Partition plate buffering material box

Abstract

The partition plate buffering material box comprises a box body, partition plates and supporting columns, bearing grooves and partition plate containing grooves are symmetrically formed in the two sides of the inner wall of the box body, the partition plate containing grooves are located below the bearing grooves, the partition plates are arranged in the two partition plate containing grooves in the same horizontal plane, and a plurality of sliding grooves are formed in the partition plates. A plurality of supporting columns are connected to the partition plate in a sliding mode, the bottom ends of the supporting columns are located in the sliding grooves, the top ends of the supporting columns support the chip substrate, the two sides of the chip substrate are inserted into the bearing grooves from the inlets and outlets, the chip substrate is bent downwards due to the gravity factor, the supporting columns are moved, the bottom ends of the supporting columns slide to the bent positions of the chip substrate in the sliding grooves, and the chip substrate is bent. The top ends of the supporting columns effectively support the chip substrates, the movable supporting columns and the sliding grooves are arranged, the supporting columns can support the chip substrates at different gravity center positions by moving the supporting columns according to the different chip substrates, the possibility of warping of the chip substrates is reduced, and the effectiveness of supporting the chip substrates by the supporting columns is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip transportation technical field especially relates to the baffle buffer material box. BACKGROUND

[0002] The existing baffle buffer material box includes material box body, baffle and protruding part on the baffle, chip substrate is placed on the baffle, the edge of chip substrate is located in the bearing groove of material box body, the center of chip substrate is supported by protruding part on the baffle, due to the different gravity center positions of each chip substrate, the position of protruding part is fixed, cannot change position along with gravity center, lead to the effect of protruding part supporting chip substrate is not good, and chip substrate is easy to be damaged in the transportation process.

[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0004] In view of the deficiencies of the prior art, the utility model discloses a baffle buffer material box to solve the problem that the position of the protruding part is fixed and cannot change position along with the gravity center, resulting in poor effect of the protruding part supporting the chip substrate.

[0005] The technical scheme adopted by the utility model is as follows:

[0006] The baffle buffer material box comprises:

[0007] The box body has at least one opening on both sides, an inner cavity, an opening in communication with the inner cavity, and a bearing groove and a baffle placement groove symmetrically formed on the inner wall of the box body.

[0008] The baffle is arranged in the two baffle placement grooves on the same horizontal plane, and a plurality of sliding grooves are formed on the baffle.

[0009] The support column has a plurality of support columns, and the plurality of support columns are slidably connected in the sliding grooves.

[0010] Further, the bottom end of the support column is detachably provided with a sliding block, and the sliding block slides in the sliding groove.

[0011] Further, the sliding groove comprises a plurality of longitudinal sliding grooves and a plurality of transverse sliding grooves, the plurality of longitudinal sliding grooves are arranged at intervals, the plurality of transverse sliding grooves are arranged at intervals, and the longitudinal sliding grooves are in communication with the transverse sliding grooves.

[0012] Further, the bottom of the support column is a threaded stud, and the top end of the sliding block is provided with a threaded hole, and the threaded stud is threadedly connected in the threaded hole.

[0013] Further, the top of the support column is provided with a mounting groove, and a spring is arranged in the mounting groove, the bottom end of the spring is connected to the groove bottom of the mounting groove, and the top end of the spring is connected with a support cap.

[0014] Further, the support cap is made of insulating elastic material.

[0015] Further, the top end of the support cap is in a wave shape.

[0016] Further, the inner side of the supporting groove is provided with a gasket, and the gasket is attached to the supporting groove.

[0017] The beneficial effects of the embodiment of the utility model are as follows:

[0018] (1) The partition buffer magazine comprises a box body, a partition and a support column, the chip substrate is inserted into the supporting groove from the inlet and outlet on both sides, the chip substrate is bent downward due to gravity, the support column is moved, the bottom end of the support column is slid in the sliding groove to the gravity center position of the chip substrate, the top end of the support column effectively supports the chip substrate, the movable support column and the sliding groove are arranged, the support column can be moved to support the chip substrate with different gravity centers, the possibility of warping of the chip substrate is reduced, and the effectiveness of the support column in supporting the chip substrate is improved.

[0019] (2) Further, the bottom of the support column is a threaded stud, the top end of the sliding block is provided with a threaded hole, and the threaded stud is threadedly connected in the threaded hole, the support column and the sliding block are threadedly displaced by rotating the support column, the lifting of the support column is realized, the height of the support column is adjusted to support the chip substrate with different bending degrees, the possibility of warping of the chip substrate is further reduced, and the effectiveness of the support column in supporting the chip substrate is improved.

[0020] (3) Further, the support cap is in a wave shape, the wave-shaped design can uniformly disperse the pressure from above or the side, the uneven surface of the wave-shaped support cap can avoid a single wear point in continuous contact, thereby prolonging the service life. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a front view structural schematic diagram of the partition buffer magazine of the utility model.

