Circulating device for transporting silicon wafers and production system

Abstract

The utility model provides a circulating device for silicon wafer transportation and a production system, and relates to the technical field of semiconductors, and the circulating device for silicon wafer transportation comprises a feeding conveying device and a discharging conveying device which are vertically arranged, and is used for horizontally conveying a silicon wafer placing rack. The lifting device is composed of a transfer frame and a lifting module, and the transfer frame can vertically move to be aligned with the feeding conveying device and the discharging conveying device and is provided with a space for containing the silicon wafer containing frame. A first fixing structure and a second fixing structure are arranged on the transfer frame, the first fixing structure is used for vertically fixing the top of the silicon wafer placing frame, the second fixing structure is used for horizontally fixing the bottom of the silicon wafer placing frame, and the definite direction of the second fixing structure is opposite to the taking direction of the silicon wafer. According to the technical scheme, the silicon wafer placing frame can be fixed in the vertical direction and the horizontal direction, the stability of the silicon wafer placing frame in the transportation process and the wafer taking process is ensured, and damage to silicon wafers is avoided.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of semiconductor technology, and in particular, to a circulating device for wafer transportation and a production system. BACKGROUND

[0002] In the production process of photovoltaic wafers, the manufacture of high-efficiency solar cell wafers requires a series of fine processing steps. In this process, the wafers need to be transferred between different processes. In order to ensure the safety and integrity of the wafers during transportation, flower baskets are widely used to carry the wafers to prevent them from being damaged during transfer.

[0003] The existing patent CN211719568U provides a silk screen feeding and discharging device. By placing the flower basket containing the wafers on the flower basket conveying belt, the flower basket is driven by the feeding motor to approach the lifting mechanism. The lifting module moves the lifting plate, so that the bottom plate is connected with the flower basket conveying belt. The flower basket moves to the second transmission belt on the bottom plate. The wafer taking mechanism takes out the wafers from the flower basket in the lifting mechanism one by one and transmits them to the wafer taking guide mechanism. Finally, the wafers are transmitted to the rear silk screen machine through the conveying mechanism, completing the automatic feeding of the wafers from the flower basket one by one, greatly improving the work efficiency. However, the fixing of the flower basket in this scheme is through the clamping cylinder to control the movement of the moving block to clamp the flower basket on the side. This causes the wafer taking mechanism to shake during wafer taking, resulting in wafer damage.

[0004] Therefore, there is a need for a circulating device for wafer transportation to at least solve the above problems. CONTENT OF THE INVENTION

[0005] One of the technical problems to be solved by the present disclosure is how to solve the problem of wafer damage caused by unstable fixing and shaking of the flower basket during wafer taking by the wafer taking mechanism.

[0006] To solve the above technical problems, the embodiment of the present disclosure provides a circulating device for silicon wafer transportation, which comprises: an inlet conveying device and an outlet conveying device, the inlet conveying device and the outlet conveying device are arranged along a vertical direction and are respectively used for conveying a silicon wafer placing rack along a horizontal direction; and a lifting device, the lifting device comprises a transfer rack and a lifting module arranged along the vertical direction, the transfer rack is arranged on the lifting module, the transfer rack can reciprocate along the vertical direction on the lifting module to be connected to the inlet conveying device and the outlet conveying device, the transfer rack has a containing space for receiving and conveying the silicon wafer placing rack, and the silicon wafer placing rack can be emptied of silicon wafers by a wafer taking device on the transfer rack; wherein the transfer rack is provided with a first fixing structure and a second fixing structure, the first fixing structure is located above the second fixing structure along the vertical direction, a first fixing end of the first fixing structure can extend into the containing space along the vertical direction to abut against a top of the silicon wafer placing rack, and a second fixing end of the second fixing structure can extend into the containing space along a first direction to abut against a bottom of the silicon wafer placing rack, the first direction is parallel to the horizontal direction and opposite to a wafer taking direction of the wafer taking device.

[0007] In some embodiments, the first fixing structure comprises a first driving device connected with the first fixing end, the first driving device is used for driving the first fixing end to repeatedly move along the vertical direction to abut against or release the top of the silicon wafer placing rack; and the second fixing structure comprises a second driving device connected with the second fixing end, the second driving device is used for driving the second fixing end to repeatedly move along the first direction to abut against or release the bottom of the silicon wafer placing rack.

