Heating assembly for etching equipment
By designing a heating component with a circular main structure, the problems of low heating efficiency and easy damage to the dielectric window of the etching equipment were solved, achieving more uniform heating and higher durability, and reducing particulate contamination and dielectric window damage.
Patent Information
- Application Number
- CN202422944472.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-11-29
AI Technical Summary
Existing etching equipment with dielectric window heating methods suffers from problems such as low heat transfer efficiency, complex structure, easy damage, and unresolved issues related to the influence of the coil's capacitive electric field.
The heating component adopts a circular main structure, including an upper insulation layer, a heating layer, a shielding layer and a lower flexible thermally conductive insulation layer. It is equipped with multiple fan-shaped through holes, uses support blocks to support the heating component, and is reliably grounded through the shielding layer, thereby improving heat conduction efficiency and protecting the heating component.
It improves the heating uniformity and durability of the medium window, reduces particulate contamination, improves the plasma distribution of the medium window, and reduces the risk of damage to the medium window.
Smart Images
Figure CN223539555U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of etching equipment technology for semiconductor devices, and particularly to the field of heating components for etching equipment. Background Technology
[0002] In the semiconductor chip manufacturing process, etching equipment, such as ICP or CCP, is required to etch grooves on the surface of the wafer.
[0003] Taking an ICP etching apparatus as an example, in this apparatus, a coil couples the energy from the radio frequency (RF) power supply through a dielectric window to the plasma within the vacuum chamber via electromagnetic induction. The upper surface of the dielectric window is located in the atmosphere, while the lower surface is located within the chamber. The interface between the dielectric window and the chamber is the plasma generation and distribution area. The temperature of the dielectric window affects the uniformity of plasma distribution and particle deposition. Simultaneously, the strong capacitive electric field of the planar coil forms a thick capacitive RF sheath layer beneath the dielectric window. The plasma is accelerated to high energies and then impacts the dielectric window surface, causing sputtering, resulting in particle contamination and damage to the dielectric window.
[0004] In existing technologies, heating medium windows generally use side heating strips or hot air heating. However, side heating strips are structurally limited and have low heat transfer efficiency, while hot air heating involves complex duct structures and does not mitigate the influence of the coil's capacitive electric field. Even when using heating wires to heat the medium window, there are problems such as poor adhesion, easy damage, and complex shielding port connections. Utility Model Content
[0005] The purpose of this invention is to provide a heating component for etching equipment to solve the above-mentioned problems.
[0006] To achieve the above objectives, this utility model is implemented through the following technical solution:
[0007] This utility model provides a heating component for etching equipment, comprising: a circular body;
[0008] The circular body includes:
[0009] Upper insulating layer;
[0010] A heating layer is disposed below the upper insulating layer;
[0011] A shielding layer is disposed below the heating layer;
[0012] A lower flexible thermally conductive insulating layer is disposed below the shielding layer;
[0013] The circular body has multiple fan-shaped through holes arranged circumferentially along its body; the shielding layer has a larger diameter than the heating layer, so as to form an exposed portion at the circumferential edge of the circular body.
[0014] Optionally, the thickness D of the circular body is 1mm < D ≤ 5mm.
[0015] Optionally, the thickness d of the heating layer is 0.1 mm < d ≤ 1 mm.
[0016] Optionally, the shielding layer includes at least two shielding sheets, each shielding sheet including a circumferential extension and a radial extension connected to the circumferential extension.
[0017] Optionally, the heating layer includes at least two heating elements, each heating element including a circumferential extension and a radial extension connected to the circumferential extension.
[0018] Optionally, the number of heating elements is four, and the heating elements are electrically connected to each other.
[0019] Optionally, the number of shielding plates is four, and the shielding plates are disconnected from each other.
[0020] Optionally, the shielding sheet and the heating sheet have the same shape.
[0021] Optionally, the radial extension portion of the shielding sheet includes at least two long radial extension portions and at least two short radial extension portions, wherein the at least one short radial extension portion is disposed between the two long radial extension portions.
[0022] Optionally, the radial extension portion of the heating element includes at least two long radial extension portions and at least two short radial extension portions, wherein the at least one short radial extension portion is disposed between the two long radial extension portions.
