Chip dismounting and mounting equipment

Abstract

The utility model relates to the technical field of chip disassembly and assembly, in particular to chip disassembly and assembly equipment which comprises a metal block, a lifting module, a heater, an air pump and a cooling fan. And the metal block gradually transmits heat to the soldering tin on the chip, so that the soldering tin is melted, and on the premise of reducing the damage to the chip, the metal block with better heat conductivity transmits the heat to the soldering tin below the chip, so that the soldering tin is heated. And compared with cavity heat conduction in the prior art, the heat conduction efficiency is better, so that the disassembly efficiency of the chip is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip dismounting technical field, specifically related to a chip dismounting equipment. BACKGROUND

[0002] Chip refers to the etching, wiring, made on semiconductor sheet, can realize certain function's semiconductor device. Chip is usually welded on the packaging substrate. And the welding height of chip needs to be measured when welding chip on the packaging substrate, the welding height of chip refers to the soldering thickness between chip and packaging substrate, and the welding height of chip directly affects the stability of chip and packaging substrate welding. If the welding height of chip does not meet the requirements, chip needs to be dismounted from the packaging substrate and reassembled.

[0003] As the Chinese invention patent with the publication number CN219577429U discloses a kind of integrated circuit chip assembly, welding and dismounting repair device shown in, usually by spray head heated air flow is sprayed to chip, so that the soldering of chip bottom melts, then by suction head chip is adsorbed to separate from packaging substrate. Figure 3 As shown in it, to reduce the damage to chip, when the soldering of chip bottom is heated, spray head and chip do not directly contact, and there is also cavity between spray head and chip, heat conduction is affected, and the dismounting efficiency of chip is reduced. UTILITY MODEL CONTENT

[0004] The utility model solves the technical scheme that the technical problem thereof adopts: provide a kind of chip dismounting equipment, including:

[0005] Metal block, the metal block is equipped with suction hole one;

[0006] Lifting module, the lifting module is used to control the metal block lifting and contacting chip;

[0007] Heater, the heater is used to heat the metal block;

[0008] Air pump, the air pump is communicated with the suction hole one, and the air pump controls the suction of the outlet of the suction hole one and generates the suction force of chip;

[0009] Radiating fan, the radiating fan is arranged on one side of the metal block, and the radiating fan is arranged towards the metal block.

[0010] Further, the metal block is also equipped with negative pressure loop cavity, and the negative pressure loop cavity and the suction hole one are interconnected.

[0011] Further, the metal block is also equipped with a plurality of suction holes two, and a plurality of the suction holes two are interconnected with the air pump, and a plurality of the suction holes two are interconnected with the negative pressure loop cavity.

[0012] Furthermore, several of the adsorption pores II are distributed circumferentially around the adsorption pore I.

[0013] Furthermore, the chip disassembly and assembly equipment also includes a support block for supporting the metal block. The support block has a communication hole that communicates with the air pump, and the communication hole and the adsorption hole are interconnected.

[0014] Furthermore, the chip assembly / disassembly device also includes a mounting block for supporting the heater, the mounting block having a second connecting hole that communicates with the first connecting hole.

[0015] Furthermore, the metal block is also provided with a third connecting hole that is connected to the first connecting hole, and the third connecting hole and the first adsorption hole are interconnected.

[0016] Furthermore, the connecting hole two, the connecting hole one, and the connecting hole three are connected in sequence, and the diameters of the connecting hole two, the connecting hole one, and the connecting hole three are successively reduced.

[0017] Furthermore, the second connecting hole, the first connecting hole, and the third connecting hole are coaxially arranged.

[0018] Furthermore, the third connecting hole is provided with a connecting groove corresponding to the second adsorption hole.

[0019] The beneficial effects of this utility model are: it provides a chip disassembly and assembly device, including a metal block, a lifting module, a heater, an air pump, and a cooling fan. In this utility model, the lifting module controls the metal block to contact the chip, and the heater first heats the metal block. The metal block then gradually transfers the heat to the solder on the chip, causing the solder to melt. While reducing damage to the chip, the metal block with good thermal conductivity transfers heat to the solder below the chip to heat the solder. Compared with the cavity heat conduction in the prior art, the heat conduction efficiency is better, thereby improving the chip disassembly efficiency. Attached Figure Description

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] In the picture: Figure 1 This is an overall structural diagram of a chip disassembly and assembly device provided in Embodiment 1 of this utility model;

[0022] Figure 2 for Figure 1 A three-dimensional structural diagram of part of the structure shown;

[0023] Figure 3 for Figure 2 The diagram shows the three-dimensional structure of the structure hidden behind the cover.

