Chip liquid cooling device
By designing separate liquid cooling channels and using thermal insulation structures in the chip liquid cooling device, the problems of heat transfer and heat crosstalk between different chips are solved, achieving more efficient temperature control and cooling effect.
Patent Information
- Application Number
- CN202422993452.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-05
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-12-05
AI Technical Summary
Existing liquid cooling devices for chips suffer from heat transfer and heat crosstalk issues when cooling multiple chips with different power levels, resulting in uneven temperatures that affect chip lifespan and cooling efficiency.
The design employs a substrate and a liquid cooling plate to form a separate first and second liquid cooling channel, through which fluids at different temperatures are introduced. Heat exchange is blocked by a thermal insulation structure to achieve thermal isolation of the chip.
It effectively reduces heat transfer and heat crosstalk between different chips, optimizes the cooling system, and improves cooling efficiency and temperature control accuracy.
Smart Images
Figure CN223527174U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to liquid cooling device technical field especially relates to a chip liquid cooling device. BACKGROUND
[0002] The inside of high-performance AI chip usually encapsulates multiple chips or multiple power areas, the power of each chip is different, the size is different, the heat flow density is different, the heat quantity is different, and the highest safe temperature that can be withstood is also different. The existing chip liquid cooling device adopts a same liquid cooling plate to cover and cool multiple power areas or multiple chips of the AI chip, due to the heat conduction characteristics of the liquid cooling plate itself, when the liquid cooling plate exchanges heat with different chips or power areas, heat transfer and heat winding are prone to occur between chips of different temperatures, leading to temperature rise of the chip with low power, exceeding the design specification, affecting the service life of the chip, and the chip with high power will have temperature reduction, and the temperature margin is large, and the working efficiency of the liquid cooling plate is low. SUMMARY
[0003] The utility model discloses a chip liquid cooling device, can pass into two different temperature fluids to the chip or power area of different positions radiate heat simultaneously, and can reduce heat transfer, heat winding problem, optimize the cooling system, improve the cooling efficiency.
[0004] To achieve this purpose, the utility model adopts the following technical scheme: a chip liquid cooling device, comprising a substrate, a liquid cooling plate and a connecting pipe assembly, the substrate is provided with a first liquid cooling area and a second liquid cooling area on one side; the liquid cooling plate is connected with the substrate, the liquid cooling plate is provided with a first chamber and a second chamber separated from each other, the first chamber forms a first opening on the bottom surface of the liquid cooling plate, the second chamber forms a second opening on the bottom surface of the liquid cooling plate, the first liquid cooling area corresponds to cover the first opening to form a first liquid cooling flow channel, the second liquid cooling area corresponds to cover the second opening to form a second liquid cooling flow channel; the connecting pipe assembly comprises a first water inlet pipe, a first water outlet pipe, a second water inlet pipe and a second water outlet pipe, the first water inlet pipe and the first water outlet pipe are communicated with the first liquid cooling flow channel respectively, the second water inlet pipe and the second water outlet pipe are communicated with the second liquid cooling flow channel respectively; wherein, the liquid cooling plate and the substrate are respectively provided with heat insulation structures, and the heat insulation structures are located between the first liquid cooling flow channel and the second liquid cooling flow channel.
[0005] As preferred, the liquid cooling plate comprises an upper plate body and a lower plate body located below the upper plate body, the upper plate body is provided with a first water inlet channel, a first water outlet channel, a second water inlet channel and a second water outlet channel, the first water inlet channel is communicated with the first water inlet pipe, the first water outlet channel is communicated with the first water outlet pipe, the second water inlet channel is communicated with the second water inlet pipe, and the second water outlet channel is communicated with the second water outlet pipe, the lower plate body is provided with a first water passing channel and a second water passing channel, the first water inlet channel is communicated with the first water outlet channel through the first water passing channel and forms the first cavity, and the second water inlet channel is communicated with the second water outlet channel through the second water passing channel and forms the second cavity.
[0006] As preferred, the heat insulation structure comprises a first hollow groove, the first hollow groove is arranged on the side of the lower plate body facing the upper plate body and located between the first water passing channel and the second water passing channel.
[0007] As preferred, the heat insulation structure further comprises a second hollow groove, the second hollow groove penetrates the upper plate body in the vertical direction and is communicated with the first hollow groove correspondingly.