[0008] In some embodiments, the lifting module comprises a third driving device and a slide rail arranged along the vertical direction, the transfer rack is arranged on the slide rail, and the third driving device is used for driving the transfer rack to reciprocate along the vertical direction on the slide rail; a counting program is arranged in the third driving device, and the counting program can control a moving distance of the transfer rack according to a wafer taking operation of the wafer taking device.

[0009] In some embodiments, the inlet conveying device and the outlet conveying device are arranged on the same side of the lifting device, the outlet conveying device is arranged below the inlet conveying device along the vertical direction, and an effective conveying length of the outlet conveying device is greater than an overall length of the inlet conveying device.

[0010] In some embodiments, the circulating device for silicon wafer transportation further comprises: an external conveying device, the external conveying device is arranged at an output end of the outlet conveying device along the horizontal direction and is used for receiving the silicon wafer placing rack output by the outlet conveying device; and a conveying plane of the external conveying device and a conveying plane of the outlet conveying device are located on the same horizontal plane.

[0011] In some embodiments, the second fixing end comprises a pair of positioning wheels arranged opposite in the second direction, and the pair of positioning wheels can be driven to move in the first direction by the second driving device to be clamped with the pair of groove structures at the bottom of the wafer placing rack; the second direction is parallel to the horizontal direction and perpendicular to the first direction.

[0012] In some embodiments, the bottom of the transfer rack in the accommodating space is provided with a receiving mechanism, and the receiving mechanism comprises a conveying belt and a fourth driving device, and the fourth driving device can drive the conveying belt to move in the same direction as the transmission direction of the infeed conveying device or the outfeed conveying device.

[0013] In some embodiments, the transfer rack is further provided with a limiting plate, and the limiting plate is arranged on the side of the receiving mechanism away from the infeed conveying device to block the transmission movement of the wafer placing rack on the conveying belt.

[0014] In some embodiments, the circulating device for wafer transportation further comprises a sensing device connected with the limiting plate, for sensing the contact state between the limiting plate and the wafer placing rack; and a control device in communication connection with the sensing device and the fourth driving device respectively, and the control device controls the start and stop of the fourth driving device according to the sensing signal of the sensing device.

[0015] The embodiments of the present disclosure also provide a production system comprising the above-mentioned circulating device for wafer transportation.

[0016] Through the above technical solutions, the circulating device for wafer transportation provided by the present disclosure can input the full wafer placing rack to the lifting device through the infeed conveying device, empty the full wafer placing rack in the lifting device by the wafer taking device, and then output the empty wafer placing rack by the outfeed conveying device, so that the wafer placing rack can be replaced without stopping, and the turnover efficiency of the wafer placing rack is improved. Through the first fixing structure and the second fixing structure, the wafer placing rack can be fixed in the vertical direction and the horizontal direction, so as to ensure the stability of the wafer placing rack during transportation and the wafer taking device during wafer taking, and avoid damage to the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor.

[0018] Figure 1 is a structural schematic diagram of the circulating device for wafer transportation disclosed by the embodiments of the present disclosure;

[0019] Figure 2 is a front view of a circulating device for wafer transportation disclosed by the embodiments of the present disclosure;

[0020] Figure 3 is a side view of the circulating device for wafer transportation disclosed by the embodiments of the present disclosure; Figure 2

[0021] Figure 4 is a top view of the circulating device for wafer transportation disclosed by the embodiments of the present disclosure; Figure 2

[0022] Figure 5 is a schematic view of a wafer placing rack on a lifting device disclosed by the embodiments of the present disclosure;

[0023] Figure 6 is a structural schematic view of a receiving mechanism in the circulating device for wafer transportation disclosed by the embodiments of the present disclosure.

[0024] Explanation of reference signs:

[0025] 1, inlet conveying device; 2, outlet conveying device; 3, lifting device; 301, transfer rack; 302, lifting module; 303, receiving mechanism; 304, conveying belt; 305, fourth driving device; 306, limiting plate; 307, supporting block; 4, first fixed structure; 401, first driving device; 402, first fixed end; 5, second fixed structure; 501, second driving device; 502, second fixed end; 6, external conveying device; 7, wafer placing rack; 8, baffle. DETAILED DESCRIPTION

[0026] The embodiments of the present disclosure are further described in detail below with reference to the accompanying drawings and embodiments. The detailed description and drawings of the following embodiments are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure, and the present disclosure can be implemented in many different forms, and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0027] The present disclosure provides these embodiments in order to make the present disclosure thorough and complete, and fully express the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specifically stated, the relative arrangement of components and steps, the composition of materials, numerical expressions and values set forth in these embodiments should be interpreted as merely exemplary, and not as a limitation.

