Chamfering equipment

Abstract

The utility model discloses chamfering equipment which is used for chamfering a wafer, and the wafer comprises a broken edge. The chamfering equipment comprises a first mounting surface, a second mounting surface, a grabbing part and a chamfering mechanism, and when the wafer is located on the first mounting surface and the grabbing part is in contact with the wafer, the center of the wafer is located between the axis of the grabbing part and the broken edge in the radial direction of the first mounting surface. And when the wafer is located on the second mounting surface and the grabbing part is in contact with the wafer, the grabbing part and the second mounting surface are coaxially arranged. And the grabbing part is used for moving the wafer from the first mounting surface to the second mounting surface. The chamfering mechanism is positioned on one side of the second mounting surface in the radial direction of the second mounting surface; and when the wafer is located on the second mounting surface, the chamfering mechanism is used for abutting against the broken edge. By adopting the chamfering equipment provided by the utility model, the size of the chamfer at the position of the broken edge is larger than that of the chamfer at other positions of the wafer, so that the qualified rate of the wafer can be effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of machining technology, and in particular to a chamfering device. Background Technology

[0002] Silicon carbide (SiC), a third-generation semiconductor, is a core material for semiconductors and possesses characteristics such as wide bandgap, high breakdown voltage, high saturation drift velocity, and high thermal conductivity, making it advantageous for applications in high-voltage, high-temperature, and high-frequency power devices. In semiconductor manufacturing, silicon carbide rods are cut to obtain wafers. However, silicon carbide has a high Mohs hardness and is relatively brittle, making wafers prone to edge chipping during the cutting process. Current technology typically uses chamfering to remove chipping; however, when the chipping is large, it can result in a wafer diameter smaller than the specified diameter, leading to a low wafer yield.

[0003] Therefore, how to improve the wafer yield while removing wafer chipping has become a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] This invention provides a chamfering device to improve the yield of wafers while removing chipped edges.

[0005] This invention provides a chamfering device for chamfering wafers, the wafers including chipped edges. The chamfering device includes a first mounting surface, a second mounting surface, a gripping part, and a chamfering mechanism. The first and second mounting surfaces are spaced apart along the radial direction of the first mounting surface and are respectively used to mount the wafer. When the wafer is located on the first mounting surface and the gripping part is in contact with the wafer, the axis of the gripping part is spaced apart from the center of the wafer along the radial direction of the first mounting surface and is away from the chipped edge relative to the center of the wafer. When the wafer is located on the second mounting surface and the gripping part is in contact with the wafer, the gripping part is coaxially arranged with the second mounting surface. The gripping part is used to move the wafer from the first mounting surface to the second mounting surface. Along the radial direction of the second mounting surface, the chamfering mechanism is located on one side of the second mounting surface; and when the wafer is located on the second mounting surface, the chamfering mechanism abuts against the chipped edge.

[0006] Using the chamfering device provided by this utility model, when the wafer is located on the first mounting surface and the gripping part is in contact with the wafer, the axis of the gripping part is spaced apart from the center of the wafer along the radial direction of the first mounting surface, and the axis of the gripping part is away from the chipping edge relative to the center of the wafer, so as to achieve eccentric gripping of the wafer by the gripping part. In this way, when the gripping part moves the wafer to the second mounting surface, the gripping part holding the wafer is coaxially arranged with the second mounting surface, so as to achieve eccentric mounting between the wafer and the second mounting surface, that is, along the radial direction of the second mounting surface, the center of the wafer is located between the axis of the second mounting surface and the chipping edge.

[0007] In this way, during the wafer chamfering process, the chamfer size at the location of the chipped edge will be larger than the chamfer size at other locations on the wafer. This can effectively reduce the risk of the wafer diameter being smaller than the specified diameter due to chamfering, thereby effectively improving the wafer yield.

[0008] In one possible implementation of this invention, the first mounting surface is used to move the wafer relative to the axis of the gripper towards the location of the chipped edge, along the radial direction of the first mounting surface. This is to ensure that the center of the wafer is located between the axis of the gripper and the chipped edge, along the radial direction of the first mounting surface.

[0009] In one possible implementation of this invention, the first mounting surface is used to move the wafer relative to the axis of the gripping part in the direction of edge chipping by a distance B, where B satisfies: 0 < B ≤ A / 2. A: the size of the edge chipping. This further reduces the risk of the wafer diameter being smaller than the specified diameter due to chamfering, thereby effectively improving the wafer yield.

