Efficient heat dissipation shell assembly and heat pump host

Abstract

The utility model discloses an efficient heat dissipation shell assembly and a heat pump main engine, the shell assembly comprises a main engine shell and a packaging plate, the packaging plate is provided with a heat dissipation area and a connecting part, and the connecting part is arranged on the periphery of the packaging plate and used for being detachably connected with the main engine shell; the packaging plate comprises a panel section and two side plate sections which are connected with each other, and the two side plate sections are oppositely arranged on the two sides of the panel section; the heat dissipation area is arranged in the middle of the panel section and extends to the side plate section. According to the utility model, the heat dissipation area covers the corner connection part of different side surfaces of the packaging plate, so that the heat dissipation surface area is increased, heat in the host case can be quickly and uniformly dissipated from the heat dissipation area of the packaging plate, and heat accumulation points cannot be formed at local corners.

Description

Technical Field

[0001] This utility model relates to the field of heat pump technology, and in particular to a high-efficiency heat dissipation housing assembly and a heat pump host. Background Technology

[0002] A heat pump is a device that transfers heat from a low-temperature heat source to a high-temperature heat source by consuming electrical energy. During its operation, components such as the compressor and heat exchanger generate a significant amount of heat. To ensure the normal operation of the heat pump, this heat needs to be dissipated through ventilation holes on the casing. To avoid reducing the strength of the casing edge if the ventilation holes were located there, these ventilation holes are positioned at a distance from the side edges, in the middle of different sides of the casing.

[0003] However, this results in uneven distribution of heat dissipation vents on the casing. Where there are no vents at the corners where different sides of the casing meet, heat tends to accumulate. This continuous heat buildup at the corners reduces the overall heat dissipation efficiency of the casing, potentially affecting the operating temperature of the internal components of the heat pump, thus reducing its efficiency and lifespan. Utility Model Content

[0004] In order to overcome at least one of the defects of the prior art, the present invention provides a high-efficiency heat dissipation housing assembly and a heat pump host, wherein the corners of different sides of the encapsulation plate are covered with heat dissipation areas, so that the heat inside the host housing can be quickly and evenly dissipated from the heat dissipation areas of the encapsulation plate, avoiding the problem of heat accumulation points forming at local corners.

[0005] The technical solution adopted by this utility model to solve its problem is:

[0006] A high-efficiency heat dissipation housing assembly includes a main housing and a packaging plate. The packaging plate has a heat dissipation area and a connecting portion. The connecting portion is disposed around the periphery of the packaging plate and is used for detachable connection with the main housing. The packaging plate includes a front panel segment and two side panel segments that are connected to each other. The two side panel segments are disposed opposite to each other on both sides of the front panel segment. The heat dissipation area is disposed in the middle of the front panel segment and extends to the side panel segments.

[0007] Furthermore, the heat dissipation area is provided with a plurality of evenly distributed heat dissipation holes; a reinforcement area is provided between the edge of the heat dissipation area and the edge of the packaging plate.

[0008] Furthermore, the heat dissipation holes are honeycomb holes.

[0009] Furthermore, the side panel segment and the front panel segment are integrally formed.

[0010] Furthermore, the panel segment and the side panel segment are connected by an arc-shaped segment.

[0011] Furthermore, the end of the side panel segment away from the panel segment extends inward to form a side flange, and the same end of the panel segment and the side panel segment are provided with a first connecting step, and the other end of the panel segment and the side panel segment are provided with a second connecting step; the connecting part includes the side flange, the first connecting step and the second connecting step.

[0012] Furthermore, the first connecting step includes a first connecting segment, a connecting segment, and a second connecting segment. The two ends of the connecting segment are respectively connected to one end of the first connecting segment and one end of the second connecting segment. The other end of the first connecting segment is connected to the panel segment or the side panel segment. The first connecting segment and / or the second connecting segment are provided with connecting holes, and the connecting holes are connected to the main housing through fasteners.

[0013] Furthermore, the connecting section is provided with a snap-fit ​​groove, which is used to snap-fit ​​with the main unit housing.

[0014] Furthermore, the second connecting step includes a third connecting segment and a fourth connecting segment. One end of the third connecting segment is connected to one end of the fourth connecting segment, and the other end of the third connecting segment is connected to the panel segment or the side panel segment. The fourth connecting segment is provided with a connecting hole, which is connected to the main housing by a fastener.

