Double-half-wafer detection all-in-one machine for solar silicon wafer

Abstract

The utility model discloses a double-half-wafer detection all-in-one machine for solar silicon wafers, which comprises a front-section conveying rail, an AOI detection mechanism and an IV detection mechanism, and the AOI detection mechanism is positioned between the front-section conveying rail and the IV detection mechanism; two sections of half-piece conveying rails are arranged on the front section of conveying rail; the AOI detection mechanism comprises a four-station rotary table, a back face AOI detection instrument assembly, a front face AOI detection instrument assembly and an AOI detection conveying rail. And the IV detection mechanism comprises a working platform, an index plate assembly and two groups of detection mechanisms. According to the double-half-wafer detection all-in-one machine for the solar silicon wafer, the double-half-wafer silicon wafer is conveyed at the same time, AOI detection and IV detection are carried out in sequence, automatic work is carried out, a probe is accurately made to be connected with grid lines on the double-half-wafer silicon wafer, the detection efficiency is improved, the productivity is improved along with increase, and the integrated multifunctional structure meets the requirements of production before and after.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer production especially relates to a solar energy silicon wafer's double half piece detection integrated machine. BACKGROUND

[0002] Crystalline silicon photovoltaic solar energy silicon wafer needs to carry out AOI detection and IV detection after printing, and the Chinese full name of AOI detection is automatic optical detection, is the equipment based on optical principle to the common defect encountered in printing production and carries out the detection, and IV detection refers to the current-voltage characteristic curve (IV curve) test of photovoltaic module, and only the silicon wafer of good quality after detection can enter the next production process equipment. The existing double half piece silicon wafer needs multiple equipment cooperation in the above-mentioned AOI detection and IV detection process, influences the docking process of detection and processing, and the production capacity is relatively low. UTILITY MODEL CONTENT

[0003] One purpose of the utility model is to provide a solar energy silicon wafer's double half piece detection integrated machine, and the AOI detection and IV detection are integrated for the detection of double half piece silicon wafer, save the process and step, and improve the detection production capacity.

[0004] To achieve this purpose, the utility model adopts the following technical scheme:

[0005] A solar energy silicon wafer's double half piece detection integrated machine, including front section conveying rail, AOI detection mechanism and IV detection mechanism, the AOI detection mechanism is between the front section conveying rail and the IV detection mechanism;

[0006] Two half piece conveying rails are arranged on the front section conveying rail;

[0007] The AOI detection mechanism includes four station turntable, back AOI detection instrument assembly, front AOI detection instrument assembly and AOI detection conveying rail, the four station turntable is located at the front end of the AOI detection conveying rail, the back AOI detection instrument assembly is located below the front end of the four station turntable, and the front AOI detection is installed above the AOI detection conveying rail;

[0008] The IV detection mechanism includes a workbench, a protractor assembly and two groups of detection mechanisms, the protractor assembly is located in the middle of the workbench, and two groups of the detection mechanisms are respectively located on the two sides of the front workstations of the protractor assembly, the detection mechanism includes a UVW base, an upper probe frame and a lower probe frame, a UVW deviation correction alignment assembly is installed at the lower end of the UVW base, the UVW deviation correction alignment assembly includes two groups of X-axis modules and a group of Y-axis modules, the upper probe frame and the lower probe frame are respectively movable on the UVW base along the vertical direction, a detection probe is installed on the lower probe frame, and the two groups of detection mechanisms move independently of each other.

[0009] As a preferred technical solution, a temporary storage linear module is arranged on the front section conveying rail, and a temporary storage frame is arranged at the driving end of the temporary storage linear module.

[0010] As a preferred technical solution, a temporary storage linear module is arranged on the front section conveying rail, and a temporary storage frame is arranged at the driving end of the temporary storage linear module.

[0011] As a preferred technical solution, a temporary storage linear module is arranged on the front section conveying rail, and a temporary storage frame is arranged at the driving end of the temporary storage linear module.

[0012] As a preferred technical solution, a temporary storage linear module is arranged on the front section conveying rail, and a temporary storage frame is arranged at the driving end of the temporary storage linear module.

[0013] As a preferred technical solution, a temporary storage linear module is arranged on the front section conveying rail, and a temporary storage frame is arranged at the driving end of the temporary storage linear module.