[0010] In one possible implementation of this invention, the chamfering device further includes a detection unit for detecting the size and location of the chipped edge. This detection unit is used to improve the movement accuracy of the first mounting surface relative to the axis of the gripping part towards the location of the chipped edge, along the radial direction of the first mounting surface. Furthermore, during the movement of the first mounting surface, the position of the wafer's center is detected to obtain the wafer's movement distance in real time, thereby effectively improving the gripping accuracy of the gripping part.

[0011] In one possible implementation of this invention, the chamfering device further includes a first rotating shaft, which is disposed on one side of the first mounting surface and is coaxially connected to the first mounting surface. When the wafer is located on the first mounting surface, the extension of the axis of the first rotating shaft passes through the center of the wafer. Along the radial direction of the first mounting surface, the first rotating shaft drives the first mounting surface to move relative to the axis of the gripping part towards the location of the chipped edge. This satisfies the movement requirements of the first mounting part while improving the structural simplicity of the chamfering device.

[0012] In one possible implementation of this invention, the first rotating shaft is used to drive the first mounting surface to rotate around the axis of the first rotating shaft. Thus, during the process of obtaining the location and size of the chipped edge on the wafer, the first mounting surface can drive the wafer to rotate around its axis, while the detection unit remains relatively stationary, allowing the detection unit to acquire images of the wafer from different angles for use in determining the location and size of the chipped edge.

[0013] In one possible implementation of this invention, the chamfering device further includes a support structure, which is spaced apart from the first mounting surface along the radial direction of the first mounting surface and is used to abut against the wafer. This helps to improve the mounting stability of the wafer.

[0014] In one possible implementation of this invention, the support structure includes a first support portion and a second support portion, with the first mounting surface located radially between the first and second support portions; both the first and second support portions are used to abut against the wafer, thereby further improving the wafer mounting stability.

[0015] In one possible implementation of this invention, the chamfering device further includes a lifting mechanism connected to the first mounting surface and extending along the axial direction of the first mounting surface. This lifting mechanism drives the first mounting surface to extend or retract. Thus, during the movement of the wafer, the lifting mechanism can lift the second rotating shaft, separating the second surface of the wafer from the support structure. This effectively reduces the risk of the second surface being scratched by the support structure during wafer movement.

[0016] In one possible implementation of this invention, the chamfering device further includes a second rotating shaft, which is disposed on one side of the second mounting surface and is coaxial with and connected to the second mounting surface. The second rotating shaft drives the second mounting surface to rotate around its axis, thereby improving chamfering efficiency during the wafer chamfering process. Simultaneously, along the radial direction of the second mounting surface, the second rotating shaft drives the second mounting surface to move towards or away from the chamfering mechanism. This allows for adjusting the contact size between the chamfering mechanism and the wafer according to the size of the chipped edge, which helps improve chamfering accuracy. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a wafer;

[0018] Figure 2 A schematic diagram of the chamfering device provided by this utility model;

[0019] Figure 3 For application Figure 2 A schematic diagram of a beveled wafer obtained by the provided beveling equipment;

[0020] Figure 4For application Figure 2 A schematic diagram of another structure of the beveled wafer obtained by the provided beveling equipment;

[0021] Figure 5 Another structural schematic diagram of the chamfering device provided by this utility model.

[0022] Reference numerals: 01-Cracked edge; 1-First mounting surface; 2-Second mounting surface; 3-Gripping part; 4-Chamfering mechanism; 41-Chamfering part; 5-Detection unit; 6-First rotating shaft; 7-Second rotating shaft; 8-Support structure; 81-First support part; 82-Second support part. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The terms expressing position and direction described in the embodiments of this utility model are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the protection scope of this utility model. The accompanying drawings of the embodiments of this utility model are only for illustrating relative positional relationships and do not represent actual proportions.

[0024] It should be noted that specific details are set forth in the following description to facilitate understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0025] Silicon carbide (SiC), a third-generation semiconductor, is a core material for semiconductors and possesses characteristics such as a wide bandgap, high breakdown voltage, high saturation drift velocity, and high thermal conductivity, making it advantageous for applications in high-voltage, high-temperature, and high-frequency power devices. In semiconductor manufacturing, silicon carbide rods are cut to obtain wafers. However, silicon carbide has a high Mohs hardness and is relatively brittle, making wafers prone to edge chipping during the cutting process. Current technology typically removes chipping by uniformly chamfering the wafer circumferentially. However, when the chipped edge is large, the diameter of the chamfered wafer may be smaller than the specified size, resulting in a low wafer yield.

