Shooting equipment

Abstract

The utility model discloses a shooting device comprising a plastic housing, a heat conduction assembly and a shooting module, the shooting module comprises a metal lens barrel, a lens module and a mainboard, the metal lens barrel is installed on a front panel of the plastic housing, the lens module is located in the plastic housing and is installed on the metal lens barrel, and the mainboard is installed on the plastic housing. The heat conduction assembly is arranged in the plastic shell and electrically connected with the mainboard, and the mainboard is located in the plastic shell and is in heat conduction connection with a front panel of the plastic shell through the heat conduction assembly. Most of heat generated when the shooting equipment works can be conducted to the front panel, which is less contacted by a user, in the plastic shell through the heat conduction assembly for heat dissipation, and part of heat can be directly conducted to the metal lens barrel for heat dissipation, so that directional and quantitative heat conduction can be carried out on areas which are possibly touched by the user when the user takes the shooting equipment; while the heat dissipation requirement of the whole machine of the product is met, different areas of the shell can have appropriate heat dissipation temperatures, so that the touch temperature is appropriate when a user takes the product.

Description

Technical Field

[0001] This utility model relates to the field of camera technology, and in particular to a shooting device. Background Technology

[0002] Current small camera products typically employ a heat dissipation design where the chip directly conducts heat to the surrounding casing via thermal grease / gel. However, as small camera products become smaller and more feature-rich, the computing power of the chips increases significantly. Therefore, it's necessary to conduct heat as much as possible to the surrounding area within a limited space. While an all-metal casing provides good heat dissipation, the high thermal conductivity of metal means the accumulated heat on the surface can easily make the product extremely hot to the touch. Conversely, a plastic casing presents significant thermal resistance, making it difficult to meet the heat dissipation requirements of small cameras and potentially leading to overheating and shutdown during shooting. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a shooting device with better heat dissipation and a more suitable touch temperature.

[0004] To solve the above-mentioned technical problems, this utility model provides a shooting device, including a plastic housing, a heat-conducting component, and a camera module. The camera module includes a metal lens barrel, a lens module, and a motherboard. The metal lens barrel is mounted on the front panel of the plastic housing. The lens module is located inside the plastic housing and mounted on the metal lens barrel, and is electrically connected to the motherboard. The motherboard is located inside the plastic housing and is thermally connected to the front panel of the plastic housing through the heat-conducting component.

[0005] A further technical solution is as follows: the shooting device also includes metal heat dissipation fins located inside the plastic housing, the metal heat dissipation fins being located between the motherboard and the rear panel of the plastic housing, and the metal heat dissipation fins being in contact with the motherboard.

[0006] The further technical solution is as follows: the shooting device also includes a fourth heat-conducting component, and the motherboard is thermally connected to the metal heat sink fins through the fourth heat-conducting component.

[0007] The further technical solution is as follows: the heat conduction component includes a first heat conduction element and a second heat conduction element, the motherboard is located on one side of the lens module, the first heat conduction element is connected between the motherboard and the lens module, the second heat conduction element is located on the other side of the lens module, and is thermally connected between the lens module and the front panel of the plastic housing.

[0008] The further technical solution is as follows: the heat-conducting component also includes a third heat-conducting element, and the motherboard is also heat-conductingly connected to the second heat-conducting element through the third heat-conducting element.

[0009] The further technical solution is as follows: the lens module includes a lens control board and a lens connected to the lens control board. The main board is located on the side of the lens control board away from the lens. The first heat-conducting component is disposed between the main board and the lens control board. The second heat-conducting component is located on the side of the lens control board connected to the lens and is thermally connected to the front panel of the lens control board and the plastic housing.

[0010] A further technical solution is as follows: one side of the second heat-conducting component is attached to the lens control plate around the lens, and the other side is attached to the inner wall of the front panel of the plastic housing.

[0011] The further technical solution is as follows: the second thermal conductive component is a thermally conductive metal component, and the first thermal conductive component is thermally conductive silicone grease.

[0012] A further technical solution is as follows: a second thermal grease is provided between the second thermal conductive element and the upper part of the lens control board.

[0013] The further technical solution is as follows: the second heat-conducting component is attached to the inner wall of the front panel of the plastic shell by a first heat-conducting adhesive.

