Semiconductor diode processing equipment

By introducing an automatic dispensing machine and a drying plate structure into semiconductor diode processing equipment, the dispensing and curing processes can be carried out simultaneously, solving the problems of low dispensing efficiency and high cost in existing equipment, and improving production efficiency and automation.

CN223539569UActive Publication Date: 2025-11-11DONGGUAN GUANJING ELECTRONICS CO LTD
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Patent Information

Application Number
CN202422956299.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-02
Publication Date
2025-11-11
Estimated Expiration
2034-12-02

AI Technical Summary

Technical Problem

Existing semiconductor diode processing equipment suffers from low dispensing efficiency, high equipment costs, long processing cycles, and low work efficiency.

Method used

A semiconductor diode processing equipment was designed, which adopts an automatic dispensing machine and a drying plate structure to realize the simultaneous operation of dispensing and curing processes. The diodes are dried at close range, uniformly and efficiently through a U-shaped drying tube and a drying plate, optimizing the overall structure and improving the degree of automation.

Benefits of technology

It improves dispensing efficiency and production efficiency, reduces equipment costs, shortens the production cycle, and ensures dispensing uniformity and drying effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the field of diode processing equipment, in particular to semiconductor diode processing equipment, which comprises a support frame, a conveying belt is arranged between the two supporting frames, an adjusting frame is fixedly connected to the upper ends of the supporting frames, an adjusting cavity is formed in the adjusting frame, a two-way threaded rod is rotatably connected to the inner side of the adjusting cavity, moving blocks are in threaded connection to the two ends of the outer side of the two-way threaded rod, and the lower ends of the moving blocks are fixedly connected with the machining base; an automatic dispensing machine is arranged at the rear end of the machining base, and a U-shaped drying pipe is fixedly connected to the front end of the machining base through a fixing block. Through the use of the processing seat and the drying plate, the drying plate continuously dries the diode from the bottom of the processing station, the curing process of the diode is accelerated, the upper and lower surfaces of the diode are subjected to close-distance drying for dispensing, the drying is uniform and efficient, the required heat is small, the dispensing and curing procedures are simultaneously operated, the overall structure is optimized, the automation degree is high, and the device cost is reduced; the production period is shortened.
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Description

Technical Field

[0001] This utility model relates to the field of diode processing equipment, and more particularly to semiconductor diode processing equipment. Background Technology

[0002] A diode is an electronic device made of semiconductor materials. By connecting diodes with components such as resistors, capacitors, and inductors, different functional circuits can be formed. Semiconductor diode processing equipment is a key tool specifically used to manufacture and process semiconductor diodes. This equipment covers multiple stages of diode production, including transfer, clamping, cutting, and encapsulation.

[0003] Existing semiconductor diode processing equipment has a relatively simple structure. In the diode production process, a dispensing process is required. The dispensing device is fixed and difficult to adjust. Uneven dispensing affects dispensing efficiency. After dispensing, the glue is usually transferred to a drying oven for curing. The glue is easily affected by the environment during the transfer process, which is time-consuming and labor-intensive. Multiple devices need to be operated in coordination, resulting in high equipment costs and long diode processing production cycles with low work efficiency.

[0004] Therefore, to address the problems of low dispensing efficiency, high equipment cost, long processing cycle, and low work efficiency of existing diode processing equipment, semiconductor diode processing equipment can be designed to improve dispensing efficiency. The equipment can be dispensing and drying the upper and lower surfaces at close range, resulting in uniform and efficient drying with low heat requirements. The dispensing and curing processes can be carried out simultaneously, optimizing the overall structure and achieving a high degree of automation. This reduces equipment costs, shortens the production cycle, and improves production efficiency. Utility Model Content

[0005] To overcome the problems of low dispensing efficiency, high equipment cost, long processing cycle and low work efficiency of existing diode processing equipment.

[0006] The technical solution of this utility model is as follows: a semiconductor diode processing equipment, including a support frame; it also includes a processing seat and a drying plate. A conveyor belt is arranged between the two support frames. An adjustment frame is fixedly connected to the upper end of the support frame. An adjustment cavity is opened inside the adjustment frame. A bidirectional threaded rod is rotatably connected to the inner side of the adjustment cavity. Moving blocks are threaded to both ends of the outer side of the bidirectional threaded rod. A processing seat is fixedly connected to the lower end of the moving blocks. An automatic dispensing machine is arranged at the rear end of the processing seat. A U-shaped drying tube is fixedly connected to the front end of the processing seat through a fixing block. A processing plate is arranged at the upper end of the conveyor belt. A processing position is fixedly connected to the upper end of the processing plate. A drying plate is arranged inside the conveyor belt.

