words, the removal or placement and lifting / lowering of wafer cassettes on the mobile platform can be performed concurrently. This further improves both the space utilization and handling efficiency of the wafer memory.

[0036] The chip memory provided in the embodiments of this disclosure will be described in more detail below with reference to the accompanying drawings.

[0037] like Figure 1a , Figure 1bAs shown, the wafer memory disclosed herein includes a storage compartment wall 1, multiple support platforms 2, a moving device 3, and a transport device 4. A storage compartment 5 is disposed within the compartment wall, and the multiple support platforms 2 are disposed within the storage compartment 5 for carrying wafer cassettes. The moving device 3 is also disposed within the storage compartment 5 and is driven to move up and down. The transport device 4 is supported on the moving device 3 to move up and down with the moving device 3 and is used to transport wafer cassettes between the multiple support platforms 2. The multiple support platforms 2 include a movable support platform 2a, which is supported on the moving device 3 and moves up and down with the moving device 3.

[0038] In this disclosure, the number of storage chamber walls 1 is not limited. Multiple storage chamber walls 1 can be enclosed together to form a storage chamber 5. The enclosing storage chamber walls 1 may or may not be joined together. The storage chamber 5 serves as a receiving space for placing multiple support platforms 2, moving devices 3, and conveying devices 4. The support platforms 2 can be used to carry wafer cassettes. The arrangement of multiple support platforms 2 can be a horizontal arrangement, a vertical arrangement, or a multi-row, multi-column matrix. The moving devices 3 can be driven to rise and fall, supporting the conveying devices 4 to different heights, thereby allowing the conveying devices 4 to grasp wafer cassettes of different heights. The moving devices 3 can be movable or fixed in the horizontal direction. When the moving devices 3 cannot move horizontally, they can be positioned in the middle of the storage chamber 5 or at the edge of the storage chamber 5, as long as they can cooperate with the conveying devices 4 to grasp wafer cassettes on all support platforms 2. This disclosure does not limit the driving method of the moving devices 3; it can be one or more of hydraulic, pneumatic, or electric drives. The transport device 4 is supported on the mobile device 3 and moves up and down with it. After reaching a designated height, the transport device 4 can grab a wafer cassette from the carrier platform 2 and move it horizontally or place it on the target carrier platform. This enables the transport of wafer cassettes between different carrier platforms 2. The mobile carrier platform 2a on the mobile device 3 utilizes its space to increase the storage capacity of the storage compartment 5. Because the mobile carrier platform 2a is close to the transport device 4, the distance the transport device 4 needs to travel is reduced when transporting wafer cassettes between the mobile carrier platform 2a and other carrier platforms 2, effectively improving transport efficiency. This disclosure does not limit the number of mobile carrier platforms 2a; one or more mobile carrier platforms 2a can be provided according to the accommodating space of the mobile device 3 and the needs of those skilled in the art. This disclosure also does not limit the positional relationship between the mobile carrier platform 2a and the transport device 4, as long as the wafer cassette on the mobile carrier platform 2a is within the gripping range of the transport device 4.

[0039] Specifically, such as Figure 1a and Figure 1bAs shown, in the above embodiment, the storage compartment wall 1 of the wafer memory can be enclosed to form a hollow rectangle, and the accommodating space formed inside the rectangle serves as the storage compartment 5. Multiple support platforms 2, arranged horizontally and vertically, are provided on the storage compartment wall 1, forming a 3*3 matrix for carrying the wafer cassette. A moving device 3 is located in the center of the storage compartment 5 and can be driven to rise and fall. The handling device 4 can be a three-axis robot 7, mounted on the moving device 3 and rising and falling together with it. Figure 2 As shown, the three-axis robot 7 includes a robotic arm 71 and an actuator 72. When the three-axis robot 7 reaches a designated height, the motor drives the robotic arm 71 to move, and the actuator 72 at the end of the robotic arm 71 can reach any position within the workspace in the horizontal direction. After reaching the designated position, the actuator 72 can grasp or place the wafer cassette 8. Therefore, with the cooperation of the moving device 3, the three-axis robot 7 can transport the wafer cassette 8 between carrier platforms 2 at different heights and positions. Furthermore, a mobile carrier platform 2a is provided on the moving device 3, so that the space within the wafer memory is effectively utilized. The mobile carrier platform 2a is closer to the transport device 4 than other carrier platforms 2, and the mobile carrier platform 2a can rise and fall together with the moving device 3, maintaining a fixed relative position with the three-axis robot 7 during the rising and falling process. In this embodiment, since the mobile carrier platform 2a rises and falls synchronously with the transport device 4, the transport device 4 can rise and fall simultaneously when taking out or placing the wafer cassette 8 on the mobile carrier platform 2a without interfering with or colliding with other carrier platforms 2, saving transport time and improving transport efficiency.

