Cavity structure of semiconductor oven
By setting up two circulation chambers and a fan, heating components and cooling components in the semiconductor oven, the air is circulated horizontally, which solves the problem of uneven temperature in the placement chamber, improves drying efficiency and has a cooling function to meet production needs.
Patent Information
- Application Number
- CN202422950829.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-11-29
AI Technical Summary
In the existing cavity structure of semiconductor ovens, uneven temperature distribution within the cavity leads to low drying efficiency.
It employs two circulation chambers, two fans, and heating components within the circulation chambers. A first return air inlet, a second return air inlet, and an air outlet are located between the circulation chambers and the placement chamber. Air circulates horizontally, and combined with cooling components, temperature uniformity is achieved.
It improves the temperature uniformity and drying efficiency within the placement chamber, and has drying and cooling functions to meet usage requirements and improve production efficiency.
Smart Images
Figure CN223550769U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor baking technology, specifically to a cavity structure of a semiconductor oven. Background Technology
[0002] In the semiconductor manufacturing process, ovens are typically used to dry the semiconductors.
[0003] Existing ovens typically have a placement chamber, two side chambers, and an upper chamber. The two side chambers are arranged facing each other, with the placement chamber located between them. The placement chamber and side chambers are separated from each other but connected by an air vent. The upper chamber is located above the placement chamber and is separated from it. The upper chamber and placement chamber are connected by a return air vent, and the upper chamber is connected to each of the two side chambers. When drying semiconductors, after placing the semiconductors on a tray in the placement chamber, the fan and heating element located at the top of the chamber are activated. Driven by the fan, the placement chamber... The air inside can enter the upper chamber through the return air vent. The heating element heats the air in the upper chamber to form hot air. The hot air then enters the two side chambers and is blown into the placement chamber through the air outlet between the side chambers and the placement chamber, raising the temperature in the placement chamber. Subsequently, the air in the placement chamber enters the upper chamber through the return air vent and is heated again by the heating element. Then it enters the two side chambers and is blown into the placement chamber through the air outlet between the side chambers and the placement chamber. This cycle continues, thus drying the semiconductors on the tray.
[0004] In the above structure, due to the use of top return air and side air outlet, the temperature in the upper part of the placement chamber will be relatively high, while the temperature in the middle and lower parts of the placement chamber will be relatively low. The large temperature difference makes it impossible to ensure the temperature uniformity in the placement chamber, thus reducing the drying efficiency. Utility Model Content
[0005] In order to overcome the shortcomings of the prior art, this utility model provides a cavity structure for a semiconductor oven, which can ensure the uniformity of temperature in the placement cavity and improve drying efficiency.
[0006] The technical solution adopted by this utility model to solve its technical problem is:
[0007] A cavity structure for a semiconductor oven includes a cavity and a tray for placing semiconductors. The cavity has a placement chamber, with the tray located within it. One side of the cavity has an opening communicating with the placement chamber. The cavity also includes two circulation chambers, separated from the placement chamber by two side plates arranged opposite each other. Both ends of the tray are connected to the two side plates. The circulation chambers communicate with the placement chambers via a first return air inlet, a second return air inlet, and an air outlet. The air outlet is located between the first and second return air inlets. The first, second, and air outlets are all located on the side plate between the circulation chambers and the placement chambers. Two fans are located at each end of the cavity, corresponding to the two circulation chambers. Parts of the fans extend into the corresponding circulation chambers. A heating element is located within each circulation chamber, extending beyond the cavity and fixed to the other side of the cavity.
[0008] As a preferred technical solution, the circulation chamber is provided with a cooling component, which extends out of the chamber and is fixed to the other side of the chamber.
[0009] As a preferred technical solution, the circulation chamber includes a first return air zone, a second return air zone, and an outlet air zone. The outlet air zone is located between the first and second return air zones. The first and second return air zones are separated from each other by a first partition and a second partition, respectively. The first and second partitions are arranged opposite each other. The first return air zone communicates with the placement chamber through a first return air inlet, the second return air zone communicates with the placement chamber through a second return air inlet, and the outlet air zone communicates with the placement chamber through an outlet air outlet. An air hood is provided in the outlet air zone, and both ends of the air hood are connected to the first and second partitions, respectively. The first partition has a first air inlet. The first air inlet is connected to the interior of the first return air zone and the hood. The second partition has a second air inlet, which is connected to the interior of the second return air zone and the hood. The hood has a hood through hole on the side away from the placement chamber, which is connected to the interior of the hood. The fan extends into the air outlet of the corresponding circulation chamber and the hood through hole. The interior of the hood is connected to the air outlet through the fan. The second partition has a through hole. The heating component is located in the air outlet, the through hole and the second return air zone, with part of the heating component extending out of the cavity. The cooling component is located in the hood, the second air inlet and the second return air zone, with part of the cooling component extending out of the cavity.
[0010] As a preferred technical solution, the heating assembly includes a serpentine heating tube. The other side of the cavity is provided with a first mounting hole that communicates with the second return air zone. The serpentine heating tube is disposed in the air outlet zone, the through hole, and the second return air zone. Both ends of the serpentine heating tube pass through the first mounting hole and extend out of the cavity. Heating fixing plates are sleeved on both ends of the serpentine heating tube. The heating fixing plates are fixed on the other side of the cavity and cover the first mounting hole.