[0026] In view of this, in the chamfering device provided by this utility model, by eccentrically mounting the wafer to the rotating shaft and along the radial direction of the rotating shaft, the axis of the wafer is located between the axis of the rotating shaft and the chipped edge, so that the diameter of the chamfered wafer meets the specified size, thereby improving the wafer yield. To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] refer to Figure 1 , Figure 1 This is a schematic diagram of a wafer structure, used to illustrate the structure of a wafer. Figure 1 The outer solid ring line represents the edge of the wafer, and the inner dashed ring line represents the chamfered edge of the wafer after chamfering in the prior art. The wafer includes a first surface ( Figure 1 (not shown in the middle), second side ( Figure 1 (Not shown in the image) and chipping edge 01 are arranged opposite each other along the axial direction of the wafer, with the first and second surfaces facing each other. Chipping edge 01 is located on either the first or second surface. (See reference) Figure 2 , Figure 2 This is a schematic diagram of a chamfering device provided by the present invention. The chamfering device is used to chamfer wafers to remove chipped edges. The chamfering device includes a first mounting surface 1, a second mounting surface 2, a gripping part 3, and a chamfering mechanism 4. The first mounting surface 1 and the second mounting surface 2 are spaced apart along the radial direction of the first mounting surface 1 and are respectively used to mount wafers. The gripping part 3 is used to move the wafer from the first mounting surface 1 to the second mounting surface 2.

[0028] In addition, when the wafer is located on the first mounting surface 1, the second mounting surface 2 is spaced apart from the wafer; and when the wafer is located on the second mounting surface 2, the first mounting surface 1 is spaced apart from the wafer.

[0029] It should be noted that the first mounting surface 1 and the second mounting surface 2 provided by this utility model are, for example, circular in shape, which helps to improve the ease of installation between the mounting surface and the wafer.

[0030] Additionally, the chamfering device may include two wafer carriers for supporting wafers. The two wafer carriers may, exemplarily, be frustums, with one side of one frustum serving as a first mounting surface 1 and the same side of the other frustum serving as a second mounting surface 2. When a chip 01 exists on the first surface of the wafer, the first mounting surface 1 and the second mounting surface 2 are respectively used to connect to the second surface of the wafer. The wafer carriers may be used, exemplarily, to attach the wafer to either the first mounting surface 1 or the second mounting surface 2.

[0031] When the chamfering mechanism 4 is specifically designed, it is located on one side of the second mounting surface 2 along the radial direction of the second mounting surface 2, and when the wafer is located on the second mounting surface 2, the chamfering mechanism 4 is used to abut against the chipped edge 01 of the wafer.

[0032] In the specific configuration of the gripping part 3, the gripping part 3 is disposed between the first mounting surface 1 and the second mounting surface 2. The gripping part 3 can be exemplarily a robotic arm, and a suction cup is provided at the end of the robotic arm near the first mounting surface 1 for adsorbing wafers, which helps to improve the stability and convenience of wafer movement.

[0033] Using the chamfering device provided by this utility model, when the wafer is located on the first mounting surface 1 and the gripping part 3 is in contact with the wafer, the axis of the gripping part 3 is spaced apart from the center of the wafer along the radial direction of the first mounting surface 1, and the axis of the gripping part 3 is away from the chipping edge 01 relative to the center of the wafer, so as to achieve eccentric gripping of the wafer by the gripping part 3. In this way, when the gripping part 3 moves the wafer to the second mounting surface 2, the gripping part 3 holding the wafer is coaxially arranged with the second mounting surface 2, so that eccentric mounting between the wafer and the second mounting surface 2 can be achieved, that is, along the radial direction of the second mounting surface 2, the center of the wafer is located between the axis of the second mounting surface 2 and the chipping edge 01.

[0034] Thus, during the wafer chamfering process, reference Figure 3 , Figure 3 This diagram illustrates the structure of the wafer obtained after chamfering using the chamfering equipment provided in Application 2. The outer solid ring line represents the wafer's edge, and the inner dashed ring line represents the inner edge of the chamfer. Therefore, the chamfer size at the location of chipped edge 01 will be larger than the chamfer sizes at other locations on the wafer. This effectively reduces the risk of the wafer's diameter being smaller than the specified diameter due to chamfering, thereby significantly improving the wafer yield.