[0028] ​​It should be noted that in the description of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is greater than or equal to two; The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer" and the like is only for the purpose of facilitating the description of the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation to the present disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0029] In addition, "first", "second" and similar words used in the present disclosure do not mean any order, number or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.

[0030] It should also be noted that in the description of the present disclosure, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; It can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances. When it is described that a specific device is located between the first device and the second device, there can be an intermediate device between the specific device and the first device or the second device, or there can be no intermediate device.

[0031] All terms used in the present disclosure have the same meaning as understood by those skilled in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or excessively formalized sense, unless specifically defined here.

[0032] Techniques, methods and equipment known to those skilled in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the specification.

[0033] The existing silicon wafer rack can be a frame structure composed of a top plate, a bottom plate and a pair of opposite side plates. The silicon wafer rack is provided with an area specially used for placing silicon wafers. On the two side plates of this area, a plurality of pairs of groove structures are uniformly distributed in the vertical direction. Each silicon wafer can be horizontally placed in these grooves, ensuring the stable storage of the silicon wafers.

[0034] In existing wire mesh loading and unloading devices, the silicon wafer placement rack is fixed by moving a clamping cylinder to clamp the silicon wafer placement rack on the side. This causes the silicon wafer placement rack to become unstable and vibrate during the wafer picking process, resulting in damage to the silicon wafer.

[0035] Example 1

[0036] To address the problems existing in the prior art, embodiments of this disclosure provide a recycling device for transporting silicon wafers, such as... Figures 1 to 6 As shown, the device includes: an infeed conveyor 1 and an outfeed conveyor 2, which are arranged vertically and used to transport silicon wafer placement racks 7 horizontally; and a lifting device 3, which includes a transfer frame 301 and a lifting module 302 arranged vertically. The transfer frame 301 is mounted on the lifting module 302 and can reciprocate vertically on the lifting module 302 to receive the infeed conveyor 1 and the outfeed conveyor 2. The transfer frame 301 has a receiving space for receiving and transporting the silicon wafer placement racks 7. The silicon wafer placement rack 7 can be emptied of silicon wafers by the wafer picking device on the transfer rack 301; wherein, the transfer rack 301 is provided with a first fixing structure 4 and a second fixing structure 5. The first fixing structure 4 is located above the second fixing structure 5 in the vertical direction. The first fixing end 402 of the first fixing structure 4 can extend into the receiving space in the vertical direction to abut against the top of the silicon wafer placement rack 7. The second fixing end 502 of the second fixing structure 5 can extend into the receiving space in the first direction to abut against the bottom of the silicon wafer placement rack 7. The first direction is parallel to the horizontal direction and opposite to the wafer picking direction of the wafer picking device.

[0037] The infeed conveyor 1 and the outfeed conveyor 2 are arranged vertically and are both used to transport the silicon wafer placement racks 7 horizontally. The infeed conveyor 1 transports the silicon wafer placement racks 7 containing silicon wafers to the position of the lifting device 3, while the outfeed conveyor 2 is responsible for sending out the empty silicon wafer placement racks 7 that have been processed on the lifting device 3. The lifting device 3 includes a transfer frame 301 and a lifting module 302. The transfer frame 301 is located on the lifting module 302 and can reciprocate vertically by being driven by the lifting module 302 to achieve docking with the infeed conveyor 1 and the outfeed conveyor 2. The transfer frame 301 is provided with a receiving space for receiving the silicon wafer placement racks 7 from the infeed conveyor 1 and keeping them stable during the lifting process.

[0038] The first fixing structure 4 and the second fixing structure 5 on the transfer frame 301 are respectively located at the upper and lower ends in the vertical direction. The first fixing end 402 of the first fixing structure 4 can extend downward into the accommodation space to abut against the top of the silicon wafer placing frame 7, so as to fix the silicon wafer placing frame 7 on the transfer frame 301 in the vertical direction. The second fixing end 502 of the second fixing structure 5 can extend horizontally into the accommodation space to abut against the bottom of the silicon wafer placing frame 7, so as to fix the silicon wafer placing frame 7 on the transfer frame 301 in the horizontal direction. The wafer taking device is located on one side of the transfer frame 301, and is used for emptying the silicon wafer placing frame 7. The second fixing end 502 of the second fixing structure 5 extends into the accommodation space in the direction opposite to the wafer taking direction of the wafer taking device, so as to ensure the stability of the silicon wafer placing frame 7 during wafer taking.