[0040] In some embodiments, such as Figure 3 As shown, the storage compartment wall 1 includes a front wall 11 and a rear wall 12. The front wall 11 has a front compartment opening 111, and the rear wall 12 has a rear compartment opening 121. The direction indicated by x+ is the front, and the direction indicated by x- is the rear. x+ and x- are collectively referred to as the front-back direction, and the direction perpendicular to the front-back direction is the width direction. In this disclosure, the conveying device 4 needs to continuously interact with the front compartment opening 111 and the rear compartment opening 121. If the movable support platform 2a is placed in front of or behind the conveying device 4, it will hinder the interaction between the conveying device 4 and the front compartment opening 111 and the rear compartment opening 121. The movable support platform 2a can be placed on one side of the conveying device 4 in the width direction. Specifically, as shown... Figure 3 As shown, the mobile support platform 2a can be positioned in a second position or a first position. Therefore, by positioning the mobile support platform 2a on one side of the conveying device 4 in the width direction, and by placing the mobile support platform 2a neither between the front opening 111 and the conveying device 4 nor between the rear opening 121 and the conveying device 4, the interference of the mobile support platform 2a on the interaction between the conveying device 4 and the front opening 111 and the rear opening 121 can be reduced.

[0041] In some embodiments, the central axis 41 of the conveying device 4 and the movable support platform 2a are not aligned in the front-rear direction. That is, the distance from the central axis 41 of the conveying device 4 to the front wall 11 is not equal to the distance from the movable support platform 2a to the front wall 11. In one embodiment, the distance from the central axis 41 of the conveying device 4 to the front wall 11 can be greater than the distance from the movable support platform 2a to the front wall 11, such as... Figure 3 As shown, the movable support platform 2a is positioned at a second location near the front wall 11. In another embodiment, the distance from the central axis 41 of the transport device 4 to the front wall 11 can be less than the distance from the movable support platform 2a to the front wall 11, meaning the movable support platform 2a is positioned at a second location near the rear wall 12. Since the storage compartment walls 1 form a rectangle, the distance from the central axis 41 of the transport device 4 to the side wall 13 is less than the distance from the central axis 41 to the intersection of the front wall 11 or the rear wall 12 and the side wall 13. This means that the space at the second location is larger than that at the first location, allowing for the placement of a larger wafer cassette 8. Because the movable support platform 2a at the second location is close to the front wall 11 or the rear wall 12, the transport device 4 needs to travel a shorter distance, thereby improving transport efficiency. Specifically, the movable support platform 2a can be placed... Figure 3 In the second position near the rear wall 12, the movable carrier 2a is located in the corner formed by the side wall 13 and the rear wall 12, allowing for the placement of a larger wafer cassette 8. Therefore, the central axis 41 of the handling device 4 and the movable carrier 2a are not aligned in the front-to-back direction, allowing for the placement of a larger wafer cassette 8 within the storage compartment 5, increasing storage capacity, while simultaneously reducing the interaction distance between the movable carrier 2a and the front or rear compartment opening 111, thus improving handling efficiency.

