Computer CPU radiator

Abstract

The utility model discloses a computer CPU radiator which comprises a main board and a CPU, a radiating mechanism is detachably connected to the main board, a CPU base is fixedly connected to the upper portion of the main board, inserting holes used for fixing the radiating mechanism are formed in the four ends of the CPU base, fixing mechanisms are detachably connected into the inserting holes, and the radiating mechanism is fixedly connected to the main board through the four fixing mechanisms. The heat dissipation mechanism is matched with a jack on the CPU base; fixing can be completed only by inserting the fixing nail into the inserting hole, pressing the movable rod and enabling the rolling ball to enter the movable groove, the design does not need to be accurately aligned with the threaded groove, the problem that installation is affected by damage of the threaded groove is avoided, operation difficulty is greatly reduced for non-professional personnel, and the dismounting is convenient and fast when dismounting is needed. And the movable rod is pressed again to enable the rolling ball to return, and then the fixing mechanism can be pulled out, so that quick disassembly and replacement are realized.

Description

Technical Field

[0001] This utility model relates to the field of CPU heat sink technology, specifically a computer CPU heat sink. Background Technology

[0002] As computer performance continues to improve and CPU power consumption continues to increase, heat dissipation has become crucial for ensuring stable operation. Early CPU cooler technology was relatively simple, mostly employing passive cooling methods, such as heatsinks directly conducting heat. However, with the increasing processing speed and power of CPUs, this method could not meet the cooling requirements. As a result, active cooling technology emerged, represented by fan-assisted cooling. The combination of a fan and a heatsink accelerates heat dissipation through air convection. This requires continuous optimization of the heatsink's material and shape design, such as using materials with good thermal conductivity like copper and designing complex fin structures to increase the heat dissipation area. In the high-end field, liquid cooling technology has gradually emerged. It uses coolant to circulate in pipes, carrying the CPU heat to the heatsink and then dissipating it. Compared to air cooling, it can handle higher heat loads and is suitable for high-performance computing scenarios. Today, heatsink technology is also developing towards intelligence, automatically adjusting fan speed and other parameters based on CPU temperature to achieve a balance between efficient heat dissipation and low noise.

[0003] However, existing equipment can only fix the CPU cooler to the motherboard using bolts and threaded slots, which lacks flexibility. During installation, precise alignment of the threaded slots is required, making the operation cumbersome and difficult for non-professionals. Moreover, if the threaded slots on the motherboard are damaged, it will affect the normal installation and fixation of the cooler, which may lead to poor heat dissipation and even affect the normal operation of the CPU. At the same time, this single fixing method also limits the quick disassembly and replacement of the cooler, which is not conducive to the maintenance of the CPU or cooler.

[0004] Therefore, this utility model provides a computer CPU heat sink to solve the above problems. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a computer CPU heatsink that solves the problem mentioned above where the heatsink and motherboard can only be fixed with bolts and threaded grooves, resulting in a lack of flexibility.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: a computer CPU heat sink, including a motherboard and a CPU, a heat dissipation mechanism is detachably connected to the motherboard, a CPU socket is fixedly connected to the top of the motherboard, the CPU socket has four holes for fixing the heat dissipation mechanism, and a fixing mechanism is detachably connected inside the holes, the heat dissipation mechanism is fixedly connected to the motherboard through four fixing mechanisms, and the heat dissipation mechanism matches the holes on the CPU socket.

[0007] The fixing mechanism includes a fixing pin, a movable rod is movably connected inside the fixing pin, and a limiting plate is fixedly connected to the upper end of the movable rod. The limiting plate is fixedly connected to the upper end of the fixing pin through two elastic components, so that the movable rod can automatically reset when pressed up and down. Two movable grooves are opened at the bottom of the movable rod, and two balls are movably connected to the bottom of the fixing pin. The balls match the movable grooves, and the bottom of the fixing pin has a groove that matches the balls, so that the balls fall into the movable grooves when the movable rod moves up and down.

[0008] Preferably, the heat dissipation mechanism includes a heat sink and a bracket for fixing the heat sink. The bracket is fixed to the motherboard by a fixing mechanism, and the heat sink is fixedly connected to a cooling fan for heat exchange via a liquid pipe.

[0009] Preferably, a press cap for preventing slippage is fixedly connected to the movable rod, and the press cap has a threaded groove for preventing friction.

[0010] Preferably, the elastic component includes, but is not limited to, elastic elements such as springs and damping pads.

[0011] Preferably, the lower wall of the groove at the bottom of the fixing pin is inclined so that the ball can fall into the interior of the movable groove under the action of gravity.

[0012] Preferably, the movable rod is fixedly connected to a rubber pad at the middle position of the two movable slots to increase the fixing effect by increasing the friction between it and the two rolling balls.

