Wave soldering jig and wave soldering machine

By designing a wave soldering fixture with a tray slot, solder-blocking strip, and rotating buckle structure, the waste and quality problems caused by solder sloshing were solved, achieving efficient utilization of solder and improved soldering quality.

CN223540760UActive Publication Date: 2025-11-11东莞捷璞电子科技有限公司
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Patent Information

Application Number
CN202422889496.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-26
Publication Date
2025-11-11
Estimated Expiration
2034-11-26

AI Technical Summary

Technical Problem

During wave soldering, the fixture sinks into the molten solder, causing it to slosh around, resulting in solder residue and waste, which affects the soldering quality of the circuit board. Furthermore, existing fixture designs are not effective in protecting non-soldering areas.

Method used

Design a wave soldering fixture including a tray, a solder-blocking strip, and a snap-fit ​​structure. The tray is provided with a slot and a solder guide groove. The solder-blocking strip blocks the molten solder. The snap-fit ​​clamps the circuit board to ensure that the molten solder flows only in the soldering area and contacts the circuit board through the solder guide groove.

Benefits of technology

This achieves efficient utilization of molten solder, reduces waste, improves soldering quality and work efficiency, and protects non-soldering areas, preventing molten solder from entering areas that do not require soldering.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a wave soldering jig and a wave soldering machine, the wave soldering jig comprises a supporting plate, the upper side face of the supporting plate is provided with a plurality of clamping grooves matched with the shape of a circuit board, the edge of the supporting plate is provided with a plurality of tin blocking edge strips in a surrounding mode, and the upper side faces of the tin blocking edge strips are provided with tin blocking protruding strips in an outward protruding mode so as to prevent tin liquid from flowing into an installation space; a plurality of tin guide grooves for plug-in pins of the circuit board to be exposed downwards are formed in the clamping grooves in a penetrating mode, the supporting plate is provided with at least three rotating buckles on the outer side of each clamping groove, each rotating buckle comprises an installation part and a limiting part, the installation parts are connected with the supporting plate through screws, the screws are sleeved with springs, and the springs act on the installation parts and push the installation parts and the limiting parts in the direction of the supporting plate. The limiting part rotates with the screw as the center and rotates to the range of the clamping groove so as to press the circuit board in the clamping groove. According to the utility model, tin liquid is blocked through the tin blocking convex strips, the tin liquid is prevented from being retained on the tin blocking edge strips, and the circuit board is pressed in the clamping grooves through the rotating buckles, so that the circuit board is prevented from being separated from the supporting plate in the wave soldering operation.
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Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and in particular to a wave soldering fixture and a wave soldering machine. Background Technology

[0002] Wave soldering machines use electric or electromagnetic pumps to spray molten solder into solder waves. When a circuit board with inserted electronic components passes through the solder wave, the pins of the electronic components are brazed to the pads of the circuit board.

[0003] In wave soldering, it is crucial not only to ensure that the molten solder effectively fills the gap between the leads of electronic components and the pads on the circuit board, but also to prevent it from entering other areas of the circuit board that do not require soldering, such as SMT components. Current technology involves placing the circuit board on a fixture before wave soldering, using the fixture to guide the molten solder to the areas requiring soldering. However, during wave soldering, at least 1 / 2 or 2 / 3 of the fixture's thickness sinks into the molten solder. As the fixture moves through the solder, it pushes the solder, causing the surface to slosh. When the solder level is higher than the top of the fixture, the excess solder is intercepted by the fixture, resulting in some solder remaining on the fixture or even entering the area where the circuit board is placed. This leads to molten solder residue on areas of the circuit board that do not require soldering and on the fixture itself, wasting solder and affecting the quality of the wave soldering. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a wave soldering fixture and a wave soldering machine.