[0007] Preferably, the processing plate and processing position move along the conveyor belt, and the rotating bidirectional threaded rod drives the processing seat to move relative to each other along the adjustment cavity and move the same distance. Two automatic dispensing machines simultaneously perform the dispensing process on the diodes in the same row of processing positions. Hot air dries the diodes above the dispensing position immediately through the U-shaped drying tube, and the drying plate continuously dries the diodes from the bottom of the processing position.

[0008] Preferably, an adjustment motor is fixedly connected to the upper side of the right end of the adjustment frame, and the output shaft of the adjustment motor is fixedly connected to the bidirectional threaded rod.

[0009] Preferably, the moving block is slidably connected to the inner wall of the adjustment cavity, the processing seat is arranged in an L-shape, and a lifting cylinder is fixedly connected to the lower end of the processing seat.

[0010] Preferably, the output end of the lifting cylinder is fixedly connected to a mounting base, the front end of the mounting base is slidably connected to the rear end of the processing base, and the lower end of the mounting base is fixedly connected to the upper end of the automatic dispensing machine.

[0011] Preferably, there are multiple processing positions arranged in an array, with a limiting groove at the upper end of each processing position. Each processing position is connected to the processing plate with multiple ventilation holes, and each ventilation hole is connected to the corresponding limiting groove.

[0012] Preferably, a hot air blower is fixedly connected to the upper end of the left support frame and to the front of the adjustment frame. A diversion pipe is fixedly connected to the air outlet of the hot air blower. A drying hose is fixedly connected to the rear end of the diversion pipe. The end of the drying hose away from the diversion pipe is connected to two U-shaped drying pipes respectively.

[0013] Preferably, the left and right ends of the drying plate are fixedly connected to the support frame, the front end of the drying plate and the diversion pipe are connected by a connecting pipe, the upper end of the drying plate is provided with drying holes, and the surface of the conveyor belt is uniformly provided with holes.

[0014] The beneficial effects of this utility model are:

[0015] This semiconductor diode processing equipment, through the use of a processing base and a drying plate, allows two automatic dispensing machines to simultaneously perform a sequential dispensing process on diodes in the same row of processing positions. This facilitates adjustment of the dispensing position, ensures uniform dispensing, and achieves high dispensing efficiency. Hot air passes through a U-shaped drying tube to instantly dry the top of the dispensed diodes, enabling rapid shaping. The drying plate continuously dries the diodes from the bottom of the processing position, accelerating their curing process. The close-range drying of the dispensing from both the top and bottom ensures uniform and efficient drying with low heat requirements. The simultaneous operation of the dispensing and curing processes optimizes the overall structure, resulting in a high degree of automation, reduced equipment costs, shorter production cycles, and improved production efficiency. Attached Figure Description

[0016] Figure 1The diagram shown is a three-dimensional representation of the semiconductor diode processing equipment of this utility model. Figure 1 ;

[0017] Figure 2 The diagram shown is a three-dimensional representation of the semiconductor diode processing equipment of this utility model. Figure 2 ;

[0018] Figure 3 The diagram shown is a schematic representation of the adjustment frame structure of the semiconductor diode processing equipment of this utility model.

[0019] Figure 4 The diagram shown is a schematic representation of the processing position structure of the semiconductor diode processing equipment of this utility model.

[0020] Figure 5 The diagram shown is a schematic representation of the drying plate structure of the semiconductor diode processing equipment of this utility model.

