Multi-size wafer film pasting table tray

Abstract

The utility model discloses a multi-size wafer film pasting table tray which comprises a table tray body. The first placing position is arranged at the center of the table tray body; the second placing position is arranged on the table tray body, and the second placing position is arranged on the outer side of the first placing position; the third placing position is arranged on the table tray body, and the third placing position is arranged on the outer side of the second placing position. Through the application of the utility model, the multi-size wafer film pasting table tray is provided, the multi-size wafer film pasting table tray can be matched with wafers of various sizes so as to realize the film pasting process of processing the wafers of various sizes on the same table tray, the compatibility of equipment is improved, and the requirements of the wafers of different sizes can be flexibly met; therefore, different wafers in a certain size range can be efficiently pasted with films, the requirements for a plurality of special devices are reduced, the production process and the operation steps are simplified, the production efficiency and the utilization rate of the devices are improved, and the production cost of enterprises is effectively reduced.

Description

Technical Field

[0001] This utility model relates to the field of wafer technology, and in particular to a multi-size wafer lamination platform. Background Technology

[0002] With the continuous advancement of technology and the development of society, wafers are widely used as the foundation of the semiconductor packaging industry. A wafer refers to a silicon or silicon carbide wafer used to fabricate semiconductor circuits. Because of its circular shape, it is called a wafer, and its raw material is silicon or silicon carbide. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, then slowly pulled out to form cylindrical single-crystal silicon, commonly known as a silicon ingot. After grinding, polishing, and slicing, the silicon ingot becomes a silicon wafer. Domestic wafer production lines include 4-inch, 6-inch, 8-inch, and 12-inch wafers. In various packaging processes, wafer dicing is required. Before dicing, there is a wafer fixing process, namely wafer film application, to facilitate subsequent wafer fabrication processes.

[0003] Thin films used for attaching to wafers include, but are not limited to, diced blue films, diced white films, thinning protective films, UV films, and conductive films for chip mounting. Wafer film attachment primarily relies on specialized attachment equipment and processes. Attaching machines can be categorized by their operation: manual contact attaching machines, semi-automatic contact attaching machines, and automatic attaching machines. Both manual and automatic attaching machines have trays for placing wafers; however, in current technology, these trays are generally fixed in a specific location, and each tray corresponds to only one wafer size, making them incompatible with multiple product sizes and thus unable to meet the film attachment requirements of various products and complex processes. Utility Model Content

[0004] In view of this, and to solve the above problems, the purpose of this utility model is to provide a multi-size wafer bonding tray, comprising:

[0005] Table body;

[0006] The first placement point is located at the center of the tray body;

[0007] The second placement location is located on the platform body and is located outside the first placement location;

[0008] The third placement location is located on the platform body and is located outside the second placement location.

[0009] In another preferred embodiment, a first edge gap is provided between the first placement location and the second placement location, a second edge gap is provided between the second placement location and the third placement location, and a third edge gap is provided on the outer side of the third placement location.

[0010] In another preferred embodiment, the cross-section of the first placement location is circular, and the cross-sections of the second and third placement locations are annular, with the centers of the first, second, and third placement locations coinciding.

[0011] In another preferred embodiment, the diameter of the first placement location is equal to the inner diameter of the first edge gap, the outer diameter of the first edge gap is equal to the inner diameter of the second placement location, the outer diameter of the second placement location is equal to the inner diameter of the second edge gap, the outer diameter of the second edge gap is equal to the inner diameter of the third placement location, and the outer diameter of the third placement location is equal to the inner diameter of the third edge gap.

[0012] In another preferred embodiment, the first placement location, the second placement location, and the third placement location all have an adsorption portion.

[0013] In another preferred embodiment, a first marker line is provided on the first placement location, and the first marker line is located on the outer edge of the first placement location.

[0014] In another preferred embodiment, a second marker line is provided on the second placement location, and the second marker line is located on the outer edge of the second placement location.

[0015] In another preferred embodiment, a notch is provided at the bottom of the third edge gap.

