Protection device of jacking mechanism and wafer lifting mechanism
By covering the lifting mechanism with a protective cover to collect film residue, the problems of jamming and breakage of the lifting mechanism are solved, ensuring that the wafer lifting and lowering can be carried out normally and avoiding the impact on the thin film deposition process.
Patent Information
- Application Number
- CN202422900581.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-11-26
AI Technical Summary
The lifting mechanism is prone to jamming or breaking during the wafer thin film deposition process due to the residue of the deposited thin film on the surface, and the wafer may be broken when the robot arm picks up the wafer.
A protective cover is designed to be installed on the lifting mechanism, with the ejector pin extending through the insertion hole. The protective cover collects and gathers the deposited film residue, preventing it from depositing on the surface of the lifting mechanism and ensuring the proper functioning of the ejector pin.
It effectively prevents the lifting mechanism from getting stuck or breaking due to residue, ensuring that the wafer lifting and lowering can proceed normally and avoiding any impact on the thin film deposition process.
Smart Images
Figure CN223513946U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a protective device for a lifting mechanism and a wafer lifting mechanism. Background Technology
[0002] In the wafer thin film deposition process, the wafer needs to be placed in a cavity for deposition reaction, and a lifting mechanism is used to lift and lower the wafer for different process steps. However, since the lifting mechanism operates inside the cavity for a long time, film residues are easily deposited on its surface. This can cause the lifting mechanism to jam due to foreign objects. In addition, when the robot enters the cavity to remove the processed wafer, it may touch the lifting mechanism's pins, causing them to break and ultimately resulting in wafer fragmentation. Utility Model Content
[0003] The purpose of this application is to provide a protective device for a lifting mechanism and a wafer lifting mechanism, which can solve the problem that the lifting mechanism is prone to jamming or even breaking due to the thin film residue deposited on its surface in the prior art, and at the same time avoids affecting the wafer thin film deposition process.
[0004] The embodiments of this application are implemented as follows:
[0005] A first aspect of this application provides a protective device for a lifting mechanism, including a protective cover with a through-hole. The protective cover is used to cover the lifting mechanism, and the ejector pin of the lifting mechanism can extend out of the protective cover through the through-hole. This protective device for the lifting mechanism can solve the problem in the prior art where the lifting mechanism is prone to jamming or even breakage due to thin film residue deposited on its surface, while also preventing any impact on the wafer thin film deposition process.
[0006] As one possible implementation, the protective cover is provided with a collection groove for collecting residues.
[0007] As one possible implementation, the protective cover is also provided with at least one collection hole, which is in communication with the collection tank, so that the residue can flow into the collection tank through the collection hole.
[0008] As one possible implementation, along the axial direction of the insertion hole, the collection hole is located at the top of the protective cover, the collection groove is located at the bottom of the protective cover, and the collection hole and the collection groove are connected through a collection channel.
[0009] As one possible implementation, the collection holes are arranged along the radial direction of the insertion hole at the edge of the protective cover away from the insertion hole.
[0010] In one possible implementation, the number of collection holes is multiple, and the multiple collection holes are arranged at intervals along the circumference of the protective cover.
[0011] As one possible implementation, the protective cover includes a first top wall, a second top wall, a bottom wall, and a peripheral wall. The first top wall, the second top wall, and the bottom wall are arranged sequentially along the axial direction of the insertion hole. The first top wall, the second top wall, and the bottom wall are all fixedly connected to the peripheral wall. A cavity is provided between the first top wall and the second top wall.
[0012] As one possible implementation, along the axial direction of the insertion hole, the distance between the first top wall and the second top wall is less than the distance between the second top wall and the bottom wall.
[0013] As one possible implementation, the protective cover has a frustum-shaped structure.
[0014] A second aspect of this application provides a wafer lifting mechanism, including a protective device for the lifting mechanism described above. This protective device for the lifting mechanism solves the problem in the prior art where the lifting mechanism is prone to jamming or even breakage due to residual thin film deposits on its surface, while also preventing any impact on the wafer thin film deposition process.