[0008] As preferred, the heat insulation structure further comprises a third hollow groove, the third hollow groove is arranged on the side of the base plate away from the lower plate body and located between the first water passing channel and the second water passing channel.
[0009] As preferred, the third hollow groove is filled with a heat insulation member, and the bottom surface of the heat insulation member is flush with the bottom surface of the base plate.
[0010] As preferred, the second water passing channel is provided with two, the two second water passing channels are symmetrically arranged on the two sides of the first water passing channel, and the second liquid cooling area, the second water inlet channel, the second water outlet channel and the second water passing channel are correspondingly arranged.
[0011] As preferred, the liquid cooling plate is provided with a first mounting block and a second mounting block on the side away from the base plate, the first mounting block and the second mounting block are arranged at intervals along the flow direction of the fluid in the second water passing channel, the first mounting block is provided with a first distribution channel, the second water inlet pipe is communicated with the two second water inlet channels through the first distribution channel, and the second mounting block is provided with a second distribution channel, and the second water outlet pipe is communicated with the two second water outlet channels through the second distribution channel.
[0012] As preferred, the lower plate body is provided with a positioning groove, and the upper plate body is limited in the positioning groove and is welded and fixed with the lower plate body.
[0013] As preferred, the first liquid cooling area is provided with a plurality of first spades arranged at intervals, and a gap for liquid to pass through is formed between two adjacent first spades; and / or, the second liquid cooling area is provided with a plurality of second spades arranged at intervals, and a gap for liquid to exist is formed between two adjacent second spades.
[0014] The first liquid cooling flow channel and the second liquid cooling flow channel formed between the substrate and the liquid cooling plate can respectively pass in fluids of different temperatures, thereby cooling different chips or power areas corresponding to the first liquid cooling area and the second liquid cooling area below. By arranging the heat insulation structure, heat exchange between the first liquid cooling flow channel and the second liquid cooling flow channel can be blocked, thereby indirectly reducing the heat transfer and heat winding problem between the chips corresponding to the first liquid cooling flow channel and the second liquid cooling flow channel, achieving the purpose of chip thermal isolation, optimizing the cooling system, and improving the cooling efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 is a structural schematic view of the chip liquid cooling device of the utility model;
[0016] Figure 2 is an exploded view of the chip liquid cooling device of the utility model;
[0017] Figure 3 is a structural schematic view of the first liquid cooling flow channel of the utility model;
[0018] Figure 4 is a structural schematic view of the second liquid cooling flow channel of the utility model;
[0019] Figure 5 is a distribution schematic view of the first liquid cooling flow channel and the second liquid cooling flow channel of the utility model;
[0020] Figure 6 is a structural schematic view of the first distribution channel of the utility model.
[0021] In the drawings:
[0022] 100, substrate; 110, first liquid cooling area; 111, first spade; 120, second liquid cooling area; 121, second spade; 130, third hollow groove; 131, heat insulation piece;
[0023] 200, liquid cooling plate; 210, first chamber; 220, second chamber; 230, upper plate body; 231, first water inlet channel; 2311, first through hole; 2312, first groove; 232, first water outlet channel; 233, second water inlet channel; 234, second water outlet channel; 235, second hollow groove; 236, fourth hollow groove; 240, lower plate body; 241, first water passing channel; 2411, second through hole; 2412, third through hole; 2413, second groove; 242, second water passing channel; 2421, third groove; 2422, fourth groove; 243, first hollow groove; 244, positioning groove; 245, fifth hollow groove; 250, first mounting block; 251, first distribution channel; 260, second mounting block; 270, third mounting block; 271, third distribution channel; 272, fourth distribution channel;
[0024] 300, connecting pipe assembly; 310, first water inlet pipe; 320, first water outlet pipe; 330, second water inlet pipe; 340, second water outlet pipe; 350, spool joint. DETAILED DESCRIPTION
[0025] The utility model will be described in further detail below in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the utility model and are not limited to the utility model. In addition, it should be noted that only the parts related to the utility model are shown in the drawings for the convenience of description, not all the structures.
[0026] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0027] In the utility model, unless otherwise explicitly specified and limited, the first feature "on" or "below" the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0028] In the description of the present embodiment, the terms "upper", "lower", "right", and the like, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used to distinguish in the description, and have no special meaning.
