Small semiconductor refrigeration air conditioner
By designing a small semiconductor refrigeration air conditioner, combining the structure of semiconductor refrigeration chip, heat sink and fan, the problems of large size and high energy consumption of existing air conditioning equipment are solved, achieving energy-saving and efficient cooling effect, and facilitating installation and maintenance.
Patent Information
- Application Number
- CN202421921983.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-09
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-08-09
AI Technical Summary
Existing air conditioning equipment is large in size, consumes a lot of energy, and has high installation and maintenance costs, making it difficult to apply to small spaces and energy-saving needs.
A small semiconductor refrigeration air conditioner is adopted, including a casing, a semiconductor refrigeration chip, a heat sink, a fan, a cooling block, a control panel, and a power interface. The semiconductor refrigeration chip achieves cooling through direct current, and the fan and heat sink are combined to optimize heat management.
It achieves a small size, easy installation and portability, low energy consumption, high operating efficiency, and simple maintenance for cooling performance.
Smart Images
Figure CN223525254U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to technical field especially, it relates to a small -size semiconductor refrigeration air conditioner. BACKGROUND
[0002] At present, the common air conditioner on market mostly adopts compressor refrigeration technology, this kind of air conditioner is big in size, complex in structure, higher in energy consumption, and higher in installation and maintenance cost. In some space limited places, such as small office, dormitory, vehicle-mounted environment etc., a small, energy-efficient, easy to install and use refrigeration equipment is needed. SUMMARY
[0003] The utility model discloses a small -size semiconductor refrigeration air conditioner to solve the technical problem.
[0004] To solve the above technical problem, the specific technical scheme of the utility model is as follows:
[0005] In some embodiments of the application, a small -size semiconductor refrigeration air conditioner is provided, comprising: shell, semiconductor refrigeration piece, radiator, fan, cold block, control panel and power interface, wherein the shell is internally provided with installation cavity, and the semiconductor refrigeration piece is installed in the installation cavity, the radiator is connected with the hot end of semiconductor refrigeration piece, the cold block is connected with the cold end of semiconductor refrigeration piece, the control panel is arranged on the surface of shell, and the power interface is used to connect external power supply.
[0006] Compared with the prior art, the utility model has the beneficial effects that, BRIEF DESCRIPTION OF DRAWINGS
[0007] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments with reference made to the accompanying drawings. The drawings are for purposes of illustration only and are not intended to limit the scope of the present utility model. Like reference numerals designate corresponding parts throughout the attached drawings. In the drawings:
[0008] Figure 1 The overall internal structure schematic diagram provided by the utility model embodiment. DETAILED DESCRIPTION
[0009] The specific embodiments of the utility model will be further described in detail below with reference to the drawings and embodiments. The following embodiments are used to illustrate the utility model, but not to limit the scope of the utility model.
[0010] In order to better understand the purpose, structure and function of the utility model, the utility model will be further described in detail below with reference to the drawings.
[0011] Refer to the drawingsFigure 1 The utility model discloses a small -size semiconductor refrigeration air conditioner includes shell 1, semiconductor refrigeration piece 2, radiator 3, fan 4, cold block 5, control panel 6 and power interface 7.
[0012] Shell 1 adopts lightweight high-strength material, has good heat insulation and protection performance, and its shape and size are designed to facilitate installation and carrying.
[0013] Semiconductor refrigeration piece 2 is installed inside shell 1, and refrigeration effect is realized through direct current driving.
[0014] Radiator 3 is connected with the hot end of semiconductor refrigeration piece 2, and is used for dissipating the heat generated when semiconductor refrigeration piece 2 works.
[0015] Cold block 5 is connected with the cold end of semiconductor refrigeration piece 2, conducts cold to the air outlet of the air conditioner, and realizes refrigeration.
[0016] Control panel 6 is arranged on the surface of shell 1, and is used for user to adjust temperature, wind speed and the like.
[0017] Power interface 7 is used for connecting external power supply, and provides the electric energy required for the operation of the air conditioner.
[0018] The small -size semiconductor refrigeration air conditioner has the following advantages:
[0019] 1. Small in size, convenient to carry and install, suitable for various small spaces.
[0020] 2. Semiconductor refrigeration technology is adopted, energy consumption is relatively low, and operation efficiency is high.
[0021] 3. Simple structure, low cost and convenient maintenance.
[0022] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0023] The terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, unless otherwise specified, the meaning of "multiple" is two or more.
[0024] In the description of the application, it is necessary to point out that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "linking" should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integrally connected; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through intermediate medium, can be internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.
[0025] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between the various embodiments can be referred to each other. For the device disclosed by the embodiments, since it corresponds to the method disclosed by the embodiments, the description is relatively simple, and the related parts can be referred to the method part.
[0026] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to the embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A small-sized semiconductor refrigeration air conditioner, characterized by comprising: It includes: The shell, semiconductor refrigeration sheet, radiator, fan, cold block, control panel and power interface, wherein the shell is internally provided with a mounting cavity, the semiconductor refrigeration sheet is mounted in the mounting cavity, the radiator is connected with the hot end of the semiconductor refrigeration sheet, the cold block is connected with the cold end of the semiconductor refrigeration sheet, the control panel is arranged on the surface of the shell, and the power interface is used for connecting the external power supply.