[0015] The beneficial effects of the embodiments of this application include:
[0016] The protective device for the lifting mechanism includes a protective cover with a through-hole. The protective cover is used to cover the lifting mechanism, and the lifting mechanism's ejector pins can extend out of the protective cover through the through-hole. In actual use, the protective cover can be placed over the lifting mechanism to protect it. Simultaneously, the ejector pins of the lifting mechanism must be able to extend out of the protective cover through the through-hole to ensure the lifting mechanism can function normally. In this way, the protective cover can completely enclose the lifting mechanism. Even if a wafer thin film deposition process occurs inside the cavity, film residue will only be deposited on the surface of the protective cover, thus preventing film residue from depositing on the surface of the lifting mechanism during wafer thin film deposition. This prevents the lifting mechanism from jamming or even breaking due to residue. Furthermore, because the ejector pins of the lifting mechanism can extend out of the protective cover through the through-hole, they can smoothly drive the wafer during lifting operations, ensuring the normal operation of the lifting mechanism and preventing any impact on the wafer thin film deposition process. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 One of the structural schematic diagrams of the protective device for the lifting mechanism provided in the embodiments of this application;
[0019] Figure 2 A second schematic diagram of the protective device for the lifting mechanism provided in the embodiments of this application;
[0020] Figure 3 This is a schematic diagram of the structure of the collection tank provided in an embodiment of this application;
[0021] Figure 4 The third schematic diagram of the protective device for the lifting mechanism provided in the embodiments of this application.
[0022] Icons: 100-Protective device; 10-Protective cover; 11-Insertion hole; 12-Collection groove; 13-Collection hole; 14-First top wall; 15-Second top wall; 16-Bottom wall; 17-Surrounding wall; 200-Ejector pin. Detailed Implementation
[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0024] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0025] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0026] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0027] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0028] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0029] Please refer to the reference. Figures 1 to 4 This application provides a protective device 100 for a lifting mechanism, including a protective cover 10. A through-hole 11 is provided on the protective cover 10, which is used to cover the lifting mechanism. The ejector pin 200 of the lifting mechanism can pass through the through-hole 11 and extend out of the protective cover 10. This protective device 100 for the lifting mechanism can solve the problem in the prior art where the lifting mechanism is prone to jamming or even breakage due to thin film residue deposited on its surface, while also preventing any impact on the wafer thin film deposition process.
[0030] It should be noted that, as Figure 1 , Figure 2 and Figure 4 As shown, the protective device 100 is used to protect the lifting mechanism. Specifically, the protective device 100 includes a protective cover 10, on which a through-hole 11 is provided. In actual use, the protective cover 10 can be placed over the lifting mechanism to protect it. At the same time, it is also necessary to ensure that the pin 200 of the lifting mechanism can pass through the through-hole 11 and extend out of the protective cover 10 to ensure that the lifting mechanism can work normally.
[0031] In this way, the protective cover 10 can cover the lifting mechanism. Even if the wafer thin film deposition process occurs inside the cavity, the film residue will only be deposited on the surface of the protective cover 10, thereby avoiding the deposition of film residue on the surface of the lifting mechanism during the wafer thin film deposition process, and thus avoiding the lifting mechanism from jamming or even breaking due to residue. At the same time, since the ejector pin 200 of the lifting mechanism can pass through the insertion hole 11 and extend out of the protective cover 10, the ejector pin 200 can smoothly drive the wafer to perform lifting and lowering operations, thus ensuring that the lifting mechanism can work normally, thereby avoiding affecting the wafer thin film deposition process.
[0032] The aforementioned insertion hole 11 can both fix and position the lifting mechanism during the assembly of the protective cover 10 and the lifting mechanism, so that the protective cover 10 and the lifting mechanism are fixed and positioned, and also serve as a through hole for the ejector pin 200 of the lifting mechanism after the protective cover 10 and the lifting mechanism are assembled, thereby ensuring that the ejector pin 200 can extend out of the protective cover 10 and normally drive the wafer to perform lifting and lowering operations.
[0033] The shape and size of the protective cover 10 described above should be reasonably selected and designed by those skilled in the art according to actual conditions. No specific limitations are made here, as long as the protective cover 10 can protect the entire lifting mechanism. As one possible implementation, such as... Figure 1 , Figure 2 and Figure 4 As shown, the protective cover 10 has a frustum-shaped structure; or, the protective cover 10 may also have a cylindrical structure.
[0034] The shape and size of the aforementioned insertion hole 11 should be compatible with the shape and size of the ejector pin 200 of the lifting mechanism; no specific restrictions are imposed here. For example, the cross-sectional shape of both the ejector pin 200 and the insertion hole 11 are circular, and the diameter of the insertion hole 11 is slightly larger than the diameter of the ejector pin 200. This allows the ejector pin 200 to pass through smoothly while preventing residue from accumulating in the insertion hole 11 and causing the ejector pin 200 to become stuck.
[0035] As one possible implementation method, such as Figure 3 As shown, a collection groove 12 is provided on the protective cover 10, which is used to collect residues. Thus, residues can be collected through the collection groove 12 to avoid residues accumulating on the surface of the protective cover 10 and causing the surface roughness of the protective cover 10 to increase.
