Illumination detection module and semiconductor manufacturing equipment
By adding a light detection module to semiconductor manufacturing equipment, production can be monitored in real time and paused, thus solving the PACC phenomenon caused by internal light exposure, improving product yield and reducing production costs.
Patent Information
- Application Number
- CN202422663599.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-01
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-11-01
AI Technical Summary
The lighting systems inside existing semiconductor manufacturing equipment are prone to photoinduced electrochemical copper corrosion (PACC), which leads to a decrease in product yield.
A light detection module, including a detection unit and a logic judgment unit, is added to the semiconductor manufacturing equipment. It is set close to the process tray to monitor the illuminance inside the machine in real time and suspend production when the illuminance exceeds the preset value.
By monitoring and pausing production in real time, the PACC phenomenon caused by light exposure was reduced, product yield was improved, and production costs were controlled.
Smart Images
Figure CN223527129U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of semiconductor manufacturing, especially a light detection module and semiconductor manufacturing equipment. BACKGROUND
[0002] In the wet process and metal polishing process, when the product has a PN junction with a specific pattern structure and is in a chemical solvent, and the external light is sufficient, the energy of the light may generate electron-hole pairs, causing the flow of electrons, forming an electrochemical reaction path, turning on the PN junction circuit, and transferring copper atoms from the P-doped region to the N-doped region, forming a photo-induced electrochemical copper corrosion (PACC) phenomenon.
[0003] Therefore, the three elements that form the PACC phenomenon are:
[0004] 1. Conductor: special design pattern of circuit structure, resulting in a copper interconnection structure connected to both ends of the PN junction, like two stages of a circuit;
[0005] 2. Dielectric: for example, water, moisture, chemical liquid, and other media that can form an electrochemical reaction path;
[0006] 3. Energy: light can provide energy to excite electron-hole pairs and promote the occurrence of electrochemical reactions.
[0007] The first two elements are difficult to effectively avoid in the process, so reducing light exposure is the simplest and most effective way. The common way is to use a light-tight or polarizing plate outside the equipment to block ambient light around the equipment. The equipment also has a light illumination system for maintenance or abnormal handling. This system still provides light energy.
[0008] Therefore, how to reduce the probability of PACC phenomenon caused by the light provided by the light illumination system inside the equipment and improve product yield has become a technical problem that needs to be solved by technicians in the field. UTILITY MODEL CONTENT
[0009] The utility model aims to provide a light detection module and semiconductor manufacturing equipment to solve the problem of PACC phenomenon caused by light provided by the light illumination system inside the existing equipment, resulting in reduced product yield.
[0010] To achieve the above purpose, the utility model provides a light detection module, which comprises a detection unit and a logic judgment unit.
[0011] The detection unit is arranged near a process disc for carrying a wafer to detect the light intensity inside the machine.
[0012] The logic judging unit is in communication connection with the detecting unit; the logic judging unit is configured to compare the real-time illuminance measured by the detecting unit with the preset illuminance, and generate a production suspension signal when the real-time illuminance is greater than the preset illuminance, and transmit the production suspension signal to the control end of the machine to suspend the current production process.
[0013] Optionally, the logic judging unit comprises a logic judging circuit.
[0014] The logic judging circuit is connected with the control end of the machine through an interlocking loop.
[0015] The detecting unit comprises a photosensitive resistor, the photosensitive resistor is connected to the logic judging circuit, and the resistance value of the photosensitive resistor decreases with the increase of the real-time illuminance.
[0016] The logic judging circuit comprises a relay and a switch; the relay is connected with the interlocking loop through the switch; the photosensitive resistor changes the resistance value based on the change of the real-time illuminance, and drives the switch to turn on or turn off the interlocking loop through the relay.
[0017] Optionally, when the real-time illuminance is less than the preset illuminance, the relay does not work, the switch remains connected with the interlocking loop, and the machine works normally.
[0018] When the real-time illuminance is greater than the preset illuminance, the relay works, the switch is disconnected with the interlocking loop, the machine suspends production and generates an alarm signal.