[0024] Figure 4 for Figure 3 a sectional view of the structure shown in figure 1;

[0025] Figure 5 for a part structure diagram of a chip dismounting equipment provided in embodiment two of the utility model;

[0026] Figure 6 for Figure 5 a perspective view of the metal block shown in figure 2;

[0027] Figure 7 for Figure 5 a sectional view of the structure shown in figure 3.

[0028] Mark explanation: 100, chip dismounting equipment; 10, rack; 20, metal block; 21, adsorption hole one; 22, negative pressure loop cavity; 221, first cavity; 222, second cavity; 23, communication hole three; 231, communication groove; 24, adsorption hole two; 30, lifting module; 40, heater; 50, cooling fan; 60, mounting frame; 61, bearing block; 611, communication hole one; 612, air hole; 62, mounting block; 621, communication hole two; 622, air guide groove; 63, cover; 632, heat dissipation groove; 633, mounting groove; 70, stage; 81, first rotating handle; 82, first threaded rod; 83, first sliding rail; 84, first frame body; 91, second rotating handle; 92, second threaded rod; 93, second sliding rail; 200, packaging substrate; 201, chip. DETAILED DESCRIPTION

[0029] In order to make the technical problems, technical schemes and beneficial effects to be solved by the utility model more clear, now combining with the drawings, the utility model is explained in detail. This figure is a simplified schematic diagram, and only the basic of the utility model is schematically shown, therefore it only shows the structure related to the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without making creative efforts belong to the scope of protection of the utility model.

[0030] Embodiment one

[0031] Please refer to Figures 1-4 , provide a kind of chip dismounting equipment, including rack 10, metal block 20, lifting module 30, heater 40, air pump and cooling fan 50, and for bearing metal block 20, heater 40, air pump and cooling fan 50 Installation frame 60 and for placing packaging substrate 200 and chip 201 Stage 70. In this embodiment, metal block 20 is made of copper or aluminum and other good metal material with thermal conductivity.

[0032] The bottom of the metal block 20 is provided with an adsorption hole 21 and a negative pressure circuit cavity 22, and the negative pressure circuit cavity 22 and the adsorption hole 21 are in communication with each other. Specifically, the negative pressure circuit cavity 22 includes a first cavity 221 in the shape of a cross and a second cavity 222 in the shape of a mouth, and the first cavity 221 is located inside the first cavity 221, and the four ends of the first cavity 221 and the four corners of the second cavity 222 are correspondingly connected. The adsorption hole 21 is located at the center of the first cavity 221. The arrangement of the negative pressure circuit cavity 22 can increase the adsorption area, thereby improving the adsorption force of the metal block 20 on the chip 201.

[0033] Further, the chip dismounting equipment 100 further includes a bearing block 61 for bearing the metal block 20 and a mounting block 62 for bearing the heater 40, and a cover 63 arranged on the side of the bearing block 61, the mounting block 62 and the metal block 20, the bearing block 61 is fixedly connected to the top end of the metal block 20, the mounting block 62 is fixedly connected to the top end of the bearing block 61, and the mounting block 62 and the mounting rack 60 are fixedly connected, and the cover 63 and the mounting rack 60 are fixedly connected.

[0034] Optionally, in the embodiment, the type of the air pump is selected as a vacuum pump. The air pump can be arranged on the bearing block 61 or the cover 63, and the air pump is not shown in the figure.

[0035] The middle part of the bearing block 61 is provided with a communication hole 611 in communication with the air pump, and the side wall of the bearing block 61 is provided with a ventilation hole 612 in communication with the communication hole 611, and the air outlet and the air inlet of the air pump are in communication with the ventilation hole 612. The metal block 20 is further provided with a communication hole 23 in communication with the communication hole 611, and the mounting block 62 is provided with a communication hole 621 in communication with the communication hole 611. The communication hole 621, the communication hole 611 and the communication hole 23 are in sequence. When the metal block 20 adsorbs the chip 201, the communication hole 621, the communication hole 611 and the communication hole 23, and the end surface of the chip 201 form a closed space, the air inlet of the air pump sucks the air in the closed space through the ventilation hole 612, so that a negative pressure is formed in the closed space, thereby controlling the outlet of the adsorption hole 21 to generate the suction force for adsorbing the chip 201.