[0013] This invention provides a computer CPU heatsink. Compared with the prior art, it has the following advantages:

[0014] (1) The computer CPU heatsink uses a fixed mechanism with components such as a movable rod and a ball. During installation, simply insert the fixing pin into the socket, press the movable rod, and the ball will enter the movable groove to complete the fixation. This design does not require precise alignment of the thread groove, avoiding the problem of installation being affected by damage to the thread groove. For non-professionals, the operation difficulty is greatly reduced. Moreover, when disassembly is required, pressing the movable rod again to return the ball to its original position allows the fixing mechanism to be pulled out, achieving quick disassembly and replacement. Compared with the traditional bolt and thread groove fixing method, it greatly improves the efficiency of installation and maintenance, saving time and effort.

[0015] (2) The computer CPU heat sink has a heat dissipation mechanism including a heat sink, a bracket, liquid pipes and a cooling fan. The heat sink is made of high-quality materials and combines liquid pipes and a cooling fan to achieve efficient heat exchange. The liquid pipes can quickly transfer heat, and the cooling fan accelerates heat dissipation through air convection. The bracket ensures the stable installation of the heat sink, so that the entire heat dissipation mechanism can play a better role. This configuration can dissipate the heat generated by the CPU in a timely and effective manner, keep the CPU working in a suitable temperature environment, improve the performance and stability of the computer, reduce the risk of failure caused by overheating, and extend the service life of the computer. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is an exploded view of the overall structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the overall structure of the fixing mechanism of this utility model;

[0019] Figure 4 This is a three-dimensional cross-sectional view of the fixing mechanism structure of this utility model.

[0020] In the diagram: 1. Motherboard; 2. Heat dissipation mechanism; 21. Heat sink; 22. Bracket; 23. Liquid pipe; 24. Cooling fan; 3. CPU socket; 4. CPU; 5. Fixing mechanism; 51. Fixing pin; 52. Movable rod; 53. Press cap; 54. Ball; 55. Limiting plate; 56. Elastic component; 57. Movable slot. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Example 1:

[0023] Please see Figures 1 to 4 A computer CPU heatsink includes a motherboard 1 and a CPU 4. A heatsink mechanism 2 is detachably connected to the motherboard 1. A CPU socket 3 is fixedly connected to the top of the motherboard 1. The CPU socket 3 has four holes for fixing the heatsink mechanism 2. Fixing mechanisms 5 are detachably connected inside the holes. The heatsink mechanism 2 is fixedly connected to the motherboard 1 through the four fixing mechanisms 5. The heatsink mechanism 2 matches the holes on the CPU socket 3.

[0024] The fixing mechanism 5 includes a fixing pin 51, with a movable rod 52 movably connected inside the fixing pin 51. A limit plate 55 is fixedly connected to the upper end of the movable rod 52. The limit plate 55 is fixedly connected to the upper end of the fixing pin 51 via two elastic components 56, allowing the movable rod 52 to automatically reset when pressed up and down. Two movable slots 57 are formed at the bottom of the movable rod 52, and two balls 54 are movably connected to the bottom of the fixing pin 51. The balls 54 match the movable slots 57, and the bottom of the fixing pin 51 has a groove matching the balls 54, so that the balls 54 fall into the movable slots 57 when the movable rod 52 moves up and down. Align the bracket 22 of the heat dissipation mechanism 2 with the socket on the CPU socket 3, ensuring that the four connecting parts of the bracket 22 are aligned with the socket. The four holes on the PU base 3 are aligned perfectly. Then, the fixing pin 51 of the fixing mechanism 5 is inserted into the holes. During insertion, the two rolling balls 54 at the bottom of the fixing pin 51 are in the groove at the bottom of the fixing pin 51. Through the friction between the rolling balls 54 and the groove, the rolling balls 54 can remain stable in the groove, ensuring that the rolling balls 54 can roll smoothly in subsequent operations. At the same time, there is a certain gap between the fixing pin 51 and the hole, which is to facilitate the movement and position adjustment of the rolling balls 54 in different states. Next, the movable rod 52 is pressed. During the pressing process, the force is transmitted to the entire fixing mechanism 5 through the movable rod 52. The movable rod 52 moves downward under the action of the force. At this time, the limiting plate 55 at the upper end of the movable rod 52 will compress the elastic component 56. The elastic component 56 begins to undergo elastic deformation, storing elastic potential energy. The elastic component 56 is a spring, and the spring is compressed, reducing the internal spacing. Simultaneously, the ball 54 at the bottom of the movable rod 52, under the influence of gravity and the component force of the inclined surface, is affected by the inclined lower wall of the groove at the bottom of the fixed pin 51. Because the lower wall of the groove at the bottom of the fixed pin 51 is inclined, the ball 54 rolls along the inclined surface under the action of gravity and rolls out of the groove at the bottom of the fixed pin 51. Furthermore, the bottom of the movable rod 52 has two movable grooves 57, and the ball 54 matches the movable grooves 57. Under the inertia of its own rolling and the guidance of the movable grooves 57, the ball 54 accurately enters the movable groove 57 at the bottom of the movable rod 52. When the movable rod 52 moves to the appropriate position... After positioning, release the movable rod 52. At this time, the elastic potential energy stored in the elastic component 56 begins to be released. The elastic component 56 will return to its original shape under the action of its own elastic restoring force, pushing the limit plate 55 to move upward, thereby causing the movable rod 52 to automatically reset and move upward back to the initial position. Due to the reset of the movable rod 52, the ball 54 is stuck in the movable groove 57 and cannot return to the groove at the bottom of the fixing pin 51. This is because the shape and size design of the movable groove 57 restricts the ball 54 within it after the movable rod 52 resets. At the same time, a rubber pad is fixedly connected to the movable rod 52 at the middle position of the two movable grooves 57. The rubber pad increases the friction between the two balls 54, further ensuring that the balls 54 are firmly stuck in the movable groove 57.This securely fixes the fixing mechanism 5 into the socket of the CPU socket 3, thereby stably fixing the heat dissipation mechanism 2 onto the motherboard 1.