[0035] It should be noted that the wafer may include one chipped edge 01 or multiple chipped edges 01. When the wafer includes multiple chipped edges 01, it is only necessary to ensure that the center of the wafer is located between the axis of the second mounting surface 2 and the chipped edge 01 with the largest size along the radial direction of the wafer.

[0036] In an optional embodiment, along the radial direction of the first mounting surface 1, the wafer can be moved relative to the axis of the gripping portion 3 toward the chipped edge 01 by the first mounting surface 1, so as to achieve that the center of the wafer is located between the axis of the gripping portion 3 and the chipped edge 01 along the radial direction of the first mounting surface 1.

[0037] It is understandable that the gripping part 3 can also be moved in the direction away from the chipped edge 01 relative to the first mounting surface 1 in the radial direction of the first mounting surface 1, so as to realize that the center of the wafer is located between the axis of the gripping part 3 and the chipped edge 01 in the radial direction of the first mounting surface 1.

[0038] It is worth mentioning that, such as Figure 4 As shown, along the radial direction of the first mounting surface 1, if the distance by which the first mounting surface 1 moves the wafer relative to the axis of the gripping part 3 towards the chipped edge 01 is B, and the maximum size of the chipped edge 01 of the wafer is A, then B satisfies: 0 < B ≤ A / 2. For example, when B = A / 2 and the diameter of the second surface of the wafer is D, when the gripping part 3 moves the wafer to the second mounting surface 2, the distance between the chamfering mechanism 4 and the axis of the second mounting surface 2 along the radial direction of the wafer is D / 2 - A / 2. Thus, when the chamfering dimension of the chamfering mechanism 4 at the location of the chipped edge 01 is A, the chamfering dimension at the position opposite to the location of the chipped edge 01 along the radial direction of the wafer will be 0, that is, the diameter of the wafer after chamfering is DA. This further reduces the risk of the wafer diameter being smaller than the specified diameter due to chamfering, thereby effectively improving the wafer yield.

[0039] In a specific embodiment, such as Figure 2 As shown, the chamfering device also includes a detection unit 5. The user can use the detection unit 5 to detect the size and position of the chipped edge 01 on the wafer, thereby improving the movement accuracy of the first mounting surface 1 relative to the axis of the gripping part 3 towards the location of the chipped edge 01 along the radial direction of the first mounting surface 1. Furthermore, during the movement of the first mounting surface 1, the position of the wafer's center is detected to obtain the wafer's movement distance in real time, effectively improving the gripping accuracy of the gripping part 3. For example, when the chipped edge 01 of the wafer is located at the 12 o'clock position, the axis of the gripping part 3 is located between the center of the wafer and the 6 o'clock position of the wafer.

[0040] In the specific configuration of the detection unit 5, the detection unit 5 includes a center calibration sensor and a chipped edge 01 detection module. The center calibration sensor is used to detect the position of the center of the second surface, while the chipped edge 01 detection module is used to detect the size and position of the chipped edge 01. Alternatively, the chipped edge 01 detection module can be, for example, a charge-coupled device (CCD).

[0041] It is worth mentioning that the detection unit 5 is close to the first mounting surface 1 relative to the second mounting surface 2. This helps to reduce the risk of damage to the detection unit 5 or reduction in detection accuracy caused by chamfering coolant or dust generated during the wafer inspection process.

[0042] In one specific embodiment, the chamfering device further includes a first rotating shaft 6, which is disposed on one side of the first mounting surface 1 and is coaxially arranged and connected to the first mounting surface 1. When the wafer is located on the first mounting surface 1, the extension line of the axis of the first rotating shaft 6 can pass through the center of the wafer. The first rotating shaft 6 can also be used to drive the first mounting surface 1 to rotate around the axis of the first rotating shaft 6. Thus, during the process of obtaining the position and size of the chipped edge 01 on the wafer, the first mounting surface 1 can drive the wafer to rotate around its axis, while the detection unit 5 remains relatively stationary, allowing the detection unit 5 to acquire images of the wafer from different angles, thereby obtaining the position and size of the chipped edge 01.

[0043] Meanwhile, along the radial direction of the first mounting surface 1, the first rotating shaft 6 can drive the first mounting surface 1 to move relative to the axis of the gripping part 3 toward the location of the chipped edge 01, so as to improve the structural simplicity of the chamfering device while meeting the movement requirements of the first mounting part.

[0044] In addition, the chamfering device also includes a drive module, which is connected to the first rotating shaft 6 to drive the movement and rotation of the first rotating shaft 6.

