Integrated electroplating equipment for local electroplating

Abstract

The integrated electroplating equipment comprises an electroplating bath, an electroplating cover and an electroplating part, the electroplating part comprises pins and a mounting plate, the electroplating part is arranged in the mounting plate in a penetrating manner, the electroplating bath is of an uncovered cavity structure, a plurality of slotted holes are formed in the surface of the electroplating cover, and the pins are arranged in the slotted holes. The length or the width of the groove hole is smaller than the size of the mounting plate, the size of the groove hole is larger than the size of the transverse section of the electroplating part, a boss extending inwards is arranged on the inner side wall of the electroplating bath and used for supporting an electroplating cover, the groove hole is in the shape of a straight kidney-shaped hole, and two execution kidney-shaped holes are arranged in parallel.

Description

Technical Field

[0001] This utility model is an integrated electroplating device for local electroplating. Background Technology

[0002] Electroplating is the process of depositing a thin layer of another metal or alloy onto the surface of certain metals using the principle of electrolysis. It utilizes electrolysis to attach a metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate), and enhancing aesthetics. Many coins also have an electroplated outer layer.

[0003] However, conventional fixtures cannot properly clamp some electroplated parts, which makes it impossible to electroplat them in batches. This undoubtedly greatly reduces the electroplating efficiency of such parts. In this regard, the present invention proposes a tooling that can clamp such electroplated parts in batches. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide an integrated electroplating device for local electroplating.

[0005] An integrated electroplating device for local electroplating includes an electroplating tank, an electroplating cover, and an electroplated part. The electroplated part includes pins and a mounting plate. The electroplated part is inserted into the mounting plate. The electroplating tank has a coverless cavity structure. The surface of the electroplating cover has multiple slots. The length or width of the slots is smaller than the size of the mounting plate, and the size of the slots is larger than the size of the transverse cross section of the electroplated part.

[0006] Furthermore, the electroplating cover has upward L-shaped bending connecting parts at both ends. The connecting parts include a vertical section and a horizontal section. The lower end face of the horizontal section is connected to the upper end face of the electroplating tank and is fixedly connected by at least two bolts.

[0007] Furthermore, at least two overflow holes are provided on the side wall of the electroplating tank. The overflow holes are located at a height higher than that of the electroplating cover. The overflow holes are connected to the sub-tank. The sub-tank is located outside the electroplating tank, with one side connected to the side wall of the electroplating tank. The sub-tank is equipped with a heating pipe and a filter circulation pump. The circulation pump is used to transport the gold plating solution in the sub-tank to the electrolytic tank, and the heating pipe is used to heat the gold plating solution in the sub-tank.

[0008] Furthermore, the slot is shaped like a straight waist hole.

[0009] Furthermore, the number of slots is two, and the two slots are set in parallel.

[0010] Furthermore, reinforcing ribs are provided on the upper end face of the electroplated cover in the extension direction.

[0011] Furthermore, both the electroplating tank and the electroplating cover are rectangular parallelepiped structures.

[0012] Furthermore, support legs are provided at the four corners of the bottom of the electroplating tank.

[0013] Furthermore, the electroplating cover is equipped with a handle that is higher than the electroplating tank.

[0014] Beneficial effects: Compared with the prior art, this utility model is specifically designed for electroplated parts of this structure. By supporting the mounting plate with the electroplating cover, the pins of the electroplated parts that need to be electroplated are suspended in the electroplating tank, achieving the effect of accurately electroplating hundreds of products at once. Subsequent operations such as water washing can be performed by simply lifting the tooling away. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of an integrated electroplating device for localized electroplating.

[0016] Figure 2 This is a top view of an integrated electroplating device used for localized electroplating;

[0017] In the diagram, 1 is the electroplating tank, 2 is the electroplating cover, 3 is the reinforcing rib, 4 is the handle, 5 is the secondary tank, 6 is the overflow hole, 7 is the electroplated part, 8 is the slot hole, and 9 is the connecting part. Detailed Implementation

[0018] To enhance understanding of this utility model, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. These embodiments are only used to explain the present utility model and do not constitute a limitation on the scope of protection of the present utility model.

[0019] like Figure 1-2 As shown, the components are: 1. Electroplating tank; 2. Electroplating cover; 3. Reinforcing rib; 4. Handle; 5. Sub-tank; 6. Overflow hole; 7. Electroplated part; 8. Slot hole; 9. Connecting part.