[0039] The full silicon wafer placing frame 7 is input to the lifting device 3 through the input conveying device 1, the full silicon wafer placing frame 7 is emptied by the wafer taking device, and the empty silicon wafer placing frame 7 is output by the output conveying device 2, so as to realize the non-stop replacement of the silicon wafer placing frame 7 and improve the turnover efficiency of the silicon wafer placing frame 7. Through the first fixing structure 4 and the second fixing structure 5, the silicon wafer placing frame 7 can be fixed in the vertical direction and the horizontal direction, so as to ensure the stability of the silicon wafer placing frame 7 during transportation and the wafer taking device during wafer taking, and avoid the damage of the silicon wafer.

[0040] In some embodiments, the input conveying device 1 and the output conveying device 2 can adopt an existing belt conveying device. The belt conveying device includes a driving roller and a driven roller. The driving roller is located at one end of the belt conveying device and is driven by a driving device through a shaft coupling or other transmission mechanism. The driven roller is located at the other end or the middle of the belt, and there can be multiple driven rollers according to the needs of the transmission line. The belt is wound around the driving roller and the driven roller to form a closed transmission loop. The tensioning device can be fixed or automatic tensioning, and is used for adjusting the belt tension. On both sides of the belt conveying device, a pair of opposite baffles 8 are arranged. The pair of baffles 8 are used for limiting the transverse displacement of the silicon wafer placing frame 7 during transmission, so as to ensure the stability and accuracy of the silicon wafer placing frame 7 during transmission.

[0041] In some embodiments, the first fixing structure 4 includes a first driving device 401 connected with the first fixing end 402, which is used for driving the first fixing end 402 to move repeatedly in the vertical direction to abut against or release the top of the silicon wafer placing frame 7. The second fixing structure 5 includes a second driving device 501 connected with the second fixing end 502, which is used for driving the second fixing end 502 to move repeatedly in the first direction to abut against or release the bottom of the silicon wafer placing frame 7.

[0042] The transfer frame 301 has a support surface for carrying the silicon wafer rack 7 and a back plate arranged in the vertical direction. The first fixing structure 4 comprises a first driving device 401 arranged at the top of the back plate, and the first driving device 401 is mechanically connected with a first fixed end 402. The first driving device 401 can be a motor, a pneumatic cylinder or other appropriate driving element, and the first fixed end 402 can be a plate body or a block structure. The first driving device 401 can be connected with the first fixed end 402 through a mechanical transmission mechanism such as a lead screw, a gear or a belt drive. When it is necessary to fix the silicon wafer rack 7, the first driving device 401 is activated to drive the first fixed end 402 to move downward in the vertical direction until the first fixed end 402 contacts the top plate of the silicon wafer rack 7 and exerts sufficient pressure, thereby fixing the silicon wafer rack 7 on the support surface of the transfer frame 301 and ensuring that the silicon wafer rack 7 will not tilt during lifting. When it is necessary to release the silicon wafer rack 7, the first driving device 401 is reversely operated to drive the first fixed end 402 to move upward in the vertical direction, thereby releasing the fixation on the top of the silicon wafer rack 7.

[0043] The second fixing structure 5 comprises a second driving device 501 mechanically connected with a second fixed end 502. The second fixed end 502 can be a plate body or a block structure, and the second driving device 501 can also be a motor, a pneumatic cylinder or the like, and is connected with the second fixed end 502 through an appropriate transmission mechanism. When it is necessary to fix the silicon wafer rack 7, the second driving device 501 is activated to drive the second fixed end 502 to move into the receiving space in a first direction (parallel to the horizontal direction and opposite to the wafer taking direction of the wafer taking device) until the second fixed end 502 contacts the bottom of the silicon wafer rack 7 and exerts sufficient pressure, thereby fixing the silicon wafer rack 7 with the back plate of the transfer frame 301. When it is necessary to release the silicon wafer rack 7, the second driving device 501 is reversely operated to drive the second fixed end 502 to move reversely in the first direction, thereby releasing the fixation on the bottom of the silicon wafer rack 7.