[0045] It should be noted that this utility model does not limit the specific structure of the drive module. For example, the drive module includes a motor, a servo motor, and a linear guide rail. A seated bearing is fitted on the side of the first rotating shaft 6 opposite to the first mounting surface 1. The bearing seat of the seated bearing is slidably connected to the linear guide rail, and the motor is used to drive the first rotating shaft 6 to move along the linear guide rail. The servo motor is connected to the first rotating shaft 6 to drive the first rotating shaft 6 to rotate.

[0046] In a specific embodiment, such as Figure 2 As shown, the chamfering mechanism 4 includes a chamfering portion 41 and a drive shaft. The drive shaft is disposed on one side of the chamfering portion 41, and its end is connected to the chamfering portion 41. The chamfering portion 41 is used to abut against the chipped edge 01. This invention does not limit the specific form of the chamfering portion 41. For example, the chamfering portion 41 can be a grinding wheel, and the drive shaft is coaxially connected to the grinding wheel to drive its rotation. The grinding wheel abuts against the chipped edge 01 of the wafer, thus simplifying the structure of the chamfering mechanism 4 while meeting its functional requirements.

[0047] The diameter of the second mounting surface 2 is smaller than the diameter of the wafer, which helps to improve the ease of chamfering the wafer.

[0048] In one alternative implementation, such as Figure 2As shown, the chamfering device also includes a second rotating shaft 7, which is disposed on one side of the second mounting surface 2 and is coaxial with and connected to the second mounting surface 2. The second rotating shaft 7 is used to drive the second mounting surface 2 to rotate around the axis of the second rotating shaft 7. This improves the chamfering efficiency during the wafer chamfering process. At the same time, along the radial direction of the second mounting surface 2, the second rotating shaft 7 is used to drive the second mounting surface 2 to move toward or away from the chamfering mechanism 4. This is used to adjust the contact size between the chamfering mechanism 4 and the wafer according to the size of the chipped edge 01, which helps to improve the chamfering accuracy.

[0049] In addition, the chamfering device also includes a drive unit connected to the second rotating shaft 7, which can drive the second rotating shaft 7 and the second mounting surface 2 to rotate synchronously. Furthermore, along the radial direction of the second rotating shaft 7, the drive unit can drive the second rotating shaft 7 to move toward or away from the chamfered portion 41.

[0050] It is understandable that the configuration of the drive device can be referenced from the drive module, and will not be elaborated here.

[0051] In one specific embodiment, reference Figure 5 , Figure 5 This is another structural schematic diagram of the chamfering device provided by this utility model. The chamfering device also includes a support structure 8, which is arranged radially along the first mounting surface 1 and spaced apart from the first mounting surface 1, and is used to abut against the wafer. This helps to improve the mounting stability of the wafer.

[0052] In the specific configuration of the support structure 8, the support structure 8 includes a first support portion 81 and a second support portion 82. Along the radial direction of the mounting surface 1, the first mounting surface 1 is located between the first support portion 81 and the second support portion 82, and both the first support portion 81 and the second support portion 82 are used to abut against the wafer. This is beneficial for further improving the mounting stability of the wafer.

[0053] It should be noted that this utility model does not limit the structure of the first support part 81 and the second support part 82. For example, the first support part 81 and the second support part 82 can be a metal structural frame or a protrusion protruding from the surface of the worktable. This simplifies the structure of the support part while meeting its functional requirements.

[0054] In one specific embodiment, the chamfering device further includes a lifting mechanism connected to the first mounting surface 1 and along the axial direction of the first mounting surface 1. The lifting mechanism is used to drive the first mounting surface 1 to extend or retract. Specifically, the lifting mechanism can be connected to the first mounting surface 1 via a first rotating shaft 6, and the first rotating shaft 6 extends or retracts along the axial direction of the first mounting surface 1. Figure 5 As shown, the Z-direction telescoping occurs, so that the first rotating shaft 6 extends along... Figure 2When moving in the positive or negative direction of X, the first mounting surface 1 can be lifted by the lifting mechanism to separate the wafer from the support structure 8. Then the first mounting surface 1 can be moved along the X direction. This can effectively reduce the risk of the wafer being scratched by the support structure 8 during the wafer's movement.

[0055] It should be noted that this utility model does not limit the specific form of the lifting mechanism. For example, the lifting mechanism includes a cylinder, and the cylinder push rod is connected to the first rotating shaft 6 through a bearing, so as to simplify the structure of the lifting mechanism while realizing its function.