[0022] Figure 2 It is a top view structural schematic diagram of the partition in the partition buffer magazine of the utility model.

[0023] Figure 3 It is the installation schematic view of the support column in the partition buffer material box.

[0024] Figure 4 It is the sectional view structure schematic view of the support column in the second embodiment of the utility model.

[0025] In the drawing,

[0026] 1, box body; 11, opening; 12, bearing groove; 13, partition placing groove; 2, partition; 21, sliding groove; 211, transverse sliding groove; 212, longitudinal sliding groove; 3, support column; 31, sliding block; 32, stud; 33, screw hole; 34, installation groove; 35, spring; 36, support cap; 4, gasket. DETAILED DESCRIPTION

[0027] The specific embodiment of the utility model will be described below in combination with the drawings.

[0028] In order to make the purpose, technical scheme and advantages of the utility model more clear and obvious, the device proposed by the utility model will be further described in detail below in combination with the drawings and specific embodiments. According to the following description, the advantages and features of the utility model will be more clear. It should be noted that the drawings are very simplified and all use non-precise proportions, and are only used to facilitate and clarify the purpose of assisting the description of the embodiment of the utility model. In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, please refer to the drawings. It should be known that the structure, proportion, size, etc. shown in the drawings attached to the specification are only used to cooperate with the content disclosed in the specification, so that people skilled in the art can understand and read, and are not used to limit the limiting conditions of the implementation of the utility model, so they do not have the technical essence, any modification of the structure, change of the proportion relationship or adjustment of the size, as long as it does not affect the effect and purpose that can be produced by the utility model, it should still fall within the scope of the technical content disclosed by the utility model.

[0029] First embodiment:

[0030] Figure 1 It is the front view structure schematic view of the partition buffer material box of the utility model. Figure 2 It is the top view structure schematic view of the partition in the partition buffer material box of the utility model. Figure 3 It is the installation schematic view of the support column in the partition buffer material box of the utility model. As Figures 1 to 3As shown, the partition buffer magazine includes a box body 1, a partition 2 and a support column 3, the box body 1 has openings 11 on both sides, the box body 1 has an inner cavity, the openings 11 communicate with the inner cavity, the inner wall of the box body 1 is symmetrically provided with a supporting groove 12 and a partition placing groove 13, the partition placing groove 13 is located below the supporting groove 12, the slot of the supporting groove 12 penetrates to the opening 11 to form an inlet and outlet, the partition 2 is arranged in the two partition placing grooves 13 on the same horizontal plane, a plurality of sliding grooves 21 are formed in the partition 2, a plurality of support columns 3 are provided, the plurality of support columns 3 are slidably connected in the sliding grooves 21, the top end of the support column 3 extends out of the upper surface of the partition 2 and supports the chip substrate. As an example, the bottom end of the support column 3 is detachably provided with a sliding block 31, and the sliding block 31 slides in the sliding groove 21.

[0031] As shown in Figure 3 Further, the sliding groove 21 includes a plurality of longitudinal sliding grooves 212 and a plurality of transverse sliding grooves 211, the plurality of longitudinal sliding grooves 212 are arranged at intervals, the plurality of transverse sliding grooves 211 are arranged at intervals, the longitudinal sliding grooves 212 communicate with the transverse sliding grooves 211, and the longitudinal sliding grooves 212 and the transverse sliding grooves 211 provide a larger moving area for the support column 3.

[0032] As shown in Figure 1 Further, the inner side of the supporting groove 12 is provided with a gasket 4, the gasket 4 is made of insulating material, for example, rubber, silica gel and EVA and the like, the insulating gasket 4 can effectively isolate electrical contact, ensure that the chip is not damaged during transportation and storage and protect the chip substrate, reduce vibration, impact or extrusion during transportation or storage, the gasket 4 can alleviate the influence of external force on the chip and reduce the risk of damage to the substrate.

[0033] When the embodiment works:

[0034] A plurality of partitions 2 are inserted into the box body 1 along the partition placing grooves 13, the chip substrate is inserted into the supporting groove 12 from the inlet and outlet on both sides of the chip substrate, the support column 3 is moved according to the bending position of the chip substrate, the sliding block 31 at the bottom end of the support column 3 moves in the longitudinal sliding groove 212 and the transverse sliding groove 211 to the bending position of the chip substrate, and the support column 3 supports the chip substrate.

[0035] In this embodiment, the sliding block 31 at the bottom end of the support column 3 and the sliding groove 21 on the partition 2 are matched and slid, so that the support column 3 can move the support column 3 to support the chip substrate with different gravity centers according to different chip substrates, the possibility of warping of the chip substrate is reduced, and the effectiveness of the support column 3 in supporting the chip substrate is improved.

[0036] Second embodiment:

[0037] Based on the first embodiment, the support column 3 of the first embodiment is further optimized and refined in the second embodiment.