[0015] A heat pump host includes the aforementioned high-efficiency heat dissipation housing assembly.

[0016] In summary, the high-efficiency heat dissipation housing assembly and heat pump host provided by this utility model have the following technical effects:

[0017] 1) The housing assembly of this utility model extends the heat dissipation area from the middle of the panel section to the side plate section, effectively covering the corner junctions of different sides of the encapsulation plate. This increases the surface area for heat dissipation and allows heat to be dissipated quickly and evenly from the heat dissipation area of ​​the encapsulation plate, preventing heat accumulation points from forming at local corners.

[0018] 2) The housing assembly of this utility model sets the heat dissipation area in the middle of the panel segment, rather than on the periphery of the panel segment. In this way, when the heat dissipation area has heat dissipation holes, the problem of reduced strength caused by opening holes on the periphery of the panel segment can be avoided.

[0019] 3) The heat pump host of this utility model can dissipate the heat at the corner to the external environment through the encapsulation plate, so as to achieve rapid and uniform heat dissipation. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the outer structure of the packaging plate according to an embodiment of the present utility model;

[0021] Figure 2 for Figure 1 Another structural diagram from another perspective;

[0022] Figure 3 This is a schematic diagram of the inner structure of the packaging plate according to an embodiment of the present utility model;

[0023] Figure 4 This is a side view of the packaging plate according to an embodiment of the present utility model.

[0024] The meanings of the reference numerals in the attached figures are as follows:

[0025] 10. Encapsulation board; 11. Panel section; 12. Side panel section; 13. Heat dissipation area; 14. Reinforcement area; 15. Arc-shaped section; 16. Side flange; 17. First connecting step; 171. First connecting section; 172. Connecting section; 173. Second connecting section; 18. Second connecting step; 181. Third connecting section; 182. Fourth connecting section; 19. Connecting hole; 20. Snap-fit ​​groove. Detailed Implementation

[0026] To better understand and implement this invention, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings.

[0027] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0029] Example 1

[0030] This utility model discloses a high-efficiency heat dissipation housing assembly, which includes a main unit housing and a packaging plate 10. (See reference...) Figure 1 and Figure 2The encapsulation plate 10 is provided with a heat dissipation area 13 and a connecting portion. The connecting portion is located around the periphery of the encapsulation plate 10 and is used for detachable connection with the main unit housing. Specifically, the encapsulation plate 10 includes a front panel segment 11 and two side panel segments 12 that are connected to each other, and the two side panel segments 12 are disposed opposite each other on both sides of the front panel segment 11. The heat dissipation area 13 is located in the middle of the front panel segment 11 and extends to the side panel segments 12.

[0031] Based on this structure, when using the high-efficiency heat dissipation housing assembly of this utility model, the periphery of the encapsulation plate 10 is first connected to the main housing via the connecting part. When the heat pump main unit starts running, internal components such as the compressor and condenser generate heat, which accumulates inside the main housing. At this time, the heat dissipation area 13 on the encapsulation plate 10 begins to function, and the heat is dissipated to the external environment through the heat dissipation area 13.

[0032] The heat dissipation area 13 is located in the center of the panel segment 11, rather than on its periphery. This avoids the strength reduction issue that would occur if the heat dissipation area 13 had ventilation holes, as the periphery of the panel segment 11 would have been affected by the holes. Furthermore, the heat dissipation area 13 extends from the center of the panel segment 11 to the side panel segment 12, effectively covering the corners where different sides of the encapsulation plate 10 meet. During prolonged operation of the heat pump unit, heat can be quickly and evenly dissipated from the heat dissipation area 13 of the encapsulation plate 10, preventing heat accumulation points at local corners.

[0033] Therefore, by providing side plate sections 12 on both sides of the panel section 11, and extending the heat dissipation area 13 from the panel section 11 to the side plate section 12, this utility model increases the surface area for heat dissipation and allows the heat dissipation area 13 to cover the corner where the panel section 11 and the side plate section 12 meet. This enables more efficient dissipation of heat from inside the main unit casing to the surrounding environment.