[0029] Referring to Figures 1 to 6 As shown in the figure, according to the chip liquid cooling device provided by the embodiment of the present application, it comprises a substrate 100, a liquid cooling plate 200 and a connecting pipe assembly 300. The substrate 100 is provided with a first liquid cooling area 110 and a second liquid cooling area 120 on one side. Specifically, the first liquid cooling area 110 and the second liquid cooling area 120 are protruding structures with specific shape and size on one side of the substrate 100.
[0030] The liquid cooling plate 200 is connected with the substrate 100. The liquid cooling plate 200 is provided with a first chamber 210 and a second chamber 220 which are separated from each other. The first chamber 210 forms a first opening on the bottom surface of the liquid cooling plate 200, and the second chamber 220 forms a second opening on the bottom surface of the liquid cooling plate 200. The first liquid cooling area 110 corresponds to cover the first opening to form a first liquid cooling flow channel, that is, the inner wall of the first liquid cooling area 110 and the first liquid cooling flow channel is surrounded to form the first liquid cooling flow channel. The second liquid cooling area 120 corresponds to cover the second opening to form a second liquid cooling flow channel, that is, the inner wall of the second liquid cooling area 120 and the second liquid cooling flow channel is surrounded to form the second liquid cooling flow channel. Optionally, the first liquid cooling flow channel and the second liquid cooling flow channel can be two channels arranged side by side, or two channels staggered with each other, or one channel surrounding the other channel. The user can design the structure and layout of the first liquid cooling flow channel and the second liquid cooling flow channel according to the layout of the multiple chips or power areas inside the AI chip, which will not be described here.
[0031] The connecting pipe assembly 300 comprises a first water inlet pipe 310, a first water outlet pipe 320, a second water inlet pipe 330 and a second water outlet pipe 340. The first water inlet pipe 310 and the first water outlet pipe 320 are respectively communicated with the first liquid cooling flow channel, and the second water inlet pipe 330 and the second water outlet pipe 340 are respectively communicated with the second liquid cooling flow channel. Optionally, the end of the first water inlet pipe 310 away from the first liquid cooling flow channel, the end of the first water outlet pipe 320 away from the first liquid cooling flow channel, the end of the second water inlet pipe 330 away from the second liquid cooling flow channel and the end of the second water outlet pipe 340 away from the second liquid cooling flow channel are all connected with a lotus-shaped joint 350, so as to facilitate the user to connect the external liquid cooling source and ensure the connection stability and sealing between the pipes.
[0032] Among them, the liquid cooling plate 200 and the substrate 100 are respectively provided with a heat insulation structure, and the heat insulation structure is located between the first liquid cooling flow channel and the second liquid cooling flow channel.
[0033] It can be understood that the first liquid cooling flow channel and the second liquid cooling flow channel formed between the substrate 100 and the liquid cooling plate 200 can respectively pass in fluids of different temperatures, thereby cooling different chips or power areas corresponding to the first liquid cooling area 110 below (i.e., the area on the side of the substrate 100 away from the liquid cooling plate 200 and corresponding to the position of the first liquid cooling area 110) and the second liquid cooling area 120 below (i.e., the area on the side of the substrate 100 away from the liquid cooling plate 200 and corresponding to the position of the first liquid cooling area 110). By providing a heat insulation structure, heat exchange between the first liquid cooling flow channel and the second liquid cooling flow channel can be blocked, indirectly reducing the problem of heat transfer and heat winding between chips corresponding to the first liquid cooling flow channel and the second liquid cooling flow channel, achieving the purpose of chip thermal isolation, ensuring that the chip or power area with poor heat resistance will not be subjected to high temperature exceeding its carrying capacity, and ensuring that the chip with high power cools in time, optimizing the cooling system and improving the cooling efficiency.
[0034] Referring to Figures 1 to 4 It can be understood that the liquid cooling plate 200 includes an upper plate body 230 and a lower plate body 240 located below the upper plate body 230, the upper plate body 230 is provided with a first water inlet channel 231, a first water outlet channel 232, a second water inlet channel 233 and a second water outlet channel 234, and the first water inlet channel 231, the first water outlet channel 232, the second water inlet channel 233 and the second water outlet channel 234 are separated from each other.
