Cutting equipment for silicon wafer production

Abstract

The utility model discloses cutting equipment for silicon wafer production, which relates to the technical field of silicon wafer production and comprises a cutting equipment main body, a support, a sliding seat, a lifting unit, a placing seat and a limiting unit, and the support is fixedly mounted in the cutting equipment main body. The beneficial effects of the utility model are that through the arrangement of the limiting unit, when a silicon wafer is placed on the placing seat and the adjusting seat drives the contact seat to move, the contact seat contacts and extrudes the silicon wafer, and under the rebound of the spring, the contact seat is pushed to limit the silicon wafer, so that the silicon wafer is positioned by the two contact seats; at the moment, a sliding seat can be pushed to enter a support along a sliding rail, at the moment, the position of a mounting frame is adjusted through a cutting equipment body, further positioning is conducted, the positioning time is short, and at the moment, a silicon wafer can be cut through a cutting mechanism.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of silicon wafer production, especially to a cutting equipment for silicon wafer production. BACKGROUND

[0002] Silicon wafer is an important basic material in the semiconductor industry, and is widely used in integrated circuits, solar cells, sensors and other fields.

[0003] When producing silicon wafers, the silicon wafers need to be cut. Silicon wafer cutting is a key link in the processing of semiconductor materials, mainly used for cutting silicon rods or ingots into thin slices for subsequent production of solar panels, integrated circuits and other applications.

[0004] At present, when cutting silicon wafers, the silicon wafers are placed in the cutting equipment, and the cutting mechanism on the cutting equipment is used to cut the silicon wafers. In order to ensure the accuracy of the cutting, the silicon wafers need to be aligned manually, and then the cutting mechanism needs to be adjusted by the silicon wafer cutting equipment to ensure the accuracy of the cutting. However, in the actual silicon wafer processing process, the positioning accuracy of the silicon wafers is poor, which leads to the need for multiple alignment and positioning of the silicon wafer cutting equipment every time the silicon wafers are positioned, resulting in a longer time consumption and lower processing efficiency.

[0005] Therefore, a cutting equipment for silicon wafer production is proposed to solve the above problems. SUMMARY

[0006] The utility model aims at solving the problem in the prior art that the positioning accuracy of the silicon wafers is poor in the actual silicon wafer processing process, which leads to the need for multiple alignment and positioning of the silicon wafer cutting equipment every time the silicon wafers are positioned, resulting in a longer time consumption and lower processing efficiency. A cutting equipment for silicon wafer production is proposed to solve the above problems.

[0007] In order to solve the problems in the prior art, the utility model adopts the following technical scheme:

[0008] A cutting equipment for silicon wafer production, comprising: a cutting equipment main body, a support, a sliding seat, a lifting unit, a placing seat and a limiting unit, the support is fixedly installed inside the cutting equipment main body, the cutting equipment main body is fixedly connected with a sliding rail, the sliding seat is slidingly connected on the sliding rail, the sliding seat is in the support, the placing seat is on the sliding seat, the lifting unit is between the sliding seat and the placing seat, the limiting unit is above the placing seat,

[0009] The lifting unit comprises rotating rods rotatably connected with the outer walls of the sliding seat and the placing seat, nut seats rotatably connected between the corresponding two rotating rods, and bidirectional screws threadedly connected with the inner walls of the plurality of nut seats.

[0010] The limiting unit comprises an adjusting seat and a contact seat slidingly connected with the placing seat, and a plurality of springs arranged between the adjusting seat and the contact seat.

[0011] Preferably, the bracket is provided with a sliding rail, a driving mechanism is connected with the sliding rail, a mounting frame is slidingly connected with the sliding rail, and a cutting mechanism is mounted on the mounting frame.

[0012] Preferably, the mounting frame is located directly above the sliding seat and the placing seat, a plurality of rotating seats are fixedly connected with the top end surface of the sliding seat and the bottom end surface of the placing seat, and the rotating seats are rotatably connected with the corresponding rotating rods.

[0013] Preferably, a plurality of connecting seats are arranged between the sliding seat and the placing seat, the connecting seats are rotatably connected with the plurality of bidirectional screws, a transmission wheel is sleeved with the outer peripheral wall of the bidirectional screw, and a transmission belt is interference-fitted with the outer peripheral wall of the transmission wheel.

