Chip packaging reflow soldering micro copper column clamping jig
By designing a micro copper pillar clamping fixture for chip packaging reflow soldering, the problems of low yield and low production efficiency in micro copper pillar chip packaging were solved, achieving efficient micro copper pillar clamping and soldering, and reducing production costs.
Patent Information
- Application Number
- CN202422746080.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-11
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-11-11
AI Technical Summary
Existing microcopper pillar chip packaging technology suffers from low yield, low production efficiency, and high cost, while traditional manufacturing processes are outdated.
A micro copper pillar clamping fixture for chip packaging reflow soldering is designed. By combining a fixed plate, a sliding plate, a micro-hole array, and a limiting block, the micro copper pillars are aligned and clamped, thereby improving the yield of the reflow soldering process.
By arranging and clamping the micro copper pillars, the yield of the reflow soldering process is improved, production efficiency is increased, and production costs are reduced.
Smart Images
Figure CN223531585U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of micro copper pillar clamping technology, and in particular to a micro copper pillar clamping fixture for chip packaging reflow soldering. Background Technology
[0002] Microcopper pillars are a common and important component in chip packaging, especially in high-performance chip packaging. Microcopper pillars are miniature connectors that are typically used to connect circuits between chips and substrates. They provide high-density electrical connections and are used in chip packaging to transmit signals, power and heat.
[0003] Currently, major packaging manufacturers use traditional manufacturing processes to produce micro-copper pillar chip packaging substrates. This involves drilling micro-holes in the substrate, electroplating copper, and then etching to obtain a substrate with multiple rows of copper pillars. This traditional manufacturing process is outdated, has low yield, low production efficiency, and high production costs. Utility Model Content
[0004] This utility model provides a micro copper pillar clamping fixture for chip packaging reflow soldering. It realizes the alignment and clamping of micro copper pillars during reflow soldering through a device, thereby improving the yield of the reflow soldering process.
[0005] The purpose of this utility model is achieved in the following manner: a micro copper pillar clamping fixture for chip packaging reflow soldering, comprising:
[0006] Fixing plate;
[0007] A sliding plate is connected to the fixed plate;
[0008] A first micropore array is disposed on the fixed plate;
[0009] A second micropore array is disposed on the fixed plate;
[0010] The limiting block is connected to the fixing plate.
[0011] As an optional solution of the present invention, the fixing plate is provided with mounting holes for fixing the fixing plate to other mechanisms.
[0012] As an optional solution to the technical solution of this utility model, the fixing plate is provided with a sliding groove;
[0013] The sliding plate is provided with a sliding edge;
[0014] The limiting block is provided with an installation edge;
[0015] The sliding edge is slidably connected to the sliding groove;
[0016] The mounting edge is slidably connected to the groove.
[0017] The beneficial effects of this utility model are:
[0018] The first and second micro-hole arrays of this invention are slightly larger in diameter than the micro-copper pillars. When the first and second micro-hole arrays are aligned, the micro-copper pillars fall into both arrays simultaneously through oscillation, completing the alignment of the micro-copper pillars. Then, a sliding plate is pushed, causing the axes of the first and second micro-hole arrays to misalign, thereby clamping and fixing the micro-copper pillars. At this point, the array of micro-copper pillars and the chip packaging substrate at the bottom can be moved as a whole into the reflow oven for soldering, realizing the alignment and clamping of the micro-copper pillars during reflow soldering and improving the yield of the reflow soldering process. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of a chip packaging reflow soldering micro copper pillar clamping fixture according to Embodiment 1 of this utility model.
[0021] Figure 2 This is a schematic diagram of the fixing plate of a chip packaging reflow soldering micro copper pillar clamping fixture according to Embodiment 1 of this utility model;
[0022] Figure 3 This is a schematic diagram of the fixing plate of a chip packaging reflow soldering micro copper pillar clamping fixture according to Embodiment 1 of this utility model;
[0023] Figure 4 This is a schematic diagram of the limiting block of a chip packaging reflow soldering micro copper pillar clamping fixture according to Embodiment 1 of this utility model.
[0024] Figure label:
[0025] 1. Fixing plate; 2. Fixing plate; 3. First micropore array; 4. Second micropore array; 5. Limiting block; 6. First rotating wheel; 7. Sliding groove; 8. Sliding edge; 9. Mounting edge. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0027] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.
[0028] In the description of the embodiments, unless otherwise expressly specified and limited, the terms "set," "connect," etc., should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or a connection through an intermediate medium, or it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0029] Example 1:
[0030] like Figure 1-3 As shown, a micro copper pillar clamping fixture for chip packaging reflow soldering includes: a fixed plate 1, a sliding plate 2, a first micro-hole array 3, a second micro-hole array 4, and a limiting block 5, wherein: the sliding plate 2 is connected to the fixed plate 1; the first micro-hole array 3 is disposed on the fixed plate 1; the second micro-hole array 4 is disposed on the sliding plate 2; and the limiting block 5 is connected to the fixed plate 1.
[0031] like Figure 1-2 As shown, as a further embodiment, the fixing plate 1 is provided with mounting holes 6 for fixing the fixing plate 1 to other mechanisms.
[0032] like Figure 2-4 As shown, as a further embodiment, the fixed plate 1 is provided with a sliding groove 7; the sliding plate 2 is provided with a sliding edge 8; the limiting block 5 is provided with an installation edge 9; the sliding edge 8 is slidably connected to the sliding groove 7; and the installation edge 9 is slidably connected to the sliding groove 7.
[0033] The workflow of this embodiment is as follows: First, insert the sliding edge 8 into the sliding groove 7 and install the sliding plate 2 onto the fixed plate 1; then, insert the mounting edge 9 into the sliding groove 7 and install the limiting block 5 onto the fixed plate 1; then, align the first micro-hole array 3 with the second micro-hole array 4; then, use oscillation to make the micro-copper pillars fall into the first micro-hole array 3 and the second micro-hole array 4 simultaneously; then, push the sliding plate 2 to misalign the axes of the first micro-hole array 3 and the second micro-hole array 4, thereby clamping and fixing the micro-copper pillars; then, the micro-copper pillar array and the bottom chip packaging substrate can be moved as a whole into the reflow oven for soldering.
[0034] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope claimed by this utility model.
Claims
1. A micro copper pillar clamping fixture for chip packaging reflow soldering, characterized in that, include: Fixing plate (1); The sliding plate (2) is connected to the fixed plate (1); The first micropore array (3) is disposed on the fixed plate (1); A second micropore array (4) is disposed on the sliding plate (2); The limiting block (5) is connected to the fixing plate (1).
2. The chip packaging reflow soldering micro copper pillar clamping fixture according to claim 1, characterized in that, The fixing plate (1) is provided with mounting holes (6) for fixing the fixing plate (1) to an external mechanism.
3. The chip packaging reflow soldering micro copper pillar clamping fixture according to claim 1, characterized in that, The fixing plate (1) is provided with a sliding groove (7); The sliding plate (2) is provided with a sliding edge (8); The limiting block (5) is provided with an installation edge (9); The sliding edge (8) is slidably connected to the sliding groove (7); The mounting edge (9) is slidably connected to the groove (7).