[0014] As a preferred technical solution, a temporary storage linear module is arranged on the front section conveying rail, and a temporary storage frame is arranged at the driving end of the temporary storage linear module.

[0015] As a preferred technical scheme, the two sides of the front half-piece track are provided with the first walking arm and the second walking arm, the first walking arm and the second walking arm are provided with walking straight line modules, the driving end of the walking straight line module is connected with a moving plate, and the inner side end of the moving plate is fixed with a negative pressure adsorption plate.

[0016] As a preferred technical scheme, the X-axis module and the Y-axis module each include a motor mounting seat, a module motor, an adjusting screw rod and an adjusting sliding table, the module motor is fixed on the motor mounting seat, the driving end of the module motor is in transmission connection with the adjusting screw rod, the adjusting screw rod is in threaded connection with the adjusting nut of the adjusting sliding table, the adjusting sliding table slides along the length direction of the adjusting screw rod, the adjusting sliding table is provided with a connecting bearing, the connecting bearing slides on the adjusting sliding table, the moving direction of the connecting bearing is perpendicular to the moving direction of the adjusting sliding table, and the edge of the UVW base is locked in the connecting bearing.

[0017] As a preferred technical scheme, the UVW base is provided with an upper straight line module and a lower straight line module, the upper straight line module controls the vertical movement of the upper probe frame, and the lower straight line module controls the vertical movement of the lower probe frame.

[0018] The solar silicon wafer double-half-piece detection all-in-one machine simultaneously conveys the double-half-piece silicon wafer, sequentially undergoes AOI detection and IV detection, automatically works, accurately makes the probe connect the gate line on the double-half-piece silicon wafer, improves detection efficiency, and increases production capacity. BRIEF DESCRIPTION OF DRAWINGS

[0019] The utility model will be further explained in detail in the basis of drawings and examples.

[0020] Figure 1 It is a whole structure schematic view of the solar silicon wafer double-half-piece detection all-in-one machine of example;

[0021] Figure 2 It is a structure schematic view of the front half-piece track of example;

[0022] Figure 3 It is a structure schematic view of the blowing cooling pipe of example;

[0023] Figure 4 It is a structure schematic view of the clamping plate positioning mechanism of example;

[0024] Figure 5 This is a schematic diagram of the structure of the ion-based static electricity removal air knife described in the embodiment;

[0025] Figure 6 This is a schematic diagram of the AOI inspection mechanism described in the embodiment;

[0026] Figure 7 This is a schematic diagram of the IV detection mechanism described in the embodiment;

[0027] Figure 8 This is a structural schematic diagram of the X-axis module (or Y-axis module) described in the embodiment;

[0028] Figure 9 This is a schematic diagram of the upper probe holder (or lower probe holder) as described in the embodiment.

[0029] Figures 1 to 9 middle:

[0030] 1. Front conveyor rail; 101. Half-piece conveyor rail; 102. Temporary storage frame; 103. Material replenishment rack; 104. Clamping plate positioning mechanism; 105. Clamping plate positioning motor; 106. Clamping plate positioning support; 107. Air blowing cooling pipe; 108. Ion antistatic air knife;

[0031] 2. AOI inspection mechanism; 201. Four-station turntable; 202. Rear AOI inspection instrument assembly; 203. Front AOI inspection instrument assembly; 204. AOI inspection conveyor rail; 205. AOI rotating shaft; 206. AOI adsorption module;

[0032] 3. IV testing mechanism; 301. Working platform; 302. Indexing plate assembly; 303. Testing mechanism; 304. UVW base; 305. Upper probe holder; 306. Lower probe holder; 307. X-axis module; 308. Front half track; 309. Rear half track; 310. First traveling arm; 311. Second traveling arm; 312. Moving plate; 313. Motor mounting base; 314. Module motor; 315. Adjusting screw; 316. Adjusting slide; 317. Connecting bearing; 318. Upper linear module; 319. Lower linear module. Detailed Implementation

[0033] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0034] like Figures 1 to 9 As shown in this embodiment, a dual-half-wafer inspection integrated machine for solar silicon wafers includes a front conveyor rail 1, an AOI inspection mechanism 2, and an IV inspection mechanism 3, with the AOI inspection mechanism 2 located between the front conveyor rail 1 and the IV inspection mechanism 3.