[0014] Preferably, a plurality of sliding grooves are formed in the placing seat, a limiting block is slidingly connected with the inner wall of the sliding groove, and the top end surface of the limiting block is fixedly connected with the adjusting seat.

[0015] Preferably, a plurality of sliding rods are slidingly connected with the inner wall of the adjusting seat, and a connecting rod is fixedly connected with the outer wall of the plurality of sliding rods.

[0016] Preferably, the end, away from the connecting rod, of the connecting rod is fixedly connected with the contact seat.

[0017] Preferably, the outer wall of the adjusting seat is fixedly connected with the spring, the end, away from the adjusting seat, of the spring is fixedly connected with the contact seat, and the spring is sleeved with the outer peripheral wall of the sliding rod.

[0018] Compared with the prior art, the utility model has the advantages that:

[0019] 1. In the utility model, when the silicon wafer is placed on the placing seat, the contact seat is in contact with and pressed against the silicon wafer when the adjusting seat drives the contact seat to move, the contact seat is limited to the silicon wafer under the rebound of the spring, the two contact seats position the silicon wafer, the placing seat enters the bracket by pushing the sliding seat along the sliding rail, the position of the mounting frame is adjusted by the cutting equipment main body to further position, the positioning time is short, and the silicon wafer can be cut by the cutting mechanism.

[0020] 2、In the utility model, when the height of the silicon wafer needs to be adjusted, under the rotation of the bidirectional screw rod, the nut seat threaded on the bidirectional screw rod moves towards or away from each other, at this time the nut seat moves, drives the rotating rod to rotate, makes the rotating rod rotate along the inner wall of the rotating seat, makes the rotating rod push the placing seat to move relative to the sliding seat, pushes the silicon wafer on the placing seat to be at the proper height, and the silicon wafer is conveniently processed. BRIEF DESCRIPTION OF DRAWINGS

[0021] The drawings described herein are used to provide further understanding of the utility model, form a part of the present application, the illustrative embodiment of the utility model and its explanation are used to explain the utility model, and do not constitute improper limitation to the utility model.

[0022] In the drawings:

[0023] Figure 1 It is the whole structure schematic diagram of the utility model;

[0024] Figure 2 It is the cutting equipment main body internal structure schematic diagram of the utility model;

[0025] Figure 3 It is the support structure schematic diagram of the utility model;

[0026] Figure 4 It is the lifting unit structure schematic diagram of the utility model;

[0027] Figure 5 It is the Figure 4 Part structure enlarged schematic diagram.

[0028] The serial number in the drawing: 1, cutting equipment main body;2, support;201, mounting frame;3, sliding seat;4, lifting unit;401, bidirectional screw rod;402, nut seat;403, rotating rod;404, rotating seat;405, connecting seat;406, transmission wheel;407, transmission belt;5, placing seat;501, sliding groove;6, limiting unit;601, adjusting seat;602, contact seat;603, sliding rod;604, connecting rod;605, spring. DETAILED DESCRIPTION

[0029] The technical scheme in the utility model embodiment will be clearly and completely described below in combination with the drawings in the utility model embodiment, and obviously, the described embodiment is only a part of the embodiment of the utility model, not all the embodiment.

[0030] Embodiment: the embodiment provides a cutting equipment for silicon wafer production, and the cutting equipment comprises a cutting equipment main body, a support, a sliding seat, a lifting unit, a placing seat and a limiting unit. Figures 1-5Specifically, it comprises a cutting device body 1, a support 2, a sliding seat 3, a lifting unit 4, a placing seat 5 and a limiting unit 6. The support 2 is fixedly installed in the cutting device body 1. The cutting device body 1 is fixedly connected with a sliding rail. The sliding seat 3 is slidingly connected to the sliding rail. A protective cover is rotatably connected to the cutting device body 1. The protective cover is convenient for protecting the cutting of the silicon wafer. When the silicon wafer is installed, the protective cover on the support 2 is opened. The sliding seat 3 is pulled out, so that the sliding seat 3 slides along the sliding rail. At this time, the silicon wafer is placed on the placing seat 5. The sliding seat 3 is in the support 2. The placing seat 5 is on the sliding seat 3. The lifting unit 4 is between the sliding seat 3 and the placing seat 5. The limiting unit 6 is above the placing seat 5.

