Heat dissipation mechanism of camera with plastic shell
By incorporating a front and rear metal shielding cover into the plastic-cased camera design, combined with thermally conductive adhesive and heat sinks, the problem of poor heat dissipation in plastic-cased cameras at high temperatures is solved, achieving more efficient heat transfer and heat dissipation, and ensuring the reliability of the camera.
Patent Information
- Application Number
- CN202423037405.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-12-10
AI Technical Summary
Plastic-cased cameras have poor heat dissipation under high-temperature conditions, causing the temperature of electronic components to exceed the allowable range and affecting the reliability of the camera.
The space for the PCB board is enclosed by a front metal shield and a rear metal shield. Thermal conductive adhesive is used to transfer the heat from the heat-generating chip to the inside of the plastic shell, and a heat sink is used to accelerate heat conduction, thus optimizing the structural design of the camera.
The improved heat dissipation efficiency of the plastic-cased camera ensures that electronic components operate normally under high-temperature conditions, thereby enhancing the camera's reliability.
Smart Images
Figure CN223514979U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of mechanical technology, specifically to a heat dissipation mechanism for a camera. Background Technology
[0002] As a key component on the sensing side, high-temperature durability testing is a fundamental test for automotive cameras and a routine item in camera reliability experiments. Plastic, a commonly used housing material for cameras, is favored by camera module manufacturers due to its low cost and ease of mass production. However, the poor thermal conductivity of plastic housings is a significant factor limiting its application, thus limiting its use to low-power cameras.
[0003] Nevertheless, under high-temperature conditions, cameras may still malfunction because the internal heat is difficult to dissipate, and the temperature may exceed the allowable temperature of electronic components.
[0004] Currently, most plastic-cased cameras on the market use methods such as exposing copper through openings in the PCB (printed circuit board) or using shielding covers in contact with the PCB for heat dissipation. However, due to the limited space on the PCB, these contact surfaces are not large and are far from the heat-generating components, so the actual heat dissipation effect is not ideal. Utility Model Content
[0005] In view of the problems existing in the prior art, this utility model provides a heat dissipation mechanism for a plastic-cased camera to solve at least one of the above-mentioned technical problems.
[0006] To achieve the above objectives, this utility model provides a heat dissipation mechanism for a plastic-cased camera, including a camera plastic casing. The camera plastic casing includes a front cover and a rear cover connected together. The front cover and the rear cover form a space for accommodating a PCB board. The rear cover is integrally injection molded with a coaxial connector. The feature is that it also includes a front metal shield and a rear metal shield.
[0007] The front metal shield and the rear metal shield form a space to accommodate the PCB board;
[0008] The rear metal shield includes a base plate, and the four sides of the base plate are respectively provided with U-shaped bending structures with downward openings. The bending structures are used to contact and connect the side walls of the front metal shield.
[0009] The substrate is connected to an upwardly bent protrusion, and thermally conductive adhesive is sandwiched between the upper surface of the protrusion and the heat-generating chip of the PCB board.
[0010] The substrate has a through hole for the coaxial connector to pass through, and the through hole is connected to at least three circumferentially arranged heat sinks, which are used to hold the coaxial connector in place.
[0011] This invention optimizes the structure of the plastic camera, particularly the front and rear metal shielding covers, to facilitate the transfer of heat from the heat-generating chip on the PCB board to other areas inside the plastic camera via thermally conductive adhesive, thus improving heat dissipation. Simultaneously, the heat sink facilitates assembly and promotes heat conduction.
[0012] More preferably, the back cover is provided with a rim that overlaps the bent structure.
[0013] More preferably, the substrate is provided with four sides having rear-bent feet that bend upwards from the inside out, and the rear-bent feet are used to abut against the inner side of the surrounding edge.
[0014] More preferably, the four sides of the front metal shield are provided with front bent feet running downwards from the inside to the outside, and the front bent feet are used to abut against the inside of the front cover.
[0015] More preferably, the heat sink extends upward from the outside to the inside from the substrate, and the circumferential width of the heat sink increases from the inside to the outside along the radial direction of the perforation.
[0016] It facilitates the passage of coaxial connectors.
[0017] More preferably, the front cover is provided with mounting posts for screws to pass through;
[0018] The front metal shield is provided with a clearance hole to avoid the mounting post;
[0019] The PCB board has mounting holes for the screw to pass through, and the PCB board is sandwiched between the mounting post and the head of the screw.
[0020] More preferably, a positioning post is provided on the front cover, and the positioning post and the mounting post are provided at adjacent corners of the front cover;
[0021] The front metal shield has a positioning notch to avoid the positioning post;
[0022] The PCB board has a positioning port for the positioning post to pass through.