[0021] Explanation of reference numerals in the attached drawings: 1. Support frame; 2. Conveyor belt; 3. Adjusting frame; 4. Adjusting cavity; 5. Bidirectional threaded rod; 6. Moving block; 7. Processing seat; 8. Automatic dispensing machine; 9. U-shaped drying tube; 10. Processing plate; 11. Processing position; 12. Drying plate; 13. Adjusting motor; 14. Lifting cylinder; 15. Mounting seat; 16. Limiting groove; 17. Vent hole; 18. Hot air blower; 19. Diverter pipe; 20. Drying hose; 21. Connecting pipe. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Please see Figures 1-5This utility model provides an embodiment of a semiconductor diode processing equipment, including a support frame 1; it also includes a processing seat 7 and a drying plate 12. A conveyor belt 2 is arranged between the two support frames 1. An adjusting frame 3 is fixedly connected to the upper end of the support frame 1. An adjusting cavity 4 is opened inside the adjusting frame 3. A bidirectional threaded rod 5 is rotatably connected to the inner side of the adjusting cavity 4. Moving blocks 6 are threaded to both ends of the outer side of the bidirectional threaded rod 5. The processing seat 7 is fixedly connected to the lower end of the moving block 6. An automatic dispensing machine 8 is arranged at the rear end of the processing seat 7. A U-shaped drying tube 9 is fixedly connected to the front end of the processing seat 7 through a fixing block. A processing plate 10 is arranged at the upper end of the conveyor belt 2. A processing position 11 is fixedly connected to the upper end of the processing plate 10. The drying plate 12 is arranged inside the conveyor belt 2. In use, the processing plate 10... The processing station 11 moves along the conveyor belt 2, and the rotating bidirectional threaded rod 5 drives the processing seat 7 to move relative to the adjustment cavity 4 and move the same distance. Two automatic dispensing machines 8 simultaneously perform the dispensing process on the diodes in the same row of processing stations 11, which facilitates the adjustment of the dispensing position, ensures uniform dispensing, and has high dispensing efficiency. Hot air passes through the U-shaped drying tube 9 to dry the top of the dispensed diodes immediately, quickly shaping them. The drying plate 12 continuously dries the diodes from the bottom of the processing station 11, accelerating their curing process and preventing the diodes from sticking to the processing station 11 and affecting the feeding. The dispensing and curing processes are carried out at close range from both the top and bottom, resulting in uniform and efficient drying with low heat requirements. The dispensing and curing processes run simultaneously, optimizing the overall structure, increasing the degree of automation, reducing equipment costs, shortening the production cycle, and improving production efficiency.

[0024] Please see Figure 1 , Figure 2 and Figure 3 In this embodiment, an adjustment motor 13 is fixedly connected to the upper right side of the adjustment frame 3. The output shaft of the adjustment motor 13 is fixedly connected to the bidirectional threaded rod 5. The adjustment motor 13 drives the bidirectional threaded rod 5 to rotate. The moving block 6 is slidably connected to the inner wall of the adjustment cavity 4. The processing seat 7 is arranged in an L-shape. The lower end of the processing seat 7 is fixedly connected to a lifting cylinder 14. The moving block 6 drives the processing seat 7 below to move synchronously, and the structure is stable. The output end of the lifting cylinder 14 is fixedly connected to a mounting seat 15. The front end of the mounting seat 15 and the rear end of the processing seat 7 are slidably connected. The lower end of the mounting seat 15 is fixedly connected to the upper end of the automatic dispensing machine 8. The lifting cylinder 14 drives the processing seat 7 and the automatic dispensing machine 8 to move up and down, adapting to the dispensing needs of different heights and positions, accurately controlling and improving the dispensing accuracy.

[0025] Please see Figure 1 , Figure 4 and Figure 5In this embodiment, multiple processing positions 11 are arranged in an array. A limiting groove 16 is formed at the upper end of each processing position 11. Multiple ventilation holes 17 are formed through each processing position 11 and the processing plate 10. Each ventilation hole 17 is connected to the corresponding limiting groove 16. When a diode is placed in the limiting groove 16, it is automatically centered. The relative positions of multiple processing positions 11 are fixed to improve the accuracy of dispensing. Hot air dries the diode through the ventilation holes 17. A hot air blower 18 is fixedly connected to the upper end of the left support frame 1 and to the front of the adjustment frame 3. A diverter pipe 19 is fixedly connected to the air outlet of the hot air blower 18. A drying hose 2 is fixedly connected to the rear end of the diverter pipe 19. 0. The end of the drying hose 20 away from the split pipe 19 is connected to two U-shaped drying pipes 9 respectively. The hot air blower 18 delivers hot air through the split pipe 19 and the drying hose 20 to the two U-shaped drying pipes 9 to dry the diodes from above. The left and right ends of the drying plate 12 are fixedly connected to the support frame 1 respectively. The front end of the drying plate 12 and the split pipe 19 are connected by the connecting pipe 21. The upper end of the drying plate 12 is provided with drying holes. The surface of the conveyor belt 2 is evenly provided with holes. The hot air blower 18 delivers hot air through the split pipe 19 and the connecting pipe 21 to the drying plate 12, and continuously dries the diodes transported on the conveyor belt 2 through the drying holes at the upper end of the drying plate 12.