[0019] Optionally, the logic judging circuit further comprises a transistor and an analog comparator.
[0020] The first end of the transistor is connected to a power supply, the second end of the transistor is connected with the relay, and the control end of the transistor is connected with the first end of the analog comparator.
[0021] The second end of the analog comparator is connected with the photosensitive resistor, and the third end of the analog comparator is connected with a fixed resistor.
[0022] When the real-time illuminance is less than the preset illuminance, the analog comparator outputs a high level, the transistor is turned off, and the relay does not work.
[0023] When the real-time illuminance is greater than the preset illuminance, the analog comparator outputs a low level, the transistor is turned on, and the relay works.
[0024] Optionally, the second end of the analog comparator is further connected with an adjustable resistor, and the adjustable resistor is used for setting the resistance value corresponding to the preset illumination.
[0025] Optionally, the detection unit comprises a sensor, the sensor is in communication connection with the logic judgment unit, and the sensor is used for generating an illumination signal based on the illumination inside the machine table and transmitting the illumination signal to the logic judgment unit.
[0026] Optionally, the logic judgment unit comprises a communication device.
[0027] The communication device is in communication connection with the control end of the machine table, and the communication device is used for comparing the size of the real-time illumination and the preset illumination, generating the pause production signal when the real-time illumination is greater than the preset illumination, and transmitting the pause production signal to the control end of the machine table.
[0028] Optionally, the logic judgment unit further comprises a translator.
[0029] The translator is in communication connection with the communication device, and the translator is used for converting the illumination signal measured by the sensor into an illumination value and transmitting the illumination value to the communication device.
[0030] In order to achieve the above purpose, the utility model also provides a semiconductor manufacturing equipment, include: machine table, process disc and as described above illumination detection module;
[0031] The process disc is arranged in the interior of the machine table, and the detection unit is arranged close to the process disc to detect the illumination inside the machine table, and the production of the machine table is paused when the real-time illumination is greater than the preset illumination.
[0032] Optionally, the machine table comprises a wet process equipment and a metal polishing equipment.
[0033] Compared with the existing semiconductor manufacturing equipment, the illumination detection module and the semiconductor manufacturing equipment have the following advantages:
[0034] The illumination detection module provided by the application adds a detection unit close to the process disc to obtain the illumination inside the machine table, and sends a pause processing signal when the real-time illumination is greater than the preset illumination to stop the processing of the machine table, thereby reducing the probability of photo-assistant copper corrosion (PACC) phenomenon of wafers in processing due to the energy provided by illumination, and improving the product yield.
[0035] The semiconductor manufacturing equipment provided by the application reduces the probability of PACC phenomenon of wafers in processing due to the energy provided by light, thereby improving product yield, and reduces product scrap rate, so that production cost can be controlled. BRIEF DESCRIPTION OF DRAWINGS
[0036] Figure 1 A first light detection module provided by the embodiment of the application is shown in the figure.
[0037] Figure 2 A second light detection module provided by the embodiment of the application is shown in the figure.
[0038] Figure 3 A photosensitive resistor provided by the embodiment of the application is shown in the figure.
[0039] Figure 4 A logic judgment circuit provided by the embodiment of the application is shown in the figure when real-time illumination is less than preset illumination.
[0040] Figure 5 A logic judgment circuit provided by the embodiment of the application is shown in the figure when real-time illumination is greater than preset illumination.
[0041] In the figures, the following signs are explained as follows:
[0042] 1-detection unit; 10-sensor;
[0043] 2-logic judgment unit; 20-logic judgment circuit; 21-photosensitive resistor; 22-analog comparator; 23-transistor; 24-relay; 25-switch; 26-adjustable resistor; 27-fixed resistor; 28-diode; 210-photoconductor; 211-electrode; 212-substrate; 213-wire; 214-contact metal;
[0044] 3-communication device; 30-translator; 31-server;
[0045] 4-interlocking circuit; 5-control end; 6-machine. DETAILED DESCRIPTION
[0046] In order to make the purpose, advantages and characteristics of the application clearer, the application is further described in detail below in combination with the drawings and specific embodiments. It should be noted that the drawings are very simplified and not drawn in proportion, and are only used to facilitate and clarify the purpose of assisting the description of the embodiment of the application. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing is different, and sometimes different proportions are used.