[0020] An integrated electroplating device for local electroplating includes an electroplating tank 1, an electroplating cover 2, and an electroplated part 7. The electroplated part 7 includes pins and a mounting plate. The electroplated part 7 is inserted into the mounting plate. The electroplating tank 1 is a coverless cavity structure. The surface of the electroplating cover 2 is provided with multiple slots 8. The length or width of the slots 8 is smaller than the size of the mounting plate, and the size of the slots 8 is larger than the size of the transverse cross section of the electroplated part 7.

[0021] In this example, the electroplating cover 2 has upward L-shaped bending connecting parts 9 at both ends. The connecting parts 9 include a vertical section and a horizontal section. The lower end face of the horizontal section is connected to the upper end face of the electroplating tank 1 and is fixedly connected by at least two bolts.

[0022] In this example, at least two overflow holes 6 are provided on the side wall of the electroplating tank 1. The overflow holes 6 are located at a height higher than the electroplating cover 2. The overflow holes 6 are connected to the auxiliary tank 5, which is located outside the electroplating tank 1. One side of the auxiliary tank 5 is connected to the side wall of the electroplating tank 1. The auxiliary tank 5 is equipped with a heating pipe and a filter circulation pump. The circulation pump is used to transport the gold plating solution in the auxiliary tank 5 to the electrolytic tank. The heating pipe is used to heat the gold plating solution in the auxiliary tank 5. It should be noted that the overflow holes 6 are used to control the liquid level. The overflowing solution flows into the auxiliary tank 5, where the heating pipe is placed to heat the solution. Then, a filter circulation pump is connected, and the solution is pumped back to the electroplating tank 1.

[0023] In this example, the slot 8 is a straight waist-shaped hole.

[0024] In this example, there are two slots 8, and the two slots are set in parallel.

[0025] In this example, the upper end face of the electroplated cover 2 is provided with reinforcing ribs 3 in the extension direction.

[0026] In this example, both the electroplating tank 1 and the electroplating cover 2 are rectangular parallelepiped structures.

[0027] In this example, support legs are provided at the four corners of the bottom of the electroplating tank 1.

[0028] In this example, the electroplating cover 2 is provided with a handle 4 that is higher than the electroplating tank 1.

[0029] Instructions for use: Pour the gold plating solution into the electroplating tank 1 until it reaches the graduation mark, cover it with the electroplating cap 2, and then place the flat end of the part 7 to be electroplated down into the slot 8.

[0030] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An integrated electroplating equipment for localized electroplating, characterized in that, The device includes an electroplating tank, an electroplating cover, and an electroplated component. The electroplated component includes pins and a mounting plate. The electroplated component is inserted into the mounting plate. The electroplating tank is a coverless cavity structure. The surface of the electroplating cover has multiple slots. The length or width of the slots is smaller than the size of the mounting plate, and the size of the slots is larger than the size of the transverse cross-section of the electroplated component.

2. The integrated electroplating equipment for localized electroplating according to claim 1, characterized in that, The electroplating cover has upward L-shaped bending connecting parts at both ends. The connecting parts include a vertical section and a horizontal section. The lower end face of the horizontal section is connected to the upper end face of the electroplating tank and is fixedly connected by at least two bolts.

3. The integrated electroplating equipment for localized electroplating according to claim 2, characterized in that, The electroplating tank has at least two overflow holes on its side wall. The overflow holes are located at a height higher than the electroplating cover. The overflow holes are connected to the sub-tank. The sub-tank is located outside the electroplating tank and is connected to the side wall of the electroplating tank on one side. The sub-tank is equipped with a heating pipe and a filter circulation pump. The circulation pump is used to transport the gold plating solution in the sub-tank to the electrolytic tank, and the heating pipe is used to heat the gold plating solution in the sub-tank.

4. The integrated electroplating equipment for localized electroplating according to claim 1, characterized in that, The slot is a straight, waist-shaped hole.

5. An integrated electroplating equipment for localized electroplating according to claim 4, characterized in that, The number of slots is two, and the two slots are arranged in parallel.

6. An integrated electroplating equipment for localized electroplating according to claim 5, characterized in that, The electroplated cover has reinforcing ribs along its elongation direction on the upper end surface.

7. An integrated electroplating equipment for localized electroplating according to claim 1, characterized in that, Both the electroplating tank and the electroplating cover are rectangular parallelepiped structures.

8. An integrated electroplating equipment for localized electroplating according to claim 7, characterized in that, The electroplating tank is equipped with support legs at the four corners of its bottom.

9. An integrated electroplating equipment for localized electroplating according to claim 1, characterized in that, The electroplating cover is provided with a handle that is higher than the electroplating tank.

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