[0035] Specifically, the front conveying track 1 is provided with two half-piece conveying tracks 101; the AOI detection mechanism 2 comprises a four-station turntable 201, a back AOI detection instrument assembly 202, a front AOI detection instrument assembly 203 and an AOI detection conveying track 204, the four-station turntable 201 is located at the front end of the AOI detection conveying track 204, the back AOI detection instrument assembly 202 is located below the front end of the four-station turntable 201, and the front AOI detection instrument assembly 203 is located above the AOI detection conveying track 204; the IV detection mechanism 3 comprises a workbench 301, a protractor assembly 302 and two sets of detection mechanisms 303, the protractor assembly 302 is located in the middle of the workbench 301, and the two sets of detection mechanisms 303 are respectively located on the two sides of the front station of the protractor assembly 302, the detection mechanism 303 comprises a UVW base 304, an upper probe frame 305 and a lower probe frame 306, a UVW deviation correction alignment assembly is installed at the lower end of the UVW base 304, the UVW deviation correction alignment assembly comprises two X-axis modules 307 and a Y-axis module, the upper probe frame 305 and the lower probe frame 306 are respectively movable on the UVW base 304 along the vertical direction, a detection probe is installed on the lower probe frame 306, and the two sets of detection mechanisms 303 move independently of each other.

[0036] After the printed double half-silicon wafers are taken out from the sintering furnace, the double half-silicon wafers enter the two half-piece conveying tracks 101 respectively, at the end of the half-piece conveying track 101, the AOI detection mechanism 2 simultaneously grabs the double half-silicon wafers to the back AOI detection instrument assembly 202 through the four-station turntable 201 for back detection, then turns to the AOI detection conveying track 204, and the AOI detection conveying track 204 conveys the double half-silicon wafers to the front AOI detection instrument assembly 203 for front detection, then the protractor assembly 302 on the IV detection mechanism 3 controls the double half-silicon wafers to reach the detection mechanism 303, and under the joint action of the two X-axis modules 307 and the Y-axis module, the lower probe frame 306 and the upper probe frame 305 on the UVW base 304 are aligned to the position of the half-silicon wafer for IV detection.

[0037] The front conveying track 1 is provided with a temporary storage linear module, a temporary storage frame 102 is arranged at the driving end of the temporary storage linear module, the temporary storage frame 102 moves transversely at the side of the half-piece conveying track 101, the temporary storage frame 102 moves transversely at the side of the front conveying track 1, when one side of the temporary storage linear module is full, the other side starts to be placed, and the full side can be manually unloaded.

[0038] The front section conveying rail 1 is provided with a replenishment linear module, the driving end of the replenishment linear module is connected with a replenishment longitudinal module, the replenishment longitudinal module moves transversely at the side of the half wafer conveying rail 101, the driving end of the replenishment longitudinal module is connected with a replenishment rack 103, the replenishment rack 103 moves up and down along the vertical direction, after the replenishment linear module approaches the front section conveying rail 1, the up and down transverse module above the front section conveying rail 1 controls the up and down suction module to suck the half wafer on the replenishment rack 103 and place it into the front section conveying rail 1, in order to ensure the height of the uppermost wafer, every time a half wafer is taken, the replenishment longitudinal module controls the replenishment rack 103 to rise by one wafer position, until all the wafers on the replenishment rack 103 are taken away, then the replenishment linear module moves transversely away from the front section conveying rail 1, and then repeats the above process after the replenishment rack 103 is filled with wafers again.

[0039] The middle part of the half wafer conveying rail 101 is provided with a clamping plate positioning mechanism 104, the clamping plate positioning mechanism 104 includes a clamping plate positioning motor 105, a clamping plate positioning synchronous belt and a clamping plate positioning support 106, the driving end of the clamping plate positioning motor 105 is connected with a clamping plate positioning wheel, the clamping plate positioning synchronous belt is in transmission connection with the clamping plate positioning wheel, and the clamping plate positioning support 106 is fixed on the clamping plate positioning synchronous belt; the clamping plate positioning motor 105 drives the clamping plate positioning synchronous belt to move by controlling the rotation of the clamping plate positioning wheel, so as to make the clamping plate positioning support 106 approach the middle part of the half wafer conveying rail 101, and the position of the half wafer is adjusted.