[0035] The first water inlet channel 231 is in communication with the first water inlet pipe 310, the first water outlet channel 232 is in communication with the first water outlet pipe 320, the second water inlet channel 233 is in communication with the second water inlet pipe 330, and the second water outlet channel 234 is in communication with the second water outlet pipe 340. The lower plate body 240 is provided with a first water passage 241 and a second water passage 242 which are separated from each other, the first water inlet channel 231 is in communication with the first water outlet channel 232 through the first water passage 241 and forms a first chamber 210, and the second water inlet channel 233 is in communication with the second water outlet channel 234 through the second water passage 242 and forms a second chamber 220.
[0036] Specifically, referring to Figure 2 and Figure 3As shown, the upper plate body 230 is provided with a first through hole 2311 and a first recess 2312, the first recess 2312 is located on the side of the upper plate body 230 facing the lower plate body 240 (the opening of the first recess 2312 is the first opening), the first recess 2312 is in communication with the first through hole 2311 and forms a first water inlet channel 231 passing through both sides of the upper plate body 230, the structure of the first water outlet channel 232 can refer to the description of the first water inlet channel 231 in the foregoing, and will not be described here. The lower plate body 240 is provided with a second through hole 2411, a third through hole 2412 and a second recess 2413, the second through hole 2411 is matched with the shape of the first recess 2312, the third through hole 2412 is matched with the shape of the first water outlet channel 232, and the second through hole 2411 and the third through hole 2412 are arranged in the first direction. The second recess 2413 is located on the side of the lower plate body 240 away from the upper plate body 230 and is matched with the shape of the first liquid cooling area 110, the second through hole 2411 and the third through hole 2412 are in communication with the second recess 2413 to form a first water passing channel 241. After the upper plate body 230 and the lower plate body 240 are connected, the first recess 2312 is in communication with the first through hole 2311, the first water outlet channel 232 is in communication with the second through hole 2411, and the communication between the first water inlet channel 231 and the first water outlet channel 232 is realized. At this time, the first cooling liquid a flowing from the first water inlet pipe 310 flows in the first water passing channel 241 from the second through hole 2411 to the third through hole 2412 in the first direction, and finally exits the liquid cooling plate 200 through the first water inlet channel 231 and the first water outlet pipe 320.
[0037] Referring to Figure 2 and Figure 4 As shown, the second water inlet channel 233 and the second water outlet channel 234 are located on the same side of the first water inlet channel 231 (or the first water outlet channel 232) and are arranged in the first direction. The side of the lower plate body 240 facing the upper plate body 230 is provided with two third recesses 2421, the two third recesses 2421 are arranged in the first direction, the side of the lower plate body 240 away from the upper plate body 230 is provided with a fourth recess 2422 (the opening of the fourth recess 2422 is the second opening), the fourth recess 2422 is arranged in the first direction, and the two ends of the fourth recess 2422 are in communication with the two third recesses 2421 respectively to form a second water passing channel 242. After the upper plate body 230 and the lower plate body 240 are connected, the second water inlet channel 233 and the second water outlet channel 234 are in communication with the two third recesses 2421 respectively, and the communication between the second water inlet channel 233 and the second water outlet channel 234 is realized. At this time, the second cooling liquid b flowing from the second water inlet pipe 330 flows in the second water passing channel 242 from the second water inlet channel 233 to the second water outlet channel 234 in the first direction, and finally exits the liquid cooling plate 200 through the second water inlet channel 233 and the second water outlet pipe 340.
[0038] By setting the upper plate body 230 and the lower plate body 240, the first chamber 210 and the second chamber 220 are split into the respective hole groove structures provided in the upper plate body 230 and the lower plate body 240, the structure of the first chamber 210 and the second chamber 220 is simplified, the design and processing of the liquid cooling plate 200 are facilitated, and the production cost of the liquid cooling plate 200 is reduced.
[0039] Further, the lower plate body 240 is provided with a positioning groove 244, the positioning groove 244 is matched with the shape of the upper plate body 230, the upper plate body 230 is limited in the positioning groove 244 and is welded and fixed with the lower plate body 240.
[0040] By setting the positioning groove 244, the positioning groove 244 can position the upper plate body 230, realize the quick alignment between the first water inlet channel 231, the first water outlet channel 232 and the first water passing channel 241 and between the second water inlet channel 233, the second water outlet channel 234 and the second water passing channel 242, and can ensure the welding precision between the upper plate body 230 and the lower plate body 240 and the structural strength of the whole liquid cooling plate 200.
