Wave soldering preheating system

Abstract

The utility model discloses a wave soldering preheating system, and relates to the field of PCB preheating. The wave-soldering preheating system is used for preheating a PCB before wave soldering, the wave-soldering preheating system comprises a horizontally-arranged gas distribution pipe, a gas distribution hopper arranged above the gas distribution pipe and a gas guide heating mechanism fixedly connected with the gas distribution hopper, one end of the gas distribution pipe is provided with a gas inlet, the other end of the gas distribution pipe is closed, a gas guide cavity is formed in the gas distribution hopper, and the gas guide cavity is communicated with the gas distribution pipe. The air guide cavity is in an inverted trapezoid shape, the air distribution pipe is fixedly connected with a lower port of the air distribution hopper, a plurality of air distribution holes are formed in the position, close to the lower port, of the air distribution pipe, and air enters the air guide cavity through the air distribution holes and then reaches the upper port of the air distribution hopper so as to heat the lower side of the PCB. The gas guiding and heating mechanism can guide and heat gas at the upper port so that the heated gas can cover the upper side of the PCB. The PCB heating efficiency can be improved, and the two sides of the PCB can be synchronously and efficiently heated.

Description

Technical Field

[0001] This application relates to the field of PCB preheating, and more particularly to wave soldering preheating systems. Background Technology

[0002] Wave soldering is a widely used soldering technology in the electronics manufacturing industry, and one of its core components is the preheating process. The importance of preheating lies in its ability to ensure that the solvent in the flux evaporates sufficiently before soldering, reducing the gases generated during soldering and thus improving soldering quality and efficiency. Furthermore, preheating helps reduce thermal shock to components, protecting sensitive components from damage.

[0003] However, existing wave soldering systems typically use a gas distribution device to blow hot air for preheating. While this heating method is easy to implement, it also has some problems. When the gas distribution device blows hot air directly onto the PCB board, it can easily lead to uneven heating. Uneven heating can cause poor local expansion and contraction of the PCB board, affecting soldering quality and circuit board reliability. In addition, uneven heating can also cause thermal stress concentration on the soldered circuit board, increasing the risk of failure during use.

[0004] To ensure uniform heating of the PCB board, the gas distribution equipment is typically spaced apart from the board. However, a larger gap increases natural gas diffusion, reducing the proportion of gas actually used for heating and thus lowering heating efficiency. Furthermore, since single-sided heating is generally used, the temperature difference between the two sides of the PCB board is significant. This can lead to asynchronous thermal expansion on both sides, resulting in poor soldering and circuit board deformation. The large temperature difference between the two sides of the PCB board can also affect the performance of the soldered circuit board, especially in applications requiring high precision and high reliability; therefore, temperature difference control is crucial. Utility Model Content

[0005] To address the issues of low PCB heating efficiency and large temperature difference between the two sides of the PCB in existing technologies, this application provides a wave soldering preheating system, the specific solution of which is as follows:

[0006] A wave soldering preheating system is used to preheat a PCB board before wave soldering. The system includes a horizontally arranged air distribution pipe, an air distribution hopper above the air distribution pipe, and an air guiding and heating mechanism fixedly connected to the air distribution hopper. One end of the air distribution pipe has an air inlet, and the other end is closed. The air distribution hopper has an air guiding chamber, which is an inverted trapezoidal shape. The air distribution pipe is fixedly connected to the lower port of the air distribution hopper. Near the lower port, the air distribution pipe has several air distribution holes. Gas enters the air guiding chamber through the air distribution holes and reaches the upper port of the air distribution hopper to heat the lower side of the PCB board. Two symmetrically arranged air guiding and heating mechanisms are fixed at the upper port. These mechanisms guide and heat the gas at the upper port so that the heated gas covers the upper side of the PCB board.

[0007] Preferably, the gas guiding and heating mechanism includes several spaced-apart gas guiding and heating components. Each gas guiding and heating component includes an inverted L-shaped gas guiding pipe, a fan, and a heating wire. The inverted L-shaped gas guiding pipe is fixedly connected to the gas distribution hopper. The gas inlet of the inverted L-shaped gas guiding pipe is located at the upper port of the gas distribution hopper, and the gas outlet of the inverted L-shaped gas guiding pipe is located above the gas distribution hopper. The fan is fixedly installed at the gas outlet of the inverted L-shaped gas guiding pipe, and the heating wire is fixedly installed inside the inverted L-shaped gas guiding pipe. The fan draws the gas at the upper port of the gas distribution hopper into the inverted L-shaped gas guiding pipe. The gas is heated by the heating wire in the inverted L-shaped gas guiding pipe and changes its direction of movement. The heated gas is discharged from the gas outlet of the inverted L-shaped gas guiding pipe and covers the upper side of the PCB board.