[0023] Optionally, the circumferential width of the circumferential extension of the shielding sheet is greater than the circumferential width of the circumferential extension of the heating sheet, so as to form an exposed portion at the circumferential edge of the circular body.
[0024] Optionally, the downward projection of the upper insulating layer covers the downward projection of the heating layer and the shielding layer.
[0025] Optionally, the diameter of the lower flexible thermally conductive insulating layer is larger than the diameter of the upper insulating layer.
[0026] Optionally, the upper insulating layer and the lower flexible thermally conductive insulating layer have the same shape, both being spoke-shaped.
[0027] This utility model also provides an etching apparatus, comprising:
[0028] Chamber;
[0029] A base, wherein the base is disposed within the cavity;
[0030] A medium window is disposed above the chamber;
[0031] The heating assembly for the etching equipment described above is disposed on the upper surface of the dielectric window;
[0032] A pressure plate, which is disposed above the heating assembly, is used to fix the heating assembly to the medium window;
[0033] The medium window or pressure plate is provided with a support block, which is configured to pass through the fan-shaped through hole.
[0034] Compared with the prior art, the present invention has the following advantages:
[0035] This utility model features a fan-shaped through hole, which facilitates the support block to support the heating component and prevents the heating component from being squeezed by excessive force. At the same time, the exposed part allows the shielding layer to be reliably grounded. Attached Figure Description
[0036] To more clearly illustrate the technical solution of this utility model, the drawings used in the description will be briefly introduced below. Obviously, the drawings in the following description are one embodiment of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort:
[0037] Figure 1 This is a schematic diagram of the etching equipment of this utility model;
[0038] Figure 2 This is a three-dimensional structural diagram of the heating component of this utility model;
[0039] Figure 3 This is a cross-sectional schematic diagram of the heating component of this utility model;
[0040] Figure 4 This is an exploded view of the heating component of this utility model;
[0041] Figure 5 This is a schematic diagram of the heating layer of this utility model;
[0042] Figure 6 This is a schematic diagram of the shielding layer of this utility model;
[0043] Figure 7 This is a schematic diagram of the combination of the heating layer and the shielding layer of this utility model. Detailed Implementation
[0044] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, further illustrates the proposed solution of this utility model. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, intended only to facilitate and clearly illustrate the embodiments of this utility model. Please refer to the drawings to make the objectives, features, and advantages of this utility model more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this utility model, should still fall within the scope of the technical content disclosed in this utility model.
[0045] Figure 1 A schematic diagram of the etching apparatus of this utility model is shown; taking ICP as an example, such as... Figure 1 As shown, the etching apparatus includes: a chamber 201, a base 202, a dielectric window 203, a heating assembly 100, and a pressure plate (not shown). The chamber 201 is used to process wafers and perform etching processes on them. The base 202 is disposed within the chamber 201; the dielectric window 203 is disposed above the chamber 201; the heating assembly 100 is disposed on the upper surface of the dielectric window 203 and is used to control the temperature of the dielectric window 203; the pressure plate is disposed above the heating assembly 100 and is used to fix the heating assembly to the dielectric window 203.
[0046] The etching apparatus further includes a process gas source 208, a coil, a coil support 204, a first plasma source 205, a second plasma source 206, a matching device 207, and a controller 209. The process gas source 208 is connected to the dielectric window 203 via a pipeline to deliver process gas into the chamber 201. The coil is positioned above the heating assembly 100 and is fixed above the chamber 201 by the coil support 204. The first plasma source 205 is connected to the coil via the matching device to transmit radio frequency signals to the coil, thereby generating plasma within the chamber 201 during the etching process. The second plasma source 206 is connected to the electrodes within the base via the matching device 207. The controller 209 is connected to both the first plasma source 205 and the second plasma source 206 to control them.
[0047] Figure 2-3 A schematic diagram of the heating assembly of this utility model is shown, as follows: Figure 2-3As shown, the heating assembly 100 includes: a circular body; the circular body includes: an upper insulating layer 110, a heating layer 120, a shielding layer 130 and a lower flexible thermally conductive insulating layer 140; the heating layer 120 is disposed below the upper insulating layer 110, the shielding layer 130 is disposed below the heating layer 120, and the lower flexible thermally conductive insulating layer 140 is disposed below the shielding layer 130.
