Electrolytic bath for electroplating

Abstract

The utility model provides an electrolytic bath for electroplating, and belongs to the technical field of electrolytic baths. Comprising an electrolytic cell shell, a workpiece penetrating into the electrolytic cell shell and a conductive copper bar component, the plurality of conductive copper bar components are uniformly distributed in the electrolytic tank shell, each conductive copper bar component comprises two copper bars A which are arranged at the lower part in the electrolytic tank shell in parallel, the two sides of the upper part of each copper bar A are connected with copper bars B, and a copper bar C is fixed at the top ends of every two adjacent copper bars B together. As shown in Figure 1, a plurality of conductive copper bar components are designed in an electrolytic bath shell, and each conductive copper bar component is composed of two copper bars A, B and C, so that copper ions can be released and deposited on the surface of a workpiece to form a copper layer in the electroplating process more quickly and uniformly, and the electric conduction is more uniform.

Description

Technical Field

[0001] This application relates to the field of electrolytic cells, and more specifically, to an electrolytic cell for electroplating. Background Technology

[0002] In electroplating, the plating metal or other insoluble material acts as the anode, and the workpiece to be plated acts as the cathode. The cations of the plating metal are reduced on the surface of the workpiece to form the plating layer. During electroplating, the workpiece to be plated is usually connected to the electroplating cathode via a fixture, while the plating metal is mounted on the electroplating anode.

[0003] When copper plating some workpieces, copper strips are usually installed as the electroplating anode. For example, Chinese Utility Model Patent Application No. CN201820664176.0 discloses an electroplating tank that uses copper strips as electroplating anodes to deposit a copper layer on the surface of the workpiece during the electrolysis process, thereby completing the workpiece electroplating.

[0004] However, in the process of implementing the technical solutions in the embodiments of this application, the inventors of this application discovered that the above-mentioned technology has at least the following technical problems:

[0005] As can be seen from the accompanying drawings and text descriptions of the above scheme, only a separate copper strip is designed to be placed in the electroplating tank to release copper ions to replenish the electrolyte inside. This results in a relatively slow release of copper ions from the electrolytic tank and poor conductivity uniformity. Utility Model Content

[0006] To overcome the above deficiencies, this application provides an electrolytic cell for electroplating, in which multiple conductive copper strip components, consisting of copper strip A, copper strip B and copper strip C, are arranged inside the outer shell of the electrolytic cell, thereby widening the copper distribution area in the electrolyte and enhancing the conductivity uniformity.

[0007] This application provides an electrolytic cell for electroplating, including an outer shell of the electrolytic cell and a workpiece inserted therein, and also includes a conductive copper strip component;

[0008] The conductive copper strip components are provided in multiple and evenly distributed inside the electrolytic cell shell. Each conductive copper strip component includes two copper strips A arranged parallel to each other in the lower part of the electrolytic cell shell. Copper strips B are connected to the upper two sides of each copper strip A. Copper strip C is fixed to the top of each pair of adjacent copper strips B.

[0009] Preferably, copper balls are equidistantly attached to the copper strip A;

[0010] The copper ball part includes a hook that is hung on the copper strip A, and a copper ball is provided at the bottom of the hook.

[0011] Preferably, each hook has a protrusion fixedly connected to its inner side, and the copper strip A has insertion holes at equal intervals that are adapted to the protrusions.

[0012] Preferably, a screw is fixedly connected to the bottom of the hook, and a screw hole adapted to the screw is opened on the copper ball.

[0013] Preferably, a rectangular frame is fixedly connected to the upper part of both sides of the outer shell of the electrolytic cell.

[0014] The electroplating electrolytic cell also includes a conductive copper strip mounting component;

[0015] The conductive copper strip mounting component includes collars fitted at both ends of the copper strip C. The top of the collars is connected to an inverted U-shaped frame that can fit against the outer side of the rectangular frame. An elastic positioning component that can limit and hold the inverted U-shaped frame is also installed inside the rectangular frame.

[0016] Preferably, the elastic positioning member includes a sleeve fixed to the inner part of the rectangular frame, a plug rod slidably connected inside the sleeve, a spring provided between the inner end of the plug rod and the inner end of the sleeve, and an insertion hole for the plug rod to pass through on the inverted U-shaped frame.

