Multi-wire cutting machine for quartz wafer processing

Abstract

The utility model relates to the technical field of quartz wafer processing, and discloses a multi-wire cutting machine for quartz wafer processing, which comprises a working table, a fixing frame is fixedly arranged on the surface of the working table, a limiting moving device is arranged on the surface of the working table, and the limiting moving device comprises a rotating motor and a limiting plate. Limiting grooves are formed in the front side surface and the rear side surface of the workbench correspondingly, firstly, a to-be-cut quartz wafer is placed on a carrier plate and fixed through vacuum adsorption holes, then the limiting plates are moved to make contact with the upper surface of the quartz wafer, a rotating motor and a cutting assembly are turned on, and the rotating motor drives a first threaded rod to rotate; under the action of a first belt wheel, a belt and a second belt wheel, a second threaded rod also rotates, the carrier plate is driven to move through a limiting sliding block, quartz wafers are stably moved and cut, accurate linear displacement control can be achieved through rotation of the first threaded rod and the second threaded rod, tiny movement increment can be achieved with high precision, the carrier plate moves stably through thread meshing, and the cutting accuracy is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to quartz wafer processing technical field especially relates to a quartz wafer processing is with multi -line cutting machine. BACKGROUND

[0002] The quartz wafer processing is with multi -line cutting machine is a kind of precision machining equipment specially used in the field of semiconductor, optics, electronic industry, quartz wafer is widely applied in electronic medical treatment, communication equipment, scientific research and other fields due to its high purity, high stability and other characteristics, and the processing precision requirement of quartz wafer is extremely high, and multi -line cutting machine is just the key equipment to meet this high-precision demand.

[0003] Applicant finds that Chinese patent discloses "a piezoelectric quartz wafer processing is with multi -line cutting machine", and its publication (announcement) number is "CN 216230165 U", the patent mainly includes the top of the table body Fixed installation has organism, the outside of the table body is fixedly installed with electric telescopic rod, the utility model, by setting the supporting plate, staff can move supporting plate and move one of the placing frame to the lower part of organism and process, another placing frame moves out the lower part of supporting plate, so that staff can change piezoelectric quartz wafer in the process of organism processing, save the time required for replacement, so as to improve the processing efficiency of piezoelectric quartz wafer, but the above prior art is easy to move quartz wafer under the condition of high-speed cutting during online cutting processing, causes cutting error, affects product quality, therefore, we propose a quartz wafer processing is with multi -line cutting machine. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a quartz wafer processing is with multi -line cutting machine to solve the problem of the above prior art in the background art that quartz wafer is easy to move under the condition of high-speed cutting during online cutting processing, causes cutting error, affects product quality.

[0005] To achieve the above object, the utility model provides the following technical scheme: a quartz wafer processing is with multi -line cutting machine, including workbench, the surface of the workbench is fixedly installed with fixed frame, the surface of the workbench is equipped with limit moving device, the limit moving device includes rotating motor and limit plate, the front and rear surface of the workbench is all equipped with limit slot, the rotating motor is connected with first pulley through first threaded rod, the surface of the workbench is equipped with carrier plate, the front and rear sides of the carrier plate are all fixedly installed with two limit sliding blocks, the inner wall of the front and rear sides of the fixed frame is all equipped with two groups of sliding slot, the front and rear sides of the limit plate are all fixedly installed with two groups of installation sliding block, the first pulley is connected with second pulley through belt, the inside of the second pulley is fixedly connected with second threaded rod, the surface of the carrier plate is equipped with a plurality of vacuum adsorption holes.

[0006] As a preferred scheme, the bottom four corners of the workbench are fixedly provided with supporting seats, and the ends of the four supporting seats away from the workbench are fixedly provided with anti-skid pads.

[0007] As a preferred scheme, the first threaded rod and the second threaded rod are rotationally connected to the interiors of the two groups of limiting grooves, the first threaded rod is threadedly connected with the front two groups of limiting sliding blocks, the second threaded rod is threadedly connected with the rear two groups of limiting sliding blocks, and the first threaded rod is fixedly connected with the output end of the rotating motor.