[0038] Figure 4 It is a sectional structure schematic view of the support column in the second embodiment of the utility model. Figure 4 As shown, the bottom of the support column 3 is a threaded stud 32, and a screw hole 33 is formed in the top end of the sliding block 31.

[0039] As shown, further, an installation groove 34 is formed in the top of the support column 3, and a spring 35 is arranged in the installation groove 34. Figure 4 The bottom end of the spring 35 is connected to the groove bottom of the installation groove 34, and the top end of the spring 35 is connected to a support cap 36.

[0040] As shown, further, the support cap 36 is made of an insulating elastic material, such as rubber, polyurethane, silica gel, or polytetrafluoroethylene, to prevent electrical short circuit between the chip substrate and the support column 3 or other objects and to reduce vibration, impact, or extrusion during transportation or storage. Figure 4 As shown, further, the top end of the support cap 36 is in a wave shape.

[0041] The wave-shaped design can uniformly disperse pressure from above or the side. Figure 4

[0042] In operation, the plurality of partitions 2 are inserted into the box body 1 along the partition placement groove 13, the chip substrate is inserted into the bearing groove 12 from the inlet and outlet, the support column 3 is moved according to the center of gravity of the chip substrate, the sliding block 31 at the bottom end of the support column 3 is moved in the longitudinal sliding groove 212 and the transverse sliding groove 211 to the center of gravity of the chip substrate, the support column 3 is rotated to produce threaded displacement with the screw hole 33 to rise upward, and the support cap 36 supports the chip substrate.

[0043] In this embodiment, the support column 3 is rotated to produce threaded displacement with the sliding block 31, the height of the support column 3 is adjusted to support chip substrates with different degrees of bending, the possibility of warping of the chip substrate is reduced, and the effectiveness of the support column 3 in supporting the chip substrate is improved.

[0044] In this embodiment, the support column 3 is rotated to produce threaded displacement with the sliding block 31, the height of the support column 3 is adjusted to support chip substrates with different degrees of bending, the possibility of warping of the chip substrate is reduced, and the effectiveness of the support column 3 in supporting the chip substrate is improved.

[0045] ​Any combination of the technical features in the above-described embodiments can be made, and for the sake of brevity, not all possible combinations are described, however, as long as the combination of the technical features does not exist in contradiction, it shall be considered as within the scope of the present disclosure.

[0046] The above-described embodiments only express several implementation manners of the present application, the description is relatively specific and detailed, but it shall not be understood as a limitation on the scope of the present application patent. It should be pointed out that, for ordinary skilled in the art, under the premise of not departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the present application patent shall be subject to the appended claims.

Claims

1. A baffle cushion magazine, characterized in that The utility model relates to a chip substrate supporting device, including: Box (1), both sides of the box (1) have opening (11), the box (1) has inner chamber, the opening (11) communicates with the inner chamber, the inner wall of the box (1) is symmetrical and set up with the support groove (12) and the partition plate placing groove (13) on both sides, the partition plate placing groove (13) is located below the support groove (12), the slot of the support groove (12) penetrates to the opening (11) and forms the import and export; Partition plate (2) is located in the same horizontal plane two partition plate placing grooves (13), a plurality of sliding slots (21) are formed in the partition plate (2); Support column (3) has a plurality of, a plurality of support column (3) is connected in the sliding slot (21), the top end of the support column (3) extends the partition plate (2) upper surface and supports chip substrate.

2. The dunnage cushion of claim 1, wherein: The bottom end of the support column (3) is detachably provided with a sliding block (31), and the sliding block (31) slides in the sliding slot (21).

3. The dunnage bag of claim 1, wherein: The sliding slot (21) includes a plurality of longitudinal sliding slots (212) and a plurality of transverse sliding slots (211), a plurality of longitudinal sliding slots (212) are arranged at intervals, a plurality of transverse sliding slots (211) are arranged at intervals, and the longitudinal sliding slot (212) communicates with the transverse sliding slot (211).

4. The dunnage cushion of claim 2, wherein: The bottom of the support column (3) is a threaded stud (32), the top end of the sliding block (31) is provided with a threaded hole (33), and the threaded stud (32) is screwed into the threaded hole (33).

5. The spacer cushion magazine of claim 1, wherein: The top of the support column (3) is provided with a mounting groove (34), the mounting groove (34) is provided with a spring (35), the bottom end of the spring (35) is connected to the groove bottom of the mounting groove (34), and the top end of the spring (35) is connected with a support cap (36).

6. The dunnage cushion of claim 5, wherein: The support cap (36) is made of insulating elastic material.

7. The dunnage cushion of claim 5, wherein: The top end of the support cap (36) is of wave type.

8. The spacer cushion magazine of claim 1, wherein: The inner side of the support groove (12) is provided with a gasket (4).

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