Film coating device for PECVD (plasma enhanced chemical vapor deposition)

Abstract

The utility model discloses a PECVD (Plasma Enhanced Chemical Vapor Deposition) coating device, which comprises a coating device and a heating assembly, the coating device comprises a chamber body, a workpiece placing plate is arranged in the chamber body, a first electrode plate is arranged at the upper end of the workpiece placing plate in the chamber body, and a second electrode plate is arranged at the lower end of the first electrode plate. A second electrode plate is mounted at the lower end of the workpiece placing plate in the cavity body, and a mounting cavity is formed in a rear side wall plate of the cavity body; the heating assembly comprises a heating plate, the heating plate is mounted in the mounting cavity, a plurality of vent holes are formed in the heating plate, a flow equalizing device is mounted on the inner side wall of the rear side wall of the chamber body, and the flow equalizing device is communicated with the interior of the mounting cavity. According to the utility model, the heating plate is arranged in the mounting cavity, and process gas needs to flow through the mounting cavity, so that the process gas can be in full contact with the heating plate, the contact time of the process gas and the heating plate is prolonged, the process gas is uniformly heated, and the coating uniformity is improved.

Description

Technical Field

[0001] This utility model belongs to the field of coating technology, specifically relating to a coating device for PECVD. Background Technology

[0002] PECVD coating equipment uses microwaves or radio frequencies to ionize the gas containing the atoms of the thin film components, forming plasma locally. Utilizing the principle that plasma has strong chemical reactivity and can easily react, the desired thin film is deposited on the workpiece to be coated.

[0003] In existing PECAD coating equipment, when coating silicon wafers, the process gas flows within the chamber and, under the action of the electrode plates, forms plasma. Simultaneously, under the action of the heating device, a thin film is formed on the workpiece surface. However, in existing coating equipment, the heating device provides poor uniformity in heating the process gas, resulting in uneven heating and affecting the uniformity of the coating.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide a coating apparatus for PECVD that can solve the problem of poor coating uniformity caused by poor heating uniformity of process gas.

[0006] To achieve the above objectives, the technical solution provided by a specific embodiment of this utility model is as follows:

[0007] A PECVD coating apparatus, comprising:

[0008] A coating apparatus includes a chamber body containing a workpiece placement plate for holding workpieces to be coated. A first electrode plate is mounted above the workpiece placement plate within the chamber body, and a second electrode plate is mounted below the workpiece placement plate. The first and second electrode plates are positive and negative electrodes, respectively. The workpiece placement plate is positioned between the first and second electrode plates so that the process gas within the workpiece placement plate forms plasma under the influence of an electric field, driven by the action of the first and second electrode plates. A mounting cavity is formed within the rear wall of the chamber body, allowing for the mounting of components and the flow of process gas within the cavity.

[0009] The heating assembly includes a heating plate, which is a heating device used in the PECVD process. The heating plate is installed inside the mounting cavity, allowing it to heat the process gas flowing within the cavity. The heating plate has multiple vent holes, allowing the process gas to flow through them while the heating plate heats the gas. A flow equalization device is installed on the inner sidewall of the rear sidewall of the chamber body. This flow equalization device communicates with the interior of the mounting cavity, allowing the heated process gas to be diverted through the flow equalization device before entering the chamber body, resulting in a uniform distribution of the process gas within the chamber body. Simultaneously, the heated process gas is further mixed within the flow equalization device to ensure even heating.

[0010] In one or more embodiments of this utility model, multiple mounting slots are provided in pairs on the left and right side walls of the chamber body, and the workpiece placement plate, the first electrode plate and the second electrode plate are all installed in the mounting slots in a sliding connection manner, so that the workpiece placement plate, the first electrode plate and the second electrode plate are easy to assemble and disassemble.

[0011] In one or more embodiments of this utility model, the plurality of mounting slots allow multiple workpiece placement plates, first electrode plates, and second electrode plates to be installed in the chamber body. The plurality of workpiece placement plates, first electrode plates, and second electrode plates are installed sequentially so that multiple workpiece placement plates, first electrode plates, and second electrode plates can be installed in the chamber body simultaneously according to the usage, so that the workpiece can be coated in multiple areas in the chamber body at the same time.