[0008] As a preferred scheme, the first belt wheel is fixedly connected to the circumferential surface of the first threaded rod and located at the right outer end of the workbench, the second belt wheel is fixedly connected to the circumferential surface of the second threaded rod, the two ends of the belt are drivingly connected with the first belt wheel and the second belt wheel respectively, the rotating motor is fixedly connected to the right front end of the workbench through the motor base, and the four groups of limiting sliding blocks are slidingly connected to the interiors of the limiting grooves.

[0009] As a preferred scheme, the limiting plate is arranged in the interior of the fixed frame and above the carrier plate, the mounting sliding block is slidingly connected to the interior of the sliding groove, and the surfaces of the carrier plate and the limiting plate are provided with a plurality of slot openings which are equally spaced and adapted to the cutting lines of the cutting assembly.

[0010] As a preferred scheme, the cooling device comprises a cooling box, the cooling box is connected with a pump body through a connecting pipe, the pump body is connected with a cooling pipe through a conduit, and a plurality of electric nozzles are fixedly arranged on one side surface of the cooling pipe.

[0011] As a preferred scheme, the cooling box and the pump body are fixedly arranged on the top of the fixed frame, one end of the connecting pipe is fixedly connected with the cooling box and penetrates through the left side surface of the cooling box, the other end of the connecting pipe is fixedly connected with the input end of the pump body, one end of the conduit is fixedly connected with the output end of the pump body, the other end of the conduit is fixedly connected with the cooling pipe, and the cooling pipe and the fixed frame are fixedly connected through two groups of connecting steel pipes.

[0012] The technical effects and advantages of the utility model are as follows:

[0013] 1. By setting the limiting movement device, first install the cutting assembly and adjust to the appropriate tension, then place the quartz wafer to be cut on the carrier plate, fixed by vacuum suction hole, then move the limiting plate to contact the upper surface of the quartz wafer, open the rotating motor and the cutting assembly, cutting, the rotating motor drives the first threaded rod to rotate, under the action of the first pulley, belt and the second pulley, the second threaded rod also rotates, the carrier plate is moved by the limiting slide block, so that the quartz wafer is stably moved and cut, the first threaded rod and the second threaded rod rotate to realize precise linear displacement control, high precision can realize small movement increment, meet the requirement of high position precision, the threaded engagement makes the carrier plate move smoothly, ensure the cutting accuracy;

[0014] 2. By setting the cooling device, at the same time of cutting, open the pump body, the cooling liquid in the cooling box passes through the connecting pipe, the conduit and the cooling pipe in turn, and finally sprays out through the plurality of electric spray heads, to cool the cutting place, prevent a large amount of heat generated by the cutting line and the quartz wafer high speed friction, the local temperature of the wafer is too high, cause the wafer to produce thermal stress and make the wafer appear crack, deformation and other defects, make the cutting assembly maintain good cutting performance, reduce the replacement frequency of the cutting line, improve the production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a three-dimensional structure schematic view of the utility model;

[0016] Figure 2 It is another perspective three-dimensional structure schematic view of the utility model;

[0017] Figure 3 It is a front view cross-sectional structure schematic view of the utility model;

[0018] Figure 4 It is a left view cross-sectional structure schematic view of the utility model;

[0019] Figure 5 It is a limiting movement device structure schematic view of the utility model;

[0020] Figure 6 It is a limiting movement device partial structure schematic view of the utility model;

[0021] Figure 7 It is a cooling device structure schematic view of the utility model.