[0005] In a first aspect, this utility model provides a wave soldering fixture, including a tray. The upper side of the tray is provided with multiple slots that match the shape of a circuit board. The edge of the tray is surrounded by multiple solder-blocking strips, which are fixed to one side of the slots on the tray. The tray and the multiple solder-blocking strips form an installation space for placing the circuit board into the slots. The upper side of the solder-blocking strips has outwardly protruding solder-blocking ridges to prevent molten solder from flowing into the installation space. Multiple solder guide grooves are provided through the slots for the plug-in pins of the circuit board to protrude downwards. The tray is provided with at least three buckles on the outside of each slot. Each buckle includes a mounting part and a limiting part. The mounting part is connected to the tray by a screw. The screw is fitted with a spring. The spring acts on the mounting part, pushing the mounting part and the limiting part in the direction of the tray. The limiting part rotates around the screw and rotates into the slot area to press the circuit board in the slot.

[0006] In some embodiments, the bottom of the slot is recessed with a groove that does not penetrate the tray.

[0007] In some embodiments, the lower edge of the solder bath is chamfered at 45°.

[0008] In some embodiments, the tray has a board retrieval slot on one side of the card slot, the board retrieval slot communicating with the card slot, and a portion of the edge of the circuit board falling into the board retrieval slot.

[0009] In some embodiments, the pallet has two connecting plates on both sides along its length, and each connecting plate has at least one connecting rod perpendicularly arranged on it, with the number of connecting rods on the two connecting plates being different.

[0010] In some embodiments, a clamping spring is provided on the upper side of the solder-blocking strip. The clamping spring includes a connecting part, an elastic part, a pressing part, and a lifting part. The connecting part, elastic part, pressing part, and lifting part are connected in sequence to form an S-shaped clamping spring. The connecting part is connected to the solder-blocking strip through a bolt assembly. The pressing part rotates around the bolt assembly. The elastic part acts on the pressing part through a C-shaped structure to drive the pressing part to press the pressure strip above the slot. The lifting part is fitted with a handle, and the handle is provided with an arc surface for lifting the pressing part in the direction of the pressing part.

[0011] In some embodiments, the bolt assembly includes a fixing bolt, a first nut, and a lock nut. The fixing bolt is fixed to a solder-blocking strip. The first nut and the lock nut are sequentially fitted onto the fixing bolt. The connecting part has a through-hole. The connecting part is fitted onto the fixing bolt through the through-hole and sandwiched between the first nut and the lock nut.

[0012] In some embodiments, the fixing hole includes three holes arranged side by side along the length of the connection, the three holes are interconnected, the fixing bolt passes through one of the holes, and a limiting protrusion is provided between two adjacent holes to limit the position of the fixing bolt in the fixing hole.

[0013] In some embodiments, the buckle has a mounting hole in the mounting part, the screw passes through the mounting hole and protrudes from the mounting part, and the mounting part has a groove on the outer circumference of the mounting hole that mates with the spring; the buckle has a lever protruding upward in the limiting part, and the height of the lever is higher than the height of the screw.

[0014] Secondly, this utility model also provides a wave soldering machine, including a furnace, a guide rail, a frame, and a wave soldering fixture as described in the first aspect. The furnace is movably mounted on the frame via a lifting motor. The guide rail is inclinedly mounted on the frame and located above the furnace. The wave soldering fixture enters the guide rail from the feed port and is transported to the top of the furnace under the drive of the chain claws on the guide rail, so as to perform wave soldering operations on the circuit board on the wave soldering fixture.

[0015] Compared with the prior art, the advantages of this utility model are: by placing three circuit boards in three slots, wave soldering of three circuit boards can be completed at one time; by using solder-blocking strips and solder-blocking protrusions to block the solder, the solder is prevented from accumulating on the solder-blocking strips, reducing solder waste, and reducing the frequency of cleaning the wave soldering fixture, thus improving work efficiency; by using snap fasteners to press the circuit boards into the tray slots, the circuit boards are prevented from separating from the tray during wave soldering, ensuring the quality of wave soldering. Attached Figure Description

[0016] Figure 1 This is a front view structural schematic diagram of the wave soldering machine according to an embodiment of this application.

[0017] Figure 2 This is a three-dimensional structural schematic diagram of the wave soldering fixture according to an embodiment of this application.

[0018] Figure 3 This is a top view of the wave soldering fixture according to an embodiment of this application.

[0019] Figure 4 This is a side view of the wave soldering fixture according to an embodiment of this application.

[0020] Figure 5 This is a cross-sectional structural diagram of the solder guide groove portion of the wave soldering fixture according to an embodiment of this application.