[0008] Preferably, the gas-guiding heating components of the gas-guiding heating mechanism are arranged at equal intervals, and the gas-guiding heating components of the two gas-guiding heating mechanisms correspond one-to-one.

[0009] Preferably, the gas guiding and heating mechanism further includes a gas guiding plate fixedly connected to the gas distribution hopper. The gas guiding plate is arranged along the distribution direction of the gas guiding and heating assembly. The gas guiding plate is closer to the outer side of the gas distribution hopper than the gas guiding and heating assembly. The gas guiding plate has a first bending portion, which causes the gas guiding plate to bend towards the inner side of the gas distribution hopper. The first bending portion is used to change the flow direction of the gas overflowing from the gas distribution hopper.

[0010] Preferably, the air guide plate also has a second bending portion, which causes the air guide plate to bend downwards. The heated gas discharged by the air guiding heating mechanism and the gas overflowing from the air distribution hopper form a mixed gas. The second bending portion is used to guide the mixed gas to move downwards at an angle.

[0011] Preferably, the air guide cavity is an inverted frustum shape.

[0012] Preferably, the air distribution holes of the air distribution pipe are arranged at equal intervals.

[0013] Preferably, the air distribution pipe has a third bend, which is used to adjust the direction of the air inlet of the air distribution pipe.

[0014] One or more technical solutions provided in this application have at least the following technical effects or advantages:

[0015] On the one hand, by setting up air distribution pipes and air distribution hoppers, the gas is evenly distributed to the lower surface of the PCB board, while effectively preventing the gas from naturally diffusing before contacting the lower surface of the PCB board, thereby improving the heating efficiency of the PCB board. On the other hand, by setting up a gas guiding and heating mechanism, the gas at the upper port of the air distribution hopper is guided and heated so that the heated gas covers the upper side of the PCB board, making full use of the gas that was about to overflow. Since the gas that was about to overflow still has a certain temperature, it only needs to be heated briefly to be used for preheating the upper surface of the PCB board, so that the upper and lower surfaces of the PCB board are heated simultaneously, which not only further improves the heating efficiency of the PCB board, but also effectively avoids the large temperature difference between the two sides of the PCB board. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely exemplary. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the wave soldering preheating system provided in the embodiments of this application;

[0018] Figure 2 This is a schematic diagram of the wave soldering preheating system provided in the embodiments of this application installed on the wave soldering equipment;

[0019] Figure 3 This is a schematic diagram of the air distribution pipe and air distribution hopper provided in the embodiments of this application;

[0020] Figure 4 This is a schematic diagram of the gas-conducting heating mechanism provided in the embodiments of this application.

[0021] In the diagram: 1. Air distribution pipe; 11. Air distribution hole; 2. Air distribution hopper; 21. Upper port; 3. Air guiding and heating mechanism; 31. Air guiding and heating assembly; 311. Inverted L-shaped air guiding pipe; 312. Fan; 32. Air guiding plate; 321. First bend; 322. Second bend; 100 - Wave soldering equipment; 200 - PCB board. Detailed Implementation

[0022] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described in this application are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0023] Please refer to the following: Figures 1 to 3 A wave soldering preheating system is used by the wave soldering equipment 100 to preheat the PCB board 200 before wave soldering. The wave soldering preheating system includes a horizontally arranged air distribution pipe 1, an air distribution hopper 2 located above the air distribution pipe 1, and an air guiding and heating mechanism 3 fixedly connected to the air distribution hopper 2. One end of the air distribution pipe 1 is provided with an air inlet, which is used to connect to an external air supply device that can provide heating gas. The other end of the air distribution pipe 1 is closed. The air distribution hopper 2 is provided with an air guiding cavity, which is an inverted trapezoidal shape. With the top surface facing down, the air distribution pipe 1 is fixedly connected to the lower port of the air distribution bucket 2. The air distribution pipe 1 is provided with several air distribution holes 11 near the lower port. The gas supplied by the air supply device enters the air guiding chamber through the air distribution holes 11 and reaches the upper port 21 of the air distribution bucket 2 to heat the lower side of the PCB board 200. Two symmetrically arranged air guiding and heating mechanisms 3 are fixed at the upper port 21. The air guiding and heating mechanisms 3 can guide and heat the gas at the upper port 21 so that the heated gas covers the upper side of the PCB board 200.

