Novel wafer grinding device
Through innovative designs of support plates, L-shaped plates, lifting components, and connecting components, the problems of unstable fixing and difficulty in disassembling the grinding disc in wafer grinding equipment have been solved, achieving stable wafer grinding and efficient maintenance, and improving production efficiency.
Patent Information
- Application Number
- CN202423069423.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-12-12
AI Technical Summary
Traditional wafer grinding equipment has insufficient fixation, which makes the wafers prone to shifting during the grinding process, reducing production efficiency. At the same time, it is inconvenient to disassemble and maintain the grinding disc, which affects work efficiency.
The design incorporates a support plate, an L-shaped plate, a lifting assembly, a fixing assembly, and a connecting assembly. The grinding disc is raised and lowered by a cylinder, and the grinding disc is easily disassembled by the cooperation of a threaded column and a moving ring. The wafer is fixed by rotating a rotating block and using a screw clamp to ensure stability during the grinding process.
It improves the fixation effect during wafer grinding, reduces offset, simplifies the disassembly and maintenance process of the grinding disc, and improves production and work efficiency.
Smart Images
Figure CN223519409U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer technical field especially relates to a novel wafer grinding device. BACKGROUND
[0002] Wafer, usually refers to silicon wafer, is a very important basic material in semiconductor industry. It is the core raw material of manufacturing integrated circuit (IC), is widely used in computer chip, microprocessor, memory and other electronic equipment. In the wafer production process, needs to use wafer grinding device.
[0003] But the fixed effect of traditional wafer grinding device to wafer indeed exists the insufficient, wafer is easy to deviate in the grinding process, reduces production efficiency, and the traditional wafer grinding device is inconvenient to disassemble the grinding disc, so that the operating personnel need to spend more time and energy when replacing or maintaining the grinding disc, reduces the working efficiency. UTILITY MODEL CONTENT
[0004] The utility model aims at solving the shortcomings in the prior art and provides a novel wafer grinding device.
[0005] In order to achieve the above object, the utility model adopts the following technical scheme: including support plate, one side of support plate top surface is fixedly connected with L-shaped plate, the inner top surface of L-shaped plate is connected with lifting assembly, the lower side of lifting assembly is connected with grinding assembly, and the top surface of support plate and the lower side of grinding assembly are connected with fixed assembly;The grinding assembly includes motor, the output end of motor is fixedly connected with connecting block, the bottom surface of connecting block is provided with recess, the recess is placed with fixed block, the bottom end of fixed block extends to the outside of recess and is fixedly connected with polishing disc, one side of connecting block is connected with connecting assembly, and connecting block and fixed block are connected through connecting assembly.
[0006] As a further description of the above technical scheme:
[0007] The lifting assembly includes the air cylinder fixed in the inner top surface of L-shaped plate, the free end of air cylinder is fixedly connected with connecting plate, one side of connecting plate is fixedly connected with sliding block, one side of L-shaped plate is provided with sliding slot, the sliding block is slidably connected in the sliding slot, and the motor is fixedly connected on the bottom surface of connecting plate.
[0008] As a further description of the above technical scheme:
[0009] The connecting assembly comprises a threaded column fixed to the outer side of the connecting block, a moving ring is slidably arranged outside the threaded column, a plug rod is fixed to the side of the moving ring close to the connecting block, a slot is formed in the side of the fixed block, the plug rod penetrates through the side wall of the connecting block and extends into the slot, a threaded sleeve is threadedly connected to the outside of the threaded column, the side of the threaded sleeve is in abutment with the moving ring, and handles are fixed to the outside of the threaded sleeve on both sides.
[0010] As a further description of the above technical solutions:
[0011] The fixing assembly comprises a supporting table fixed to the top surface of the supporting plate, a plurality of placing grooves are formed in the supporting table, a fixing plate is fixed to the top surface of the supporting table and located on both sides of the plurality of placing grooves, a screw rod is threadedly connected to the fixing plate, a clamping plate is rotatably connected to the end of the screw rod close to the placing groove, a rotating block is fixed to the other end of the screw rod, a sliding rod is fixed to the clamping plate, and the sliding rod penetrates through the corresponding fixing plate and is slidably connected with the fixing plate.
[0012] As a further description of the above technical solutions:
[0013] A threaded hole is formed in the fixing plate, and the screw rod is threadedly connected in the threaded hole.
[0014] As a further description of the above technical solutions:
[0015] A through hole is formed in the fixing plate, and the sliding rod is slidably connected in the through hole.
[0016] As a further description of the above technical solutions:
[0017] Supporting legs are fixed to the bottom surface of the supporting plate at four corners.
[0018] The utility model has the advantages of:
[0019] 1、In the utility model, the rotating rotating block drives the screw rod to rotate, the screw rod drives the clamping plate to move towards the direction close to the wafer, so that the wafer can be fixed, the wafer is not easy to deviate in the grinding process, and the grinding efficiency of the wafer is improved.