[0026] During operation, the processing plate 10 and processing position 11 move along the conveyor belt 2. The regulating motor 13 drives the bidirectional threaded rod 5 to rotate. The moving block 6 drives the processing seat 7 below to move synchronously along the regulating cavity 4 and move the same distance. The lifting cylinder 14 drives the processing seat 7 and the automatic dispensing machine 8 to move up and down. The two automatic dispensing machines 8 simultaneously perform a sequential dispensing process on the diodes in the same row of processing positions 11, which facilitates adjustment of the dispensing position, ensures uniform dispensing, and has high dispensing efficiency. At the same time, the hot air fan 18 delivers hot air to the two U-shaped drying tubes through the split pipe 19. Inside tube 9, the diodes that have been glued are dried immediately above them, allowing for rapid shaping. The glue dispensing and curing processes are completed by moving the processing seat 7, optimizing the overall structure, increasing automation, and reducing equipment costs. Hot air continuously dries the diodes transported on the conveyor belt 2 from the bottom of the processing station 11 through the drying plate 12, accelerating their curing process. The glue dispensing and drying are done at close range on both the top and bottom sides, resulting in uniform and efficient drying with low heat requirements, reducing production costs, shortening the production cycle, improving production efficiency, improving product quality, and preventing the diodes from sticking to the processing station 11 and affecting the unloading process.

[0027] Through the above steps, the use of processing base 7 and drying plate 12 allows for close-range drying of the adhesive on both the upper and lower surfaces, resulting in uniform and efficient drying with low heat requirements. The adhesive dispensing and curing processes operate simultaneously, optimizing the overall structure and increasing automation. This reduces equipment costs, shortens the production cycle, and improves production efficiency, thus solving the problems of low adhesive dispensing efficiency, high equipment costs, long processing cycles, and low work efficiency in existing diode processing equipment.

Claims

1. A semiconductor diode processing apparatus, comprising a support frame (1); characterized in that: It also includes a processing seat (7) and a drying plate (12). A conveyor belt (2) is set between the two support frames (1). An adjustment frame (3) is fixedly connected to the upper end of the support frame (1). An adjustment cavity (4) is opened inside the adjustment frame (3). A two-way threaded rod (5) is rotatably connected to the inner side of the adjustment cavity (4). A moving block (6) is threaded to both ends of the outer side of the two-way threaded rod (5). A processing seat (7) is fixedly connected to the lower end of the moving block (6). An automatic dispensing machine (8) is set at the rear end of the processing seat (7). A U-shaped drying tube (9) is fixedly connected to the front end of the processing seat (7) through a fixed block. A processing plate (10) is set at the upper end of the conveyor belt (2). A processing position (11) is fixedly connected to the upper end of the processing plate (10). A drying plate (12) is set inside the conveyor belt (2).

2. The semiconductor diode processing equipment according to claim 1, characterized in that: An adjustment motor (13) is fixedly connected to the upper right side of the adjustment frame (3), and the output shaft of the adjustment motor (13) is fixedly connected to the bidirectional threaded rod (5).

3. The semiconductor diode processing equipment according to claim 1, characterized in that: The moving block (6) is slidably connected to the inner wall of the adjusting cavity (4), the processing seat (7) is set in an L-shaped structure, and the lower end of the processing seat (7) is fixedly connected to the lifting cylinder (14).

4. The semiconductor diode processing equipment according to claim 3, characterized in that: The output end of the lifting cylinder (14) is fixedly connected to the mounting base (15). The front end of the mounting base (15) is slidably connected to the rear end of the processing base (7), and the lower end of the mounting base (15) is fixedly connected to the upper end of the automatic dispensing machine (8).

5. The semiconductor diode processing equipment according to claim 1, characterized in that: The processing positions (11) are arranged in an array. A limiting groove (16) is opened at the upper end of the processing position (11). Each processing position (11) and the processing plate (10) are provided with multiple ventilation holes (17), and each ventilation hole (17) and the corresponding limiting groove (16) are connected.

6. The semiconductor diode processing equipment according to claim 1, characterized in that: A hot air blower (18) is fixedly connected to the upper end of the left support frame (1) and to the front of the adjustment frame (3). A diversion pipe (19) is fixedly connected to the air outlet of the hot air blower (18). A drying hose (20) is fixedly connected to the rear end of the diversion pipe (19). The end of the drying hose (20) away from the diversion pipe (19) is connected to two U-shaped drying pipes (9).

7. The semiconductor diode processing equipment according to claim 6, characterized in that: The left and right ends of the drying plate (12) are fixedly connected to the support frame (1), and the front end of the drying plate (12) and the diversion pipe (19) are connected by the connecting pipe (21). The upper end of the drying plate (12) is provided with drying holes, and the surface of the conveyor belt (2) is uniformly provided with holes.