[0017] Preferably, both ends of the copper strip C are respectively attached to the two sides of the inner wall of the electrolytic cell shell.

[0018] Beneficial effects: This application provides an electrolytic cell for electroplating, such as... Figure 1 As shown, multiple conductive copper strip components are designed inside the outer shell of the electrolytic cell, and each conductive copper strip component consists of two copper strips A, B, and C. This arrangement allows copper ions to be released more quickly and evenly during the electroplating process and deposited on the surface of the workpiece to form a copper layer, resulting in more uniform conductivity. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the electrolytic cell structure for electroplating provided in the embodiments of this application;

[0021] Figure 2 A schematic diagram illustrating the connection relationship between the conductive copper strip component and the copper ball portion provided in the embodiments of this application;

[0022] Figure 3 A schematic diagram of the copper strip A structure provided for an embodiment of this application;

[0023] Figure 4A partial cross-sectional structural diagram of the copper ball portion provided for an embodiment of this application;

[0024] Figure 5 A schematic diagram of the connection between the copper strip C and the conductive copper strip mounting component provided in the embodiments of this application;

[0025] Figure 6 A schematic diagram of the elastic positioning member structure provided for an embodiment of this application.

[0026] In the diagram: 1-Electrolytic cell shell; 2-Workpiece; 3-Conductive copper strip component; 31-Copper strip A; 311-Intercepting hole; 32-Copper strip B; 33-Copper strip C; 4-Copper ball; 41-Hook; 42-Copper ball; 43-Protrusion; 44-Screw; 5-Conductive copper strip mounting component; 51-Collar; 52-Inverted U-shaped frame; 53-Elastic positioning component; 531-Sleeve; 532-Intercepting rod; 533-Spring; 6-Rectangular frame. Detailed Implementation

[0027] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0028] Please see Figures 1-6 This application provides an electrolytic cell for electroplating, including an electrolytic cell shell 1 and a workpiece 2 inserted therein, and also includes a conductive copper strip component 3;

[0029] Multiple conductive copper strip components 3 are provided and evenly distributed inside the outer shell 1 of the electrolytic cell. Each conductive copper strip component 3 includes two copper strips A31 arranged parallel to each other in the lower part of the outer shell 1 of the electrolytic cell. Copper strips B32 are connected to the upper two sides of copper strip A31. Copper strip C33 is fixed to the top of each pair of adjacent copper strips B32.

[0030] In this embodiment, as Figure 1 As shown, multiple conductive copper strip components 3 are designed inside the outer shell 1 of the electrolytic cell, and each conductive copper strip component 3 is composed of two copper strips A31, B32 and C33. This arrangement allows copper ions to be released more quickly and evenly during the electroplating process and deposited on the surface of the workpiece 2 to form a copper layer, resulting in more uniform conductivity.

[0031] It should also be noted that the outer shell 1 of the electrolytic cell is designed with an electroplating cathode (not shown) that can be connected to the workpiece 2 and an electroplating anode (not shown) that can be connected to the conductive copper strip component 3. The specific connection method is existing technology and will not be described in detail here.

[0032] Copper balls 4 are equidistantly attached to copper strip A31;

[0033] The copper ball part 4 includes a hook 41 that is hung on the copper strip A31, and a copper ball 42 is provided at the bottom of the hook 41. Specifically, as shown... Figure 2 As shown, the copper balls 4, which are equidistantly hung on the copper strip A31, can further increase the copper layout in the electrolyte and further improve the uniformity of conductivity during the electroplating process.

[0034] Each hook 41 has a protruding block 43 fixedly connected to its inner side, and the copper strip A31 has equally spaced insertion holes 311 that match the protruding blocks 43. Specifically, as shown... Figure 3 and Figure 4 As shown, the copper ball part 4 can be more stably fixed in the designated position by using the cooperation of the protrusion 43 and the insertion hole 311.

[0035] A screw 44 is fixedly connected to the bottom of the hook 41, and a screw hole adapted to the screw 44 is opened on the copper ball 42. Specifically, as shown... Figure 4 As shown, the design of the screw 44 and screw hole allows the hook 41 to be detachably fixed to the copper ball 42.

[0036] A rectangular frame 6 is fixedly connected to the upper part of both sides of the outer shell 1 of the electrolytic cell.