[0047] As used in this specification, the singular forms "a," "an" and "the" include plural referents unless the context clearly dictates otherwise. The term "or" is generally employed in its sense including "and / or" unless the context clearly dictates otherwise. The term "and / or" means "and", "or" or both. The term "at least two" generally means "two or more" unless the context clearly dictates otherwise. The terms "first," "second," "third," etc. are used only to describe different instances and do not imply or suggest relative importance or a number of the indicated technical features. Thus, features defined with "first," "second," "third" can explicitly or implicitly include one or at least two of the features. The terms "one end" and "the other end" and "proximal" and "distal" generally refer to two parts corresponding to each other, which not only includes the end points, and the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or detachably connected, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. In addition, as used in this specification, a component disposed in another component generally only indicates that there is a connection, coupling, cooperation or transmission relationship between the two components, and the two components can be directly or indirectly connected, coupled, cooperated or transmitted through an intermediate component, and cannot be understood as indicating or suggesting the spatial positional relationship between the two components, i.e. one component can be in any position inside, outside, above, below or one side of another component, unless the context clearly indicates otherwise. The terms "up", "down", "top", "bottom" are generally relative positional relationships arranged according to the direction of gravity; the terms "vertical direction", "vertical direction" generally refer to the direction along the gravity, which is generally perpendicular to the ground, and the terms "horizontal direction", "horizontal plane direction" generally refer to the direction parallel to the ground; for those skilled in the art, the specific meaning of the above terms in this specification can be understood according to the specific circumstances.
[0048] The utility model discloses a light detection module and semiconductor manufacturing equipment, to solve the light illumination system provided by the light of the inside of the equipment of present equipment is easy to form PACC phenomenon, cause the problem of product yield reduction.
[0049] As can be understood by those skilled in the art, three elements forming the photo-assistant copper corrosion (PACC) phenomenon are conductor, dielectric and energy. Among them, the conductor and the dielectric are formed in the early stage of product design, and it is difficult to change in the process of production and manufacturing, so reducing the external substances that can provide energy for electrochemical copper corrosion in the process of production and manufacturing becomes the simplest and most effective way. As the most direct and effective way to provide energy, whether it is environmental light or laser, it can provide energy for electrochemical reaction to promote the movement of copper atoms. In the actual production and manufacturing process, blind plates or polarized plates are often used to isolate external light, but the machine table is also equipped with a light illumination system for maintenance or abnormal handling. Once the operator does not turn off the light illumination system in time after use, the probability of PACC phenomenon of the product being produced will be greatly increased, thereby affecting the product yield. Based on this, the embodiment provides a light detection module and a semiconductor manufacturing equipment. By adding a detection unit near the process disc, the light intensity inside the machine table is detected, and when the real-time light intensity is greater than the preset light intensity, a production suspension signal is generated to reduce the impact of light on the product, thereby reducing the probability of PACC phenomenon of the product, and effectively improving the product yield.