[0012] In one or more embodiments of this utility model, an air inlet is provided on the rear side wall of the chamber body, and an air supply pipe is installed on the outer side of the rear side wall of the chamber body at the air inlet, and the air supply pipe delivers process gas to the installation cavity through the air inlet.

[0013] In one or more embodiments of this utility model, sliding grooves are provided on the upper and lower side walls of the mounting cavity, and the heating plate is installed in the mounting cavity through the sliding grooves, making it convenient to install and remove the heating plate in the mounting cavity.

[0014] In one or more embodiments of this utility model, the apertures of the plurality of vent holes are different, and the apertures of the plurality of vent holes are arranged in such a way that they gradually increase from the center of the heating plate to both sides. Since the air inlet is located at the center of the heating plate, the arrangement of the vent hole apertures allows the process gas to flow over a large range when it enters the mounting cavity through the air inlet.

[0015] In one or more embodiments of the present invention, the flow equalization device has a plurality of flow equalization holes on the side wall away from the bottom of the chamber body, and the plurality of flow equalization holes are arranged in a plurality of annular arrangements.

[0016] In one or more embodiments of this utility model, the plurality of flow equalization holes are inclined in a way that diffuses outward, and the inclination of the flow equalization holes on different annular rings is set in a way that gradually increases from the center of the flow equalization device to both sides, so that when the process gas entering the flow equalization device is ejected through the flow equalization holes, the process gas can diffuse evenly into the chamber body, so that the process gas is evenly distributed in the chamber body.

[0017] In one or more embodiments of this utility model, one side of the mounting cavity is configured as an opening, and the other end of the mounting cavity is configured as a closed opening.

[0018] In one or more embodiments of this utility model, the mounting cavity is configured such that one end of the opening is covered with a side cover, which facilitates the maintenance and replacement of the heating plate. A fixing screw is threaded between the side cover and the side wall of the cavity body, making it easy to assemble and disassemble the side cover.

[0019] Compared with the prior art, this utility model places the heating plate inside the mounting cavity, and the process gas needs to flow through the mounting cavity, so that the process gas can fully contact the heating plate, thereby increasing the contact time between the process gas and the heating plate, so that the process gas is heated evenly, thereby improving the uniformity of the coating. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a front view of a PECVD coating apparatus according to one embodiment of the present invention;

[0022] Figure 2 This is an exploded view of a PECVD coating apparatus according to one embodiment of the present invention;

[0023] Figure 3 This is a cross-sectional view of a PECVD coating apparatus according to one embodiment of the present invention;

[0024] Figure 4 In one embodiment of this utility model Figure 3 Enlarged view of point A in the middle;

[0025] Figure 5 This is an exploded view of the area between the side cover and the chamber body in one embodiment of the present invention;

[0026] Figure 6 This is a schematic diagram of the heating plate in one embodiment of the present invention.

[0027] Explanation of key figure labels:

[0028] 1-Coating device, 11-Cavity body, 12-Workpiece placement plate, 13-First electrode plate, 14-Second electrode plate, 15-Mounting groove, 16-Mounting cavity, 17-Air inlet, 18-Air supply pipe, 2-Heating component, 21-Heating plate, 22-Ventilation hole, 23-Flow equalization device, 24-Flow equalization hole, 25-Side cover, 26-Fixing screw. Detailed Implementation

[0029] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0030] like Figures 1-3 As shown, a PECVD coating apparatus in one embodiment of the present invention includes a coating apparatus 1 and a heating component 2.

[0031] like Figures 1-3 As shown, the coating apparatus 1 includes a chamber body 11, within which a workpiece placement plate 12 is installed. The chamber body 11 is used to place workpieces to be coated. A first electrode plate 13 is installed at the upper end of the workpiece placement plate 12 within the chamber body 11, and a second electrode plate 14 is installed at the lower end of the workpiece placement plate 12 within the chamber body 11. The first electrode plate 13 and the second electrode plate 14 are positive and negative electrode plates, respectively. The workpiece placement plate 12 is positioned between the first electrode plate 13 and the second electrode plate 14 so that the process gas within the chamber body 11 forms plasma under the influence of an electric field through the action of the first electrode plate 13 and the second electrode plate 14. A mounting cavity 16 is formed in the rear wall of the chamber body 11, allowing components to be mounted within the rear wall of the chamber body 11 while simultaneously allowing the process gas to flow within the mounting cavity 16.