[0023] More preferably, the rear cover is provided with an extension post;
[0024] The PCB board has openings to avoid the extension post;
[0025] The front metal shield is provided with a bent spring, and the extension post abuts against the bent spring.
[0026] More preferably, the front cover has a through hole, and the front cover is connected to the lens by adhesive, with the lens facing the through hole.
[0027] More preferably, the front metal shield is connected to the front cover by riveting.
[0028] Beneficial effects: This invention uses thermally conductive adhesive to directly contact the heat-generating chip on the PCB board, transferring heat through the rear metal shield to the plastic shell and the metal shell of the coaxial connector. Compared with the prior art, it has better heat transfer efficiency and better heat dissipation effect. Attached Figure Description
[0029] Figure 1 This is a cross-sectional view of the present invention;
[0030] Figure 2 This is a schematic diagram of the front cover of a specific embodiment 1 of the present utility model;
[0031] Figure 3 This is a schematic diagram of the structure of the front cover after the front metal shield is installed on the front cover in a specific embodiment 1 of this utility model;
[0032] Figure 4 This is a schematic diagram of the structure after the front metal shield and PCB board are installed on the front cover in a specific embodiment 1 of this utility model;
[0033] Figure 5 This is a schematic diagram of a structure of the combination of a metal shield and thermally conductive adhesive in specific embodiment 1 of this utility model;
[0034] Figure 6 This is a schematic diagram of the structure of the metal shielding cover in specific embodiment 1 of this utility model;
[0035] Figure 7 This is a schematic diagram of the structure of the front metal shield and the rear metal shield combination in specific embodiment 1 of this utility model;
[0036] Figure 8 This is a schematic diagram of the structure of the front metal shield, rear metal shield, and PCB board combination in a specific embodiment of this utility model;
[0037] Figure 9 This is a schematic diagram of the structure of the front metal shield, the rear metal shield, and the rear cover assembly in a specific embodiment of the present invention.
[0038] Figure 10 This is a schematic diagram of the back cover structure of a specific embodiment 1 of this utility model;
[0039] Figure 11 This is a schematic diagram of a specific embodiment 1 of the present utility model.
[0040] Among them: 1 is the lens, 2 is the glue, 3 is the front cover, 4 is the front metal shield, 5 is the PCB board, 6 is the heat-generating chip, 7 is the thermally conductive adhesive, 8 is the rear metal shield, 9 is the rear cover, 10 is the coaxial connector, 31 is the mounting post, 32 is the positioning post, 41 is the front bent foot, 42 is the bent spring, 81 is the raised part, 82 is the bent structure, 83 is the rear bent foot, 84 is the heat sink, 91 is the extension post, and 92 is the edging. Detailed Implementation
[0041] The present invention will be further described below with reference to the accompanying drawings.
[0042] See Figures 1 to 11 Specific Embodiment 1: A heat dissipation mechanism for a plastic-cased camera includes a camera plastic casing, which includes a front cover 3 and a rear cover 9 connected together. The front cover 3 and the rear cover 9 form a space for accommodating a PCB board 5. The rear cover 9 is integrally injection molded to a coaxial connector 10. The mechanism is characterized by further including a front metal shield 4 and a rear metal shield 8. The front metal shield 4 and the rear metal shield 8 form a space for accommodating the PCB board 5. The rear metal shield 8 includes a substrate, and the four sides of the substrate are respectively provided with U-shaped bending structures 82 with downward openings. The bending structures 82 are used to contact and connect to the sidewalls of the front metal shield 4. The substrate is connected to an upwardly bent protrusion 81. Thermally conductive adhesive 7 is sandwiched between the upper surface of the protrusion 81 and the heat-generating chip 6 of the PCB board 5. The substrate is provided with a through hole for passing through the coaxial connector 10. The through hole of the substrate is connected to at least three circumferentially arranged heat sinks 84, which are used to abut against the coaxial connector 10. This invention optimizes the structure of the plastic camera, specifically the front and rear metal shielding covers 4 and 8, to facilitate the transfer of heat from the heat-generating chip 6 on the PCB board 5 to other areas inside the plastic camera via the thermally conductive adhesive 7, thus improving heat dissipation. Simultaneously, the heat sink facilitates assembly and promotes heat conduction. A gap exists between the substrate and the raised portion, allowing for bending of the raised portion. Two bending structures are located on adjacent sides of the substrate and the raised portion.
[0043] Both the front and rear metal shielding covers are made of metal to facilitate heat dissipation.
[0044] The front cover 3 and the rear cover 9 are laser welded together.
[0045] The rear cover 9 has a surrounding edge 92 with an overlapping and bending structure 82. The four sides of the substrate have upwardly bent rear bending feet 83 that bend from the inside out, which abut against the inner side of the surrounding edge 92. The four sides of the front metal shield 4 have downwardly bent front bending feet 41 that abut against the inner side of the front cover 3. The front metal shield includes a top plate and four side plates, which connect to the four sides of the top plate. The connections between the four side plates and the top plate are provided with front bending feet 41.