[0044] Through the precise control of the first driving device 401 and the second driving device 501, the silicon wafer rack 7 can be quickly and accurately fixed and released at the top and the bottom, thereby improving the automation degree and efficiency of the operation. Due to the precise control of the fixing structure, the collision and damage of the silicon wafer during transportation can be effectively avoided, thereby improving the safety of the entire system.

[0045] In some embodiments, the lifting module 302 comprises a third driving device and a slide rail arranged in the vertical direction, and the transfer frame 301 is arranged on the slide rail. The third driving device is used to drive the transfer frame 301 to reciprocate in the vertical direction on the slide rail. The third driving device is provided with a counting program, which can control the moving distance of the transfer frame 301 according to the wafer taking operation of the wafer taking device.

[0046] The lifting module 302 is composed of a third driving device and a slide rail, and the transfer frame 301 is installed on the slide rail. The third driving device can be a servo motor or a linear motor, which is connected to the transfer frame 301 through mechanical connection (such as screw, belt or gear) to provide power and drive the transfer frame 301 to reciprocate vertically on the slide rail.

[0047] The third driving device is internally integrated with a counting program, which can be an encoder, a PLC (programmable logic controller) or other forms of counting and control unit. It can monitor and record the movement distance of the transfer frame 301. When the wafer taking device performs wafer taking operation, the counting program will receive the corresponding signal or instruction, calculate and control the exact distance that the transfer frame 301 needs to move according to the operation requirements of the wafer taking device and the size of the wafer placing rack 7. When the wafer taking device starts to take the wafer from the wafer placing rack 7, the counting program in the third driving device will start. The counting program will calculate and control the distance that the transfer frame 301 moves upward or downward according to the preset parameters (such as the height difference of each wafer taking). In this way, it can ensure that the wafer placing rack 7 can accurately return to the position where the wafer taking device can continue to work after each wafer taking, without being too low or too high.

[0048] Through the cooperation of the third driving device and the slide rail, the accurate movement of the transfer frame 301 in the vertical direction is realized, and the stability and accuracy of the wafer placing rack 7 during transportation are improved. The counting program makes the movement distance of the transfer frame 301 automatically adjustable according to the operation of the wafer taking device, which improves the automation level and the flexibility of operation.

[0049] In some embodiments, the infeed conveying device 1 and the outfeed conveying device 2 are arranged on the same side of the lifting device 3, and the outfeed conveying device 2 is arranged below the infeed conveying device 1 in the vertical direction. The effective transmission length of the outfeed conveying device 2 is greater than the overall length of the infeed conveying device 1.

[0050] The infeed conveyor 1 and the outfeed conveyor 2 are located on the same side of the lifting device 3, and such a layout can enable the infeed and outfeed operations of the wafer holder 7 to be performed on the same work surface, thereby simplifying the structure and operation process of the device. The wafer holder 7 is first received by the infeed conveyor 1 and horizontally transmitted to the transfer rack 301 of the lifting device 3, and the transfer rack 301 is driven by the third driving device to ascend and abut against the infeed conveyor 1 to receive the wafer holder 7. The wafer holder 7 descends with the transfer rack 301, and the wafer taking device starts to empty the wafer holder 7. The empty wafer holder 7 continues to descend with the transfer rack 301 and abuts against the outfeed conveyor 2. The effective transmission length of the outfeed conveyor 2 is greater than the overall length of the infeed conveyor 1, and the outfeed conveyor 2 can provide more buffer space due to the greater effective transmission length, thereby avoiding the infeed conveyor 1 from blocking the outfeed conveyor 2 in the horizontal projection, so as to facilitate the processing and arrangement of the empty wafer holder 7.

[0051] In some embodiments, the circulating device for wafer transportation further comprises an external conveyor 6 arranged at the output end of the outfeed conveyor 2 in the horizontal direction to receive the wafer holder 7 output by the outfeed conveyor 2, and the transmission plane of the external conveyor 6 is located on the same horizontal plane as the transmission plane of the outfeed conveyor 2.