[0040] The front end of the half wafer conveying rail 101 is provided with a blowing cooling pipe 107, and the rear end of the half wafer conveying rail 101 is provided with an ion static electricity removing air knife 108, the blowing cooling pipe 107 performs cooling treatment, and the ion static electricity removing air knife 108 is responsible for static electricity removal.

[0041] The upper part of the four-station turntable 201 is provided with an AOI rotating shaft 205, the periphery of the four-station turntable 201 is provided with four AOI suction modules 206, and the rotation of the AOI rotating shaft 205 drives the four AOI suction modules 206 to transfer the half wafer counterclockwise.

[0042] Two front half wafer tracks 308 and two rear half wafer tracks 309 are arranged on two sides of the index plate assembly 302, the front half wafer tracks 308 and the rear half wafer tracks 309 are driven by track motors to convey the wafer, the first walking arm 310 and the second walking arm 311 are arranged on two sides of the front half wafer tracks 308 and the rear half wafer tracks 309, the walking linear module is arranged on the first walking arm 310 and the second walking arm 311, the moving plate 312 is connected to the driving end of the walking linear module, the negative pressure adsorption plate is fixed to the inner side end of the moving plate 312, the two front half wafer tracks 308 are responsible for moving the double half wafer to the index plate assembly 302, the first walking arm 310 and the second walking arm 311 control the up and down movement of the double half wafer on the index plate assembly 302, the negative pressure adsorption plate adsorbs the half wafer, and the two rear half wafer tracks 309 are responsible for discharging the double half wafer from the index plate assembly 302.

[0043] The X-axis module 307 and the Y-axis module both include a motor mounting seat 313, a module motor 314, an adjusting screw rod 315 and an adjusting sliding table 316, the module motor 314 is fixed to the motor mounting seat 313, the driving end of the module motor 314 is in transmission connection with the adjusting screw rod 315, the adjusting screw rod 315 is in threaded connection with the adjusting nut of the adjusting sliding table 316, the adjusting sliding table 316 slides along the length direction of the adjusting screw rod 315, the connecting bearing 317 is arranged on the adjusting sliding table 316, the connecting bearing 317 slides on the adjusting sliding table 316, the moving direction of the connecting bearing 317 is perpendicular to the moving direction of the adjusting sliding table 316, the edge of the UVW base 304 is locked in the connecting bearing 317, the two groups of X-axis modules 307 and the group of Y-axis modules jointly control the T-axis steering of one side of the UVW base 304, in the UVW alignment, the two groups of X-axis modules 307 and the group of Y-axis modules realize the X-axis translation, the Y-axis translation and the T-axis rotation of the upper probe frame 305 and the lower probe frame 306 in the above structure, and the alignment requirements are met.

[0044] The UVW base 304 is provided with an upper linear module 318 and a lower linear module 319, the upper linear module 318 controls the vertical movement of the upper probe frame 305, the lower linear module 319 controls the vertical movement of the lower probe frame 306, the upper linear module 318 makes the upper probe frame 305 move downward and press on the upper surface of the half wafer, and the lower linear module 319 makes the lower probe frame 306 move upward and contact the gate line on the half wafer, so that the formed loop can be used for IV detection.

[0045] It should be noted that the above specific embodiments only serve as the preferred embodiments of the present application and the applied technical principles, and any changes or replacements easily thought by any person skilled in the art within the technical range disclosed by the present application should be covered in the protection range of the present application.