[0031] The lifting unit 4 comprises rotating rods 403 rotatably connected to the outer walls of the sliding seat 3 and the placing seat 5. Correspondingly, two rotating rods 403 are rotatably connected with nut seats 402. A plurality of nut seats 402 are threadedly connected with bidirectional lead screws 401 on the inner walls. When the height of the silicon wafer needs to be adjusted, the nut seats 402 threadedly connected with the bidirectional lead screws 401 move towards or away from each other under the rotation of the bidirectional lead screws 401. At this time, the nut seats 402 move, driving the rotating rods 403 to rotate, so that the rotating rods 403 rotate along the inner walls of the rotating seats 404, driving the placing seat 5 to move relative to the sliding seat 3, driving the silicon wafer on the placing seat 5 to be at a suitable height, facilitating the processing of the silicon wafer.

[0032] The limiting unit 6 comprises adjusting seats 601 slidingly connected to the placing seat 5 and contact seats 602. A plurality of springs 605 are arranged between the adjusting seats 601 and the contact seats 602. When the silicon wafer is placed on the placing seat 5, the adjusting seats 601 drive the contact seats 602 to move, so that the contact seats 602 contact and press the silicon wafer. Under the rebound of the springs 605, the contact seats 602 drive the silicon wafer to be limited, so that the two contact seats 602 position the silicon wafer. At this time, the placing seat 5 can be pushed into the support 2 by pushing the sliding seat 3 along the sliding rail. The position of the mounting frame 201 can be adjusted by the cutting device body 1, so that the positioning time is shorter. At this time, the silicon wafer can be cut by the cutting mechanism.

[0033] The support 2 is provided with a sliding rail. A driving mechanism is connected to the sliding rail. A mounting frame 201 is slidingly connected to the sliding rail. A cutting mechanism is installed on the mounting frame 201.

[0034] The mounting frame 201 is located directly above the sliding seat 3 and the placing seat 5, the top end surface of the sliding seat 3 and the bottom end surface of the placing seat 5 are fixedly connected with a plurality of rotating seats 404, the rotating seat 404 is rotationally connected with the corresponding rotating rod 403, under the rotation of the bidirectional screw rod 401, the nut seat 402 threaded on the bidirectional screw rod 401 moves towards or away from each other, at this time the nut seat 402 moves, drives the rotating rod 403 to rotate, so that the rotating rod 403 rotates along the inner wall of the rotating seat 404, so that the rotating rod 403 pushes the placing seat 5 to move relative to the sliding seat 3, pushes the silicon wafer on the placing seat 5 to be at the appropriate height, facilitating the processing of the silicon wafer.

[0035] A plurality of connecting seats 405 are arranged between the sliding seat 3 and the placing seat 5, the connecting seat 405 is rotationally connected with a plurality of bidirectional screw rods 401, the outer peripheral wall of the bidirectional screw rod 401 is sleeved with a transmission wheel 406, the outer peripheral wall of the transmission wheel 406 is interference fit with a transmission belt 407, under the rotation of the transmission wheel 406, the transmission belt 407 is rotated, under the action of the transmission belt 407, the two transmission wheels 406 are simultaneously rotated, and then the plurality of bidirectional screw rods 401 are simultaneously rotated, facilitating the rotation of the bidirectional screw rod 401 to drive the connecting seat 405 to move relative to the sliding seat 3.

[0036] When the height of the silicon wafer needs to be adjusted, one of the bidirectional screw rods 401 is rotated, the bidirectional screw rod 401 rotates on the inner wall of the two connecting seats 405, under the rotation of the bidirectional screw rod 401, the transmission wheel 406 on the outer peripheral wall thereof rotates, the transmission belt 407 rotates, and under the action of the transmission belt 407, the two bidirectional screw rods 401 rotate simultaneously.