[0025] Example 2:

[0026] Please see Figures 1 to 4 This embodiment provides a technical solution based on Embodiment 1: The heat dissipation mechanism 2 includes a heat sink 21 and a bracket 22 for fixing the heat sink 21. The bracket 22 is fixed to the motherboard 1 by a fixing mechanism 5. The heat sink 21 is fixedly connected to a heat exchange fan 24 through a liquid pipe 23. A press cap 53 for preventing slippage is fixedly connected to the movable rod 52, and the press cap 53 has an anti-friction threaded groove. The elastic component 56 includes, but is not limited to, elastic elements such as springs and damping pads. The lower wall of the groove at the bottom of the fixing nail 51 is inclined so that the rolling ball 54 can fall into the interior of the movable groove 57 under the action of gravity. A rubber pad is fixedly connected to the movable rod 52 at the middle position of the two movable grooves 57 to increase the fixing effect by increasing the friction between the movable rod 52 and the two rolling balls 54. When it is necessary to disassemble the heat dissipation mechanism 2, press the movable rod 52 again to move it downwards again. During the pressing process, the movable rod 52 compresses the elastic component 56 again, and the elastic component 56 stores elastic potential energy again. At the same time, the ball 54, guided by the spatial change of the movable groove 57 at the bottom of the movable rod 52 and the inclined lower wall of the groove at the bottom of the fixing pin 51, rolls out of the movable groove 57 and back into the groove at the bottom of the fixing pin 51. At this time, since the ball 54 has returned to the groove, the fixed connection between the fixing mechanism 5 and the socket is released, and the fixing mechanism 5 can be pulled out from the socket of the CPU base 3, thereby easily disassembling the heat dissipation mechanism 2. During the process of pulling out the fixing mechanism 5, care should be taken to keep the fixing mechanism 5 in a vertical state to avoid damage to the socket and the fixing mechanism 5 itself.