[0021] Figure 6 This is an exploded structural diagram of the clamping spring according to an embodiment of this application.

[0022] Figure reference numerals: 101, wave soldering fixture; 102, frame; 103, guide rail; 104, furnace liner; 105, feed inlet; 106, discharge outlet; 107, chain claw; 108, lifting motor; 109, lifting drive component;

[0023] 201. Circuit board;

[0024] 1. Tray; 11. Slot; 12. Groove; 13. Solder guide groove; 14. Installation space; 15. Board removal slot; 16. Chamfer;

[0025] 2. Solder-blocking edge strip; 21. Solder-blocking raised strip;

[0026] 3. Turnbuckle; 31. Mounting part; 32. Limiting part; 33. Screw; 34. Spring; 35. Mounting hole; 36. Slot; 37. Lever;

[0027] 4. Pressing spring; 41. Connecting part; 42. Elastic part; 43. Pressing part; 44. Lifting part; 45. Handle; 46. Fixing hole; 47. Hole position; 48. Curved surface;

[0028] 5. Bolt assembly; 51. Fixing bolt; 52. First nut; 53. Locking nut;

[0029] 6. Connecting plate; 61. Connecting rod;

[0030] 7. Pressing strip. Detailed Implementation

[0031] The specific embodiments of this utility model are described with reference to the accompanying drawings.

[0032] refer to Figure 1 The figure shows a front view of the wave soldering machine. The left side of the figure is the inlet 105, and the right side is the outlet 106. The guide rail 103 is inclined between the inlet 105 and the outlet 106. The furnace chamber 104 is in the center of the frame 102. The guide rail 103 drives the wave soldering fixture 101 to the furnace chamber 104 through the chain claw 107 to perform wave soldering on the circuit board 201 on the wave soldering fixture 101.

[0033] refer to Figures 2 to 6 A wave soldering fixture 101 includes a tray 1. The upper side of the tray 1 has multiple slots 11 that match the shape of a circuit board 201. Multiple solder-blocking strips 2 surround the edge of the tray 1 and are fixed to one side of the slots 11. The tray 1 and the multiple solder-blocking strips 2 form an installation space 14 for placing the circuit board 201 into the slots 11. Solder-blocking protrusions 21 protrude outwards from the upper side of the solder-blocking strips 2 to prevent molten solder from flowing into the installation space 14. Multiple circuit board 201 mounting strips are provided through the slots 11. The solder guide groove 13 of the plug-in pin of 01 is exposed downward. The tray 1 is provided with at least three buckles 3 on the outside of each slot 11. The buckle 3 includes a mounting part 31 and a limiting part 32. The mounting part 31 is connected to the tray 1 by a screw 33. The screw 33 is fitted with a spring 34. The spring 34 acts on the mounting part 31 and pushes the mounting part 31 and the limiting part 32 in the direction of the tray 1. The limiting part 32 rotates around the screw 33 and rotates to the range of the slot 11 to press the circuit board 201 in the slot 11.

[0034] The wave soldering fixture 101 of this application embodiment holds three circuit boards 201 through three slots 11, and can complete the wave soldering operation of the three circuit boards 201 in one go. The solder blocking strip 2 and the solder blocking protrusion 21 block the solder liquid, avoid the solder liquid from being stuck on the solder blocking strip 2, reduce the waste of solder liquid, and at the same time reduce the frequency of cleaning the wave soldering fixture 101, thus improving work efficiency. The circuit board 201 is pressed into the slot 11 of the support plate 1 by the snap fastener 3, which prevents the circuit board 201 from separating from the support plate 1 during the wave soldering operation and ensures the quality of wave soldering.

[0035] To protect SMT components on circuit board 201 that do not require wave soldering, in this embodiment, reference is made to... Figure 1 and Figure 2 The bottom of the slot 11 is provided with a groove 12, which does not penetrate the support plate 1.

