Wafer alignment platform device

Abstract

The utility model relates to the technical field of wafers, in particular to a wafer alignment platform device. Comprising a base, the upper end of the base is provided with a Y-direction linear moving unit, the upper end of the Y-direction linear moving unit is connected with an X-direction linear moving unit, the upper end of the X-direction linear moving unit is connected with a Z-direction linear moving unit, and the upper end of the Z-direction linear moving unit is connected with a wafer bearing disc; the wafer bearing disc comprises a rotating disc and bearing sheets, the upper end of the rotating disc is provided with a plurality of C-shaped bearing sheets with different diameters, and the plurality of bearing sheets are concentrically arranged. Compared with the prior art, the opening of the wafer bearing disc is designed in a layered manner, and the wafer bearing disc is compatible with wafers of various specifications, high in applicability and capable of being adjusted according to actual conditions. And the Z-direction lifting mechanism is compact in structure, and the precision, the attractiveness and the stability are enhanced through protection of the shell.

Description

Technical Field

[0001] This utility model relates to the field of wafer technology, specifically a wafer alignment platform device. Background Technology

[0002] Wafers are the basic material for integrated circuits, and wafer alignment platforms are key components for wafer testing, responsible for accurately positioning the wafer to ensure accurate and reliable test results.

[0003] Chinese patent application number CN2021208425950 discloses a high-precision automatic wafer alignment system, which achieves wafer alignment by moving along the X, Y, and Z axes and automatically adjusting the alignment through rotation. However, it is not suitable for wafers of different sizes, and the Z-axis movement mechanism is exposed, making it susceptible to interference from other components, resulting in deficiencies in overall accuracy, aesthetics, and stability. Summary of the Invention

[0004] This invention provides a wafer alignment platform device to overcome the shortcomings of the prior art.

[0005] To achieve the above objectives, a wafer alignment platform device is designed, including a base. The upper end of the base is provided with a Y-axis linear moving unit, the upper end of which is connected to an X-axis linear moving unit, the upper end of which is connected to a Z-axis linear moving unit, and the upper end of which is connected to a wafer carrier disk. The wafer carrier disk includes a turntable and carrier plates. The upper end of the turntable is provided with several C-shaped carrier plates of different diameters, and the carrier plates are arranged concentrically.

[0006] The turntable and the carrier plate are detachably connected.

[0007] The base has a groove at its upper end.

[0008] The Y-axis linear motion unit includes a Y-axis stator, a Y-axis mover, a Y-axis guide rail, and a Y-axis grating. The upper end of the base is provided with several Y-axis stators. One end of the Y-axis stator is slidably connected to the Y-axis mover. Y-axis guide rails are provided on both sides of the Y-axis stator, and a Y-axis grating is provided on one side of the Y-axis guide rail.

[0009] The upper end of the Y-axis stator is connected to the X-axis linear moving unit through the YX connecting plate, and the upper end of the Y-axis guide rail is connected to the YX connecting plate through the Y-axis guide rail slider. Y-axis anti-collision blocks are provided at both ends of the Y-axis guide rail.

[0010] The X-axis linear motion unit includes an X-axis stator, an X-axis mover, an X-axis guide rail, and an X-axis grating. The upper end of the base is provided with several X-axis stators. One end of the X-axis stator is slidably connected to the X-axis mover. X-axis guide rails are provided on both sides of the X-axis stator, and an X-axis grating is provided on one side of the X-axis guide rail.

[0011] The upper end of the X-axis stator is connected to the Z-axis linear moving unit through the XZ connecting plate, and the upper end of the X-axis guide rail is connected to the XZ connecting plate through the X-axis guide rail slider. X-axis anti-collision blocks are provided at both ends of the X-axis guide rail.

[0012] The Z-axis linear movement unit includes a housing, a Z-axis lead screw module, a Z-axis lifting plate, a Z-axis guide rail, and a Z-axis grating. The housing contains a Z-axis lead screw module, which is connected to one end of the Z-axis lifting plate. The other end of the Z-axis lifting plate is connected to the Z-axis guide rail. A Z-axis grating is located at one end of the Z-axis lead screw module.

[0013] The upper end of the outer shell is connected to the wafer carrier disk via a Z-θ connecting plate, and the outer shell is provided with an opening for the Z-axis lifting plate to move.

[0014] The Z-axis lead screw module is connected to a reinforcing rib support plate at the end away from the Z-axis lifting plate.

[0015] Compared with existing technologies, this utility model features a layered design with an open wafer carrier disk, compatible with various wafer specifications, offering strong applicability and allowing for adjustments based on actual conditions. The slotted base lowers the center of gravity, and the compact Z-axis lifting mechanism, protected by an outer shell, enhances precision, aesthetics, and stability. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model.

[0017] Figure 2 This is a schematic diagram of the structure of the Y-axis linear movement unit of this utility model.

[0018] Figure 3 This is a schematic diagram of the structure of the X-axis linear movement unit of this utility model.

[0019] Figure 4 This is a schematic diagram of the Z-axis linear movement unit of this utility model.