[0050] Please refer to Figures 1 to 2 The utility model provides a kind of light detection module, comprising: detection unit 1 and logic judging unit 2;Detection unit 1 is close to the process disc (not shown in the figure) for carrying wafer and is arranged, for detecting the light intensity inside machine table 6;Logic judging unit 2 is connected with detection unit 1;Logic judging unit 2 is configured as: comparing the size of real-time light intensity measured by detection unit 1 and preset light intensity, when real-time light intensity is greater than preset light intensity, generate suspension production signal, and transmit to the control end 5 of machine table 6, to suspend current production process.As an optional embodiment, after receiving suspension production signal, the wafer of the batch being produced needs to continue to be processed, and the wafer of the next batch which has not been produced is suspended production, to ensure that the wafer of the batch being produced is not completely scrapped.It needs to be explained that, in the embodiment, detection unit 1 can be a photosensitive resistor 21 (such as Figure 1 As shown), it can also be a light intensity sensor (such as Figure 2The resistance of the photoresistor 21 can change based on the change of the light intensity, thereby forming a difference. The light intensity sensor is a sensor 10 for measuring the light intensity. Based on the photoelectric effect, when light shines on the photosensitive element of the sensor 10, the photosensitive element will generate a current or voltage change. Since there is a relationship between the light intensity and the output signal of the photosensitive element, the light intensity of the current environment can be determined by measuring the output signal of the photosensitive element. The logic judgment unit 2 can be a logic judgment circuit 20 (as shown in Figure 1 which can be used with the photoresistor 21 and connected to the internal interlocking circuit 4 of the machine 6 to control the production of the machine 6 based on the size of the real-time light intensity and the preset light intensity. It can also be a translator 30 and a server 31 (as shown in Figure 2 which can be used with the light intensity sensor to store and detect the light intensity inside the machine 6 in real time, and send a production suspension instruction to the control end 5 of the machine 6 when the real-time light intensity is greater than the preset light intensity. Those skilled in the art can understand that the light intensity refers to the total amount of light received per unit area, which is usually represented by lux (lx). The preset light intensity mentioned in this embodiment can be a critical light intensity determined by combining experiments and previous product production data. When the real-time light intensity is less than the above critical light intensity, the product is not prone to PACC phenomenon; when the real-time light intensity is greater than the above critical light intensity, the probability of PACC phenomenon of the product increases. In other embodiments, the detection unit 1 and the logic judgment unit 2 can also be other components with the same function, and this embodiment does not limit this.
[0051] In this way, by adding a detection unit 1 near the process disc, the light intensity inside the machine 6 is obtained, and a processing suspension signal is sent out when the real-time light intensity is greater than the preset light intensity to stop the processing of the machine 6, thereby reducing the probability of PACC phenomenon of the wafer due to the energy provided by the light in the processing, and improving the product yield.
[0052] Please refer to Figure 1 , Figures 3 to 5, the logic judging unit 2 comprises a logic judging circuit 20; the logic judging circuit 20 is connected with the control end 5 of the machine 6 through the interlocking loop 4; the detecting unit 1 comprises a light-dependent resistor 21, the light-dependent resistor 21 is connected with the logic judging circuit 20, the resistance value of the light-dependent resistor 21 decreases with the increase of the real-time illumination; the logic judging circuit 20 comprises a relay 24 and a switch 25; the relay 24 is connected with the interlocking loop 4 through the switch 25; the light-dependent resistor 21 changes the resistance value based on the change of the real-time illumination, and drives the switch 25 to turn on or turn off the interlocking loop 4 through the relay 24. Further, when the real-time illumination is less than the preset illumination, the relay 24 does not work, the switch 25 keeps connected with the interlocking loop 4, and the machine 6 works normally; when the real-time illumination is greater than the preset illumination, the relay 24 works, the switch 25 disconnects with the interlocking loop 4, and the machine 6 suspends production and generates an alarm signal. Those skilled in the art can understand that, please refer to Figure 3 , the light-dependent resistor 21 (Light-dependent Resister, LDR) is a special resistor with photoconductive effect, which usually comprises a photoconductive body 210, an electrode 211, a contact metal 214, a substrate 212 and a wire 213. When there is light irradiation, the electrons of the resistor will be excited from the original stable state to become free electrons. The stronger the light is, the more free electrons are generated, and the smaller the resistance is. The on or off of the circuit can be controlled by using this characteristic. Please refer to Figures 4 to 5 , the interlocking loop 4 is a kind of logic control loop for realizing mutual restriction and interlocking protection between devices. Its main function is to ensure that the devices start, stop or switch states according to the specified sequence and conditions, so as to ensure the safety, stability and high efficiency of the production process. In this embodiment, the light-dependent resistor 21 is connected with the logic judging circuit 20, and changes the resistance value of the circuit based on the change of the illumination, and then controls the on or off of the switch 25 through the relay 24. It should be noted that the relay 24 is an electrical control device. When the input (excitation) reaches a specified value, it can make the controlled quantity have a predetermined step change or make the controlled circuit have an on-off state change. Therefore, when the relay 24 does not work, the switch 25 is in a normally closed state to turn on the interlocking loop 4, thereby ensuring the normal work of the machine 6; once the illumination changes and the resistance value of the light-dependent resistor 21 changes greatly, the relay 24 starts to work, and the switch 25 is in an off state, at this time the interlocking loop 4 is turned off, and the control end 5 of the machine 6 immediately sends a production suspension signal and an alarm signal to inform the operator to handle the subsequent process. The alarm signal here can be an acoustic signal, a light signal emitted by a buzzer, or a notification signal automatically sent by the system, which is not limited in this embodiment.