[0036] As one possible implementation, the protective cover 10 is also provided with at least one collection hole 13, which communicates with the collection tank 12 so that residues can flow into the collection tank 12 through the collection hole 13. For example, both the collection hole 13 and the collection tank 12 can be provided on the top of the protective cover 10, and the two are arranged radially.
[0037] Or, such as Figure 1 and Figure 2 As shown, in one possible implementation, along the axial direction of the insertion hole 11, the collection hole 13 is arranged on the top of the protective cover 10, and the collection groove 12 is arranged on the bottom of the protective cover 10. The collection hole 13 and the collection groove 12 are connected through a collection channel so that the residue flows into the collection groove 12 under the action of gravity.
[0038] As one possible implementation, along the radial direction of the insertion hole 11, the collection hole 13 is arranged on the edge of the protective cover 10 away from the insertion hole 11, so as to prevent excessive residue from overflowing from the collection hole 13 into the insertion hole 11.
[0039] As one possible implementation method, such as Figure 1 and Figure 2 As shown, there are multiple collection holes 13, which are arranged at intervals along the circumference of the protective cover 10 to improve the collection effect of residues.
[0040] As one possible implementation method, such as Figure 4 As shown, the protective cover 10 includes a first top wall 14, a second top wall 15, a bottom wall 16, and a peripheral wall 17. The first top wall 14, the second top wall 15, and the bottom wall 16 are arranged sequentially along the axial direction of the insertion hole 11. The first top wall 14, the second top wall 15, and the bottom wall 16 are all fixedly connected to the peripheral wall 17. A cavity is provided between the first top wall 14 and the second top wall 15.
[0041] It should be noted that since the protective cover 10 is mounted on the lifting mechanism, the first top wall 14 of the protective cover 10 will come into contact with the bottom surface of the wafer during the wafer thin film deposition process. By setting a cavity between the first top wall 14 and the second top wall 15 of the protective cover 10, the heat dissipation performance of the first top wall 14 can be improved, thereby significantly improving the heat dissipation performance of the wafer, which in turn helps to improve the wafer thin film deposition effect.
[0042] As one possible implementation method, such as Figure 4 As shown, along the axial direction of the insertion hole 11, the distance between the first top wall 14 and the second top wall 15 is less than the distance between the second top wall 15 and the bottom wall 16, so as to avoid the cavity height being too large, affecting the strength of the protective cover 10 itself, and causing the protective cover 10 to break at the cavity position.
[0043] A second aspect of this application provides a wafer lifting mechanism, which includes the protective device 100 of the lifting mechanism described above. Since the structure and beneficial effects of the protective device 100 of the lifting mechanism have been described in detail in the foregoing embodiments, they will not be repeated here.
[0044] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
[0045] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.
Claims
1. A protective device for a lifting mechanism, characterized in that, The device includes a protective cover with a through-hole. The protective cover is used to cover the lifting mechanism, and the pin of the lifting mechanism can extend out of the protective cover through the through-hole.
2. The protective device for the lifting mechanism according to claim 1, characterized in that, The protective cover is provided with a collection groove for collecting residues.
3. The protective device for the lifting mechanism according to claim 2, characterized in that, The protective cover is also provided with at least one collection hole, which is connected to the collection tank so that the residue can flow into the collection tank through the collection hole.
4. The protective device for the lifting mechanism according to claim 3, characterized in that, Along the axial direction of the insertion hole, the collection hole is located at the top of the protective cover, and the collection groove is located at the bottom of the protective cover. The collection hole and the collection groove are connected through a collection channel.
5. The protective device for the lifting mechanism according to claim 3, characterized in that, Along the radial direction of the insertion hole, the collection hole is located at the edge of the protective cover away from the insertion hole.
6. The protective device for the lifting mechanism according to claim 3, characterized in that, The number of collection holes is multiple, and the multiple collection holes are arranged at intervals along the circumference of the protective cover.
7. The protective device for the lifting mechanism according to claim 1, characterized in that, The protective cover includes a first top wall, a second top wall, a bottom wall, and a peripheral wall. The first top wall, the second top wall, and the bottom wall are arranged sequentially along the axial direction of the insertion hole. The first top wall, the second top wall, and the bottom wall are all fixedly connected to the peripheral wall. A cavity is provided between the first top wall and the second top wall.
8. The protective device for the lifting mechanism according to claim 7, characterized in that, Along the axial direction of the insertion hole, the distance between the first top wall and the second top wall is less than the distance between the second top wall and the bottom wall.
9. The protective device for the lifting mechanism according to any one of claims 1 to 8, characterized in that, The protective cover has a frustum-shaped structure.
10. A wafer lifting mechanism, characterized in that, The protective device includes the lifting mechanism as described in any one of claims 1 to 9.