[0016] In another preferred embodiment, the first marker line and the second marker line are arranged in parallel.

[0017] The present invention, by adopting the above-mentioned technical solution, has the following positive effects compared with the prior art: By applying the present invention, a multi-size wafer laminating tray is proposed, which can be adapted to wafers of various sizes to realize the laminating process of multi-size wafers on the same tray, thereby improving the compatibility of the equipment and flexibly meeting the needs of wafers of different sizes. This allows different wafers within a certain size range to be laminated efficiently, reducing the need for multiple dedicated equipment, simplifying the production process and operation steps, improving production efficiency and equipment utilization, and effectively reducing the production costs of enterprises. Attached Figure Description

[0018] Figure 1This is a schematic diagram of the structure of a multi-size wafer lamination platform according to the present invention.

[0019] In the attached image:

[0020] 1. Tray body; 2. First placement position; 3. Second placement position; 4. Third placement position; 5. First edge gap; 6. Second edge gap; 7. Third edge gap; 8. Adsorption part; 9. First marking line; 10. Second marking line. Detailed Implementation

[0021] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0022] In the description of this utility model, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", "front", "back", "horizontal", and "vertical" are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0023] It should be noted that the terms "horizontal" and "vertical" in this utility model are used to describe approximate positional relationships, and not strictly "horizontal plane" or "vertical plane".

[0024] like Figure 1 As shown, a preferred embodiment of a multi-size wafer bonding tray includes:

[0025] Table body 1;

[0026] First placement point 2, the first placement point 2 is located at the center of the tray body 1;

[0027] The second placement location 3 is located on the tray body 1 and is located outside the first placement location 2.

[0028] The third placement point 4 is located on the platform body 1 and is located outside the second placement point 3.

[0029] Furthermore, as a preferred embodiment, when it is necessary to apply a film to the wafer, a four-inch wafer can be placed at the first placement location 2, a six-inch wafer can be placed at the first placement location 2 and the second placement location 3, and an eight-inch wafer can be placed at the first placement location 2, the second placement location 3 and the third placement location 4.

[0030] Furthermore, in a preferred embodiment, the outer contour of the first placement location 2 is the same as the outer contour size of the four-inch wafer, the outer diameter of the second placement location 3 is the same as the outer diameter of the six-inch wafer, and the outer diameter of the third placement location 4 is the same as the outer diameter of the eight-inch wafer.

[0031] Furthermore, as a preferred embodiment, the second placement 3 can prevent the four-inch wafer from being suspended outside the tray body 1, and the third placement 4 can prevent the six-inch wafer from being suspended outside the tray body 1, thereby preventing the wafer from cracking or breaking.

[0032] Furthermore, as a preferred embodiment, a first edge gap 5 is provided between the first placement 2 and the second placement 3, a second edge gap 6 is provided between the second placement 3 and the third placement 4, and a third edge gap 7 is provided on the outer side of the third placement 4.

[0033] Furthermore, as a preferred embodiment, the width of the first edge gap 5 is preferably set to 0.20-0.50 mm to reduce the impact on the placement of the six-inch wafer.

[0034] Furthermore, as a preferred embodiment, the width of the second edge gap 6 is preferably set to 0.20-0.50 mm to reduce the impact on the placement of the eight-inch wafer.

[0035] Furthermore, as a preferred embodiment, the width of the third edge gap 7 is preferably set to 0.20-0.50 mm to provide positioning and fixing for the eight-inch wafer.

[0036] Furthermore, as a preferred embodiment, the cross-section of the first placement location 2 is circular, and the cross-sections of the second placement location 3 and the third placement location 4 are annular, with the centers of the first placement location 2, the second placement location 3, and the third placement location 4 coinciding.

[0037] Furthermore, in a preferred embodiment, the diameter of the first placement 2 is equal to the inner diameter of the first edge gap 5, the outer diameter of the first edge gap 5 is equal to the inner diameter of the second placement 3, the outer diameter of the second placement 3 is equal to the inner diameter of the second edge gap 6, the outer diameter of the second edge gap 6 is equal to the inner diameter of the third placement 4, and the outer diameter of the third placement 4 is equal to the inner diameter of the third edge gap 7.