[0048] The circular main body is provided with a plurality of fan-shaped through holes 160 arranged circumferentially on the main body. Support blocks are provided on the medium window 203 or the pressure plate, for example, on the upper surface of the medium window or the lower surface of the pressure plate. Multiple support blocks are configured, for example, the same number as the number of fan-shaped through holes 160. The support blocks are configured to pass through the fan-shaped through holes 160 to provide support for the heating component. More preferably, the shape of the support blocks is the same as the shape of the fan-shaped through holes 160; more preferably, their sizes are matched. Both the fan-shaped through holes 160 and the support blocks are evenly distributed circumferentially. Since the heating component 100 is very thin and is fixed to the medium window 203 by the pressure plate, the support blocks between the medium window 203 and the pressure plate effectively protect the heating component from damage.
[0049] See appendix for further details. Figure 2 The diameter of the shielding layer 130 is larger than the diameter of the heating layer 120, forming an exposed portion 151 at the circumferential edge of the circular body. More preferably, the diameter of the shielding layer 130 is also larger than the diameter of the upper insulating layer 110, which has the same diameter as the heating layer 120. This exposed portion 151 provides a larger grounding area with the external grounding, resulting in a more reliable connection.
[0050] Preferably, the thickness D of the circular body is 1mm < D ≤ 5mm. The thickness d of the heating layer is 0.1mm < d ≤ 1mm. The heating layer 120 is made of PI or PTFE material, which can achieve an ultra-thin heating layer. The lower flexible thermally conductive insulating layer 140 is made of silicone cloth, which has good flexibility and thermal conductivity. The flexibility promotes better adhesion, thereby improving heat conduction efficiency. The shielding layer is made of metal, such as aluminum.
[0051] Figure 4 An exploded view of the heating assembly is shown. Figure 5-7 A schematic diagram of the shielding layer and the heating layer is shown, as follows: Figure 4-7As shown, the shielding layer includes at least two shielding sheets 131. Preferably, there are four shielding sheets 131 arranged in a roughly circular shape. Each shielding sheet 131 includes a circumferential extension portion 132 and a radial extension portion connected to the circumferential extension portion. One end of the radial extension portion is connected to the circumferential extension portion, and the other end is unoccupied. Optionally, the radial extension portion of the shielding sheet includes at least two long radial extension portions 134 and at least two short radial extension portions 133, with at least one short radial extension portion 133 disposed between two long radial extension portions 134. Optionally, the short radial extension portions 133 and long radial extension portions 134 are spaced apart, with three short radial extension portions 133 and three long radial extension portions 134.
[0052] The heating layer includes at least two heating elements 121, preferably four heating elements 121 arranged in a roughly circular shape. Each heating element 121 includes a circumferential extension 122 and a radial extension connected to the circumferential extension. One end of the radial extension is connected to the circumferential extension, and the other end is unoccupied. Optionally, the radial extension of the heating element 121 includes at least two long radial extensions 124 and at least two short radial extensions 123, with at least one short radial extension disposed between two long radial extensions. Optionally, the short radial extensions 133 and long radial extensions 134 are spaced apart, with three short radial extensions 133 and three long radial extensions 134.
[0053] A fan-shaped through hole 160 is formed between the shielding plate 131 and the radial extension of the heating plate.
[0054] Optionally, the shielding sheet 131 and the heating sheet 121 have the same shape. The four heating sheets are electrically connected, for example, in series. The four shielding sheets are disconnected (i.e., not connected) to prevent the generation of an induced loop current opposite to the direction of the coil current, which would have a thermal effect. The shielding sheets 131 are disconnected by a break portion 152 extending radially.
[0055] like Figure 7 As shown, the circumferential width of the circumferential extension of the shielding sheet 131 is greater than the circumferential width of the circumferential extension of the heating sheet 121, so as to form an exposed portion 151 at the circumferential edge of the circular body.