[0014] The beneficial technical effects of this utility model are as follows: Compared with the prior art, the housing of the shooting device of this utility model is a plastic housing. The main board located inside the plastic housing is thermally connected to the front panel of the plastic housing through a heat-conducting component. The heat-conducting component can conduct the heat generated by the main board to the front panel of the plastic housing, and then radiate it to the external environment from the front panel, thus meeting the heat dissipation requirements. Moreover, the lens module is directly mounted on the metal lens barrel, and the heat generated can be directly conducted to the metal lens barrel, thereby quickly dissipating heat through the metal lens barrel. It can be seen that most of the heat generated when the shooting device of this utility model is working can be conducted to the front panel of the plastic housing, which is less touched by the user, through the heat-conducting component for heat dissipation. Some of the heat can also be directly conducted to the metal lens barrel for heat dissipation. This allows for targeted and quantitative heat conduction to areas that the user may touch when picking up the device. While meeting the overall heat dissipation requirements of the product, it also allows different areas of the housing to have suitable heat dissipation temperatures, making the touch temperature more comfortable for the user and improving the user experience. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a specific embodiment of the shooting device of this utility model;

[0016] Figure 2 This is an exploded structural diagram of a specific embodiment of the shooting device of this utility model;

[0017] Figure 3 This is a partial structural exploded view of the shooting device of this utility model from another perspective;

[0018] Figure 4 yes Figure 1 A cross-sectional view of the imaging equipment shown. Detailed Implementation

[0019] To better understand the technical content of this utility model, the technical solution of this utility model will be further introduced and explained below with reference to the schematic diagram, but it is not limited thereto.

[0020] Reference Figures 1 to 4 , Figures 1 to 4 A specific embodiment of the imaging device 100 of this utility model is shown. In the embodiment shown in the figures, the imaging device 100 includes a plastic housing 10, a heat-conducting component, and a camera module 20. The camera module 20 includes a metal lens barrel 21, a lens module 22, and a main board 23. The metal lens barrel 21 is mounted on the front panel 111 of the plastic housing 10. The lens module 22 is located inside the plastic housing 10 and mounted on the metal lens barrel 21, and is electrically connected to the main board 23. The main board 23 is located inside the plastic housing 10 and is thermally connected to the front panel 111 of the plastic housing 10 through the heat-conducting component. In this invention, the motherboard 23 controls the operation of the lens module 22, which is used for imaging. Understandably, the motherboard 23 experiences the highest temperature rise when the shooting device 100 is operating, followed by the lens module 22. In this invention, most of the heat generated by the motherboard 23 during operation is conducted through a heat-conducting component to the front panel 111 of the plastic housing 10, which is less frequently touched by the user, and then radiated to the external environment by the front panel 111 for heat dissipation. The heat generated by the lens module 22 is directly conducted to the metal lens barrel 21 for heat dissipation, thus solving the problem of internal heat dissipation in the small shooting device 100 and meeting the overall heat dissipation requirements of the product. Furthermore, the combination of the plastic housing 10, the heat-conducting component, and the motherboard 23 in this invention can achieve the purpose of directional and quantitative heat conduction to areas that the user may touch when handling the device, thereby ensuring that different areas of the plastic housing 10 have suitable heat dissipation temperatures, making the touch temperature more suitable for the user and avoiding burns, thus improving the user experience.

[0021] In this invention, the plastic housing 10 includes a front housing 11 and a rear cover 12 that covers the rear end of the front housing 11 and forms an accommodating space 113 with the front housing 11. In this embodiment, the metal lens barrel 21 is mounted on the front end of the front housing 11, i.e., on the front panel 111. The lens module 22, the main board 23, and the heat-conducting component are all located within the accommodating space 113. Preferably, the shooting device 100 may further include a metal heat sink 40 located within the accommodating space 113. The metal heat sink 40 is located between the main board 23 and the rear cover 12 of the plastic housing 10, and the metal heat sink 40 is in contact with the main board 23. Based on the above design, since the thermal conductivity of the metal heat sink 40 is relatively high, the heat generated by the motherboard 23 can be concentrated and stored on the metal heat sink 40. The metal heat sink 40 can be equivalent to a heat storage device. The metal heat sink 40 can gradually conduct heat to the back cover 12. The back cover 12 is made of plastic, which has a lower thermal resistance than metal materials. When the shooting device 100 is working, it can avoid the overall temperature of the front shell 11 and the back cover 12 in the plastic shell 10 from being too high. It can make the heat generated by the motherboard 23 and the lens module 22 generate a thermal conductivity difference in the front and back direction of the whole machine. It can conduct heat in a targeted and quantitative manner for the areas that the user may touch, so that the temperature of the front shell 11 and the back cover 12 that the user mainly touches when picking it up is lower, which can give the user a more suitable touch temperature.

