Guide device for stamping

Abstract

The utility model relates to the technical field of guide devices, and discloses a guide device for stamping, which comprises a guide post, a guide sleeve, a guide sleeve and a guide sleeve, and is characterized in that the guide post is arranged on an upper die; the guide sleeve is arranged on the lower die; the guide post can do linear motion along the inner cavity of the guide sleeve; the buffer part is inserted into the top of the guide sleeve; the large-ring spring is arranged on the surface of the outer ring of the buffer piece in a sleeving manner; the small ring spring is sleeved on the surface of the inner ring of the buffer piece; the supporting base is detachably arranged on the lower die, and the top of the supporting base is detachably connected with the bottom of the guide sleeve. And a double-layer spring structure of the large-ring spring and the small-ring spring is arranged, the damping effect is provided for the outer ring and the inner ring, the stability between the buffering piece and the guide sleeve can be enhanced, the vibration frequency in the stamping process is effectively reduced, and guiding work is stably achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to guiding device technical field, concretely relates to a stamping guiding device. BACKGROUND

[0002] Stamping die as a kind of efficient, precision processing tool, it has wide application in industrial production, especially in automobile manufacturing, household appliance production, electronic industry etc.;However, in actual use, the guiding stability and shock-absorbing performance of stamping die are one of the key factors influencing product machining precision and die life;In the design of traditional stamping die, guiding structure is mostly relatively simple, usually adopts the form of guiding column and guide sleeve cooperation to complete guiding function, but these traditional designs still have many deficiencies in practical application.

[0003] Firstly, the traditional guiding structure lacks stable limiting design, and the guiding column shakes in the guide sleeve. This shaking can lead to the positioning accuracy of die reducing in stamping process, and further affect the quality of stamping product;In addition, the rotation phenomenon generated in guiding process can also lead to the abrasion between guiding column and guide sleeve aggravating, shortens the service life of die.

[0004] In view of the above, the present application proposes a stamping guiding device to solve the above problems, which can effectively improve the guiding stability, enhance the shock-absorbing effect, and realize the flexible adjustment of die, improve the machining precision and production efficiency. UTILITY MODEL CONTENT

[0005] In view of the deficiencies of prior art, the utility model provides a stamping guiding device, which solves the problems proposed in the above background art.

[0006] To achieve the above purpose, the utility model realizes by the following technical scheme:

[0007] A stamping guiding device is arranged on the upper die and the lower die, comprising,

[0008] The guiding column is arranged on the upper die, and the surface is tooth-shaped;

[0009] The guide sleeve is arranged on the lower die;The guiding column can move linearly along the inner cavity of the guide sleeve;

[0010] The buffer is inserted into the top of the guide sleeve;

[0011] The large coil spring is sleeved on the outer circle surface of the buffer;

[0012] The small coil spring is sleeved on the inner circle surface of the buffer;

[0013] The supporting base is detachably arranged on the lower die, and the top is detachably connected with the bottom of the guide sleeve.

[0014] Optionally, the upper die comprises a stamping plate and a mounting plate.

[0015] The mounting plate is detachably arranged on the stamping plate, and the guide column is arranged on the stamping plate and movably connected with the guide sleeve through penetrating the stamping plate.

[0016] Optionally, the guide sleeve is internally provided with a guide groove and a buffer groove.

[0017] The guide groove and the buffer groove are coaxially arranged, and the diameter of the guide groove is smaller than that of the buffer groove.

[0018] Optionally, the buffer member comprises a contact plate and a moving shaft.

[0019] The diameter of the contact plate is the same as that of the guide sleeve.

[0020] The moving shaft is coaxially connected with the contact plate, and the moving shaft is inserted into the buffer groove to move linearly.

[0021] Optionally, the bottom of the guide groove and the bottom of the guide column are in trapezoidal shape.

[0022] Optionally, the connecting middle part of the support base and the guide column is provided with a shock-absorbing gasket.

[0023] Optionally, the side, away from the stamping plate, of the mounting plate is provided with a groove matched with the buffer member.

[0024] The utility model provides a kind of guiding device for stamping, with the following beneficial effects:

[0025] 1, the guide column and the guide sleeve are engaged through the tooth structure, effectively reduce shaking and rotation phenomenon, significantly improve the precision and stability of guiding.

[0026] 2, the double-layer spring structure of large coil spring and small coil spring is provided, not only provides damping effect in outer ring and inner ring respectively, but also can enhance the stability between buffer member and guide sleeve, effectively reduce the vibration frequency in stamping process, stably realize guiding work. BRIEF DESCRIPTION OF DRAWINGS

[0027] Fig. 1 It is the structural schematic diagram of the utility model;

[0028] Fig. 2 It is the sectional structure schematic diagram of the utility model.