[0024] Specifically, please refer to the following: Figure 1 and Figure 3The gas-guiding heating mechanism 3 includes several spaced-apart gas-guiding heating components 31. Each gas-guiding heating component 31 includes an inverted L-shaped gas-guiding pipe 311, a fan 312, and a heating wire. The inverted L-shaped gas-guiding pipe 311 is fixedly connected to the air distribution hopper 2. The inverted L-shaped gas-guiding pipe 311 can be fixedly connected to the air distribution hopper 2 via a connector. The gas inlet of the inverted L-shaped gas-guiding pipe 311 is located at the upper port 21 of the air distribution hopper 2, and the gas outlet of the inverted L-shaped gas-guiding pipe 311 is located above the air distribution hopper 2. The fan 312 is fixedly installed at the gas outlet of the inverted L-shaped gas-guiding pipe 311, and the heating wire is fixedly installed inside the inverted L-shaped gas-guiding pipe 311. The fan 312 draws the gas from the upper port 21 of the air distribution hopper 2 into the inverted L-shaped gas-guiding pipe 311. 1. The gas is heated by the heating wire in the inverted L-shaped gas guide tube 311 and its direction of movement is changed. The heated gas is discharged from the gas guide outlet of the inverted L-shaped gas guide tube 311 and covers the upper side of the PCB board 200. The gas guide heating component 31 guides the gas about to overflow at the upper port 21 of the gas distribution hopper 2, so that the upper surface of the PCB board 200 can also exchange heat with the gas to improve the heating efficiency of the PCB board 200. At the same time, most of the gas about to overflow at the upper port 21 of the gas distribution hopper 2 has already exchanged heat with the lower surface of the PCB board 200. Therefore, the heating of the gas by the heating wire of the gas guide heating component 31 can preheat the upper and lower surfaces of the PCB board 200 with the same heating efficiency, thereby reducing the temperature difference between the upper and lower surfaces of the PCB board 200.

[0025] Specifically, please refer to the following: Figure 1 and Figure 4 The gas-guiding heating components 31 of the gas-guiding heating mechanism 3 are arranged at equal intervals, and the gas-guiding heating components 31 of the two gas-guiding heating mechanisms 3 correspond one-to-one.

[0026] Specifically, please refer to the following: Figure 1 and Figure 4 The gas guiding heating mechanism 3 further includes a gas guiding plate 32 fixedly connected to the gas distribution hopper 2. The gas guiding plate 32 is arranged along the distribution direction of the gas guiding heating component 31. The gas guiding plate 32 is closer to the outer side of the gas distribution hopper 2 than the gas guiding heating component 31. The gas guiding plate 32 has a first bending portion 321. The first bending portion 321 causes the gas guiding plate 32 to bend towards the inner side of the gas distribution hopper 2. The first bending portion 321 is used to change the flow direction of the gas overflowing from the gas distribution hopper 2.

[0027] Specifically, the air guide plate 32 also has a second bending portion 322, which causes the air guide plate 32 to bend downward. The heated gas discharged from the air guiding heating mechanism 3 and the gas overflowing from the air distribution hopper 2 form a mixed gas. The second bending portion 322 is used to guide the mixed gas to move downward at an angle.

[0028] Specifically, the air guide cavity is an inverted frustum shape, as an alternative to an inverted trapezoidal shape.

[0029] Specifically, the air distribution holes 11 of the air distribution pipe 1 are arranged at equal intervals to ensure uniform air distribution.

[0030] Specifically, the air distribution pipe 1 is provided with a third bend, which is used to adjust the direction of the air inlet of the air distribution pipe 1. Since most of the air distribution pipe 1 needs to be located inside the wave soldering equipment 100, but the air inlet of the air distribution pipe 1 needs to be located outside the wave soldering equipment 100, the third bend can change the direction of the air inlet of the air distribution pipe 1, which can facilitate changing the position of the air inlet exiting the wave soldering equipment 100.