[0022] In the figure: 1, workbench; 2, fixed frame; 3, support seat; 4, limit moving device; 5, cooling device; 6, cutting assembly; 401, limit groove; 402, rotating motor; 403, first threaded rod; 404, first pulley; 405, limit sliding block; 406, second threaded rod; 407, second pulley; 408, belt; 409, vacuum adsorption hole; 410, limit plate; 411, sliding groove; 412, sliding block; 413, carrier plate; 501, cooling box; 502, connecting pipe; 503, pump body; 504, conduit; 505, cooling pipe; 506, electric nozzle; 507, connecting steel pipe. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0024] Embodiment one:

[0025] Please refer to the drawings Figure 1 - the drawings Figure 2 and the drawings Figure 5 - the drawings Figure 6The utility model provides a kind of multi-wire cutting machine for quartz wafer processing, a kind of multi-wire cutting machine for quartz wafer processing, including workbench 1, the surface of workbench 1 is fixedly installed with fixed frame 2, the surface of workbench 1 is equipped with limit moving device 4, limit moving device 4 includes rotating motor 402 and limit plate 410, the front and rear surfaces of workbench 1 are both provided with limit groove 401, rotating motor 402 is connected with first pulley 404 by first threaded rod 403, the surface of workbench 1 is equipped with carrier plate 413, the front and rear sides of carrier plate 413 are both fixedly installed with two limit sliding blocks 405, the inner wall of the front and rear sides of fixed frame 2 is both provided with two groups of sliding grooves 411, the front and rear sides of limit plate 410 are both fixedly installed with two groups of mounting sliding blocks 412, first pulley 404 is connected with second pulley 407 by belt 408, second pulley 407 is fixedly connected with second threaded rod 406 in the inside, the surface of carrier plate 413 is equipped with multiple vacuum suction holes 409, the bottom of workbench 1 is fixedly installed with support base 3 in four corners, the end of four support bases 3 away from workbench 1 is all fixedly installed with non-slip mat, the upper end of fixed frame 2 is equipped with cooling device 5, the inside of fixed frame 2 and the bottom of workbench 1 are equipped with cutting assembly 6, first threaded rod 403 and second threaded rod 406 are all rotationally connected in the inside of two groups of limit grooves 401, first threaded rod 403 is screw-connected with two groups of limit sliding blocks 405 on the front side, second threaded rod 406 is screw-connected with two groups of limit sliding blocks 405 on the rear side, first threaded rod 403 is fixedly installed on the output end of rotating motor 402, first pulley 404 is fixedly installed on the circumferential surface of first threaded rod 403 and located at the right side outer end of workbench 1, second pulley 407 is fixedly installed on the circumferential surface of second threaded rod 406, the two ends of belt 408 are respectively drivingly connected with first pulley 404 and second pulley 407, rotating motor 402 is fixedly installed on the right side front end of workbench 1 by motor base, four groups of limit sliding blocks 405 are all slidingly connected in the inside of limit groove 401, limit plate 410 is arranged in the inside of fixed frame 2 and located above carrier plate 413, mounting sliding block 412 is slidingly connected in the inside of sliding groove 411, the surface of carrier plate 413 and limit plate 410 is both provided with multiple grooves that are equally spaced distribution and adapt to the cutting line of cutting assembly 6.

[0026] In the process of moving cutting, since the limiting plate 410 is in contact with the surface of the quartz wafer, when one end of the quartz wafer is cut, the other end can be kept in a stable state through the cooperation of the limiting plate 410 and the vacuum suction hole 409, so as to prevent position deviation. The moving speed of the object can be adjusted by changing the rotating speed of the first threaded rod 403 and the second threaded rod 406, so as to control the moving speed of the carrier plate 413. The threaded rod transmission structure is relatively simple and is not prone to failure. Compared with other complex transmission mechanisms, the structure of the first threaded rod 403 and the second threaded rod 406 is relatively simple and has no too many vulnerable parts, so it has high reliability and durability. After moving cutting, the quartz wafer moves to the left end of the workbench 1, which is convenient for taking out. The setting of multiple notches is beneficial to the passing of multiple cutting lines.