[0027] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0028] Working principle: During operation, first align the bracket 22 of the heat dissipation mechanism 2 with the socket on the CPU socket 3, ensuring that the four connecting parts of the bracket 22 are fully aligned with the four sockets on the CPU socket 3. Then, insert the fixing pin 51 of the fixing mechanism 5 into the socket. During insertion, the two rolling balls 54 at the bottom of the fixing pin 51 are in the groove at the bottom of the fixing pin 51. Through the friction between the rolling balls 54 and the groove, the rolling balls 54 can remain stable in the groove, ensuring that the rolling balls 54 can roll smoothly in subsequent operations. At the same time, there is a certain gap between the fixing pin 51 and the socket, which is to facilitate the movement and position adjustment of the rolling balls 54 in different states. Next, press the movable rod 52. During the pressing process, the force is transmitted through the movable rod 52. As the entire fixed mechanism 5 is in motion, the movable rod 52 moves downward under the action of force. At this time, the limiting plate 55 at the upper end of the movable rod 52 will compress the elastic component 56, and the elastic component 56 will begin to undergo elastic deformation, storing elastic potential energy. The elastic component 56 is a spring, and the spring will be compressed, reducing the internal spacing. At the same time, the ball 54 at the bottom of the movable rod 52 is affected by gravity and the component force of the inclined surface under the action of the inclined lower wall of the groove at the bottom of the fixed pin 51. Since the lower wall of the groove at the bottom of the fixed pin 51 is inclined, the ball 54 will roll along the inclined surface under the action of gravity and roll out of the groove at the bottom of the fixed pin 51. Moreover, there are two movable grooves 57 at the bottom of the movable rod 52, and the ball 54 matches the movable grooves 57. The ball 54 will roll out due to its own rolling inertia. Guided by the movable groove 57, the ball accurately enters the movable groove 57 at the bottom of the movable rod 52. When the movable rod 52 moves to the appropriate position, it is released. At this time, the elastic potential energy stored in the elastic component 56 begins to be released. The elastic component 56 will return to its original shape under the action of its own elastic restoring force, pushing the limit plate 55 to move upward, thereby causing the movable rod 52 to automatically reset and move upward back to the initial position. The ball 54 is stuck in the movable groove 57 due to the reset of the movable rod 52 and cannot return to the groove at the bottom of the fixing pin 51. This is because the shape and size design of the movable groove 57 restricts the ball 54 after the movable rod 52 resets. At the same time, a rubber pad is fixedly connected to the movable rod 52 in the middle position of the two movable grooves 57. The rubber pad increases the friction between the two rolling balls 54, further ensuring that the rolling balls 54 are firmly locked in the movable groove 57, thereby firmly fixing the fixing mechanism 5 in the socket of the CPU socket 3, and thus stably fixing the heat dissipation mechanism 2 to the motherboard 1. When it is necessary to disassemble the heat dissipation mechanism 2, press the movable rod 52 again to move the movable rod 52 downward again. During the pressing process, the movable rod 52 compresses the elastic component 56 again, and the elastic component 56 stores elastic potential energy again. At the same time, under the guidance of the spatial change of the movable groove 57 at the bottom of the movable rod 52 and the inclined lower wall of the groove at the bottom of the fixing pin 51, the rolling ball 54 rolls out of the movable groove 57 and back into the groove at the bottom of the fixing pin 51. At this time, since the rolling ball 54 has returned to the groove,Once the fixing mechanism 5 is released from the socket, it can be pulled out of the socket on the CPU socket 3, allowing for easy removal of the heat dissipation mechanism 2. During the removal process, care should be taken to keep the fixing mechanism 5 vertical to avoid damage to the socket or the fixing mechanism 5 itself.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A computer CPU heatsink, comprising a motherboard (1) and a CPU (4), characterized in that: A heat dissipation mechanism (2) is detachably connected to the motherboard (1), and a CPU socket (3) is fixedly connected to the top of the motherboard (1). The CPU socket (3) has four holes for fixing the heat dissipation mechanism (2) at its four ends, and a fixing mechanism (5) is detachably connected inside the holes. The heat dissipation mechanism (2) is fixedly connected to the motherboard (1) through four fixing mechanisms (5), and the heat dissipation mechanism (2) matches the holes on the CPU socket (3). The fixing mechanism (5) includes a fixing pin (51), and a movable rod (52) is movably connected inside the fixing pin (51). A limiting plate (55) is fixedly connected to the upper end of the movable rod (52). The limiting plate (55) is fixedly connected to the upper end of the fixing pin (51) through two elastic components (56) so that the movable rod (52) can automatically reset when it moves up and down. Two movable grooves (57) are opened at the bottom of the movable rod (52), and two balls (54) are movably connected to the bottom of the fixing pin (51). The balls (54) match the movable grooves (57), and the bottom of the fixing pin (51) is provided with a groove that matches the balls (54) so ​​that the balls (54) fall into the movable grooves (57) when the movable rod (52) moves up and down.

2. A computer CPU heatsink according to claim 1, characterized in that: The heat dissipation mechanism (2) includes a heat sink (21) and a bracket (22) for fixing the heat sink (21). The bracket (22) is fixed to the motherboard (1) by a fixing mechanism (5). The heat sink (21) is fixedly connected to a heat dissipation fan (24) for heat exchange by a liquid pipe (23).

3. A computer CPU heatsink according to claim 1, characterized in that: A pressing cap (53) for preventing slippage is fixedly connected to the movable rod (52), and the pressing cap (53) is provided with a threaded groove for preventing friction.

4. A computer CPU heatsink according to claim 1, characterized in that: The elastic component (56) includes, but is not limited to, springs and damping pads.

5. A computer CPU heatsink according to claim 1, characterized in that: The lower wall of the groove at the bottom of the fixing pin (51) is inclined so that the ball (54) can fall into the interior of the movable groove (57) under the action of gravity.

6. A computer CPU heatsink according to claim 1, characterized in that: The movable rod (52) is fixedly connected to a rubber pad at the middle position of the two movable grooves (57) to increase the friction between it and the two rolling balls (54).

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