[0032] like Figure 2 As shown, multiple mounting slots 15 are provided in pairs on the left and right side walls of the chamber body 11. The workpiece placement plate 12, the first electrode plate 13, and the second electrode plate 14 are all installed in the mounting slots 15 in a sliding connection manner, which makes it convenient to assemble and disassemble the workpiece placement plate 12, the first electrode plate 13, and the second electrode plate 14.

[0033] like Figures 1-3 As shown, multiple mounting slots 15 allow multiple workpiece placement plates 12, first electrode plates 13, and second electrode plates 14 to be installed inside the chamber body 11. The multiple workpiece placement plates 12, first electrode plates 13, and second electrode plates 14 are installed sequentially so that multiple workpiece placement plates 12, first electrode plates 13, and second electrode plates 14 can be installed inside the chamber body 11 simultaneously according to the usage, so that workpieces can be coated simultaneously through multiple areas inside the chamber body 11.

[0034] like Figure 3 Combination Figure 4 As shown, an air inlet 17 is provided on the rear side wall of the chamber body 11, and an air supply pipe 18 is installed on the outer side of the rear side wall of the chamber body 11 on the air inlet 17. The air supply pipe 18 delivers the process gas to the installation cavity 16 through the air inlet 17.

[0035] like Figures 3-5 As shown, the heating assembly 2 includes a heating plate 21, which is a heating device used in the PECVD process. The heating plate 21 is installed inside the mounting cavity 16, allowing it to heat the process gas flowing within the cavity. The heating plate 21 has multiple vent holes 22, allowing the process gas to flow through these holes while heating the cavity. A flow equalization device 23 is installed on the inner sidewall of the rear sidewall of the chamber body 11. This device communicates with the interior of the mounting cavity 16, allowing the heated process gas to be diverted by the flow equalization device 23 before entering the chamber body 11, resulting in a uniform distribution of the process gas within the chamber body 11. Simultaneously, the heated process gas is further mixed within the flow equalization device 23, ensuring even heating.

[0036] Preferably, since the space inside the mounting cavity 16 is limited, in order for the process gas to flow through the surface of the heating plate 21 inside the mounting cavity 16, so that the process gas can fully contact the heating plate 21 and increase the contact time between the process gas and the heating plate 21, so as to make the heating of the process gas uniform, a certain distance is set between the heating plate 21 and the front and rear side walls of the mounting cavity 16 when it is installed inside the mounting cavity 16.

[0037] like Figure 3 As shown, sliding grooves are provided on the upper and lower side walls of the mounting cavity 16. The heating plate 21 is installed in the mounting cavity 16 through the sliding grooves, making it convenient to install and remove the heating plate 21 in the mounting cavity 16.

[0038] like Figure 6As shown, the diameters of the multiple vent holes 22 are different, and the diameters of the multiple vent holes 22 are arranged in a manner that gradually increases from the center of the heating plate 21 to both sides. Since the air inlet 17 is located at the center of the heating plate 21, the arrangement of the vent hole diameters of the vent holes 22 allows the process gas to flow over a large range when it enters the mounting cavity 16 through the air inlet 17.

[0039] like Figure 4 and Figure 5 As shown, the flow equalization device 23 has multiple flow equalization holes 24 on the side wall away from the bottom of the chamber body 11, and the multiple flow equalization holes 24 are arranged in a ring-shaped manner.

[0040] like Figure 4 As shown, multiple flow equalization holes 24 are inclined in a way that diffuses outward, and the inclination of the flow equalization holes 24 on different annular rings is set in a way that gradually increases from the center of the flow equalization device 23 to both sides, so that when the process gas entering the flow equalization device 23 is ejected through the flow equalization holes 24, the process gas can diffuse evenly into the chamber body 11, so that the process gas is evenly distributed in the chamber body 11.