[0027] Specifically, first, the cutting assembly 6 is installed and completed, and the tension is adjusted to an appropriate degree. Then, the quartz wafer to be cut is placed on the carrier plate 413 and is fixed by the vacuum suction hole 409. Subsequently, the limiting plate 410 is moved to be in contact with the upper surface of the quartz wafer. The rotating motor 402 and the cutting assembly 6 are turned on. In the process of cutting, the rotating motor 402 drives the first threaded rod 403 to rotate. Under the action of the first pulley 404, the belt 408 and the second pulley 407, the second threaded rod 406 also rotates, so as to drive the carrier plate 413 to move through the limiting slide block 405, so that the quartz wafer can stably move and cut. The rotation of the first threaded rod 403 and the second threaded rod 406 can realize precise linear displacement control, and its high-precision characteristic enables it to realize very small movement increment, so as to meet the application with extremely high position accuracy requirement. The meshing action of the threads makes the carrier plate 413 not prone to shaking or jumping during movement, so as to keep a stable movement state and ensure the cutting accuracy.

[0028] Embodiment two:

[0029] Please refer to the accompanying Figure 1 - the accompanying Figure 4 and the accompanying Figure 7 On the basis of embodiment one, it is further obtained that the cooling device 5 comprises a cooling box 501, the cooling box 501 is connected with a pump body 503 through a connecting pipe 502, the pump body 503 is connected with a cooling pipe 505 through a guide pipe 504, a plurality of electric nozzles 506 are fixedly installed on one side surface of the cooling pipe 505 in equal intervals, the cooling box 501 and the pump body 503 are both fixedly installed on the top of the fixed frame 2, one end of the connecting pipe 502 is fixedly connected with the cooling box 501 and penetrates through the left side surface thereof, and the other end thereof is fixedly connected with the input end of the pump body 503. One end of the guide pipe 504 is fixedly connected with the output end of the pump body 503, and the other end thereof is fixedly connected with the cooling pipe 505. The cooling pipe 505 and the fixed frame 2 are fixedly connected through two groups of connecting steel pipes 507.

[0030] The output ends of the plurality of electric spray heads 506 are directed towards the surface of the carrier plate 413, and the cutting assembly 6 continuously cools the cutting position of the quartz wafer, and the plurality of electric spray heads 506 can be arranged to cover the cutting positions of the plurality of cutting lines in all directions.

[0031] Specifically, while cutting, the pump body 503 is opened, and the cooling liquid in the cooling box 501 sequentially passes through the connecting pipe 502, the conduit 504 and the cooling pipe 505, and is finally sprayed out through the plurality of electric spray heads 506 to cool the cutting position, so as to prevent a large amount of heat generated by high-speed friction between the cutting line and the quartz wafer, local high temperature of the wafer, internal thermal stress of the wafer, cracks and deformation of the wafer, and the like, so that the cutting assembly 6 maintains good cutting performance, the replacement frequency of the cutting line is reduced, and the production efficiency is improved.

[0032] The utility model discloses a kind of quartz wafer processing with multi-wire cutting machine, first, cutting assembly 6 is installed, make its tension degree adjustment be appropriate degree, after this, the quartz wafer to be cut is placed on carrier plate 413, it is fixed by being adsorbed to it by vacuum adsorption hole 409, subsequently, moving limit plate 410 makes it contact with the upper surface of quartz wafer, opening rotating motor 402 and cutting assembly 6, while cutting, rotating motor 402 drives first threaded rod 403 rotation, under the action of first pulley 404, belt 408 and second pulley 407, second threaded rod 406 also follows rotation, to be driven carrier plate 413 by limit sliding block 405 to move, so that quartz wafer can stably move cutting, while this, opening pump body 503, cooling liquid in cooling box 501 sequentially passes through connecting pipe 502, conduit 504 and cooling pipe 505, and is finally sprayed out through the plurality of electric spray heads 506, to continuously cool the cutting position, by this, entire process ends.

[0033] Finally, it should be noted that: the above only for preferred embodiment of the utility model, and does not limit the utility model, although the utility model is described in detail with reference to the foregoing embodiments, for the person skilled in the art, it still can modify the technical scheme recorded in the foregoing each embodiment, or equivalent replacement to part of technical features, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the utility model, should be included in the protection scope of the utility model.