[0042] In some embodiments, such as Figure 4As shown, the mobile device 3 includes a first platform 31, a second platform 32, and a frame 33, with the first platform 31 and the second platform 32 fixed to the frame 33. A transport device 4 is supported on the first platform 31. The transport device 4 includes a main body 42 and an arm mechanism 43. A mobile support platform 2a is supported on the second platform 32. The transport device 4 typically has a certain height. If the transport device 4 and the mobile support platform 2a are placed directly on the same platform, the arm mechanism 43 in the transport device 4 will not be at the same height as the mobile support platform 2a. Since the arm mechanism 43 in the transport device 4 can only move horizontally, it will be unable to grasp the wafer cassette 8 on the mobile support platform 2a. Therefore, this disclosure allows for two platforms on the mobile device 3: a first platform 31 and a second platform 32, which can be connected via the frame 33. By supporting the transport device 4 on the first platform 31 and the mobile support platform 2a on the second platform 32, and adjusting the height difference and distance between the first platform 31 and the second platform 32, the wafer cassette 8 on the mobile support platform 2a can be placed within the grasping range of the transport device 4. Specifically, the first platform 31 is lower than the second platform 32. The first platform 31 is connected to the bottom of the frame 33, the main body 42 is supported on the first platform 31, and the arm mechanism 43 is located above the main body 42. The second platform 32 is connected to the top of the frame 33, and the movable support platform 2a is disposed on the second platform 32. This makes the main body 42 lower than the movable support platform 2a, and the movable support platform 2a and the arm mechanism 43 are at the same height. The first platform 31 and the second platform 32 can be two flat plates. This disclosure does not limit the connection method between the first platform 31, the second platform 32, and the frame 33; for example, they can be connected by welding or bolts. This disclosure does not limit the materials of the first platform 31, the second platform 32, and the frame 33; for example, they can be metal or carbon fiber. Therefore, this disclosure adjusts the height difference and distance between the first platform 31 and the second platform 32 to ensure that the wafer cassette 8 on the movable support platform 2a is within the grasping range of the handling device 4.

[0043] In the above embodiments, such as Figure 5As shown, the chip memory may also include a drive device 9, which can be fixed to the first platform 31. The first platform 31 can rise or fall under the drive of the drive device 9, thereby allowing the transport device 4, frame 33, second platform 32, and movable support platform 2a to rise or fall under the support of the first platform 31, thus achieving synchronized lifting and lowering of the transport device 3, transport device 4, and movable support platform 2a. During this process, the weight of the transport device 4, which has the largest mass, is applied to the first platform 31. The connection strength between the frame 33 and the first platform 31 and second platform 32 only needs to consider the mass of the movable support platform 2a, which is typically small; therefore, the connection strength requirement between the frame 33 and the first platform 31 and second platform 32 is not high. However, if the drive unit 9 is connected to the second platform 32, the weight of the transport device 4 will be applied to the connection point between the frame 33 and the first platform 31 and the second platform 32; if the drive unit 9 is connected to the frame 33, the weight of the transport device 4 will be applied to the connection point between the frame 33 and the first platform 31; the strength requirements for the connection point are very high. If the strength is insufficient, it will cause damage to the moving device 3. Therefore, by fixing the drive unit 9 to the first platform 31, the moving device 3 is less likely to be damaged when the drive unit 9 drives the moving device 3 to rise and fall, thus improving the safety of the moving device 3.

[0044] In the above embodiments, such as Figure 5 As shown, the drive device 9 also includes a guide rail 91 and a slider 92. The guide rail 91 has a certain height, and the slider 92 can be driven to move up and down along the guide rail 91. To avoid obstructing the rear compartment opening 121, the guide rail 91 needs to be lower than the rear compartment opening 121. In this disclosure, the arm mechanism 43 can be raised to the same height as the rear compartment opening 121. Therefore, in some embodiments, the slider 92 can be fixed on the moving device 3 near the bottom to maximize the maximum height that the arm mechanism 43 can reach. Specifically, as... Figure 5 As shown, the slider 92 can be fixed to the first platform 31. When the slider 92 is at the highest point of the guide rail 91, the arm mechanism 43 can be raised to the same height as the rear compartment opening 121 with the support of the main body 42. Therefore, by fixing the slider 92 to the first platform 31 at the bottom of the mobile device, this disclosure allows the guide rail 91 to not obstruct the rear compartment opening 121 while the arm mechanism 43 can be raised to the same height as the rear compartment opening 121.

[0045] Furthermore, to improve the overall structural strength of the mobile device 3, such as... Figure 6As shown, the first platform 31 includes a base plate 313 and multiple surrounding plates fixed to the base plate 313. The conveying device 4 is supported on the base plate 313, and the multiple surrounding plates are arranged around the conveying device 4. The multiple surrounding plates include a first surrounding plate 311. Specifically, the first surrounding plate 311, which is disposed on the base plate 313, is close to the driving device 9 and perpendicular to the base plate 313. The driving device 9 is fixed to the first surrounding plate 311, and there is a large fixed area between the first surrounding plate 311 and the driving device 9, which can improve the connection strength between the driving device 9 and the first platform 31. The connection methods between the first surrounding plate 311, the base plate 313, and the driving device 9 include, but are not limited to, bolted connections and welding.