[0022] Furthermore, such as Figure 2 and Figure 4 As shown, the imaging device 100 also includes a fourth heat-conducting component 50, and the motherboard 23 is thermally connected to the metal heat sink 40 through the fourth heat-conducting component 50. In this embodiment, the motherboard 23 contacts the metal heat sink 40 through the fourth heat-conducting component 50. The fourth heat-conducting component 50 can be thermal grease, and the metal heat sink 40 can be attached to the rear cover 12 of the plastic housing 10 through a second thermally conductive adhesive 60. That is, in this embodiment, the metal heat sink 40 can also be installed on the rear cover 12 by adhesive, and at the same time, heat can be slowly conducted to the rear cover 12 through the second thermally conductive adhesive 60.

[0023] Continue to refer to Figures 2 to 4In the embodiment shown in the accompanying drawings, the heat-conducting component includes a first heat-conducting element 31 and a second heat-conducting element 32. The motherboard 23 is located on one side of the lens module 22. The first heat-conducting element 31 is connected between the motherboard 23 and the lens module 22. The second heat-conducting element 32 is located on the other side of the lens module 22 and is thermally connected between the lens module 22 and the front panel 111. In this embodiment, the second heat-conducting element 32 can be a thermally conductive metal component, preferably a thermally conductive aluminum component, and the first heat-conducting element 31 can be thermally conductive silicone grease. Based on the above design, the motherboard 23 is thermally connected to the lens module 22 through the first heat-conducting element 31, and the heat generated by the motherboard 23 and the lens module 22 is quickly conducted to the front panel 111 through the thermally conductive aluminum component.

[0024] Specifically, in this embodiment, the lens module 22 includes a lens control board 221 and a lens 222 connected to the lens control board 221. The lens 222 faces the front panel 111. The main board 23 is located on the side of the lens control board 221 away from the lens 222. The first heat-conducting element 31 is connected between the main board 23 and the lens control board 221. The second heat-conducting element 32 is located on the side of the lens control board 221 connected to the lens 222 and is thermally connected between the lens control board 221 and the front panel 111 of the plastic housing 10. Understandably, when the lens module 22 is working, the main heat is generated by the lens control board 221. The heat on the lens control board 221 can be directly conducted to the metal lens barrel 21 for heat dissipation, or it can be conducted to the front panel 111 for heat dissipation through the second heat-conducting element 32.

[0025] Furthermore, in some embodiments, one side of the second heat-conducting element 32 is attached to the lens control plate 221 around the lens 222, and the other side is attached to the inner wall of the front panel 111. In this embodiment, a groove 112 is provided on the inner wall of the front panel 111 corresponding to the second heat-conducting element 32. The second heat-conducting element 32 can be attached to the groove 112 on the inner wall of the front panel 111 by adhesive, that is, the second heat-conducting element 32 is pasted into the groove 112 by a first thermally conductive adhesive 70.

[0026] In some embodiments, a second thermal grease 34 is further disposed between the second thermal conductive element 32 and the upper part of the lens control board 221. That is, the thermal conductive aluminum component and the upper part of the lens control board 221 are also heat-conducted through the second thermal conductive grease 34, so that the heat generated by the lens control board 221 and the motherboard 23, which are thermally connected by the first thermal conductive element 31, can be further quickly conducted forward to the second thermal conductive element 32 through the second thermal conductive grease 34. Furthermore, the thermal conductive assembly may also include a third thermal conductive element 33, and the motherboard 23 can also be thermally connected to the second thermal conductive element 32 through the third thermal conductive element 33. Preferably, in this embodiment, the third thermal conductive element 33 may also be thermal conductive grease, so that some of the heat generated by the motherboard 23 can be directly conducted to the thermal conductive aluminum component, and then conducted to the front panel 111 through the thermal conductive aluminum component, thereby further accelerating heat dissipation.