Claims

1. A multi-wire saw for processing a quartz wafer, comprising a table (1), characterized in that: The surface of the workbench (1) is fixedly provided with a fixing frame (2), the surface of the workbench (1) is provided with a limiting moving device (4), the limiting moving device (4) comprises a rotating motor (402) and a limiting plate (410), both sides of the surface of the workbench (1) are provided with limiting grooves (401), the rotating motor (402) is connected with a first pulley (404) through a first threaded rod (403), the surface of the workbench (1) is provided with a carrier plate (413), both sides of the carrier plate (413) are fixedly provided with two limiting sliding blocks (405), both sides of the inner wall of the fixing frame (2) are provided with two groups of sliding grooves (411), both sides of the limiting plate (410) are fixedly provided with two groups of mounting sliding blocks (412), the first pulley (404) is connected with a second pulley (407) through a belt (408), the second pulley (407) is fixedly connected with a second threaded rod (406) in the inside, the surface of the carrier plate (413) is provided with a plurality of vacuum suction holes (409).

2. The multi-wire saw for processing a quartz wafer according to claim 1, wherein: The bottom of the workbench (1) is fixedly provided with a supporting seat (3), the end away from the workbench (1) of the four supporting seats (3) is fixedly provided with a non-slip pad, the upper end of the fixing frame (2) is provided with a cooling device (5), the inside of the fixing frame (2) and the bottom of the workbench (1) are provided with a cutting assembly (6).

3. The multi-wire saw for processing a quartz wafer according to claim 1, wherein: The first threaded rod (403) and the second threaded rod (406) are rotatably connected in the inside of the two groups of limiting grooves (401), the first threaded rod (403) is threadedly connected with the two groups of limiting sliding blocks (405) on the front side, the second threaded rod (406) is threadedly connected with the two groups of limiting sliding blocks (405) on the rear side, and the first threaded rod (403) is fixedly installed on the output end of the rotating motor (402).

4. The multi-wire saw for processing a quartz wafer according to claim 1, wherein: The first pulley (404) is fixedly installed on the circumferential surface of the first threaded rod (403) and located at the right outer end of the workbench (1), the second pulley (407) is fixedly installed on the circumferential surface of the second threaded rod (406), both ends of the belt (408) are drivingly connected with the first pulley (404) and the second pulley (407) respectively, the rotating motor (402) is fixedly installed on the right front end of the workbench (1) through a motor base, and the four groups of limiting sliding blocks (405) are slidingly connected in the inside of the limiting grooves (401).

5. The multi-wire saw for processing a quartz wafer according to claim 1, wherein: The limiting plate (410) is arranged in the inside of the fixing frame (2) and above the carrier plate (413), the mounting sliding blocks (412) are slidingly connected in the inside of the sliding grooves (411), and the surfaces of the carrier plate (413) and the limiting plate (410) are provided with a plurality of grooves that are equally spaced and matched with the cutting lines of the cutting assembly (6).

6. The multi-wire saw for processing a quartz wafer according to claim 2, wherein: The cooling device (5) comprises a cooling box (501), the pump body (503) is connected with the cooling box (501) through a connecting pipe (502), the cooling pipe (505) is connected with the pump body (503) through a guide pipe (504), and the side surface of the cooling pipe (505) is fixedly installed with a plurality of electric nozzles (506) distributed at equal intervals.

7. The multi-wire saw for processing a quartz wafer according to claim 6, wherein: The cooling box (501) and the pump body (503) are fixedly installed on the top of the fixed frame (2), one end of the connecting pipe (502) is fixedly connected with the cooling box (501) and penetrates through the left side surface thereof, the other end of the connecting pipe (502) is fixedly connected with the input end of the pump body (503), one end of the guide pipe (504) is fixedly connected with the output end of the pump body (503), the other end of the guide pipe (504) is fixedly connected with the cooling pipe (505), and the cooling pipe (505) and the fixed frame (2) are fixedly connected through two groups of connecting steel pipes (507).

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