[0052] The external conveyor 6 can have the same structure as the outfeed conveyor 2, and the external conveyor 6 is arranged at the output end of the outfeed conveyor 2 in the horizontal direction. The transmission plane of the external conveyor 6 is located on the same horizontal plane as the transmission plane of the outfeed conveyor 2, which can ensure smooth transition of the wafer holder 7 and reduce shaking during the transition process. The external conveyor 6 is seamlessly connected to the outfeed conveyor 2, so that the empty wafer holder 7 can be smoothly transferred from the outfeed conveyor 2 to the external conveyor 6. The external conveyor 6 can be a conveyor belt, a roller conveying line or other suitable conveying system, which can continue to horizontally convey the wafer holder 7 to the next process link or storage location. The external conveyor 6 can further extend the transmission path to provide sufficient space for processing and arranging the empty wafer holder 7, thereby improving the processing capacity and efficiency of the entire system.

[0053] In some embodiments, the second fixed end 502 comprises a pair of positioning wheels arranged opposite to each other in the second direction, and the pair of positioning wheels can be driven by the second driving device 501 to move in the first direction and be clamped with a pair of groove structures at the bottom of the wafer holder 7. The second direction is parallel to the horizontal direction and satisfies the vertical condition with the first direction.

[0054] The second driving device 501, such as a cylinder or a motor, is connected to the positioning wheels through mechanical connection and can drive a pair of positioning wheels to move in the first direction (parallel to the horizontal direction and opposite to the wafer taking direction of the wafer taking device) so that they can enter or exit the groove structure at the bottom of the wafer holder 7, which can be a V-shaped structure. When it is necessary to fix the wafer holder 7, the second driving device 501 is activated to drive the positioning wheels to move inward in the first direction until the positioning wheels are clamped into the groove at the bottom of the wafer holder 7, thereby fixing the position of the wafer holder 7. When it is necessary to release the wafer holder 7, the second driving device 501 is reversely operated to drive the positioning wheels to move outward in the first direction and disengage from the groove at the bottom of the wafer holder 7, thereby allowing the wafer holder 7 to be taken out or moved to other positions.

[0055] By clamping the positioning wheels with the groove structure at the bottom of the wafer holder 7, the wafer holder 7 can be accurately positioned to ensure that it remains stable during transportation. The positioning wheels are oppositely arranged in the second direction and perpendicular to the first direction. Through multi-point positioning, the wafer holder 7 is more stable when fixed and is less likely to be damaged due to tilting or deviation.

[0056] In some embodiments, the bottom of the transfer rack 301 located in the accommodation space is provided with a receiving mechanism 303, which includes a conveying belt 304 and a fourth driving device 305. The fourth driving device 305 can drive the conveying belt 304 to move in the same direction as the transmission direction of the infeed conveying device 1 or the outfeed conveying device 2.

[0057] The bottom of the transfer rack 301 located in the accommodation space is provided with a receiving mechanism 303, which is composed of a conveying belt 304 and a fourth driving device 305. The fourth driving device 305, which can be a cylinder or a motor, is connected to the conveying belt 304 through mechanical connection and can provide power to drive the conveying belt 304 to move in a specific direction. When the transfer rack 301 needs to receive the wafer holder 7 from the infeed conveying device 1, the fourth driving device 305 is activated to drive the conveying belt 304 to move in the same direction as the transmission direction of the infeed conveying device 1. In this way, the wafer holder 7 can be smoothly transferred from the infeed conveying device 1 to the conveying belt 304 of the transfer rack 301. Similarly, when the transfer rack 301 needs to output the emptied wafer holder 7 to the outfeed conveying device 2, the fourth driving device 305 is again activated to drive the conveying belt 304 to move in the same direction as the transmission direction of the outfeed conveying device 2, ensuring that the wafer holder 7 can be smoothly transferred from the transfer rack 301 to the outfeed conveying device 2. By moving the conveying belt 304 in the same direction as the transmission direction of the infeed conveying device 1 or the outfeed conveying device 2, the moving speed of the wafer holder 7 can be increased, thereby improving the overall processing efficiency.

[0058] In some embodiments, the transfer frame 301 further comprises a limiting plate 306, which is arranged on the side of the receiving mechanism 303 away from the infeed conveyor 1, and is used to block the movement of the wafer holder 7 during the transmission of the conveyor belt 304.