[0027] In summary, the shooting device of this utility model has a plastic housing and a metal lens barrel. Heat dissipation is achieved through the combination of plastic and metal materials. The heat generated by the motherboard and lens control board can be conducted to the front panel of the plastic housing via a heat-conducting component, and then radiated to the external environment from the front panel. Simultaneously, the heat generated by the lens control board can be directly conducted to the metal lens barrel connected to it, improving heat dissipation efficiency. Furthermore, the metal heat dissipation fins located between the motherboard and the rear cover can store a large amount of heat generated by the motherboard. The metal heat dissipation fins can slowly conduct heat to the rear cover through a second thermally conductive adhesive. Since the rear cover is made of plastic, its thermal resistance is lower than that of metal materials, preventing the overall temperature of both the front housing and the rear cover from becoming too high. While ensuring overall heat dissipation, the heat generated by the motherboard and lens module can create a thermal conductivity difference in the front-to-back direction of the device. This allows for targeted and quantitative heat conduction in areas that the user may touch, resulting in lower temperatures around the front housing and the rear cover, providing a more comfortable touch temperature and improving the user experience.

[0028] The above preferred embodiments should be regarded as illustrative examples of the implementation of the present utility model. Any technical deductions, substitutions, improvements, etc. that are similar to or based on the present utility model should be considered within the scope of protection of this patent.

Claims

1. A shooting device, characterized in that, The shooting device includes a plastic housing, a heat-conducting component, and a camera module. The camera module includes a metal lens barrel, a lens module, and a motherboard. The metal lens barrel is mounted on the front panel of the plastic housing. The lens module is located inside the plastic housing and mounted on the metal lens barrel, and is electrically connected to the motherboard. The motherboard is located inside the plastic housing and is thermally connected to the front panel of the plastic housing through the heat-conducting component.

2. The shooting device as described in claim 1, characterized in that, The imaging device also includes metal heat dissipation fins located inside the plastic housing. The metal heat dissipation fins are located between the motherboard and the rear panel of the plastic housing, and the metal heat dissipation fins are in contact with the motherboard.

3. The shooting device as described in claim 2, characterized in that, The shooting device also includes a fourth heat-conducting component, and the motherboard is thermally connected to the metal heat sink fins through the fourth heat-conducting component.

4. The shooting device as described in claim 1 or 2, characterized in that, The heat-conducting component includes a first heat-conducting element and a second heat-conducting element. The motherboard is located on one side of the lens module. The first heat-conducting element is connected between the motherboard and the lens module. The second heat-conducting element is located on the other side of the lens module and is thermally connected between the lens module and the front panel of the plastic housing.

5. The shooting device as described in claim 4, characterized in that, The heat-conducting component also includes a third heat-conducting element, and the motherboard is also heat-conductingly connected to the second heat-conducting element through the third heat-conducting element.

6. The shooting device as described in claim 4, characterized in that, The lens module includes a lens control board and a lens connected to the lens control board. The main board is located on the side of the lens control board away from the lens. The first heat-conducting component is disposed between the main board and the lens control board. The second heat-conducting component is located on the side of the lens control board connected to the lens and is thermally connected to the front panel of the lens control board and the plastic housing.

7. The shooting device as described in claim 6, characterized in that, One side of the second heat-conducting component is attached to the lens control plate around the lens, and the other side is attached to the inner wall of the front panel of the plastic housing.

8. The shooting device as described in claim 7, characterized in that, The second thermally conductive component is a thermally conductive metal component, and the first thermally conductive component is thermally conductive silicone grease.

9. The shooting device as described in claim 8, characterized in that, A second thermal grease is also provided between the second thermal conductive element and the upper part of the lens control board.

10. The shooting device as described in claim 7, characterized in that, The second thermally conductive component is attached to the inner wall of the front panel of the plastic housing by a first thermally conductive adhesive.

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