[0020] Figure 5 This is a schematic diagram of the Z-axis linear movement unit of this utility model after removing the outer shell.

[0021] Figure 6 This is a schematic diagram of the structure of the wafer carrier disk of this utility model.

[0022] Figure 7 This is a schematic diagram of the structure of the carrier sheet of this utility model. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings.

[0024] like Figures 1 to 7As shown, the base 5 has a Y-axis linear movement unit 1 at its upper end, an X-axis linear movement unit 2 connected to the upper end of the Y-axis linear movement unit 1, a Z-axis linear movement unit 3 connected to the upper end of the X-axis linear movement unit 2, and a wafer carrier disk 4 connected to the upper end of the Z-axis linear movement unit 3. The wafer carrier disk 4 includes a turntable 4-1 and carrier plates 4-2. The turntable 4-1 has several C-shaped carrier plates 4-2 of different diameters arranged concentrically. In actual use, the turntable 4-1 is rotated by a direct drive motor. The carrier plates 4-2 have an open, layered design, compatible with various wafer specifications, making them highly adaptable and adjustable according to actual needs.

[0025] The turntable 4-1 and the support plate 4-2 are detachably connected. In this embodiment, the turntable 4-1 and the support plate 4-2 are connected by bolts.

[0026] The upper end of the base 5 has a groove 5-1. The groove design reduces the overall height, makes the structure more compact, lowers the center of gravity, and enhances stability. In this embodiment, the base 5 is made of marble.

[0027] The Y-axis linear motion unit 1 includes a Y-axis stator 1-1, a Y-axis mover 1-2, a Y-axis guide rail 1-3, and a Y-axis grating 1-4. The upper end of the base 5 is provided with a plurality of Y-axis stators 1-1. One end of the Y-axis stator 1-1 is slidably connected to the Y-axis mover 1-2. Y-axis guide rails 1-3 are respectively provided on both sides of the Y-axis stator 1-1. A Y-axis grating 1-4 is provided on one side of the Y-axis guide rail 1-3.

[0028] The upper end of the Y-axis stator 1-1 is connected to the X-axis linear moving unit 2 via the YX connecting plate 6, and the upper end of the Y-axis guide rail 1-3 is connected to the YX connecting plate 6 via the Y-axis guide rail slider 1-5. Y-axis anti-collision blocks 1-6 are provided at both ends of the Y-axis guide rail 1-3 to prevent collisions and friction, protect equipment operation, reduce maintenance costs, and extend service life.

[0029] The Y-axis linear motion unit 1 is mounted on the marble base 5 and is used for reciprocating motion along the Y-axis. The Y-axis gratings 1-4 provide high-precision position feedback for the Y-axis linear motion unit 1, improving the accuracy and stability of the equipment.

[0030] The X-direction linear motion unit 2 includes an X-direction stator 2-1, an X-direction mover 2-2, an X-direction guide rail 2-3, and an X-direction grating 2-4. The upper end of the base 5 is provided with a plurality of X-direction stators 2-1. One end of the X-direction stator 2-1 is slidably connected to the X-direction mover 2-2. X-direction guide rails 2-3 are respectively provided on both sides of the X-direction stator 2-1. An X-direction grating 2-4 is provided on one side of the X-direction guide rail 2-3.

[0031] The upper end of the X-axis stator 2-1 is connected to the Z-axis linear moving unit 3 via the XZ connecting plate 7, and the upper end of the X-axis guide rail 2-3 is connected to the XZ connecting plate 7 via the X-axis guide rail slider 2-5. X-axis anti-collision blocks 2-6 are provided at both ends of the X-axis guide rail 2-3. The X-axis anti-collision blocks 2-6 prevent collisions and friction, protect equipment operation, reduce maintenance costs, and extend service life.

[0032] X-axis linear motion unit 2 is used for reciprocating motion along the X-axis. X-axis grating 2-4 provides high-precision position feedback for X-axis linear motion unit 2, improving the accuracy and stability of the equipment.

[0033] Z-axis linear movement unit 3 includes a housing 3-1, a Z-axis lead screw module 3-2, a Z-axis lifting plate 3-3, a Z-axis guide rail 3-4, and a Z-axis grating 3-5. The housing 3-1 contains the Z-axis lead screw module 3-2, which is connected to one end of the Z-axis lifting plate 3-3. The other end of the Z-axis lifting plate 3-3 is connected to the Z-axis guide rail 3-4. The Z-axis grating 3-5 is located at one end of the Z-axis lead screw module 3-2.

[0034] The Z-axis linear motion unit 3 drives the Z-axis lead screw module 3-2 through the drive motor, which in turn drives the Z-axis lifting plate 3-3 to perform Z-axis reciprocating motion. The Z-axis grating 3-5 provides high-precision position feedback for the Z-axis linear motion unit 3, improving the accuracy and stability of the equipment.

[0035] The upper end of the outer casing 3-1 is connected to the wafer carrier disk 4 via the Z-θ connecting plate 8, and the outer casing 3-1 is provided with an opening 3-6 for the Z-axis lifting plate 3-3 to move.