[0059] The limiting plate 306 is located on the side of the receiving mechanism 303 away from the infeed conveyor 1, and is used to block the movement of the wafer holder 7 during the transmission of the conveyor belt 304, so as to ensure that the wafer holder 7 is accurately stopped in the accommodation space of the transfer frame 301. The limiting plate 306 is designed to be higher than the surface of the conveyor belt 304, so as to effectively intercept the wafer holder 7 and prevent it from sliding out of the conveyor belt 304 due to inertia or other factors during the conveying process. Through the precise blocking of the limiting plate 306, the wafer holder 7 can be accurately positioned in the accommodation space of the transfer frame 301. At the same time, the position of the limiting plate 306 is coordinated with a pair of positioning wheels, which can accurately embed into the groove structure at the bottom of the wafer holder 7 when the wafer holder 7 is blocked and stopped by the limiting plate 306, so as to further ensure the stability and accuracy of the wafer holder.

[0060] In some embodiments, the receiving mechanism 303 further comprises a support block 307, which can be a pair of support blocks 307 arranged opposite to each other on the two sides of the conveyor belt 304. One side of the pair of support blocks 307 facing the accommodation space forms a support surface, and the height of the support surface in the vertical direction is lower than the height of the conveying surface. The support block 307 is used to stably support the wafer holder 7 when the first fixing structure 4 fixes the wafer holder 7.

[0061] In some embodiments, the circulating device for wafer transportation further comprises a sensing device connected with the limiting plate 306, which is used to sense the contact state between the limiting plate 306 and the wafer holder 7; and a control device in communication connection with the sensing device and the fourth driving device 305, respectively, which controls the start and stop of the fourth driving device 305 according to the sensing signal of the sensing device.

[0062] The sensing device is connected with the limiting plate 306, and is used to sense the contact state between the limiting plate 306 and the wafer holder 7. The sensing device can be a proximity sensor, a photoelectric sensor or other types of sensors, which can send signals to indicate whether the limiting plate 306 is in contact with the wafer holder 7. When the wafer holder 7 is conveyed by the conveyor belt 304 to the vicinity of the limiting plate 306, the sensing device detects the contact between the wafer holder 7 and the limiting plate 306, and sends a signal to the control device.

[0063] The control device is in communication connection with the induction device and the fourth driving device 305 respectively. After the control device receives the induction signal, according to the preset program logic, the fourth driving device 305 is instructed to stop, so as to accurately control the stop of the conveying belt 304, and ensure the correct position of the silicon wafer placing rack 7 on the transfer rack 301. Through the linkage of the induction device and the control device, the automatic positioning of the silicon wafer placing rack 7 is realized, the need for manual intervention is reduced, and the degree of automation is improved.

[0064] In some embodiments, the control device can be electrically connected with the infeed conveying device 1, the outfeed conveying device 2, the lifting device 3, the first fixed structure 4 and the second fixed structure 5, to realize accurate control of them. The control device can send instructions to start or stop the operation of the above-mentioned devices, to ensure that the silicon wafer placing rack 7 moves and positions according to the preset program in the entire production process. Through the control of the control device, the entire silicon wafer processing process can be highly automated and accurate, reducing manual intervention and improving production efficiency and product consistency.

[0065] Embodiment 2

[0066] Embodiment 2 of the present disclosure provides a production system, including the circulating device for silicon wafer transportation provided in embodiment 1.

[0067] The production system includes the circulating device for silicon wafer transportation provided in embodiment 1, which can realize the automatic infeed, outfeed and emptying operation of the silicon wafer placing rack 7. In the production system, the circulating device is combined with other production links, such as the cleaning, detection, etching and deposition process steps of the silicon wafer, to form a complete silicon wafer processing process. The infeed conveying device 1 of the circulating device receives the silicon wafer placing rack 7 from the upstream process, and transports the silicon wafer placing rack 7 to the wafer taking device through the lifting device 3 and the transfer rack 301 for silicon wafer emptying. The emptied silicon wafer placing rack 7 is transported to the downstream process by the outfeed conveying device 2 of the circulating device, or returns to the infeed end of the circulating device to be reloaded with silicon wafers, to realize recycling. Through the circulating device, the production system realizes the automatic transportation of the silicon wafer in the entire production process, greatly improves the production efficiency, and the automatic transportation of the silicon wafer reduces the downtime in the production process, improves the continuity and throughput of the production line.

[0068] So far, the embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein according to the above description.

[0069] Although some specific embodiments of the present disclosure have been described in detail by way of examples, one skilled in the art should understand that the above examples are only for illustration, and are not intended to limit the scope of the present disclosure. One skilled in the art should understand that the above embodiments can be modified or equivalent replacements can be made to some technical features without departing from the scope and spirit of the present disclosure. In particular, the technical features mentioned in each embodiment can be combined in any manner as long as there is no structural conflict.