[0037] A plurality of sliding grooves 501 are formed in the placing seat 5, a limiting block is slidably connected to the inner wall of the sliding groove 501, and the top end surface of the limiting block is fixedly connected with an adjusting seat 601.

[0038] A plurality of sliding rods 603 are slidably connected to the inner wall of the adjusting seat 601, and the outer wall of the plurality of sliding rods 603 is fixedly connected with a connecting rod 604.

[0039] The end of the connecting rod 604 away from the connecting rod 604 is fixedly connected with a contact seat 602, when the silicon wafer is placed on the placing seat 5, the bolts on the adjusting seat 601 are loosened, the adjusting seat 601 is not fixed with the placing seat 5, the adjusting seat 601 is pulled to slide on the placing seat 5, when the adjusting seat 601 drives the contact seat 602 to move, the contact seat 602 contacts and presses the silicon wafer.

[0040] The outer wall of the adjusting seat 601 is fixedly connected with the spring 605, the end of the spring 605 away from the adjusting seat 601 is fixedly connected with the contact seat 602, and the spring 605 is sleeved on the outer peripheral wall of the sliding rod 603; at this time, the adjusting seat 601 slides along the outer peripheral wall of the sliding rod 603, so that the adjusting seat 601 compresses the plurality of springs 605; under the rebound of the spring 605, the contact seat 602 is pushed to limit the silicon wafer; when the positions of the two adjusting seats 601 are adjusted to be appropriate, the two contact seats 602 position the silicon wafer; at this time, the adjusting seat 601 is limited by being tightened by the bolt; at this time, the contact seat 602 limits the silicon wafer through the action of the contact seat 602;

[0041] At this time, the placing seat 5 can enter the support 2 by pushing the sliding seat 3 along the slide rail; under the action of the slide rail, the movement of the sliding seat 3 is stable; at this time, the position of the mounting frame 201 is adjusted by the cutting equipment main body 1, and further positioning is performed, so that the positioning time is shorter; at this time, the silicon wafer can be cut by the cutting mechanism.

[0042] When the cutting is completed, the silicon wafer is placed outside by pulling the sliding seat 3; at this time, the silicon wafer can be taken down, and a new silicon wafer can be placed on the placing seat 5; the silicon wafer can be limited by the two contact seats 602, so that the positioning accuracy is ensured each time.

[0043] Specifically, the working principle and operation method of the utility model are as follows: the protective cover on the support 2 is opened, the sliding seat 3 is pulled out, the sliding seat 3 slides along the slide rail, and the silicon wafer is placed on the placing seat 5 at this time.

[0044] When the silicon wafer is placed on the placing seat 5, the bolt on the adjusting seat 601 is loosened at this time, so that the adjusting seat 601 is not fixed with the placing seat 5; at this time, the adjusting seat 601 is pulled to slide on the placing seat 5; when the contact seat 602 is moved by the adjusting seat 601, the contact seat 602 is in contact with and pressed against the silicon wafer.

[0045] At this time, the adjusting seat 601 slides along the outer peripheral wall of the sliding rod 603, so that the adjusting seat 601 compresses the plurality of springs 605; under the rebound of the spring 605, the contact seat 602 is pushed to limit the silicon wafer; when the positions of the two adjusting seats 601 are adjusted to be appropriate, the two contact seats 602 position the silicon wafer; at this time, the adjusting seat 601 is limited by being tightened by the bolt; at this time, the contact seat 602 limits the silicon wafer through the action of the contact seat 602;

[0046] At this time, the placing seat 5 can be put into the support 2 by pushing the sliding seat 3 along the slide rail, and the position of the mounting frame 201 is adjusted by the cutting equipment body 1, and further positioning is carried out, so that the positioning time is short, and the silicon wafer can be cut by the cutting mechanism;

[0047] When the cutting is completed, the silicon wafer is taken out by pulling the sliding seat 3, and then a new silicon wafer is placed on the placing seat 5, and the silicon wafer can be limited by the two contact seats 602, so that the positioning accuracy is ensured.