[0029] In the drawing: 1, upper die; 11, stamping plate; 12, mounting plate; 121, groove; 2, lower die; 3, guide column; 4, guide sleeve; 41, guide groove; 42, buffer groove; 5, buffer member; 51, contact plate; 52, moving shaft; 6, large coil spring; 7, small coil spring; 8, support base; 81, shock-absorbing gasket. DETAILED DESCRIPTION

[0030] In order to make the technical means, creation characteristics, purposes and effects of the utility model easy to understand, the utility model is further described below in combination with specific embodiments.

[0031] In the description of the utility model, it should be understood that the directions or positional relationships indicated by the terms "transverse", "longitudinal", "end", "edge", "side wall", "upper", "lower", "upper part", "lower part", "directly above", "surface", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", "end", "head", "tail" are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the technical solutions of the utility model and simplifying the description, and therefore cannot be understood as limiting the indicated devices or elements to have a specific direction, to be constructed and operated in a specific direction, and therefore cannot be understood as limiting the utility model.

[0032] The application provides a guiding device for stamping.

[0033] Referring to Figs. 1-2 The application is mainly arranged on the upper die 1 and the lower die 2 for use, and comprises a guide column 3 arranged on the upper die 1, a guide sleeve 4 arranged on the lower die 2, a buffer 5 inserted into the guide sleeve 4, a large-circle spring 6 sleeved on the outer circumferential surface of the buffer 5, a small-circle spring 7 sleeved on the inner circumferential surface of the buffer 5, and a support base 8 detachably arranged on the lower die 2. Through cooperation between the components, the guiding effect of the stamping die during stamping work can be achieved, and the damping and anti-rotation conditions can be achieved through structural cooperation, so that the guiding work is more stable.

[0034] Referring to Figs. 1-2 The stamping die is a combination of the upper die 1 and the lower die 2. The upper die 1 comprises a stamping plate 11 and a mounting plate 12. The mounting plate 12 is detachably arranged on the stamping plate 11. The guide column 3 is arranged on the stamping plate 11 and movably connected with the guide sleeve 4 through the stamping plate 11. Based on the arrangement of the guide sleeve 4, different lengths of the guide column 3 can be replaced on the mounting plate 12 for work.

[0035] The guide column 3 is arranged on the upper die, the guide sleeve 4 is arranged on the lower die 2, the guide sleeve 4 is internally provided with a guide groove 41 and a buffer groove 42, the guide groove 41 and the buffer groove 42 are coaxially arranged, the diameter of the guide groove 41 is smaller than that of the buffer groove 42, the guide groove 41 is used for connecting with the guide column 3, the surface of the guide column 3 is arranged in a toothed manner, the inner cavity of the guide groove 41 is adaptively arranged with the guide column 3, through the toothed connection, the shaking and rotation conditions can be effectively reduced, and the stability of the guiding can be further increased.

[0036] Referring to Figs. 1-2 , the buffer groove 42 is used to accommodate the working of the buffer 5, wherein the buffer 5 comprises a contact plate 51 and a moving shaft 52; the diameter of the contact plate 51 is the same as the diameter of the guide sleeve 4; the moving shaft 52 is coaxially connected with the contact plate 51, and the diameter of the moving shaft 52 is smaller than the diameter of the contact plate 51; when the guide column 3 is inserted into the guide groove 41 to work, the upper die 1 is driven to move downward, and after the upper die 1 touches the contact plate 51, the moving shaft 52 is inserted into the buffer groove 42 to move linearly;

[0037] In order to achieve the damping effect of the buffer 5 during movement, a large ring spring 6 is sleeved on the outer surface of the buffer 5; there is a gap between the edge of the contact plate 51 and the outer circle of the moving shaft 52, and the large ring spring 6 is arranged at the gap, the top of the large ring spring 6 is fixedly connected with the lower surface of the contact plate 51, and the bottom of the large ring spring 6 is fixedly connected with the upper surface of the guide sleeve 4, so as to realize the damping effect when the contact plate 51 moves towards the guide sleeve 4, and the frequency of vibration is reduced to realize the stability of the guide.