[0034] Furthermore, since the connecting part is detachable, the encapsulation board 10 can be removed from the main housing when maintenance or replacement of parts is required. After long-term use, the encapsulation board 10 can be easily removed for cleaning or replacement.

[0035] Furthermore, the heat dissipation area 13 is provided with a plurality of evenly distributed heat dissipation holes, and a reinforcement area 14 is provided between the edge of the heat dissipation area 13 and the edge of the encapsulation plate 10.

[0036] Specifically, the reinforced area 14 is the area on the panel section 11 and the side panel section 12 where no heat dissipation holes are provided. Its material distribution is uniform and continuous, and it can evenly bear and disperse external forces. Since the connecting part is located at the edge of the encapsulation plate 10, and the reinforced area 14 is located between the edge of the heat dissipation area 13 and the edge of the encapsulation plate 10, when the material around the heat dissipation holes is repeatedly subjected to stresses such as thermal expansion and contraction and slight external impacts, the reinforced area 14 can effectively block the transmission of these stresses to the edge of the encapsulation plate 10, and avoid the problem of reduced connection strength between the connecting part and the main body shell due to the decrease in the edge strength of the encapsulation plate 10.

[0037] The reinforcing area 14 can be thickened, either uniformly or gradually. For example, it can be gradually thickened near the edge of the heat dissipation area 13, and then gradually return to normal thickness further away from the edge. The thickened frame increases the strength of the encapsulation plate 10 at the edge because it provides more material to withstand external pressure. Furthermore, where stress concentration is likely to occur at the edge of the heat dissipation area 13, the thickened frame can act as a robust protective layer, effectively resisting cracks and deformations that may result from stress concentration.

[0038] In this way, the reinforcing zone 14 provided around the heat dissipation zone 13 can effectively solve the problem of reduced strength of the encapsulation board 10 caused by the heat dissipation zone 13. When the encapsulation board 10 is subjected to external pressure, the reinforcing zone 14 can disperse stress concentration. Due to the presence of the heat dissipation zone 13, stress concentration is prone to occur, especially at the edges of structures such as heat dissipation holes. The reinforcing zone 14 acts as a buffer, distributing stress evenly across the entire encapsulation board 10.

[0039] Furthermore, the heat dissipation holes are honeycomb-shaped.

[0040] It should be noted that the shape of the honeycomb holes is similar to a regular hexagonal honeycomb structure. This structure can provide more hole wall area in the same space than other shapes (such as circles or squares). For example, when heat is conducted from the inside of the main unit casing to the heat dissipation area 13 of the packaging board 10, the heat will be exchanged with the outside air through the hole walls of the honeycomb holes. Because the honeycomb holes have a large hole wall area, the surface area for heat exchange is increased, thereby dissipating heat more effectively and improving heat dissipation efficiency.

[0041] Meanwhile, the honeycomb structure itself has high strength. When the encapsulation plate 10 is subjected to external forces, such as collisions, vibrations, or pressure, the honeycomb structure can evenly distribute stress. Compared with other shapes of holes, honeycomb holes can avoid stress concentration in local areas when subjected to external forces, thereby reducing the possibility of deformation or damage to the heat dissipation area 13 and maintaining the structural integrity of the encapsulation plate 10.

[0042] Furthermore, the side panel segment 12 and the front panel segment 11 are integrally formed.

[0043] Specifically, the encapsulation board 10 can be die-cast from metal materials such as aluminum alloy and zinc alloy, so that the side plate section 12 and the front panel section 11 can be formed simultaneously to obtain an integrated encapsulation board 10 structure.

[0044] Therefore, the integral molding of the side panel segment 12 and the front panel segment 11 avoids the weak points that may occur in traditional connection methods such as welding, riveting, or screw connections. Since a continuous material structure is formed at the corner joint, when the encapsulation plate 10 is subjected to external forces such as collisions and vibrations, the stress can be evenly distributed along this continuous structure, reducing the risk of local damage and ensuring the structural integrity of the entire encapsulation plate 10.

[0045] Furthermore, the panel segment 11 and the side panel segment 12 are connected by an arc-shaped segment 15.