[0041] Referring to Figure 4 and Figure 5 It can be understood that the second water passing channel 242 is provided with two, the two second water passing channels 242 are symmetrically provided on both sides of the first water passing channel 241 in the second direction, the second liquid cooling area 120, the second water inlet channel 233, the second water outlet channel 234 and the second water passing channel 242 are one-to-one correspondingly provided, and the second direction, the first direction and the vertical direction are perpendicular to each other.
[0042] By setting two second water passing channels 242, the two second water passing channels 242 and the two second water inlet channels 233, the two second water outlet channels 234 and the two second water passing channels 242 are correspondingly communicated, two second chambers 220 can be formed, the two second chambers 220 cooperate with the two second liquid cooling areas 120, and two second liquid cooling flow channels can be formed on both sides of the first liquid cooling flow channel. The two second liquid cooling flow channels can uniformly cool other chips around the chip below the first liquid cooling flow channel, and further improve the cooling efficiency of the chip liquid cooling device.
[0043] Referring to Figure 2 and Figure 5 It can be understood that the heat insulation structure includes a first hollow groove 243, the first hollow groove 243 is opened on the side of the lower plate body 240 facing the upper plate body 230 and is located between the first water passing channel 241 and the second water passing channel 242.
[0044] By setting the first hollow groove 243, the air in the first hollow groove 243 can avoid heat exchange with the first cooling liquid a in the first water passage 241 or the second cooling liquid b in the second water passage 242, thereby avoiding the temperature rise of the cooling liquid with lower temperature, further optimizing the cooling system, and improving the cooling efficiency of the chip liquid cooling device.
[0045] Further, the heat insulation structure further comprises a second hollow groove 235, which penetrates the upper plate body 230 in the vertical direction and communicates with the first hollow groove 243, that is, the second hollow groove 235 is provided with two, one of which is located between the first water inlet passage 231 (or the first water outlet passage 232) and the second water inlet passage 233, and the other is located between the first water inlet passage 231 (or the first water outlet passage 232) and the second water outlet passage 234.
[0046] By setting the second hollow groove 235, the air in the second hollow groove 235 can avoid entering the first liquid cooling flow channel first cooling liquid a and the second liquid cooling flow channel second cooling liquid b on the upper plate body 230 to exchange heat, ensuring that the inlet temperature of the first cooling liquid a and the second cooling liquid b will not fluctuate, thereby ensuring the heat exchange performance of the subsequent first cooling liquid a and the second cooling liquid b.
[0047] Referring to Figure 5 It can be understood that the heat insulation structure further comprises a third hollow groove 130, which is opened on the side of the substrate 100 away from the lower plate body 240 and located between the first water passage 241 and the second water passage 242.
[0048] By setting the third hollow groove 130, the third hollow groove 130 can avoid the heat exchange of the substrate 100 itself or the heat exchange of the substrate 100 itself, which can effectively improve the independence of the first liquid cooling flow channel and the second liquid cooling flow channel, and further improve the cooling efficiency of the chip liquid cooling device.
[0049] Further, the third hollow groove 130 is filled with a heat insulation piece 131, which is made of epoxy resin glue or other low thermal conductivity materials with low thermal conductivity, and the bottom surface of the heat insulation piece 131 is flush with the bottom surface of the substrate 100.
[0050] The side of the lower plate body 240 away from the upper plate body 230, i.e., the side of the substrate 100 in contact with the chip (the substrate 100 and the chip are usually also coated with a heat-conducting paste). By providing the heat insulating piece 131, the problem of uneven application of the heat-conducting paste caused by the third hollow groove 130 and the resulting suboptimal heat conduction effect can be avoided, the working stability of the chip liquid cooling device is improved, and at the same time, the heat insulating piece 131 is flush with the bottom surface of the substrate 100, i.e., the heat insulating piece 131 abuts against the chip, which can increase the contact area of the substrate 100 and the chip, ensure uniform pressure of the substrate 100 on the chip, and further improve the cooling efficiency of the chip liquid cooling device.