[0031] Please refer to the following: Figure 1 and Figure 2 During the preheating process of PCB board 200, the conveyor belt of wave soldering equipment 100 first transports PCB board 200 to the upper port 21 of air distribution hopper 2. Then, the heated gas provided by the gas supply equipment enters the air distribution pipe 1 and enters the air guide chamber through the air distribution hole 11, reaching the upper port 21 of air distribution hopper 2. Part of the gas heats the lower surface of PCB board 200, while another part of the gas reaches the upper port 21 of air distribution hopper 2 and is sucked in and heated by the air guide heating component 31 of air guide heating mechanism 3. The heated gas is guided to the upper surface of PCB board 200. With the cooperation of multiple air guide heating mechanisms 3, and the fact that two air guide heating mechanisms 3 are symmetrically arranged, the heated gas can evenly cover the upper surface of PCB board 200. Finally, due to the setting of air guide plate 32, the utilization rate of gas can be further improved, and the heating efficiency of gas on the upper surface of PCB board 200 can be enhanced.

[0032] In summary, this application can improve the heating efficiency of the PCB board and enable simultaneous and efficient heating on both sides of the PCB board, thereby improving the quality of subsequent wave soldering.

[0033] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0034] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of this application and its equivalents, this application also intends to include such modifications and variations.

Claims

1. A wave soldering preheating system for preheating PCB boards before wave soldering, characterized in that, The device includes a horizontally arranged air distribution pipe, an air distribution hopper located above the air distribution pipe, and an air guiding and heating mechanism fixedly connected to the air distribution hopper. One end of the air distribution pipe has an air inlet, and the other end is closed. The air distribution hopper has an air guiding chamber, which is an inverted trapezoidal shape. The air distribution pipe is fixedly connected to the lower port of the air distribution hopper. Near the lower port of the air distribution pipe, there are several air distribution holes. Gas enters the air guiding chamber through the air distribution holes and reaches the upper port of the air distribution hopper to heat the lower side of the PCB board. Two symmetrically arranged air guiding and heating mechanisms are fixed at the upper port. The air guiding and heating mechanisms can guide and heat the gas at the upper port so that the heated gas covers the upper side of the PCB board.

2. The wave soldering preheating system as described in claim 1, characterized in that, The gas guiding and heating mechanism includes several spaced-apart gas guiding and heating components. Each gas guiding and heating component includes an inverted L-shaped gas guiding pipe, a fan, and a heating wire. The inverted L-shaped gas guiding pipe is fixedly connected to the gas distribution hopper. The gas inlet of the inverted L-shaped gas guiding pipe is located at the upper port of the gas distribution hopper, and the gas outlet of the inverted L-shaped gas guiding pipe is located above the gas distribution hopper. The fan is fixed at the gas outlet of the inverted L-shaped gas guiding pipe, and the heating wire is fixed inside the inverted L-shaped gas guiding pipe. The fan draws the gas from the upper port of the gas distribution hopper into the inverted L-shaped gas guiding pipe. The gas is heated by the heating wire in the inverted L-shaped gas guiding pipe and changes its direction of movement. The heated gas is discharged from the gas outlet of the inverted L-shaped gas guiding pipe and covers the upper side of the PCB board.

3. The wave soldering preheating system as described in claim 2, characterized in that, The gas-guiding heating components of the gas-guiding heating mechanism are arranged at equal intervals, and the gas-guiding heating components of the two gas-guiding heating mechanisms correspond one-to-one.

4. The wave soldering preheating system as described in claim 2, characterized in that, The gas guiding and heating mechanism further includes a gas guiding plate fixedly connected to the gas distribution hopper. The gas guiding plate is arranged along the distribution direction of the gas guiding and heating assembly. The gas guiding plate is closer to the outer side of the gas distribution hopper than the gas guiding and heating assembly. The gas guiding plate has a first bending portion, which causes the gas guiding plate to bend towards the inner side of the gas distribution hopper. The first bending portion is used to change the flow direction of the gas overflowing from the gas distribution hopper.

5. The wave soldering preheating system as described in claim 4, characterized in that, The air guide plate also has a second bending portion, which causes the air guide plate to bend downward. The heated gas discharged from the air guiding heating mechanism and the gas overflowing from the air distribution bucket form a mixed gas. The second bending portion is used to guide the mixed gas to move downward at an angle.

6. The wave soldering preheating system as described in claim 1, characterized in that, The air guide cavity is an inverted frustum shape.

7. The wave soldering preheating system as described in claim 1, characterized in that, The air distribution pipe has air distribution holes spaced at equal intervals.

8. The wave soldering preheating system as described in claim 1, characterized in that, The air distribution pipe is provided with a third bend, which is used to adjust the direction of the air inlet of the air distribution pipe.

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