Claims

1. A circulation device for silicon wafer transportation, characterized by, The utility model relates to a kind of circulating device for wafer transport, including: Inlet conveying device (1) and outlet conveying device (2), the inlet conveying device (1) is arranged along vertical direction with the outlet conveying device (2), for transmitting silicon wafer rack (7) along horizontal direction respectively;And, Lifting device (3), the lifting device (3) includes transfer frame (301) and lifting module (302) arranged along vertical direction, the transfer frame (301) is arranged on the lifting module (302), the transfer frame (301) can reciprocate along vertical direction on the lifting module (302) to interface the inlet conveying device (1) and the outlet conveying device (2), the transfer frame (301) has accommodating space for receiving and conveying the silicon wafer rack (7), and the silicon wafer rack (7) can be emptied by wafer taking device on the transfer frame (301) silicon wafer; Wherein, the first fixed structure (4) is located above the second fixed structure (5) along the vertical direction, the first fixed end (402) of the first fixed structure (4) can be inserted into the accommodating space along the vertical direction to abut the top of the silicon wafer rack (7), the second fixed end (502) of the second fixed structure (5) can be inserted into the accommodating space along the first direction to abut the bottom of the silicon wafer rack (7), and the first direction is parallel to the horizontal direction and opposite to the wafer taking direction of the wafer taking device.

2. The circulating device for wafer transport according to claim 1, wherein The first fixed structure (4) includes first driving device (401), and the first driving device (401) is connected with the first fixed end (402) for driving the first fixed end (402) to reciprocate along the vertical direction to abut or release the top of the silicon wafer rack (7); The second fixed structure (5) includes second driving device (501), and the second driving device (501) is connected with the second fixed end (502) for driving the second fixed end (502) to reciprocate along the first direction to abut or release the bottom of the silicon wafer rack (7).

3. The circulating device for wafer transport according to claim 1, wherein The lifting module (302) includes third driving device and slide rail arranged along the vertical direction, and the transfer frame (301) is arranged on the slide rail, and the third driving device is used for driving the transfer frame (301) to reciprocate along the vertical direction on the slide rail.

4. The circulating device for wafer transport according to claim 1, wherein The inlet conveying device (1) and the outlet conveying device (2) are arranged on the same side of the lifting device (3), the outlet conveying device (2) is arranged below the inlet conveying device (1) along vertical direction, and the effective transmission length of the outlet conveying device (2) is greater than the overall length of the inlet conveying device (1).

5. The cycle apparatus for silicon wafer transportation according to claim 1, wherein Also include: An external conveying device (6) is arranged at the output end of the discharging conveying device (2) in the horizontal direction to receive the wafer rack (7) output by the discharging conveying device (2); The transmission plane of the external conveying device (6) and the transmission plane of the discharging conveying device (2) are in the same horizontal plane.

6. The circulating device for wafer transportation according to claim 2, wherein The second fixed end (502) comprises a pair of positioning wheels arranged opposite in the second direction, which can be driven by the second driving device (501) to move in the first direction and be clamped with a pair of groove structures on the bottom of the wafer rack (7); The second direction is parallel to the horizontal direction and perpendicular to the first direction.

7. The circulating device for wafer transportation according to claim 1, wherein The bottom of the transfer rack (301) is provided with a receiving mechanism (303), which comprises a conveying belt (304) and a fourth driving device (305), which can drive the conveying belt (304) to move in the same direction as the transmission direction of the feeding conveying device (1) or the discharging conveying device (2).

8. The circulating device for wafer transportation according to claim 7, wherein The transfer rack (301) is further provided with a limiting plate (306) arranged on the side of the receiving mechanism (303) away from the feeding conveying device (1) to block the transmission movement of the wafer rack (7) on the conveying belt (304).

9. The circulation device for silicon wafer transportation according to claim 8, wherein Further comprising: An induction device connected with the limiting plate (306) to sense the contact state between the limiting plate (306) and the wafer rack (7); A control device communicatively connected with the induction device and the fourth driving device (305), which controls the start and stop of the fourth driving device (305) according to the sensing signal of the induction device.

10. A production system characterized by, The circulating device for wafer transportation according to any one of claims 1 to 9.

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