[0051] Referring to Figure 1 and Figure 6 It can be understood that the liquid cooling plate 200 is provided with a first mounting block 250 and a second mounting block 260 on the side away from the substrate 100, the first mounting block 250 and the second mounting block 260 are arranged in a spaced manner along the flow direction of the fluid in the second water passage 242, the first mounting block 250 is provided with a first distribution passage 251, the second water inlet pipe 330 communicates with the two second water inlet passages 233 through the first distribution passage 251, and the second mounting block 260 is provided with a second distribution passage, and the second water outlet pipe 340 communicates with the two second water outlet passages 234 through the second distribution passage.
[0052] By providing the first mounting block 250 and the second mounting block 260, the chip liquid cooling device can pass the second cooling liquid b into the two second water inlet passages 233 through the same second water inlet pipe 330, and can receive the second cooling liquid b flowing out of the two second water outlet passages 234 through the same second water outlet pipe 340. The structure of the chip liquid cooling device is simplified, and subsequent pipe connection of the chip liquid cooling device is facilitated.
[0053] It should be noted that the heat insulating structure further includes two fourth hollow grooves 236 and two fifth hollow grooves 245, the two fourth hollow grooves 236 are respectively located below the first mounting block 250 and the second mounting block 260 and penetrate through both sides of the upper plate body 230, and the two fifth hollow grooves 245 are respectively located below the two fourth hollow grooves 236 and communicate with the two fourth hollow grooves 236 in a corresponding manner. By providing the fourth hollow grooves 236 and the fifth hollow grooves 245, the first hollow groove 243, the second hollow groove 235, the fourth hollow groove 236, and the fifth hollow groove 245 cooperate to separate the four sides of the first liquid cooling flow channel from other components of the liquid cooling plate 200 through air, achieving the purpose of thermal isolation of the first liquid cooling flow channel and the second liquid cooling flow channel, greatly improving the independence of the first liquid cooling flow channel, and improving the utilization rate of the first cooling liquid a and the second cooling liquid b.
[0054] Optionally, two first water inlet channels 231 are provided, and the two first water inlet channels 231 are spaced apart along a first direction. A first water outlet channel 232 is located between the two first water inlet channels 231. A third mounting block 270 is provided on the side of the liquid cooling plate 200 away from the substrate 100. The third mounting block 270 is provided with a third distribution channel 271 and a fourth distribution channel 272. The first water inlet pipe 310 is connected to the first water inlet channel 231 through the third distribution channel 271, and the first water outlet pipe 320 is connected to the two first water inlet channels 231 through the fourth distribution channel 272. The connection structure between the first mounting block 250, the second mounting block 260, the third mounting block 270 and the upper plate 230 can be referred to the previous description of the connection between the upper plate 230 and the lower plate 240, and will not be repeated here.
[0055] Reference Figure 5 and Figure 6 As shown, it can be understood that the first liquid cooling zone 110 is provided with a plurality of first shovel teeth 111, the first shovel teeth 111 are arranged vertically upward and abut against the top wall of the first water passage 241 (i.e., the bottom wall of the second groove 2413), the plurality of first shovel teeth 111 are spaced apart along the second direction, and there is a gap between two adjacent first shovel teeth 111 for liquid to pass through; or, the second liquid cooling zone 120 is provided with a plurality of second shovel teeth 121, the second shovel teeth 121 are arranged vertically upward and abut against the top wall of the second water passage 242 (i.e., the bottom wall of the fourth groove 2422), the plurality of second shovel teeth 121 are spaced apart along the second direction, and a gap for liquid to exist is formed between two adjacent second shovel teeth 121; or, the first liquid cooling zone 110 is provided with a plurality of first shovel teeth 111, and the second liquid cooling zone 120 is provided with a plurality of second shovel teeth 121.
[0056] By setting the first spade 111 and the second spade 121, the contact area between the first cooling liquid a and the second cooling liquid b and the inner wall of the substrate 100 can be increased, thereby increasing the convective heat dissipation area and significantly improving the heat exchange efficiency of the first cooling liquid a and the second cooling liquid b. Optionally, the number of teeth, tooth thickness, tooth spacing, and other parameters of the first spade 111 and the second spade 121 can be set according to the required heat dissipation efficiency of the chip. Here, the structural arrangement of the first spade 111 and the second spade 121 is not specifically limited, as long as it can quickly cool the chip.