[0036] The Z-axis lead screw module 3-2, located away from the Z-axis lifting plate 3-3, is connected to a reinforcing rib support plate 3-7 to improve the structural strength and stability of the Z-axis linear movement unit 3.

[0037] In actual use, the Y-axis linear movement unit 1, the X-axis linear movement unit 2, the Z-axis linear movement unit 3, and the wafer carrier disk 4 are all driven by drive motors.

[0038] In practical applications, this invention is used in exposure machines, wafer dicing machines, and packaging and testing equipment. When in use, after the wafer is placed into the wafer carrier tray 4 via a conveying mechanism, the invention begins to move. First, it moves along the Y-axis linear movement unit 1 and X-axis linear movement unit 2 along the Y-axis and X-axis guide rails to below the designated detection position. The detection device then feeds back the information about the current wafer position to the controller. The controller processes and converts this information before feeding it back to the Y-axis linear movement unit 1, X-axis linear movement unit 2, and wafer carrier tray 4. Each unit adjusts its actions based on the feedback data. After completion, the wafer rises to the designated position via the Z-axis linear movement unit 3 for probe detection.

Claims

1. A wafer alignment platform device, comprising a base, characterized in that: The base (5) is provided with a Y-axis linear moving unit (1) at the upper end, the Y-axis linear moving unit (1) is connected to an X-axis linear moving unit (2) at the upper end, the X-axis linear moving unit (2) is connected to a Z-axis linear moving unit (3) at the upper end, and the Z-axis linear moving unit (3) is connected to a wafer carrier disk (4) at the upper end; the wafer carrier disk (4) includes a turntable (4-1) and a carrier plate (4-2), the turntable (4-1) is provided with a number of C-shaped carrier plates (4-2) of different diameters at the upper end, and the number of carrier plates (4-2) are arranged concentrically.

2. The wafer alignment platform device according to claim 1, characterized in that: The turntable (4-1) and the support plate (4-2) are detachably connected.

3. The wafer alignment platform device according to claim 1, characterized in that: The base (5) has a groove (5-1) at its upper end.

4. The wafer alignment platform device according to claim 1, characterized in that: The Y-direction linear movement unit (1) includes a Y-direction stator (1-1), a Y-direction mover (1-2), a Y-direction guide rail (1-3), and a Y-direction grating (1-4). The upper end of the base (5) is provided with several Y-direction stators (1-1). One end of the Y-direction stator (1-1) is slidably connected to the Y-direction mover (1-2). Y-direction guide rails (1-3) are provided on both sides of the Y-direction stator (1-1), and a Y-direction grating (1-4) is provided on one side of the Y-direction guide rail (1-3).

5. The wafer alignment platform device according to claim 4, characterized in that: The upper end of the Y-direction stator (1-1) is connected to the X-direction linear movement unit (2) through the YX connecting plate (6), and the upper end of the Y-direction guide rail (1-3) is connected to the YX connecting plate (6) through the Y-direction guide rail slider (1-5). Y-direction anti-collision blocks (1-6) are provided at both ends of the Y-direction guide rail (1-3).

6. The wafer alignment platform device according to claim 1, characterized in that: The X-direction linear movement unit (2) includes an X-direction stator (2-1), an X-direction mover (2-2), an X-direction guide rail (2-3), and an X-direction grating (2-4). The upper end of the base (5) is provided with several X-direction stators (2-1). One end of the X-direction stator (2-1) is slidably connected to the X-direction mover (2-2). X-direction guide rails (2-3) are provided on both sides of the X-direction stator (2-1), and an X-direction grating (2-4) is provided on one side of the X-direction guide rail (2-3).

7. A wafer alignment platform device according to claim 6, characterized in that: The upper end of the X-direction stator (2-1) is connected to the Z-direction linear movement unit (3) through the XZ connecting plate (7), the upper end of the X-direction guide rail (2-3) is connected to the XZ connecting plate (7) through the X-direction guide rail slider (2-5), and X-direction anti-collision blocks (2-6) are provided at both ends of the X-direction guide rail (2-3).

8. The wafer alignment platform device according to claim 1, characterized in that: The Z-axis linear movement unit (3) includes a housing (3-1), a Z-axis lead screw module (3-2), a Z-axis lifting plate (3-3), a Z-axis guide rail (3-4), and a Z-axis grating (3-5). The housing (3-1) contains the Z-axis lead screw module (3-2), which is connected to one end of the Z-axis lifting plate (3-3). The other end of the Z-axis lifting plate (3-3) is connected to the Z-axis guide rail (3-4). The Z-axis grating (3-5) is located at one end of the Z-axis lead screw module (3-2).

9. A wafer alignment platform device according to claim 8, characterized in that: The upper end of the outer shell (3-1) is connected to the wafer carrier disk (4) via a Z-θ connecting plate (8), and the outer shell (3-1) is provided with an opening (3-6) for the Z-axis lifting plate (3-3) to move.

10. A wafer alignment platform device according to claim 8, characterized in that: The Z-axis lead screw module (3-2) is connected to a reinforcing rib support plate (3-7) at the end away from the Z-axis lifting plate (3-3).

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