[0036] Further, the communication hole two 621, the communication hole one 611 and the communication hole three 23 are coaxially arranged, and the aperture of the communication hole two 621, the communication hole one 611 and the communication hole three 23 is sequentially reduced along the height direction of the rack 10, the aperture of the air inlet hole one is smaller than the aperture of the communication hole three 23, the arrangement of the communication hole three 23 prolongs the length of the gas flow path in the closed space, so that when the air pump inhales, the air flow rate gradually increases along the order of the communication hole two 621, the communication hole one 611 and the communication hole three 23, the rate of change of the air flow rate is reduced, thereby reducing the damage to the chip 201 caused by the fact that the suction force to the chip 201 becomes too large due to the too fast change of the air flow rate.

[0037] The side wall of the cover 63 is provided with a circular hole (not shown in the figure) in communication with the air outlet of the cooling fan 50, and a plurality of cooling slots 632, and the bottom end of the cover 63 is provided with a mounting slot 633 for exposing the metal block 20, and the size of the mounting slot 633 is larger than that of the metal block 20. The cooling fan 50 is arranged on the cover 63, and the cooling fan 50 is arranged on one side of the metal block 20, and the cooling fan 50 is arranged towards the metal block 20. Specifically, in the embodiment, the cooling fan 50 is a prior art, and the specific structure is not described in detail. The cooling fan 50 is provided with two, and the two cooling fans 50 are symmetrically arranged about the center axis of the cover 63.

[0038] Optionally, the mounting block 62 is also provided with a plurality of air guide grooves 622, and the ends of the air guide grooves 622 are respectively opposite to the air outlets of the two cooling fans 50. The arrangement of the air guide grooves 622 can guide the gas in the cover 63, facilitating the flow of the gas.

[0039] The lifting module 30 is used to control the lifting of the metal block 20 to contact the chip 201, and the lifting module 30 is fixedly arranged on the rack 10, and the output end of the lifting module 30 is fixedly connected with the mounting frame 60. Specifically, in the embodiment, the lifting module 30 is a screw transmission structure in the prior art.

[0040] The heater 40 is used to heat the metal block 20. Specifically, in the embodiment, the heater 40 includes an electric heating rod and a control module for controlling the heating temperature of the electric heating rod. The electric heating rod is arranged in the bearing block 61. Only the connection part of the electric heating rod and the control module is shown in the figure, and the control module is not shown in the figure.

[0041] Optionally, in the embodiment, the chip dismounting device 100 further comprises a first moving assembly and a second moving assembly, which are arranged along the length direction of the rack 10 and the width direction of the rack 10 respectively. The first moving assembly comprises a first rotating handle 81, a first threaded rod 82 coaxially fixed with the first rotating handle 81, a first sliding rail 83 arranged on the rack 10, and a first frame body 84 slidingly arranged on the first sliding rail 83. The second moving assembly comprises a second rotating handle 91, a second threaded rod 92 coaxially fixed with the second rotating handle 91, and a second sliding rail 93 arranged on the first frame body 84. The first frame body 84 and the carrier 70 are respectively provided with protrusions (not numbered in the figure) matched with the first sliding rail 83 and the second sliding rail 93.

[0042] The first threaded rod 82 is threadedly connected with the first frame body 84, and the second threaded rod 92 is threadedly connected with the carrier 70. The first sliding rail 83 is arranged along the length direction of the rack 10, and the second sliding rail 93 is arranged along the width direction of the rack 10. The first rotating handle 81 controls the rotation of the first threaded rod 82 to move the carrier 70 along the length direction of the rack 10, and the second rotating handle 91 controls the rotation of the second threaded rod 92 to move the carrier 70 along the width direction of the rack 10. The two are matched with each other, so that the carrier 70 drives the chip 201 to be dismounted to a position opposite to the metal block 20, thereby facilitating the dismounting of the chip 201.