[0053] As an optional embodiment, please refer to Figures 4 to 5The logic judging circuit 20 further comprises a transistor 23 and an analog comparator 22; the first end of the transistor 23 is connected to a power supply, the second end of the transistor 23 is connected to a relay 24, and the control end 5 of the transistor 23 is connected to the first end of the analog comparator 22; the second end of the analog comparator 22 is connected to the photosensitive resistor 21, and the third end of the analog comparator 22 is connected to a fixed resistor 27; when the real-time illumination is less than the preset illumination, the analog comparator 22 outputs a high level, the transistor 23 is turned off, and the relay 24 does not work; when the real-time illumination is greater than the preset illumination, the analog comparator 22 outputs a low level, the transistor 23 is turned on, and the relay 24 works. It should be noted that, in the embodiment, the transistor 23 can be a PNP triode with a model number of S8550, the photosensitive resistor 21 can be a model number of 5516, the analog comparator 22 can be a model number of LM393, and the diode 28 can be a model number of 1N4007. As shown in FIG. 2, when the real-time illumination intensity in the environment is less than the preset illumination intensity, the resistance value of the photosensitive resistor 21 increases (tends to 1MΩ), so that the potential of the third end (i.e., the positive phase end) of the analog comparator 22 is higher than that of the second end (i.e., the reverse end), the analog comparator 22 outputs a high level, the transistor 23 is not turned on, the coil of the relay 24 does not work, the normally closed contact connected to the interlocking circuit 4 is maintained closed, the interlocking circuit 4 remains in the pass state, and the equipment normally works. As shown in FIG. 3, when the real-time illumination intensity in the environment is greater than the preset illumination intensity, the resistance value of the photosensitive resistor 21 decreases (about 5KΩ-10KΩ), so that the potential of the second end (i.e., the reverse end) of the analog comparator 22 is higher than that of the third end (i.e., the positive phase end), the analog comparator 22 outputs a low level, the transistor 23 is turned on, the coil of the relay 24 works, the normally closed contact connected to the interlocking circuit 4 is maintained open, the interlocking circuit 4 forms an open circuit state, the equipment suspends work and generates an alarm signal. As an optional embodiment, the logic judging circuit 20 further comprises a diode 28 and a plurality of fixed resistors 27; the diode 28 is connected in parallel with the relay 24, to prevent the transistor 23 from being damaged by a reverse voltage generated after the coil of the relay 24 is powered off; the resistance values of the plurality of fixed resistors 27 are indefinite, and a person skilled in the art can configure the number, connection relationship and resistance values of the fixed resistors 27 according to actual conditions, and the embodiment does not limit this. Figure 4 Figure 5
[0054] As an optional embodiment, the second end of the analog comparator 22 is also connected with an adjustable resistor 26, which is used to set the resistance value corresponding to the preset illuminance. Those skilled in the art can understand that the resistance value of the adjustable resistor 26 can be artificially adjusted to meet the needs of the circuit, and the common adjustable resistor 26 mainly changes the resistance value by changing the length of the resistor connected to the circuit. In this embodiment, the operator can set the resistance value corresponding to the preset illuminance by adjusting the resistance value of the adjustable resistor 26 to form the on and off conditions of the trigger circuit. The operator can adjust the resistance value of the adjustable resistor 26 based on the previous test and the actual production results.