[0036] Understandably, with this setup, SMT components cannot be wave soldered using solder paste processing. The slot 11 has a groove 12 designed on the solder side where the SMT component is located. When the circuit board 201 is placed in the slot 11, the SMT component is located in the groove 12, and the solder side of the circuit board 201 is in close contact with the bottom of the slot 11, so that the solder will not enter the SMT component, thus protecting the SMT component. At the same time, the depth of the groove 12 is greater than the highest SMT component to prevent the tray 1 from bumping into the SMT component.

[0037] In order to ensure that the molten solder can smoothly enter the solder bath, in this embodiment, reference is made to... Figure 5 The lower edge of the solder guide 13 is provided with a 45° chamfer 16.

[0038] Understandably, this design, with the chamfer 16 on the lower side of the solder bath 13 that contacts the molten solder, increases the area on which the molten solder enters the solder bath 13, allowing the molten solder to smoothly enter the solder bath 13 and contact the pins of the electronic components on the circuit board 201, avoiding empty soldering and improving the quality of wave soldering.

[0039] To facilitate the handling of the circuit board 201, in this embodiment, reference is made to... Figure 2 and Figure 3 The tray 1 has a board taking groove 15 on one side of the card slot 11. The board taking groove 15 communicates with the card slot 11, and part of the edge of the circuit board 201 falls into the board taking groove 15.

[0040] Understandably, with this configuration, the shape of the card slot 11 matches that of the circuit board 201. To prevent the circuit board 201 from wobbling in the card slot 11, the gap between the edge of the circuit board 201 and the inner wall of the card slot 11 is designed to be small. Part of the edge of the circuit board 201 falls into the board picking slot 15, so the circuit board 201 can be directly picked up and put down through the picking slot. This avoids the operator from directly grabbing the electronic components of the circuit board 201 when picking up and putting down the circuit board 201, which could lead to the electronic components becoming loose, falling off, or having poor soldering.

[0041] In order to cooperate with the guide rail 103 of the wave soldering machine, in this embodiment, reference is made to... Figures 1 to 3 The pallet 1 has two connecting plates 6 on both sides along its length. Each connecting plate 6 has at least one connecting rod 61 vertically mounted on it. The number of connecting rods 61 on the two connecting plates 6 is different.

[0042] Understandably, with this setup, the wave soldering machine's guide rail 103 uses a transmission chain to drive the wave soldering fixture 101. The chain claws 107 of the transmission chain engage with the connecting rods 61, and the chain claws 107 hold the connecting rods 61 through the locking mechanism, thereby driving the wave soldering fixture 101. At the same time, one connecting plate 6 is equipped with one connecting rod 61, and the other connecting plate 6 is equipped with two connecting rods 61. The different numbers of connecting rods 61 on both sides form a foolproof structure, ensuring that the wave soldering fixture 101 is correctly placed on the guide rail 103, so that the travel direction of the wave soldering fixture 101 is better aligned with the solder guide trough 13.

[0043] In order to better press the circuit board 201, in this embodiment, refer to Figures 2 to 6 The upper side of the solder-blocking strip 2 is provided with a clamping spring 4. The clamping spring 4 includes a connecting part 41, an elastic part 42, a pressing part 43, and a lifting part 44. The connecting part 41, the elastic part 42, the pressing part 43, and the lifting part 44 are connected in sequence to form an S-shaped clamping spring 4. The connecting part 41 is connected to the solder-blocking strip 2 through a bolt assembly 5. The pressing part 43 rotates around the bolt assembly 5. The elastic part 42 acts on the pressing part 43 through a C-shaped structure to drive the pressing part 43 to press the pressure strip 7 above the slot 11. The lifting part 44 is fitted with a handle 45. The handle 45 is provided with an arc surface 48 for lifting the pressing part 43 in the direction of the pressing part 43.

[0044] Understandably, with this setup, the circuit board 201 is placed in the slot 11 for initial positioning. The four snap fasteners 3 press the circuit board 201 firmly into the slot 11. A pressure strip 7 is placed above the circuit board 201. The shape and size of the pressure strip 7 are determined by the position of the electronic components on the circuit board 201. The pressure strip 7 presses on the circuit board 201 while avoiding the electronic components on the circuit board 201. The lower pressing part 43 of the pressing spring 4 contacts the pressure strip 7. The elastic part 42 presses the lower pressing part 43 against the pressure strip 7 and the circuit board 201, thereby ensuring that the circuit board 201 can stick tightly to the support plate 1 and preventing the molten solder sprayed during wave soldering from entering the non-soldering area from the solder guide 13. The curved surface 48 of the lifting part 44 makes it easy for the fingers to apply force, ensuring that the operator can more easily lift and press the pressing spring 4.