[0046] Furthermore, a second enclosure 312 can be provided on the base plate 313, and the frame 33 can be fixed to the second enclosure 312. Specifically, as shown in the example... Figure 6 As shown, a second enclosure plate 312 is provided on each side of the conveying device 4 on the base plate, and the frame 33 is connected to the second enclosure plate 312. The frame 33 is connected to the first platform 31 through the second enclosure plate 312. Compared with direct connection to the base plate 313, this increases the fixed area between the frame 33 and the first platform 31, resulting in higher overall structural strength of the connecting device. The connection methods between the second enclosure plate 312, the base plate 313, and the frame 33 include, but are not limited to, bolt connection and welding.

[0047] In some embodiments, the handling device 4 includes a main body 42 and an arm mechanism 43, the arm mechanism 43 being located above the main body 42 and driven to move up and down relative to the main body 42. Because the arm mechanism 43 can move up and down relative to the main body 42, its height can be higher or lower than the moving device 3. Therefore, when the height of the arm mechanism 43 is higher or lower than the moving support stage 2a, the arm mechanism 43 and the wafer cassette 8 it holds can rotate freely on the horizontal plane without interfering with the moving support stage 2a. Specifically, as... Figure 7 As shown, a shaft 44 can be installed inside the main body 42, with its top end connected to the arm mechanism 43. The shaft 44 can be driven to rise and fall relative to the main body 42, thereby driving the arm mechanism 43 to rise and fall. The driving methods for driving the shaft 44 to rise and fall include, but are not limited to, hydraulic drive, pneumatic drive, and electric drive. Therefore, this disclosure enables the arm mechanism 43 to rise and fall relative to the main body 42, allowing the height of the arm mechanism 43 to be higher or lower than the movable support platform 2a. This allows the wafer cassette 8 to avoid the moving device 3 when moving horizontally, resulting in a more flexible trajectory and improved handling efficiency.

[0048] The present disclosure is described in more detail below with specific examples. It should be noted that these examples are merely to assist those skilled in the art in understanding the present disclosure and are not intended to limit the disclosure to the specific numerical values ​​or scenarios illustrated. Those skilled in the art will obviously be able to make various equivalent modifications or variations based on the examples given below, and such modifications or variations also fall within the scope of this disclosure.

[0049] like Figures 1a-8 As shown, the chip memory includes a storage compartment wall 1, which forms a hollow cube. The space inside the cube serves as a storage compartment 5. Multiple support platforms 2 are located within the storage compartment 5 and are mounted on the storage compartment wall 1. The support platforms 2 on the storage compartment wall 1 are arranged horizontally and vertically, forming a support platform matrix for supporting the chip cassette 8. The storage compartment wall 1 includes a front wall 11 and a rear wall 12. The front wall 11 has a front opening 111, and the rear wall 12 has a rear opening 121.

[0050] The storage compartment 5 contains a drive unit 9, with a guide rail 91 close to the rear wall 12. A screw is located inside the guide rail 91, and a slider 92 is positioned on the side of the guide rail 91 facing the front wall 11, connected to the screw. The motor in the drive unit 9 drives the screw to rotate via a fingerprint sensor, which in turn causes the slider 92 to move up and down along the guide rail 91.

[0051] The storage compartment 5 is also equipped with a moving device 3, which includes a first platform 31, a second platform 32, and a frame 33. The first platform 31 is located at the bottom of the frame 33, and a conveying device 4 is mounted on it. The second platform 32 is located at the top of the frame 33, and a movable support platform 2a is mounted on it. The first platform 31 includes a base plate 313, on which three surrounding plates are fixedly connected. The three surrounding plates surround the conveying device 4 and are perpendicular to the base plate 313. The first surrounding plate 311 is located on the side of the base plate 313 near the rear wall 12. Two second surrounding plates 312 are respectively located on both sides of the conveying device 4 and are perpendicular to the first surrounding plate 311. The frame 33 is fixedly connected to the second surrounding plates 312. The slider 92 in the drive device 9 is fixedly connected to the first surrounding plate 311, thereby driving the moving device 3, the conveying device 4, and the movable support platform 2a to rise and fall synchronously.