[0043] Embodiment two

[0044] Please refer to Figures 5-7 The difference between the embodiment and embodiment one is that the metal block 20 is further provided with a plurality of adsorption holes two 24, the plurality of adsorption holes two 24 are in communication with the air pump and the negative pressure return cavity 22. Further, the plurality of adsorption holes two 24 are distributed around the circumferential side of the adsorption hole one 21. Specifically, in the embodiment, the adsorption hole two 24 is provided with four, and the four adsorption holes two 24 are arranged in the four branches of the first cavity 221.

[0045] Further, in the embodiment, the end of the communication hole three 23 is provided with a communication groove 231 corresponding to the adsorption hole two 24. The communication groove 231 is provided with four, corresponding to the four adsorption holes two 24, and the four communication grooves 231 are located at the top end of the metal block 20.

[0046] The arrangement of the four adsorption holes two 24 and the four communication grooves 231 increases the adsorption points of the metal block 20 to the chip 201, further increases the adsorption force of the metal block 20 to the chip 201, and thereby improves the stability of the adsorption of the metal block 20 to the chip 201.

[0047] The working process of the chip dismounting equipment 100 described in the above embodiment is as follows: first, the first moving assembly and the second moving assembly are matched to make the chip 201 to be dismounted on the packaging substrate 200 located directly below the metal block 20, then the lifting module 30 is controlled to lower the mounting frame 60 to the bottom surface of the metal block 20 to be in contact with the chip 201, the heater 40 is started to heat the metal block 20 and gradually transfer the heat to the solder on the chip 201 to make the solder melt. After the solder melts, the air pump is started to suck air to generate negative pressure in the sealed space between the chip 201 and the metal block 20, and the metal block 20 sucks the chip 201. The lifting module 30 controls the metal block 20 to ascend and descend to make the height of the solder at the bottom end of the chip 201 meet the requirements, then the heater 40 is turned off, and the cooling fan 50 is turned on to cool the solder, and after the solder solidifies, the air pump is released to control the metal block 20 to release the adsorption of the chip 201.

Claims

1. A chip mounting and demounting apparatus characterized by comprising: The chip dismounting device comprises: a metal block, which is provided with an adsorption hole one; a lifting module, which is used for controlling the lifting of the metal block to contact with a chip; a heater, which is used for heating the metal block; a gas pump, which is communicated with the adsorption hole one, and controls the suction force of the outlet of the adsorption hole one to adsorb the chip; a heat dissipation fan, which is arranged on one side of the metal block and faces the metal block.

2. The chip mounting and demounting apparatus according to claim 1, characterized by: The metal block is further provided with a negative pressure loop cavity, which is communicated with the adsorption hole one.

3. The chip mounting and demounting apparatus according to claim 2, characterized by: The chip dismounting device further comprises a bearing block for bearing the metal block, which is provided with a communication hole one communicated with the gas pump, and the communication hole one is communicated with the adsorption hole one.

4. The chip mounting and demounting apparatus according to claim 3, wherein: The chip dismounting device further comprises a mounting block for bearing the heater, which is provided with a communication hole two communicated with the communication hole one.

5. The chip mounting and demounting apparatus according to claim 4, characterized by: The metal block is further provided with a communication hole three communicated with the communication hole one, and the communication hole three is communicated with the adsorption hole one.

6. The chip mounting and demounting apparatus according to claim 5, wherein: The communication hole two, the communication hole one and the communication hole three are communicated in sequence, and the diameters of the communication hole two, the communication hole one and the communication hole three are reduced in sequence.

7. The chip mount / demount apparatus according to claim 6, characterized by: The communication hole two, the communication hole one and the communication hole three are coaxially arranged.

8. The chip mounting and demounting apparatus according to claim 7, characterized by: The metal block is further provided with a plurality of adsorption holes two, and the plurality of adsorption holes two are communicated with the gas pump.

9. The chip mount / demount apparatus according to claim 8, characterized by: The plurality of adsorption holes two are distributed around the circumferential side of the adsorption hole one.

10. The chip mounting and demounting apparatus according to claim 9, wherein: The communication hole three is provided with a communication groove corresponding to the adsorption hole two.

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