[0048] When the height of the silicon wafer needs to be adjusted, one of the two-way screw rods 401 is rotated, so that the two-way screw rod 401 rotates on the inner wall of the connecting seat 405, and under the rotation of the two-way screw rod 401, the transmission wheel 406 on the outer wall of the two-way screw rod 401 rotates, so that the transmission belt 407 rotates, and under the action of the transmission belt 407, the two two-way screw rods 401 rotate at the same time.

[0049] Under the action of the transmission belt 407, the two transmission wheels 406 rotate at the same time, and then the plurality of two-way screw rods 401 rotate at the same time, so that the two-way screw rod 401 drives the connecting seat 405 to rotate, and is used for stably driving the placing seat 5 to move relative to the sliding seat 3.

[0050] Under the rotation of the two-way screw rod 401, the nut seat 402 threaded on the two-way screw rod 401 moves towards or away from each other, and the nut seat 402 moves to drive the rotating rod 403 to rotate, so that the rotating rod 403 rotates along the inner wall of the rotating seat 404, and the rotating rod 403 drives the placing seat 5 to move relative to the sliding seat 3, and the silicon wafer on the placing seat 5 is at a suitable height, which is convenient for processing the silicon wafer.

[0051] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A cutting device for silicon wafer production, comprising a cutting device body (1), a support (2), a sliding seat (3), a lifting unit (4), a placing seat (5) and a limiting unit (6), the support (2) is fixedly installed in the interior of the cutting device body (1), the cutting device body (1) is fixedly connected with a sliding rail, the sliding seat (3) is slidingly connected on the sliding rail, the sliding seat (3) is in the support (2), the placing seat (5) is on the sliding seat (3), the lifting unit (4) is between the sliding seat (3) and the placing seat (5), and the limiting unit (6) is above the placing seat (5), characterized in that: the lifting unit (4) comprises rotating rods (403) rotatably connected with the outer walls of the sliding seat (3) and the placing seat (5), and a nut seat (402) is rotatably connected between the corresponding two rotating rods (403); a plurality of the nut seats (402) are threadedly connected with bidirectional lead screws (401) on the inner walls thereof. The limiting unit (6) comprises an adjusting seat (601) and a contact seat (602) slidingly connected on the placing seat (5), and a plurality of springs (605) are arranged between the adjusting seat (601) and the contact seat (602).

2. The cutting apparatus for producing a silicon wafer according to claim 1, wherein: The support (2) is provided with a sliding rail, a driving mechanism is connected on the sliding rail, a mounting frame (201) is slidingly connected on the sliding rail, and a cutting mechanism is mounted on the mounting frame (201).

3. The cutting apparatus for producing a silicon wafer according to claim 2, wherein: The mounting frame (201) is directly above the sliding seat (3) and the placing seat (5), a plurality of rotating seats (404) are fixedly connected to the top end surface of the sliding seat (3) and the bottom end surface of the placing seat (5), and the rotating seats (404) are rotatably connected with the corresponding rotating rods (403).

4. The apparatus according to claim 3, wherein: A plurality of connecting seats (405) are arranged between the sliding seat (3) and the placing seat (5), the connecting seats (405) are rotatably connected with the bidirectional lead screws (401), a transmission wheel (406) is sleeved on the outer peripheral wall of the bidirectional lead screw (401), and the transmission belt (407) is interference-fitted on the outer peripheral wall of the transmission wheel (406).

5. The apparatus according to claim 4, wherein: A plurality of sliding grooves (501) are formed in the placing seat (5), limiting blocks are slidingly connected on the inner walls of the sliding grooves (501), and the top end surfaces of the limiting blocks are fixedly connected with the adjusting seat (601).

6. The apparatus according to claim 5, wherein: A plurality of sliding rods (603) are slidingly connected on the inner wall of the adjusting seat (601), and connecting rods (604) are fixedly connected to the outer walls of the plurality of sliding rods (603).

7. The apparatus according to claim 6, wherein: The end of the connecting rod (604) away from the connecting rod (604) is fixedly connected with the contact seat (602).

8. The apparatus according to claim 7, wherein: The outer wall of the adjusting seat (601) is fixedly connected with the spring (605), the end of the spring (605) away from the adjusting seat (601) is fixedly connected with the contact seat (602), and the spring (605) is sleeved on the outer peripheral wall of the sliding rod (603).

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