[0052] The transport device 4, mounted on the first platform 31 of the mobile device 3, includes a main body 42 and an arm mechanism 43. The main body 42 contains a shaft 44, which can rise and fall relative to the main body 42 under the drive of a motor. The arm mechanism 43 is located above the main body 42 and connected to the top of the shaft 44. The arm mechanism 43 can also rise and fall relative to the main body 42 under the drive of the shaft 44. The arm mechanism 43 is a three-axis robot 7, whose end effector 72 is a gripper capable of grasping a wafer cassette 8. The three-axis robot 7 can move the wafer cassette 8 on a horizontal plane using its robotic arm 71. When the height of the three-axis robot 7 is higher than the mobile support platform 2a, the wafer cassette 8 grasped by the gripper can move freely on the horizontal plane without interfering with the mobile support platform 2a. This disclosure provides a mobile support platform 2a on the mobile device 3, increasing the capacity of the wafer memory. Simultaneously, the mobile support platform 2a rises and falls together with the transport device 4, allowing the transport device 4 to rise and fall simultaneously when removing or placing the wafer cassette 8 on the mobile support platform 2a, thus improving transport efficiency.

[0053] It should be noted that the elements described in the above specific embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0054] It should be understood that multiple components and / or parts can be provided by a single integrated component or part. Alternatively, a single integrated component or part can be divided into multiple separate components and / or parts. The use of the public designation "a" or "an" to describe a component or part does not imply the exclusion of other components or parts.

[0055] It should be understood that although terms such as “first” or “second” may be used in this disclosure to describe various elements (such as the first platform and the second platform), these elements are not defined by these terms, which are only used to distinguish one element from another.

[0056] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0057] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A chip memory, characterized in that, The chip memory includes: Storage compartment wall, wherein a storage compartment is provided within the storage compartment wall; Multiple support platforms are disposed within the storage compartment for supporting wafer cassettes; A mobile device, disposed within the storage compartment and driven to move up and down; and A transport device, supported on the mobile device to move up and down with the mobile device, and used to transport the wafer cassette between a plurality of carrier platforms, wherein the plurality of carrier platforms includes a mobile carrier platform supported on the mobile device to move up and down with the mobile device.

2. The chip memory according to claim 1, characterized in that, The storage compartment wall includes a front wall and a rear wall. The front wall has a front compartment opening, and the rear wall has a rear compartment opening. The width direction is defined as the direction perpendicular to the front-back direction. The mobile support platform is located on one side of the handling device in the width direction.

3. The chip memory according to claim 2, characterized in that, The central axis of the conveying device and the movable support platform are not aligned in the front-to-back direction.

4. The chip memory according to any one of claims 1 to 3, characterized in that, The mobile device includes a first platform, a second platform, and a frame. The first platform and the second platform are fixed to the frame. The transport device is supported on the first platform, and the mobile carrier is supported on the second platform.

5. The chip memory according to claim 4, characterized in that, The transport device includes a main body and an arm mechanism. The main body is supported on the first platform, and the arm mechanism is located above the main body. The first platform is lower than the second platform, so that the main body is lower than the mobile support platform.

6. The chip memory according to claim 5, characterized in that, The chip memory also includes a driving device, which is fixed to the first platform.

7. The chip memory according to claim 6, characterized in that, The driving device includes a guide rail and a slider, the guide rail guides the slider to move up and down, and the slider is fixed to the first platform.

8. The chip memory according to claim 6, characterized in that, The first platform includes a base plate and a plurality of side plates fixed to the base plate. The transport device is supported on the base plate, and the plurality of side plates are arranged around the transport device. The plurality of side plates include a first side plate, and the drive device is fixed to the first side plate.

9. The chip memory according to claim 8, characterized in that, The plurality of enclosures also includes a second enclosure, to which the frame is fixed.

10. The chip memory according to any one of claims 1 to 3, characterized in that, The transport device includes a main body and an arm mechanism, the arm mechanism being located above the main body and being driven to rise and fall relative to the main body.

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