[0046] The heat sink extends upwards from the outside to the inside of the substrate, and the circumferential width of the heat sink increases radially from the inside to the outside along the perforation. This facilitates the passage of the coaxial connector 10.
[0047] The front cover 3 has a mounting post 31 for screws to pass through; the front metal shield 4 has a clearance hole to avoid the mounting post 31; the PCB board 5 has a mounting hole for screws to pass through, and the PCB board 5 is sandwiched between the mounting post 31 and the head of the screw. The front cover 3 has a positioning post 32, and the positioning post 32 and the mounting post 31 are located at adjacent corners of the front cover 3; the front metal shield 4 has a positioning notch to avoid the positioning post 32; the PCB board 5 has a positioning opening for the positioning post 32 to pass through.
[0048] An extension post 91 is provided on the rear cover 9; an opening is provided on the PCB board 5 to avoid the extension post 91; a bending spring 42 is provided on the front metal shield 4, and the extension post 91 abuts against the bending spring 42.
[0049] A through hole is provided on the front cover 3, and the front cover 3 is connected to the lens 1 by glue 2, with the lens 1 facing the through hole. The front metal shield 4 is connected to the front cover 3 by riveting. Figure 1 The bent structure, front support feet, and heat sink shown are in their initial, unstressed state. At this time, the outer edge of the bent structure is located on the periphery of the four sides of the front metal shield. Due to the constraint of the front metal shield, the bent structure does not protrude from the front metal shield, and under the action of elasticity, the bent structure abuts against the side wall of the front metal shield.
[0050] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.
Claims
1. A heat dissipation mechanism for a plastic-cased camera, comprising a camera plastic casing, the camera plastic casing including a front cover and a rear cover connected together, the front cover and the rear cover forming a space for accommodating a PCB board, the rear cover being integrally injection molded to a coaxial connector, characterized in that, It also includes a front metal shield and a rear metal shield; The front metal shield and the rear metal shield form a space to accommodate the PCB board; The rear metal shield includes a base plate, and the four sides of the base plate are respectively provided with U-shaped bending structures with downward openings. The bending structures are used to contact and connect the side walls of the front metal shield. The substrate is connected to an upwardly bent protrusion, and thermally conductive adhesive is sandwiched between the upper surface of the protrusion and the heat-generating chip of the PCB board. The substrate has a through hole for the coaxial connector to pass through, and the through hole is connected to at least three circumferentially arranged heat sinks, which are used to hold the coaxial connector in place.
2. The heat dissipation mechanism for a plastic-cased camera according to claim 1, characterized in that: The rear cover is provided with a rim that overlaps the bent structure.
3. The heat dissipation mechanism for a plastic-cased camera according to claim 2, characterized in that: The substrate has four sides with upwardly bent feet that bend from the inside out, and the bent feet are used to abut against the inner side of the surrounding edge.
4. The heat dissipation mechanism for a plastic-cased camera according to claim 1, characterized in that: The front metal shield has four sides with front bent feet running downwards from the inside to the outside, and the front bent feet are used to abut against the inside of the front cover.
5. The heat dissipation mechanism for a plastic-cased camera according to claim 1, characterized in that: The heat sink extends upward from the outside to the inside from the substrate, and the circumferential width of the heat sink increases from the inside to the outside along the radial direction of the perforation.
6. The heat dissipation mechanism for a plastic-cased camera according to claim 1, characterized in that: The front cover is provided with mounting posts for screws to pass through; The front metal shield is provided with a clearance hole to avoid the mounting post; The PCB board has mounting holes for the screw to pass through, and the PCB board is sandwiched between the mounting post and the head of the screw.
7. The heat dissipation mechanism for a plastic-cased camera according to claim 6, characterized in that: The front cover is provided with a positioning post, and the positioning post and the mounting post are located at adjacent corners of the front cover. The front metal shield has a positioning notch to avoid the positioning post; The PCB board has a positioning port for the positioning post to pass through.
8. The heat dissipation mechanism for a plastic-cased camera according to claim 1, characterized in that: An extension post is provided on the rear cover; The PCB board has openings to avoid the extension post; The front metal shield is provided with a bent spring, and the extension post abuts against the bent spring.
9. The heat dissipation mechanism for a plastic-cased camera according to claim 1, characterized in that: The front cover has a through hole, and the front cover is connected to the lens by glue, with the lens facing the through hole.
10. The heat dissipation mechanism for a plastic-cased camera according to claim 1, characterized in that: The front metal shield is connected to the front cover by riveting.