[0020] 2、In the utility model, the connecting assembly is arranged, the handle is rotated, the threaded sleeve is moved out of the threaded column, the moving ring can be taken down, the plug rod is moved out of the slot under the driving of the moving ring, the polishing disc can be disassembled, maintenance or replacement is facilitated, and the working efficiency of wafer grinding is improved. DRAWINGS
[0021] Figure 1 The utility model provides a whole structure schematic of a novel wafer grinding device Figure One ;
[0022] Figure 2 The whole structure diagram of a novel wafer grinding device is provided in the utility model Figure Two ;
[0023] Figure 3 The connecting assembly diagram of a novel wafer grinding device is provided in the utility model
[0024] Figure 4 The fixing assembly diagram of a novel wafer grinding device is provided in the utility model.
[0025] Legend:
[0026] 1, support leg; 2, support plate; 3, L-shaped plate; 4, air cylinder; 5, connecting plate; 6, sliding groove; 7, motor; 8, connecting block; 9, polishing disc; 10, threaded column; 11, moving ring; 12, threaded sleeve; 13, handle; 14, support table; 15, fixed plate; 16, sliding block; 17, placing groove; 18, sliding rod; 19, screw rod; 20, rotating block; 21, clamping plate; 22, insertion rod; 23, groove; 24, fixed block; 25, insertion slot. Specific implementation
[0027] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0028] With reference to Figures 1-4 , the utility model provides an embodiment: including support plate 2, support plate 2 top surface one side fixed connection has L-shaped plate 3, L-shaped plate 3 inner top surface is connected with lifting assembly, and lifting assembly below is connected with grinding assembly, and support plate 2 top surface and located the fixed component of grinding assembly's just below is connected, grinding assembly includes motor 7, and motor 7 output fixed connection has connecting block 8, and connecting block 8 bottom surface is set up with recess 23, and recess 23 is placed with fixed block 24, and fixed block 24 bottom end extends to recess 23 outside and is fixedly connected with polishing disc 9, and one side of connecting block 8 is connected with connecting assembly, and connecting block 8 is connected with fixed block 24 through connecting assembly, and through setting connecting assembly, can disassemble polishing disc 9, is convenient for maintenance or replacement, improves the work efficiency of wafer grinding.
[0029] The lifting assembly comprises a cylinder 4 fixed to the top surface of the L-shaped plate 3, a connecting plate 5 fixed to the free end of the cylinder 4, a sliding block 16 fixed to one side of the connecting plate 5, a sliding groove 6 formed in one side of the L-shaped plate 3, the sliding block 16 being slidingly connected in the sliding groove 6, and a motor 7 fixed to the bottom surface of the connecting plate 5. The connecting assembly comprises a threaded column 10 fixed to the outer side surface of a connecting block 8, a moving ring 11 slidingly sleeved on the threaded column 10, a plug rod 22 fixed to one side of the moving ring 11 close to the connecting block 8, a recess 23 formed in one side of a fixed block 24, the plug rod 22 penetrating through the side wall of the connecting block 8 and extending into the recess 23 and being inserted into the slot 25, a threaded sleeve 12 threadedly connected to the outer side of the threaded column 10, the threaded sleeve 12 being in abutment with the moving ring 11 on one side, and handles 13 fixed to the outer sides of the threaded sleeve 12. The fixing assembly comprises a support table 14 fixed to the top surface of the support plate 2, a plurality of placing grooves 17 formed in the support table 14, and fixed plates 15 fixed to the top surface of the support table 14 and located on both sides of the plurality of placing grooves 17, threaded rods 19 threadedly penetrating through the fixed plates 15, clamping plates 21 rotatably connected to one end of the threaded rods 19 close to the placing grooves 17, and rotating blocks 20 fixed to the other ends of the threaded rods 19. The clamping plates 21 are fixed with sliding rods 18, the sliding rods 18 penetrating through the corresponding fixed plates 15 and being slidingly connected with the fixed plates 15. Rotating the rotating block 20 drives the threaded rods 19 to rotate, so that the threaded rods 19 drive the clamping plates 21 to move towards the wafer, thereby fixing the wafer, preventing the wafer from deviating during grinding, and improving the grinding efficiency of the wafer. Threaded holes are formed in the fixed plates 15, the threaded rods 19 are threadedly connected in the threaded holes, through holes are formed in the fixed plates 15, and the sliding rods 18 are slidingly connected in the through holes. Support legs 1 are fixed to the bottom surface of the support plate 2 at the four corners.