Claims

1. A solar silicon wafer double half wafer detection all-in-one machine, characterized in that, The front section conveying track, the AOI detection mechanism and the IV detection mechanism are included, and the AOI detection mechanism is between the front section conveying track and the IV detection mechanism; Two sections of half wafer conveying tracks are arranged on the front section conveying track; The AOI detection mechanism includes a four-station rotary table, a back AOI detection instrument assembly, a front AOI detection instrument assembly and an AOI detection conveying track, the four-station rotary table is located at the front end of the AOI detection conveying track, the back AOI detection instrument assembly is located below the front end of the four-station rotary table, and the front AOI detection instrument assembly is arranged above the AOI detection conveying track; The IV detection mechanism includes a work platform, a protractor assembly and two groups of detection mechanisms, the protractor assembly is located in the middle of the work platform, the two groups of detection mechanisms are respectively located on the two sides of the front station of the protractor assembly, the detection mechanism includes a UVW base, an upper probe frame and a lower probe frame, a UVW deviation correction alignment assembly is arranged at the lower end of the UVW base, the UVW deviation correction alignment assembly includes two groups of X-axis modules and a group of Y-axis modules, the upper probe frame and the lower probe frame are respectively movably arranged on the UVW base along the vertical direction, a detection probe is arranged on the lower probe frame, and the two groups of detection mechanisms are independently movable. 2.The solar silicon wafer double-half wafer detection integrated machine of claim 1, wherein, A temporary storage linear module is arranged on the front section conveying track, and a temporary storage frame is arranged at the driving end of the temporary storage linear module. 3.The solar silicon wafer double-half wafer detection integrated machine of claim 1, wherein, A material supplementing linear module is arranged on the front section conveying track, a material supplementing longitudinal module is connected to the driving end of the material supplementing linear module, the material supplementing longitudinal module is movably arranged on the side of the half wafer conveying track, a material supplementing frame is connected to the driving end of the material supplementing longitudinal module, and the material supplementing frame is movably arranged on the vertical direction.

4. The double half wafer detection integrated machine for solar silicon wafers of claim 1, wherein, A clamping plate positioning mechanism is arranged in the middle of the half wafer conveying track, the clamping plate positioning mechanism includes a clamping plate positioning motor, a clamping plate positioning synchronous belt and a clamping plate positioning support, a clamping plate positioning wheel is connected to the driving end of the clamping plate positioning motor, the clamping plate positioning synchronous belt is in transmission connection with the clamping plate positioning wheel, and the clamping plate positioning support is fixed on the clamping plate positioning synchronous belt.

5. The solar silicon wafer double-half wafer detection integrated machine according to claim 1, characterized in that, A blowing and cooling pipe is arranged at the front end of the half wafer conveying track, and an ion static electricity removing air knife is arranged at the rear end of the half wafer conveying track.

6. The double half wafer detection integrated machine for solar silicon wafers of claim 1, wherein, An AOI rotating shaft is arranged above the four-station rotary table, and four AOI suction modules are arranged on the periphery of the four-station rotary table.

7. The solar silicon wafer double-half wafer detection integrated machine according to claim 1, characterized in that, Two front half wafer tracks and two rear half wafer tracks are arranged on the two sides of the protractor assembly, and the front half wafer tracks and the rear half wafer tracks are used for conveying silicon wafers through track motors and track belts. 8.The solar silicon wafer double-half wafer detection integrated machine of claim 7, wherein, First walking arms and second walking arms are arranged on the two sides of the front half wafer tracks and the two sides of the rear half wafer tracks, walking linear modules are arranged on the first walking arms and the second walking arms, moving plates are connected to the driving ends of the walking linear modules, and negative pressure suction plates are fixed on the inner side ends of the moving plates. 9.The solar silicon wafer double-half wafer detection integrated machine of claim 1, wherein, The X-axis module and the Y-axis module each comprise a motor mounting base, a module motor, an adjusting screw rod and an adjusting sliding table, the module motor is fixed on the motor mounting base, the driving end of the module motor is in transmission connection with the adjusting screw rod, the adjusting screw rod is in screw connection with the adjusting nut of the adjusting sliding table, the adjusting sliding table slides along the length direction of the adjusting screw rod, the adjusting sliding table is provided with a connecting bearing, the connecting bearing slides on the adjusting sliding table, the moving direction of the connecting bearing is perpendicular to the moving direction of the adjusting sliding table, the edge of the UVW base is locked in the connecting bearing, two groups of the X-axis module plus one group of the Y-axis module jointly control the T-axis steering of the UVW base on one side. 10.The solar silicon wafer double-half wafer detection integrated machine of claim 1, wherein, The UVW base is provided with an upper linear module and a lower linear module, the upper linear module controls the vertical movement of the upper probe frame, and the lower linear module controls the vertical movement of the lower probe frame.

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