[0057] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A liquid cooling device for chips, characterized by include: The substrate (100) has a first liquid cooling area (110) and a second liquid cooling area (120) on one side; A liquid cooling plate (200) is connected to the substrate (100). The liquid cooling plate (200) is provided with a first chamber (210) and a second chamber (220) that are separated from each other. The first chamber (210) forms a first opening on the bottom surface of the liquid cooling plate (200), and the second chamber (220) forms a second opening on the bottom surface of the liquid cooling plate (200). The first liquid cooling area (110) covers the first opening to form a first liquid cooling channel, and the second liquid cooling area (120) covers the second opening to form a second liquid cooling channel. The connecting pipe assembly (300) includes a first water inlet pipe (310), a first water outlet pipe (320), a second water inlet pipe (330), and a second water outlet pipe (340). The first water inlet pipe (310) and the first water outlet pipe (320) are respectively connected to the first liquid cooling channel, and the second water inlet pipe (330) and the second water outlet pipe (340) are respectively connected to the second liquid cooling channel. The liquid cooling plate (200) and the substrate (100) are respectively provided with heat insulation structures, and the heat insulation structures are located between the first liquid cooling channel and the second liquid cooling channel.
2. The chip liquid cooling device according to claim 1, characterized by, The liquid cooling plate (200) includes an upper plate (230) and a lower plate (240) located below the upper plate (230). The upper plate (230) is provided with a first water inlet channel (231), a first water outlet channel (232), a second water inlet channel (233), and a second water outlet channel (234). The first water inlet channel (231) is connected to the first water inlet pipe (310), the first water outlet channel (232) is connected to the first water outlet pipe (320), and the second water inlet channel (233) is connected to the second water inlet pipe (334). 0) Connected, the second water outlet channel (234) is connected to the second water outlet pipe (340), the lower plate (240) is provided with a first water passage channel (241) and a second water passage channel (242), the first water inlet channel (231) is connected to the first water outlet channel (232) through the first water passage channel (241) and forms the first chamber (210), the second water inlet channel (233) is connected to the second water outlet channel (234) through the second water passage channel (242) and forms the second chamber (220).
3. The liquid cooling device for chips according to claim 2, characterized by The heat insulation structure includes a first hollow groove (243), which is opened on the side of the lower plate (240) facing the upper plate (230) and located between the first water passage (241) and the second water passage (242).
4. The liquid cooling device for chip according to claim 3, wherein The heat insulation structure also includes a second hollow groove (235), which penetrates the upper plate (230) in the vertical direction and is correspondingly connected to the first hollow groove (243).
5. The liquid cooling device for chip according to claim 4, wherein The heat insulation structure further comprises a third hollow groove (130) which is arranged on the side of the base plate (100) away from the lower plate body (240) and between the first water passing channel (241) and the second water passing channel (242).
6. The liquid cooling device for chip according to claim 5, wherein The third hollow groove (130) is filled with a heat insulation member (131) whose bottom surface is flush with the bottom surface of the base plate (100).
7. The liquid cooling device of any one of claims 2-6, wherein, The second water passing channel (242) is provided with two second water passing channels (242) which are symmetrically arranged on the two sides of the first water passing channel (241), and the second liquid cooling area (120), the second water inlet channel (233), the second water outlet channel (234) and the second water passing channel (242) are one-to-one correspondingly arranged.
8. The liquid cooling device for chip according to claim 7, wherein The liquid cooling plate (200) is provided with a first mounting block (250) and a second mounting block (260) on the side away from the base plate (100), the first mounting block (250) and the second mounting block (260) are spaced apart along the flow direction of the fluid in the second water passing channel (242), the first mounting block (250) is provided with a first distribution channel (251), the second water inlet pipe (330) communicates with the two second water inlet channels (233) through the first distribution channel (251), and the second mounting block (260) is provided with a second distribution channel, the second water outlet pipe (340) communicates with the two second water outlet channels (234) through the second distribution channel.
9. The liquid cooling device of any one of claims 2-6, wherein, The lower plate body (240) is provided with a positioning groove (244), and the upper plate body (230) is limited in the positioning groove (244) and is welded and fixed with the lower plate body (240).
10. The liquid cooling device of any one of claims 1-6, wherein, The first liquid cooling area (110) is provided with a plurality of first spading teeth (111) which are spaced apart, and there is a gap between two adjacent first spading teeth (111) for liquid to pass through; and / or, the second liquid cooling area (120) is provided with a plurality of second spading teeth (121) which are spaced apart, and there is a gap between two adjacent second spading teeth (121) for liquid to pass through.