[0030] Working principle: the wafer to be ground is placed in the placing groove 17, the rotating block 20 is rotated, the rotating block 20 drives the threaded rods 19 to rotate, so that the threaded rods 19 drive the clamping plates 21 to move towards the wafer, thereby fixing the wafer, preventing the wafer from deviating during grinding, and improving the production efficiency. The cylinder 4 is started, the cylinder 4 drives the grinding disc 9 to move downward, the motor 7 is started, the motor 7 drives the grinding disc 9 to rotate, thereby grinding the wafer. The handle 13 is rotated, the handle 13 drives the threaded sleeve 12 to rotate, so that the threaded sleeve 12 moves out of the threaded column 10, then the moving ring 11 can be removed, the plug rod 22 connected with the moving ring 11 moves out of the slot 25, the grinding disc 9 can be disassembled, the grinding disc 9 is convenient to maintain or replace, and the working efficiency is improved.
[0031] The electrical components in the text are all connected with the main controller and 220V mains electricity, and the main controller can be a computer or other conventional known devices that can be controlled. The detailed description of known functions and known components is omitted in the specific embodiments of the disclosure. To ensure the compatibility of the device, the operation means adopted is consistent with the parameters of the market appliances.
[0032] It should be pointed out finally that the above only for the preferred embodiments of the present application and is not intended to limit the present application, although the present application is described in detail with reference to the foregoing embodiments, for those skilled in the art, it still can be modified to the technical solutions recorded in the foregoing embodiments, or equivalent replacement of some of the technical features, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, should be included within the scope of the present application.
Claims
1. A novel wafer polishing apparatus comprising a support plate (2) characterized in that: The top surface of the support plate (2) is fixedly connected with an L-shaped plate (3), the inner top surface of the L-shaped plate (3) is connected with a lifting assembly, the lower part of the lifting assembly is connected with a grinding assembly, and the top surface of the support plate (2) and directly below the grinding assembly is connected with a fixing assembly. The grinding assembly comprises a motor (7), the output end of the motor (7) is fixedly connected with a connecting block (8), the bottom surface of the connecting block (8) is provided with a groove (23), the groove (23) is placed with a fixed block (24), the bottom end of the fixed block (24) extends to the outside of the groove (23) and is fixedly connected with a grinding disc (9), one side of the connecting block (8) is connected with a connecting assembly, and the connecting block (8) and the fixed block (24) are connected through the connecting assembly.
2. A novel wafer polishing device according to claim 1, characterized in that: The lifting assembly comprises a gas cylinder (4) fixedly connected to the inner top surface of the L-shaped plate (3), a connecting plate (5) fixedly connected to the free end of the gas cylinder (4), a sliding block (16) fixedly connected to one side of the connecting plate (5), and a sliding groove (6) formed in one side of the L-shaped plate (3), wherein the sliding block (16) is slidingly connected in the sliding groove (6), and the motor (7) is fixedly connected to the bottom surface of the connecting plate (5).
3. A novel wafer polishing device as claimed in claim 1, wherein: The connecting assembly comprises a threaded column (10) fixedly connected to the outer side of the connecting block (8), a moving ring (11) slidingly sleeved on the outer part of the threaded column (10), an insertion rod (22) fixedly connected to one side of the moving ring (11) close to the connecting block (8), an insertion groove (25) formed in the side surface of the fixed block (24), the insertion rod (22) penetrating through the side wall of the connecting block (8) and extending into the groove (23) and being inserted into the insertion groove (25), and a threaded sleeve (12) threadedly connected to the outer part of the threaded column (10), wherein one side of the threaded sleeve (12) abuts against the moving ring (11), and handles (13) are fixedly connected to the outer parts of the threaded sleeve (12) on both sides.
4. A novel wafer polishing device as claimed in claim 1, wherein: The fixing assembly comprises a support table (14) fixedly connected to the top surface of the support plate (2), a plurality of placement grooves (17) formed in the support table (14), and fixed plates (15) fixedly connected to the top surface of the support table (14) on both sides of the plurality of placement grooves (17), wherein threaded rods (19) are threadedly penetrated and connected to the fixed plates (15), clamping plates (21) are rotatably connected to one end of the threaded rods (19) close to the placement grooves (17), rotating blocks (20) are fixedly connected to the other end of the threaded rods (19), and sliding rods (18) are fixedly connected to the clamping plates (21) and penetratingly pass through the fixed plates (15) and are slidingly connected with the fixed plates (15).
5. A novel wafer polishing device as claimed in claim 4, wherein: Threaded holes are formed in the fixed plates (15), and the threaded rods (19) are threadedly connected in the threaded holes.
6. A novel wafer polishing device as claimed in claim 4, wherein: Through holes are formed in the fixed plates (15), and the sliding rods (18) are slidingly connected in the through holes.
7. A novel wafer polishing device as claimed in claim 1, wherein: Support legs (1) are fixedly connected to the bottom surface of the support plate (2) at four corners.