[0046] Compared to right-angle connections, the arc-shaped segment 15 allows force to be transmitted more smoothly along the curve. Thus, when the encapsulation board 10 is subjected to external impact, the arc-shaped segment 15 can effectively disperse stress, avoid stress concentration, and enhance the strength of the connection between the panel segment 11 and the side panel segment 12. The heat dissipation holes cover the arc-shaped segment 15, and the arc shape naturally guides airflow, allowing hot air generated inside the main casing to be discharged through the heat dissipation holes and guided by the arc-shaped segment 15 to flow away from the main casing.

[0047] Further, see Figure 3 The side panel segment 12 extends inward from the end away from the panel segment 11 to form a side flange 16. The same end of the panel segment 11 and the side panel segment 12 are provided with a first connecting step 17, and the other end of the panel segment 11 and the side panel segment 12 are provided with a second connecting step 18. The connecting part includes the side flange 16, the first connecting step 17 and the second connecting step 18.

[0048] Based on this structure, when installing the encapsulation board 10, firstly, align the side flange 16 of the side panel section 12 with the corresponding mounting position on the main housing to achieve initial positioning. Next, align the side panel section 12 and the end of the front panel section 11 with the first connecting step 17 with the corresponding position on the main housing. Specifically, this connection can be achieved by embedding it into the groove of the main housing or by engaging with the protruding structure on the main housing, so that this end can be firmly combined with the main housing.

[0049] Finally, the second connecting step 18 at the other end of the side panel section 12 and the front panel section 11 is also connected to the corresponding position of the main housing to ensure that the entire encapsulation board 10 is tightly connected to the main housing in all directions through the side flange 16, the first connecting step 17 and the second connecting step 18, thus completing the assembly operation.

[0050] Therefore, the side flange 16 extends inward and fits snugly against the main housing, increasing the contact area between the side plate section 12 and the main housing in the lateral direction, which can disperse the external force on the connection part. The first connecting step 17 and the second connecting step 18 form a multi-point, multi-directional connection with the main housing. This multi-directional connection method allows the encapsulation plate 10 to be well fixed in all directions, avoiding loosening or displacement due to force in a single direction.

[0051] Further, see Figure 2 and Figure 4 The first connecting step 17 includes a first connecting segment 171, a connecting segment 172, and a second connecting segment 173. The two ends of the connecting segment 172 are respectively connected to one end of the first connecting segment 171 and one end of the second connecting segment 173. The other end of the first connecting segment 171 is connected to the panel segment 11 or the side panel segment 12. Furthermore, the first connecting segment 171 and / or the second connecting segment 173 are provided with connecting holes 19, and the connecting holes 19 are connected to the main housing via fasteners.

[0052] The first connecting segment 171, the connecting segment 172, and the second connecting segment 173 are sequentially connected to form a stepped structure. This stepped structure can be closely fitted and connected to the corresponding stepped structure on the main housing. During connection, screws, bolts, and other fasteners can be passed through the connecting holes 19 on the first connecting segment 171 and / or the second connecting segment 173 and connected to the screw holes on the main housing. During the tightening process, it is ensured that the first connecting segment 171, the connecting segment 172, and the second connecting segment 173 are all tightly fitted to the main housing to ensure the stability of the connection.

[0053] Furthermore, the connecting section 172 is provided with a snap-fit ​​groove 20, which is used to snap-fit ​​with the main housing.

[0054] Thus, the interlocking groove 20 and the snap-fit ​​component of the main housing provide an additional fixing method for the connection between the first connecting step 17 and the main housing. In addition to the fastener connection, the snap-fit ​​structure can limit the relative displacement between the first connecting step 17 and the main housing in the horizontal or vertical direction.

[0055] Further, see Figure 1 and Figure 3 The second connecting step 18 includes a third connecting segment 181 and a fourth connecting segment 182. Specifically, one end of the third connecting segment 181 is connected to one end of the fourth connecting segment 182, and the other end of the third connecting segment 181 is connected to the panel segment 11 or the side panel segment 12. The fourth connecting segment 182 is provided with a connecting hole 19, and the connecting hole 19 is connected to the main housing by a fastener.

[0056] Based on this structure, when installing the encapsulation plate 10, the second connecting step 18 can be attached and connected to the corresponding step structure on the main body housing. When connecting, screws, bolts and other fasteners can be passed through the connecting holes 19 on the fourth connecting section 182 and connected to the screw holes on the main body housing.