[0056] Further optional, such as Figure 4As shown, the downward projection of the upper insulating layer 110 covers the downward projections of the heating layer 120 and the shielding layer 130. The upper insulating layer 110 and the lower flexible thermally conductive insulating layer 140 have the same shape, both being spoke-shaped. The diameter of the lower flexible thermally conductive insulating layer 140 is larger than the diameter of the upper insulating layer. Fan-shaped through holes 160 are formed between the spokes of the upper insulating layer 110 and the lower flexible thermally conductive insulating layer 140.
[0057] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. Additionally, the term "connection" in this document indicates a direct connection between A and B, or an indirect connection between A and B, such as an indirect connection between A and B via C, or even via C and D, or more components. The connection between A and B can be integral or separate, detachable or fixed. The term "optional" in this document indicates that the technical feature can be combined with or not combined with any feature in the document.
[0058] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.
Claims
1. A heating assembly for an etching apparatus, characterized in that, include: Circular main body; The circular body includes: Upper insulating layer; A heating layer is disposed below the upper insulating layer; A shielding layer is disposed below the heating layer; A lower flexible thermally conductive insulating layer is disposed below the shielding layer; The circular body has multiple fan-shaped through holes arranged circumferentially along its body; the shielding layer has a larger diameter than the heating layer, so as to form an exposed portion at the circumferential edge of the circular body.
2. The heating assembly for etching equipment as described in claim 1, characterized in that, The thickness D of the circular body is 1mm < D ≤ 5mm.
3. The heating assembly for etching equipment as described in claim 1, characterized in that, The thickness d of the heating layer is 0.1mm < d ≤ 1mm.
4. The heating assembly for etching equipment as described in claim 1, characterized in that, The shielding layer includes at least two shielding sheets, each shielding sheet including a circumferential extension portion and a radial extension portion connected to the circumferential extension portion.
5. The heating assembly for etching equipment as described in claim 4, characterized in that, The heating layer includes at least two heating elements, each heating element comprising a circumferential extension portion and a radial extension portion connected to the circumferential extension portion.
6. The heating assembly for etching equipment as described in claim 5, characterized in that, The number of heating elements is 4, and the heating elements are electrically connected to each other.
7. The heating assembly for etching equipment as described in claim 4, characterized in that, The shielding plates consist of four pieces, and the shielding plates are disconnected from each other.
8. The heating assembly for etching equipment as described in claim 5, characterized in that, The shielding sheet and the heating sheet have the same shape.
9. The heating assembly for etching equipment as described in claim 5, characterized in that, The radial extension portion of the shielding sheet includes at least two long radial extension portions and at least two short radial extension portions, wherein at least one short radial extension portion is disposed between the two long radial extension portions.
10. The heating assembly for etching equipment as described in claim 9, characterized in that, The radial extension portion of the heating element includes at least two long radial extension portions and at least two short radial extension portions, wherein at least one short radial extension portion is disposed between the two long radial extension portions.
11. The heating assembly for etching equipment as described in claim 10, characterized in that, The circumferential width of the shielding sheet is greater than the circumferential width of the heating sheet, so as to form an exposed portion at the circumferential edge of the circular body.
12. The heating assembly for etching equipment as claimed in claim 1, characterized in that, The downward projection of the upper insulating layer covers the downward projection of the heating layer and the shielding layer.
13. The heating assembly for etching equipment as described in claim 12, characterized in that, The diameter of the lower flexible thermally conductive insulating layer is larger than the diameter of the upper insulating layer.
14. The heating assembly for etching equipment as described in claim 12, characterized in that, The upper insulating layer and the lower flexible thermally conductive insulating layer have the same shape, both being spoke-shaped.
15. An etching apparatus, characterized in that, include: chamber; A base, wherein the base is disposed within the cavity; A medium window is disposed above the chamber; The heating assembly for an etching apparatus as described in any one of claims 1-14, wherein the heating assembly is disposed on the upper surface of the dielectric window; A pressure plate, which is disposed above the heating assembly, is used to fix the heating assembly to the medium window; in, A support block is provided on the medium window or pressure plate, and the support block is configured to pass through the fan-shaped through hole.