[0045] In order to ensure that the clamping spring 4 is stably installed on the solder-blocking strip 2, in this embodiment, reference is made to... Figure 5 The bolt assembly 5 includes a fixing bolt 51, a first nut 52, and a lock nut 53. The fixing bolt 51 is fixed to the solder-blocking strip 2. The first nut 52 and the lock nut 53 are sequentially sleeved on the fixing bolt 51. The connecting part 41 is provided with a fixing hole 46. The connecting part 41 is sleeved on the fixing bolt 51 through the fixing hole 46 and sandwiched between the first nut 52 and the lock nut 53.

[0046] Understandably, with this setup, the fixing bolt 51 serves as the rotation center of the clamping spring 4, the first nut 52 presses against the connecting part 41 of the clamping spring 4, and the clamping spring 4 is fixed by the gap between the anti-loosening nut 53 and the first nut 52. At the same time, it is necessary to ensure that the clamping spring 4 can rotate, and the anti-loosening nut 53 ensures that the clamping spring 4 will not come off the fixing bolt 51, thus ensuring that the clamping spring 4 can be stably installed on the solder-blocking strip 2.

[0047] In order to ensure that the clamping spring 4 is compatible with clamping strips 7 of different sizes, in this embodiment, reference is made to... Figure 5 The fixing hole 46 includes three holes 47 arranged side by side along the length of the connecting part 41. The three holes 47 are interconnected. The fixing bolt 51 passes through one of the holes 47. A limiting protrusion is provided between two adjacent holes 47 to limit the position of the fixing bolt 51 in the fixing hole 46.

[0048] Understandably, with this configuration, the fixing bolt 51 passes through one of the three holes 47 in the connecting part 41. Different holes 47 will result in different distances between the pressing part 43 and the fixing bolt 51, so that the corresponding hole 47 can be selected according to the pressure strip 7 of different sizes, thereby improving the compatibility of the clamping spring 4.

[0049] In order to hold the circuit board 201 in place, in this embodiment, reference is made to Figure 2 and Figure 3 The rotating buckle 3 has a mounting hole 35 in the mounting part 31, and the screw 33 passes through the mounting hole 35 and protrudes from the mounting part 31. The mounting part 31 has a groove 36 on the outer circumference of the mounting hole 35 that mates with the spring 34. The rotating buckle 3 has a lever 37 protruding upward in the limiting part 32. The height of the lever 37 is higher than the height of the screw 33.

[0050] Understandably, with this setup, the rotating buckle 3 presses the circuit board 201 with the elastic force of the spring 34, preventing the circuit board 201 from floating up due to the impact of solder waves when it moves inside the furnace liner 104, ensuring that the circuit board 201 is stably pressed on the support plate 1. The limiting part 32 of the rotating buckle 3 can be easily moved by the lever 37. The limiting part 32 cannot touch the electronic components on the circuit board 201 within one rotation, nor can it press down on any electronic components, thus avoiding operator misoperation and bumping into electronic components when rotating the rotating buckle 3.

[0051] refer to Figure 1A wave soldering machine includes a furnace chamber 104, a guide rail 103, a frame 102, and the aforementioned wave soldering fixture 101. The furnace chamber 104 is movably mounted on the frame 102 via a lifting motor 108. The guide rail 103 is inclinedly mounted on the frame 102 and located above the furnace chamber 104. The wave soldering fixture 101 enters the guide rail 103 through the feed port 105 and is transported to the top of the furnace chamber 104 by the chain claw 107 of the guide rail 103, so as to perform wave soldering operations on the circuit board 201 on the wave soldering fixture 101.