[0041] like Figure 5 As shown, one side of the mounting cavity 16 is set as an opening, and the other end of the mounting cavity 16 is set as a closed opening.

[0042] like Figure 5 As shown, the mounting cavity 16 is configured such that one end of the opening is covered with a side cover 25, which facilitates the maintenance and replacement of the heating plate 21. A fixing screw 26 is threaded between the side cover 25 and the side wall of the cavity body 11, which makes it easy to install and remove the side cover 25.

[0043] In use, according to the process requirements, a corresponding number of workpiece placement plates 12, first electrode plates 13 and second electrode plates 14 are installed in the chamber body 11. The workpiece to be coated is placed on the workpiece placement plate 12. The first electrode plate 13 and the second electrode plate 14 are energized to form an electric field between the workpiece placement plates 12. The gas supply pipe 18 delivers the process gas to the installation cavity 16 through the gas inlet 17, so that the process gas flows in the installation cavity 16. When it flows, the process gas will come into contact with the heating plate 21, so that the heating plate 21 heats the process gas. The heated process gas will flow through the vent 22 and then enter the flow equalization device 23, so that the process gas is buffered in the flow equalization device 23 to make the heating more uniform. Then, the process gas is evenly released into the chamber body 11 through the flow equalization hole 24. The process gas will form plasma under the action of the electric field, so that it can react on the surface of the workpiece to form a thin film.

[0044] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0045] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A coating apparatus for PECVD, characterized in that, include: A coating apparatus includes a chamber body, a workpiece placement plate installed inside the chamber body, a first electrode plate installed at the upper end of the workpiece placement plate inside the chamber body, a second electrode plate installed at the lower end of the workpiece placement plate inside the chamber body, and an installation cavity opened in the rear side wall of the chamber body. The heating assembly includes a heating plate installed in the mounting cavity. The heating plate has multiple vent holes. A flow equalization device is installed on the inner side wall of the rear side wall of the cavity body. The flow equalization device is connected to the interior of the mounting cavity.

2. The coating apparatus for PECVD according to claim 1, characterized in that, Multiple mounting slots are provided in pairs on the left and right side walls of the chamber body, and the workpiece placement plate, the first electrode plate and the second electrode plate are all installed in the mounting slots in a sliding connection manner.

3. The coating apparatus for PECVD according to claim 2, characterized in that, The multiple mounting slots allow multiple workpiece placement plates, first electrode plates, and second electrode plates to be installed within the chamber body, with the multiple workpiece placement plates, first electrode plates, and second electrode plates installed sequentially.

4. The coating apparatus for PECVD according to claim 1, characterized in that, An air inlet is provided on the rear side wall of the chamber body, and an air supply pipe is installed on the outer side of the rear side wall of the chamber body at the air inlet.

5. A coating apparatus for PECVD according to claim 1, characterized in that, The upper and lower side walls of the mounting cavity are provided with sliding grooves, and the heating plate is installed in the mounting cavity through the sliding grooves.

6. A coating apparatus for PECVD according to claim 1, characterized in that, The multiple vent holes have different diameters, and the diameters of the multiple vent holes are arranged in a manner that gradually increases from the center of the heating plate to both sides.

7. A coating apparatus for PECVD according to claim 1, characterized in that, The flow equalization device has multiple flow equalization holes on its side wall away from the bottom of the chamber body, and the multiple flow equalization holes are arranged in a ring-shaped manner.

8. A coating apparatus for PECVD according to claim 7, characterized in that, The multiple flow equalization holes are all inclined in a way that diffuses outward, and the inclination of the flow equalization holes on different rings is set in a way that gradually increases from the center of the flow equalization device to both sides.

9. A coating apparatus for PECVD according to claim 1, characterized in that, One side of the mounting cavity is set as an opening, and the other end of the mounting cavity is set as a closed opening.

10. A coating apparatus for PECVD according to claim 9, characterized in that, The mounting cavity is configured such that one end of the opening is covered by a side cover, and the side cover is threadedly connected to the side wall of the cavity body by a fixing screw.

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