[0037] The electroplating electrolytic cell also includes a conductive copper strip mounting component 5;

[0038] The conductive copper strip mounting component 5 includes collars 51 sleeved on both ends of the copper strip C33. The top of the collars 51 is connected to an inverted U-shaped frame 52 that can fit against the outer side of the rectangular frame 6. An elastic positioning component 53 that can limit and hold the inverted U-shaped frame 52 is also installed inside the rectangular frame 6.

[0039] The elastic positioning element 53 includes a sleeve 531 fixed to the inner part of the rectangular frame 6. A connecting rod 532 is slidably connected inside the sleeve 531. A spring 533 is provided between the inner end of the connecting rod 532 and the inner end of the sleeve 531. An insertion hole is opened on the inverted U-shaped frame 52 for the connecting rod 532 to pass through. Specifically, as shown... Figure 1 , Figure 5 and Figure 6 As shown, pressing the plug rod 532 disengages it from the corresponding insertion hole, and pulling up the U-shaped bracket 52 can quickly remove the conductive copper strip component 3 from the electrolytic cell housing 1.

[0040] The two ends of the copper strip C33 are respectively attached to the two sides of the inner wall of the electrolytic cell shell 1.

[0041] When this application is used:

[0042] like Figure 1As shown, multiple conductive copper strip components 3 are designed inside the outer shell 1 of the electrolytic cell, and each conductive copper strip component 3 consists of two copper strips A31, B32, and C33. This arrangement allows copper ions to be released and deposited on the surface of the workpiece 2 more quickly and evenly during the electroplating process, forming a copper layer and resulting in more uniform conductivity. The copper balls 4, equidistantly hung on the copper strips A31, further increase the copper distribution in the electrolyte, further improving the uniformity of conductivity during the electroplating process.

[0043] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An electroplating tank, comprising an outer shell (1) and a workpiece (2) inserted therein, characterized in that, Also includes; The conductive copper strip components (3) are provided in multiple and evenly distributed inside the outer shell (1) of the electrolytic cell. Each conductive copper strip component (3) includes two copper strips A (31) arranged parallel to each other inside the lower part of the outer shell (1) of the electrolytic cell. Copper strips B (32) are connected to the upper sides of the copper strips A (31). Copper strip C (33) is fixed to the top of each pair of adjacent copper strips B (32).

2. The electrolytic cell for electroplating according to claim 1, characterized in that, Copper balls (4) are equidistantly attached to the copper strip A (31); The copper ball part (4) includes a hook (41) that is hung on the copper strip A (31), and a copper ball (42) is provided at the bottom of the hook (41).

3. The electroplating electrolytic cell according to claim 2, characterized in that, The hooks (41) are all fixedly connected to the inner side of the protrusions (43), and the copper strip A (31) is provided with insertion holes (311) that are adapted to the protrusions (43) at equal intervals.

4. The electroplating electrolytic cell according to claim 3, characterized in that, The bottom of the hook (41) is fixedly connected to a screw (44), and the copper ball (42) has a screw hole that matches the screw (44).

5. The electroplating electrolytic cell according to claim 1, characterized in that, A rectangular frame (6) is fixedly connected to the upper part of both sides of the outer shell (1) of the electrolytic cell.

6. The electroplating electrolytic cell according to claim 5, characterized in that, It also includes conductive copper strip mounting components (5); The conductive copper strip mounting component (5) includes collars (51) sleeved on both ends of the copper strip C (33). The top of the collars (51) is connected to an inverted U-shaped frame (52) that can fit against the outer side of the rectangular frame (6). The rectangular frame (6) is also equipped with an elastic positioning component (53) that can limit and hold the inverted U-shaped frame (52).

7. The electroplating electrolytic cell according to claim 6, characterized in that, The elastic positioning component (53) includes a sleeve (531) fixed to the inner part of the rectangular frame (6), a plug rod (532) is slidably connected inside the sleeve (531), a spring (533) is provided between the inner end of the plug rod (532) and the inner end of the sleeve (531), and an insertion hole is opened on the inverted U-shaped frame (52) for the plug rod (532) to pass through.

8. The electroplating cell according to claim 1, characterized in that, The two ends of the copper strip C (33) are respectively attached to the inner walls of the electrolytic cell shell (1).

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