[0055] In another optional embodiment, please refer to Figure 2 , the detection unit 1 includes a sensor 10; the sensor 10 is in communication connection with the logic judgment unit 2, and the sensor 10 is used to generate an illuminance signal based on the light in the internal of the machine 6 and transmit it to the logic judgment unit 2. Further, the logic judgment unit 2 includes a communication device 3; the communication device 3 is in communication connection with the control end 5 of the machine 6, and the communication device 3 is used to compare the size of the real-time illuminance and the preset illuminance, and generate a pause production signal when the real-time illuminance is greater than the preset illuminance, and transmit it to the control end 5 of the machine 6. It should be noted that in Figure 2 the exemplary embodiment shown, the sensor 10 is an illuminance sensor, and the communication device 3 is a server 31 which is built-in with a FDC (Failure Date Collection) system, a CIM (Computer Integrated Manufacturing) system or an EAP (Equipment Automation Program) system. In this embodiment, the illuminance signal measured by the illuminance sensor is transmitted to the FDC system of the server 31, and the FDC system compares the size of the real-time illuminance and the preset illuminance in real time, and sends a pause processing signal to the control end 5 of the machine 6 through the CIM system / EAP system when the real-time illuminance is greater than the preset illuminance, thereby realizing long-term monitoring of the illuminance of the internal environment of the machine 6.
[0056] As an optional embodiment, please continue to refer to Figure 2 , the logic judgment unit 2 also includes a translator 30; the translator 30 is in communication connection with the communication device 3, and the translator 30 is used to convert the illuminance signal measured by the sensor 10 into an illuminance value and transmit it to the communication device 3. Those skilled in the art can understand that the translator 30 can convert the illuminance signal measured by the sensor 10 into a specific coding format and upload it to the FDC system, thereby realizing data storage and comparison.
[0057] In another embodiment, the utility model also provides a semiconductor manufacturing equipment, include: machine table 6, process tray (not shown in the drawing) and the light detection module as described above, process tray is arranged in the inside of machine table 6, and detection unit 1 is arranged close to process tray, to carry out detection to the light intensity of the inside of machine table 6, and when real-time light intensity is greater than preset light intensity, the production of machine table 6 is suspended. Further, machine table 6 includes: wet equipment, metal polishing equipment. It needs to be explained that, in actual production process, wet equipment and metal polishing equipment can satisfy three elements of PACC phenomenon, therefore, the above-mentioned light detection module should be preferably arranged in wet equipment and metal polishing equipment to reduce the probability of PACC phenomenon. Of course, the above-mentioned light detection module can also be used in other light illumination areas and equipment that can affect normal production, and the embodiment does not limit this. By using the above-mentioned light detection module, the probability of PACC phenomenon of wafer in processing due to the energy provided by light illumination is reduced, thereby improving product yield; at the same time, the scrap rate of product is reduced, so that the production cost can be controlled.
[0058] In summary, in the light detection module and the semiconductor manufacturing equipment provided by the embodiment of the utility model, the light detection module includes: a detection unit and a logic judgment unit; the detection unit is arranged close to a process tray for carrying a wafer, for detecting the light intensity in the machine table; the logic judgment unit is in communication connection with the detection unit; the logic judgment unit is configured to: compare the size of the real-time light intensity measured by the detection unit and the preset light intensity, when the real-time light intensity is greater than the preset light intensity, generate a production suspension signal and transmit it to the control end of the machine table to suspend the current production process.
[0059] In this way, by adding a detection unit close to the process tray to obtain the light intensity in the machine table, and sending a processing suspension signal when the real-time light intensity is greater than the preset light intensity to stop the processing of the machine table, the probability of PACC phenomenon of wafer in processing due to the energy provided by light illumination is reduced, thereby improving product yield.