[0057] Therefore, by setting the first connecting step 17 and the second connecting step 18, the contact area and the degree of fit between the encapsulation plate 10 and the main body shell can be increased. The fit of the step structure can make the two better fit together from multiple levels and angles, reduce the connection gap, and avoid unstable phenomena such as shaking and abnormal noise during use due to large gaps in the connection parts.

[0058] Example 2

[0059] Unlike Embodiment 1, this embodiment discloses a heat pump host, which includes the high-efficiency heat dissipation housing assembly as described in Embodiment 1. Specifically, the compressor, condenser, and other components of the heat pump host are installed in the mounting cavity formed by the host housing and the encapsulation plate 10, and dissipate heat to the external environment through heat dissipation holes on the host housing and the encapsulation plate 10.

[0060] The encapsulation board 10 includes a front panel segment 11 and side panel segments 12, and the encapsulation board 10 is connected to the main housing through the side panel segments 12 on both sides. It is worth noting that the heat dissipation area 13 on the front panel segment 11 extends to the side panel segment 12, so that the heat dissipation area 13 can cover the two corner positions of the encapsulation board 10. In this way, when the encapsulation board 10 is connected to the main housing, the mounting cavity can dissipate heat at the two corners on the side near the encapsulation board 10 through the heat dissipation area 13, thereby improving the heat dissipation efficiency of the housing assembly and avoiding the problem of heat accumulation at the corners of the housing.

[0061] Furthermore, the specific structure of the encapsulation board 10 and the usage process of the heat dissipation area 13 are described uniformly in Embodiment 1, and will not be elaborated further here.

[0062] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. A high-efficiency heat dissipation housing assembly, characterized in that: The device includes a main housing and a packaging board. The packaging board has a heat dissipation area and a connecting part. The connecting part is located around the periphery of the packaging board and is used for detachable connection with the main housing. The packaging board includes a front panel segment and two side panel segments that are connected to each other. The two side panel segments are disposed opposite to each other on both sides of the front panel segment. The heat dissipation area is located in the middle of the front panel segment and extends to the side panel segments.

2. The high-efficiency heat dissipation housing assembly according to claim 1, characterized in that: The heat dissipation area is provided with a plurality of evenly distributed heat dissipation holes; a reinforcement area is provided between the edge of the heat dissipation area and the edge of the packaging plate.

3. The high-efficiency heat dissipation housing assembly according to claim 2, characterized in that: The heat dissipation holes are honeycomb holes.

4. The high-efficiency heat dissipation housing assembly according to claim 1, characterized in that: The side panel segment is integrally formed with the front panel segment.

5. The high-efficiency heat dissipation housing assembly according to claim 1 or 4, characterized in that: The panel segment and the side panel segment are connected by an arc segment.

6. The high-efficiency heat dissipation housing assembly according to claim 1, characterized in that: The side plate segment extends inward from the end away from the panel segment to form a side flange. The same end of the panel segment and the side plate segment are provided with a first connecting step, and the other end of the panel segment and the side plate segment are provided with a second connecting step. The connecting part includes the side flange, the first connecting step, and the second connecting step.

7. The high-efficiency heat dissipation housing assembly according to claim 6, characterized in that: The first connecting step includes a first connecting segment, a connecting segment, and a second connecting segment. The two ends of the connecting segment are respectively connected to one end of the first connecting segment and one end of the second connecting segment. The other end of the first connecting segment is connected to the panel segment or the side panel segment. The first connecting segment and / or the second connecting segment are provided with connecting holes, and the connecting holes are connected to the main housing through fasteners.

8. The high-efficiency heat dissipation housing assembly according to claim 7, characterized in that: The connecting section is provided with a snap-fit ​​groove, which is used to snap-fit ​​with the main unit housing.

9. The high-efficiency heat dissipation housing assembly according to claim 6, characterized in that: The second connecting step includes a third connecting segment and a fourth connecting segment. One end of the third connecting segment is connected to one end of the fourth connecting segment, and the other end of the third connecting segment is connected to the panel segment or the side panel segment. The fourth connecting segment is provided with a connecting hole, which is connected to the main housing by a fastener.

10. A heat pump main unit, characterized in that: Includes the housing assembly with high-efficiency heat dissipation as described in any one of claims 1-9.

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