[0056] In summary, the chamfering device provided by this utility model, when the wafer is located on the first mounting surface 1 and the gripping part 3 is in contact with the wafer, achieves eccentric gripping of the wafer by setting the axis of the gripping part 3 at a distance from the center of the wafer along the radial direction of the first mounting surface 1, with the axis of the gripping part 3 away from the chipped edge 01 relative to the center of the wafer. Thus, when the gripping part 3 moves the wafer to the second mounting surface 2, by setting the gripping part 3 holding the wafer coaxially with the second mounting surface 2, eccentric mounting between the wafer and the second mounting surface 2 can be achieved. That is, along the radial direction of the second mounting surface 2, the center of the wafer is located between the axis of the second mounting surface 2 and the chipped edge 01. Therefore, during the wafer chamfering process, the chamfer size at the location of the chipped edge 01 will be larger than the chamfer size at other locations on the wafer. This effectively reduces the risk of the wafer diameter being smaller than the specified diameter due to chamfering, thereby effectively improving the wafer yield.

[0057] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A chamfering device for chamfering wafers, said wafers including chipped edges, characterized in that, The chamfering device includes a first mounting surface, a second mounting surface, a gripping part, and a chamfering mechanism, wherein: Along the radial direction of the first mounting surface, the first mounting surface and the second mounting surface are spaced apart and are respectively used to mount the wafer; When the wafer is located on the first mounting surface and the gripping part is used to contact the wafer, the axis of the gripping part is arranged at a distance from the center of the wafer along the radial direction of the first mounting surface, and is away from the chipped edge relative to the center of the wafer. When the wafer is located on the second mounting surface and the gripping part is used to contact the wafer, the gripping part is configured to be coaxially arranged with the second mounting surface; The gripping part is used to move the wafer from the first mounting surface to the second mounting surface; The chamfering mechanism is located on one side of the second mounting surface along the radial direction of the second mounting surface; and when the wafer is located on the second mounting surface, the chamfering mechanism is used to abut against the chipped edge.

2. The chamfering device according to claim 1, characterized in that, Along the radial direction of the first mounting surface, the first mounting surface is used to drive the wafer to move relative to the axis of the gripping portion toward the location of the chipped edge.

3. The chamfering device according to claim 2, characterized in that, The first mounting surface is used to move the wafer relative to the axis of the gripping part toward the direction of the chipped edge by a distance B, and B satisfies: 0 < B ≤ A / 2; A: The size of the chipped edge.

4. The chamfering device according to claim 3, characterized in that, The chamfering device also includes a detection unit, which is used to detect the position of the center of the wafer and the size and position of the chipped edge.

5. The chamfering device according to claim 4, characterized in that, The chamfering device further includes a first rotating shaft, which is disposed on one side of the first mounting surface and is coaxially arranged and connected to the first mounting surface; When the wafer is located on the first mounting surface, the extension of the axis of the first rotating shaft is used to pass through the center of the wafer; Along the radial direction of the first mounting surface, the first rotating shaft is used to drive the first mounting surface to move relative to the axis of the gripping part toward the location of the chipped edge.

6. The chamfering device according to claim 5, characterized in that, The first rotating shaft is used to drive the first mounting surface to rotate around the axis of the first rotating shaft.

7. The chamfering device according to claim 2, characterized in that, The chamfering device further includes a support structure, which is arranged radially along the first mounting surface and spaced apart from the first mounting surface, and is used to abut against the wafer.

8. The chamfering device according to claim 7, characterized in that, The support structure includes a first support portion and a second support portion, which are located radially along the first mounting surface between the first support portion and the second support portion; both the first support portion and the second support portion are used to abut against the wafer.

9. The chamfering device according to claim 7, characterized in that, The chamfering device further includes a lifting mechanism, which is connected to the first mounting surface and extends along the axial direction of the first mounting surface. The lifting mechanism is used to drive the first mounting surface to extend or retract.

10. The chamfering device according to any one of claims 1 to 9, characterized in that, The chamfering device further includes a second rotating shaft, which is disposed on one side of the second mounting surface and is coaxial with and connected to the second mounting surface; The second rotating shaft is used to drive the second mounting surface to rotate around the axis of the second rotating shaft; Along the radial direction of the second mounting surface, the second rotating shaft is used to drive the second mounting surface to move toward or away from the chamfering mechanism.

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