[0038] Furthermore, in a preferred embodiment, the first placement location 2, the second placement location 3, and the third placement location 4 all have adsorption portions 8. Furthermore, the adsorption portions 8 can be used to fix the wafer onto the tray body 1.

[0039] Furthermore, in a preferred embodiment, the adsorption unit 8 includes an air suction port. The interior of the platform body 1 is provided with three independent chambers. The first placement position 2, the second placement position 3, and the third placement position 4 each correspond to a chamber. The air suction port communicates with the corresponding chamber. The chamber is used to connect to an external negative pressure device, so that a negative pressure is generated inside the chamber, thereby causing the air suction port to hold the wafer. Furthermore, in use, wafers of different sizes are placed in different placement positions, and then the pneumatic negative pressure device generates negative pressure in the air suction port, thereby fixing the wafer in place.

[0040] Furthermore, as a preferred embodiment, a first marking line 9 is provided on the first placement location 2, and the first marking line 9 is located on the outer edge of the first placement location 2.

[0041] Furthermore, as a preferred embodiment, when placing a four-inch wafer, the flat edge of the four-inch wafer is directly opposite the first marking line 9.

[0042] Furthermore, as a preferred embodiment, the length of the first marking line 9 is preferably set to 29.5mm-30mm. The first marking line 9 is used to position the four-inch wafer, and the first marking line 9 can be applied to four-inch wafers with different flat edge lengths.

[0043] Furthermore, as a preferred embodiment, a second marker line 10 is provided on the second placement location 3, and the second marker line 10 is located on the outer edge of the second placement location 3.

[0044] Furthermore, as a preferred embodiment, when a six-inch wafer is placed, the flat edge of the six-inch wafer is directly opposite the first marking line 10.

[0045] Furthermore, as a preferred embodiment, the length of the second marking line 10 is preferably set to 54.5mm-55mm. The second marking line 10 is used to position the six-inch wafer, and the second marking line 10 can be applied to six-inch wafers with different flat edge lengths.

[0046] Furthermore, in a preferred embodiment, a notch is provided at the bottom of the third edge gap 7. The notch is further used for positioning the eight-inch wafer, and the outer contour of the eight-inch wafer can be aligned with the notch.

[0047] Furthermore, as a preferred embodiment, the first marker line 9 and the second marker line 10 are arranged in parallel.

[0048] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multi-size wafer lamination platform, characterized in that, include: Table body; The first placement point is located at the center of the tray body; The second placement location is located on the platform body and is located outside the first placement location; The third placement location is located on the platform body and is located outside the second placement location; The first placement location, the second placement location, and the third placement location all have an adsorption part; A first marker line is provided on the first placement location, and the first marker line is located on the outer edge of the first placement location; A second marker line is provided on the second placement location, and the second marker line is located on the outer edge of the second placement location.

2. The multi-size wafer lamination platform according to claim 1, characterized in that, A first edge gap is provided between the first placement location and the second placement location, a second edge gap is provided between the second placement location and the third placement location, and a third edge gap is provided on the outer side of the third placement location.

3. The multi-size wafer lamination platform according to claim 1, characterized in that, The cross-section of the first placement location is circular, and the cross-sections of the second and third placement locations are annular, with the centers of the first, second, and third placement locations coinciding.

4. The multi-size wafer lamination platform according to claim 2, characterized in that, The diameter of the first placement location is equal to the inner diameter of the first edge gap, the outer diameter of the first edge gap is equal to the inner diameter of the second placement location, the outer diameter of the second placement location is equal to the inner diameter of the second edge gap, the outer diameter of the second edge gap is equal to the inner diameter of the third placement location, and the outer diameter of the third placement location is equal to the inner diameter of the third edge gap.

5. The multi-size wafer lamination platform according to claim 2, characterized in that, The bottom of the third edge gap has a notch.

6. The multi-size wafer lamination platform according to claim 1, characterized in that, The first and second marker lines are set in parallel.

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