[0060] The above description is only a description of the preferred embodiment of the utility model, and does not limit the scope of the utility model, any change or modification made by the person skilled in the art according to the above disclosure is within the protection scope of the claims.
Claims
1. An illumination detection module, comprising: The application relates to a photometric device for a machine tool for processing wafers, which comprises a detection unit and a logic judgment unit. The detection unit is arranged close to a process disc for carrying wafers and is used for detecting the light intensity inside the machine tool. The logic judgment unit is in communication connection with the detection unit. The logic judgment unit is configured to compare the real-time light intensity measured by the detection unit with a preset light intensity, generate a production suspension signal when the real-time light intensity is greater than the preset light intensity, and transmit the production suspension signal to the control end of the machine tool to suspend the current production process.
2. The illumination detection module of claim 1, wherein, The logic judgment unit comprises a logic judgment circuit. The logic judgment circuit is connected to the control end of the machine tool through an interlocking loop. The detection unit comprises a photosensitive resistor. The photosensitive resistor is connected to the logic judgment circuit.
3. The illumination detection module of claim 2, wherein, The resistance value of the photosensitive resistor decreases with the increase of the real-time light intensity. The logic judgment circuit comprises a relay and a switch.
4. The illumination detection module of claim 3, wherein, The relay is connected to the interlocking loop through the switch. The photosensitive resistor changes the resistance value based on the change of the real-time light intensity and drives the switch to turn on or turn off the interlocking loop through the relay. When the real-time light intensity is less than the preset light intensity, the relay does not work, the switch keeps connected to the interlocking loop, and the machine tool works normally. When the real-time light intensity is greater than the preset light intensity, the relay works, the switch disconnects from the interlocking loop, the machine tool suspends production and generates an alarm signal. The logic judgment circuit further comprises a transistor and an analog comparator.
5. The illumination detection module of claim 4, wherein the light source is a light emitting diode. The first end of the transistor is connected to a power supply, the second end of the transistor is connected to the relay, and the control end of the transistor is connected to the first end of the analog comparator.
6. The illumination detection module of claim 1, wherein, The second end of the analog comparator is connected to the photosensitive resistor, and the third end of the analog comparator is connected to a fixed resistor.
7. The illumination detection module of claim 6, wherein the light source is a light emitting diode. When the real-time light intensity is less than the preset light intensity, the analog comparator outputs a high level, the transistor is turned off, and the relay does not work. When the real-time light intensity is greater than the preset light intensity, the analog comparator outputs a low level, the transistor is turned on, and the relay works.
8. The illumination detection module of claim 7, wherein, The second end of the analog comparator is also connected to an adjustable resistor. The adjustable resistor is used for setting the resistance value corresponding to the preset light intensity.
9. A semiconductor manufacturing apparatus, characterized by comprising: The detection unit comprises a sensor. The sensor is in communication connection with the logic judgment unit. The sensor is used for generating a light intensity signal based on the light inside the machine tool and transmitting the light intensity signal to the logic judgment unit. The logic judgment unit comprises a communication device. The communication device is in communication connection with the control end of the machine tool. The communication device is used for comparing the real-time light intensity with the preset light intensity, generating the production suspension signal when the real-time light intensity is greater than the preset light intensity, and transmitting the production suspension signal to the control end of the machine tool. The logic judgment unit further comprises a translator. The translator is in communication connection with the communication device. The translator is used for converting the light intensity signal measured by the sensor into a light intensity value and transmitting the light intensity value to the communication device. The application further discloses a photometric device for a machine tool for processing wafers. A machine table, a process tray and a light detection module as claimed in any one of claims 1-8; The process tray is arranged in the interior of the machine table and is used to carry a wafer, and the detection unit is arranged close to the process tray to detect the light intensity in the interior of the machine table and to suspend the production of the machine table when the real-time light intensity is greater than the preset light intensity.
10. The semiconductor manufacturing apparatus according to Claim 9, wherein The machine table comprises a wet processing device and a metal polishing device.