[0038] Referring to Figs. 1-2 , the gap between the inner edge of the moving shaft 52 and the edge of the guide groove 41 is also the same, in order to further enhance the damping effect, a small ring spring 7 with a smaller diameter than the large ring spring 6 is arranged at the gap, and the upper and lower surfaces of the small ring spring 7 are connected with the upper and lower surfaces of the large ring spring 6, and the moving shaft 52 and the guide sleeve 4 at the corresponding upper and lower positions are fixedly connected; the arrangement of the double-layer spring not only realizes the damping effect, but also enhances the stability of the connection between the moving shaft 52 and the guide sleeve 4.

[0039] Further, in order to further reduce the impact of stamping, the bottom of the guide groove 41 and the bottom of the guide column 3 are both trapezoidal, so that the guide column 3 can be buffered when it approaches the inner bottom wall of the guide groove 41.

[0040] Referring to Figs. 1-2 , the height of the guide sleeve 4 used on the lower die 2 may be different, and the application is designed to facilitate the adjustment of the height of the guide sleeve 4 exposed on the upper surface of the lower die 2, and a detachable support base 8 is arranged at the bottom of the guide sleeve 4, wherein the support base 8 is not limited in height, and the support base 8 is adjusted based on single use, and the support base 8 with different height is used.

[0041] Referring to Figs. 1-2 , in order to further reduce the impact of the guide sleeve 4 on the support base 8, a damping pad 81 is arranged at the middle part of the connection between the two, and further damping work is performed; the damping effect realized by the multi-layer structure can make the guide work more stable, and reduce the problem of micro-deviation and other problems that may cause the unqualified film pressing model.

[0042] The working steps of the device are as follows:

[0043] 1. First, the guide column 3 is arranged on the mounting plate 12, and then the mounting plate 12 is mounted on the stamping plate 11;

[0044] 2. Secondly, after the material is placed in the connecting middle part of the upper die 1 and the lower die 2, the stamping work is carried out through the punch;

[0045] 3. Then, in the process of stamping, the guide column 3 moves in the inner cavity of the guide sleeve 4;

[0046] 4. Finally, when the upper die 1 contacts the buffer 5, the buffer 5 is extruded to move downward, and the large ring spring 6 and the small ring spring 7 buffer the pressure in the extrusion process.

[0047] The basic principle, main features and advantages of the utility model are shown and described above. Those skilled in the art should understand that the utility model is not limited by the above-mentioned embodiments, and various changes and improvements can be made without departing from the spirit and scope of the utility model. These changes and improvements all fall within the scope of the utility model. The scope of protection of the utility model is defined by the appended claims and their equivalents.

Claims

1. A guiding device for stamping, said guiding device being provided on an upper die (1) and a lower die (2); characterized in that: The utility model relates to a kind of stamping device, including, Guide column (3) is equipped on upper die (1), surface is dentiform; Guide bush (4) is equipped on lower die (2);Its the guide column (3) can be linear motion along guide bush (4) inner cavity; Buffering member (5) is inserted in the top of guide bush (4); Large circle spring (6) is sleeved in the outer circle surface of buffering member (5); Small circle spring (7) is sleeved in the inner circle surface of buffering member (5); Support base (8) is detachably equipped on lower die (2), and its top is detachably connected with the bottom of guide bush (4).

2. The punch guiding device according to claim 1, characterized in that The upper die (1) includes stamping plate (11) and mounting plate (12); The mounting plate (12) is detachably equipped on stamping plate (11), and then the guide column (3) is equipped on stamping plate (11), and the guide column (3) is movably connected with guide bush (4) and penetrates stamping plate (11).

3. The punch guiding device according to claim 1, characterized in that: The guide bush (4) is equipped with guide groove (41) and buffer groove (42); The guide groove (41) and buffer groove (42) are coaxially arranged, wherein the diameter of the guide groove (41) is smaller than the diameter of the buffer groove (42).

4. The punch guiding device according to claim 3, characterized in that: The buffering member (5) includes contact plate (51) and moving shaft (52); The diameter of the contact plate (51) is the same as the diameter of the guide bush (4); Wherein, the moving shaft (52) is coaxially connected with the contact plate (51), and the moving shaft (52) is inserted in the buffer groove (42) and moves linearly.

5. The punch guiding device according to claim 3, characterized in that: The bottom of the guide groove (41) and the bottom of the guide column (3) are both trapezoidal.

6. The punch guide of claim 2 wherein: The connecting middle part of the support base (8) and the guide column (3) is provided with a shock-absorbing gasket (81).

7. The punch guide of claim 1 wherein: The side of the mounting plate (12) away from the stamping plate (11) is provided with a groove (121) adapted to the buffering member (5).

Images