[0052] The wave soldering machine of this application uses a guide rail 103 to transport the wave soldering fixture 101 and circuit board 201 from the inlet 105 to the furnace chamber 104 and the outlet 106. Wave soldering of the circuit board 201 is performed at the furnace chamber 104. The exhaust gas generated during the wave soldering process is treated and discharged through the exhaust pipe above the frame 102. The inlet 105 and outlet 106 of the guide rail 103 are equipped with lifting drive components 109 to adjust the height of the guide rail 103.

[0053] The above does not limit the technical scope of this utility model. Any modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this utility model shall still fall within the scope of the technical solution of this utility model.

Claims

1. A wave soldering fixture, characterized in that, The device includes a tray with multiple slots on its upper side that match the shape of a circuit board. Multiple solder-blocking strips surround the edge of the tray and are fixed to one side of the slots. The tray and the solder-blocking strips form an installation space for placing the circuit board into the slots. The upper side of each solder-blocking strip has outwardly protruding solder-blocking ridges to prevent molten solder from flowing into the installation space. Multiple solder guide grooves are provided through the slots to expose the pins of the circuit board downwards. Each slot on the tray has at least three rotating buckles, each buckle including a mounting part and a limiting part. The mounting part is connected to the tray by screws, and the screws are fitted with springs. The springs act on the mounting part, pushing the mounting part and the limiting part towards the tray. The limiting part rotates around the screw until it reaches the slot area, thus pressing the circuit board inside the slot.

2. The wave soldering fixture according to claim 1, characterized in that, The bottom of the slot is recessed with a groove that does not penetrate the support plate.

3. The wave soldering fixture according to claim 1, characterized in that, The lower edge of the solder guide groove is chamfered at 45°.

4. The wave soldering fixture according to claim 1, characterized in that, The tray has a board retrieval slot on one side of the card slot, the board retrieval slot is connected to the card slot, and part of the edge of the circuit board falls into the board retrieval slot.

5. The wave soldering fixture according to claim 1, characterized in that, The pallet has two connecting plates on both sides along its length. Each connecting plate has at least one connecting rod perpendicularly attached to it, and the number of connecting rods on the two connecting plates is different.

6. The wave soldering fixture according to claim 1, characterized in that, The upper side of the solder-blocking strip is provided with a clamping spring. The clamping spring includes a connecting part, an elastic part, a pressing part, and a lifting part. The connecting part, elastic part, pressing part, and lifting part are connected in sequence to form an S-shaped clamping spring. The connecting part is connected to the solder-blocking strip through a bolt assembly. The pressing part rotates around the bolt assembly. The elastic part acts on the pressing part through a C-shaped structure to drive the pressing part to press the pressure strip above the slot. The lifting part is fitted with a handle. The handle is provided with an arc surface for lifting the pressing part in the direction of the pressing part.

7. The wave soldering fixture according to claim 6, characterized in that, The bolt assembly includes a fixing bolt, a first nut, and a lock nut. The fixing bolt is fixed to the solder-blocking strip. The first nut and the lock nut are sequentially fitted onto the fixing bolt. The connecting part has a through-hole. The connecting part is fitted onto the fixing bolt through the through-hole and sandwiched between the first nut and the lock nut.

8. The wave soldering fixture according to claim 7, characterized in that, The fixing hole includes three holes arranged side by side along the length of the connection, the three holes are interconnected, the fixing bolt passes through one of the holes, and a limit protrusion is provided between two adjacent holes to limit the position of the fixing bolt in the fixing hole.

9. The wave soldering fixture according to claim 1, characterized in that, The rotating buckle has a mounting hole in the mounting part, the screw passes through the mounting hole and protrudes from the mounting part, and the mounting part has a groove on the outer circumference of the mounting hole that mates with the spring; the rotating buckle has a lever protruding upward in the limiting part, and the height of the lever is higher than the height of the screw.

10. A wave soldering machine, characterized in that, The device includes a furnace chamber, a guide rail, a frame, and a wave soldering fixture as described in any one of claims 1 to 9. The furnace chamber is movably mounted on the frame via a lifting motor. The guide rail is inclinedly mounted on the frame and located above the furnace chamber. The wave soldering fixture enters the guide rail from the feed port and is transported to the top of the furnace chamber by the chain claws of the guide rail, so as to perform wave soldering operations on the circuit board on the wave soldering fixture.