[0011] As a preferred technical solution, the cooling assembly includes a cooling heat exchanger, which is disposed within the shroud, the second air inlet, and the second return air zone. One end of the cooling heat exchanger is provided with two connecting pipes, and the other side of the cavity is provided with a second mounting hole communicating with the second return air zone. The ends of the two connecting pipes away from the cooling heat exchanger pass through the second mounting hole and extend out of the cavity. The two connecting pipes are fitted with a cooling fixing plate, which is disposed on the other side of the cavity and covers the second mounting hole.
[0012] As a preferred technical solution, there are multiple first return air inlets, multiple second return air inlets, and multiple air outlets.
[0013] As a preferred technical solution, the two ends of the tray are slidably connected to two side plates respectively; the two ends of the tray are respectively provided with two first sliding members, the side plate is provided with a mounting plate corresponding to the tray on the side near the placement chamber, the mounting plate is provided with a second sliding member on the side away from the side plate, the side of the second sliding member away from the mounting plate has a sliding groove, and the two first sliding members are slidably engaged with the sliding grooves of the second sliding members of the two side plates respectively.
[0014] As a preferred technical solution, the tray is provided with a handle on the side near the opening.
[0015] As a preferred technical solution, the tray has a cavity inside, and multiple tray through holes are evenly distributed at the top and bottom of the tray, and the multiple tray through holes are respectively connected to the cavity.
[0016] As a preferred technical solution, there are two heating components in the circulation chamber, and the serpentine heating tubes of the two heating components are located above and below the shroud, respectively.
[0017] The beneficial effects of this utility model are as follows: This utility model, through the arrangement of two circulating chambers, two fans, and heating components in the circulating chambers, with the placement chamber located between the two circulating chambers, and the first return air inlet, the second return air inlet, and the air outlet all located on the side plate between the circulating chamber and the placement chamber, with the air outlet located between the first return air inlet and the second return air inlet, allows for air return and air outlet on both sides of the placement chamber. The air outlet and return air are located on the same side, and the air circulates horizontally. The temperature difference between the upper, middle, and lower parts of the placement chamber is small, thereby ensuring the uniformity of temperature within the placement chamber and improving drying efficiency. Attached Figure Description
[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0019] Figure 1 This is a schematic diagram of the cavity structure of a semiconductor oven according to an embodiment of the present invention from a first angle;
[0020] Figure 2 yes Figure 1 A schematic diagram of the cavity structure of the semiconductor oven shown from a second angle;
[0021] Figure 3 yes Figure 1 A cross-sectional schematic diagram of the cavity structure of the semiconductor oven shown;
[0022] Figure 4 yes Figure 1 An exploded view of the cavity structure of the semiconductor oven shown.
[0023] Figure 5 yes Figure 1 The diagram shows the cavity structure of the semiconductor oven. Detailed Implementation
[0024] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this utility model can be combined interactively without contradicting each other.
[0025] Please refer to Figures 1 to 4An embodiment of the present invention provides a cavity structure for a semiconductor oven, including a cavity 10 and a tray 20 for placing semiconductors.
[0026] Combination Figure 5 As shown, the cavity 10 has an opening 11 on one side. The cavity 10 contains a placement chamber 12 and two circulation chambers 13, which are separated from the placement chamber 12 by two side plates 30 arranged facing each other. The opening 11 communicates with the placement chamber 12. A tray 20 is located within the placement chamber 12, and both ends of the tray 20 are connected to the two side plates 30.
[0027] The circulation chamber 13 is connected to the placement chamber 12 via a first return air inlet 31, a second return air inlet 32, and an air outlet 33. The air outlet 33 is located between the first return air inlet 31 and the second return air inlet 32. The first return air inlet 31, the second return air inlet 32, and the air outlet 33 are all located on the side plate 30 between the circulation chamber 13 and the placement chamber 12. Two fans 40 are provided at both ends of the cavity 10, and the two fans 40 correspond to the two circulation chambers 13 respectively. Part of the fan 40 extends into the corresponding circulation chamber 13, and the fan 40 is used to drive the air to circulate between the corresponding circulation chamber 13 and the placement chamber 12. A heating component 50 is provided in the circulation chamber 13. Part of the heating component 50 extends out of the cavity 10 and is fixed on the other side of the cavity 10. The heating component 50 is used to heat the air in the circulation chamber 13 to form hot air. A cooling assembly 60 is provided inside the circulation chamber 13. Part of the cooling assembly 60 extends out of the chamber 10 and is fixed to the other side of the chamber 10. The cooling assembly 60 is used to cool the air inside the circulation chamber 13 to form cold air.
[0028] Specifically, in combination Figure 5As shown, the circulation chamber 13 includes a first return air zone 131, a second return air zone 132, and an air outlet zone 133. The air outlet zone 133 is located between the first return air zone 131 and the second return air zone 132. The first return air zone 131 and the air outlet zone 133, and the second return air zone 132 and the air outlet zone 133 are separated by a first partition 134 and a second partition 135, respectively. The first partition 134 and the second partition 135 are arranged in a front-to-back configuration. The first return air zone 131 is connected to the placement chamber 12 through a first return air inlet 31, the second return air zone 132 is connected to the placement chamber 12 through a second return air inlet 32, and the air outlet zone 133 is connected to the placement chamber 12 through an air outlet 33. A fan hood 136 is provided at the center of the air outlet zone 133, and the two ends of the fan hood 136 are connected to the first partition 134 and the second partition 135, respectively. The first partition 134 is provided with a first air inlet, which is connected to the interior of the first return air zone 131 and the hood 136 respectively. The second partition 135 is provided with a second air inlet 1352, which is connected to the interior of the second return air zone 132 and the hood 136 respectively.
[0029] The side of the shroud 136 away from the placement chamber 12 is provided with a shroud through hole 1361 communicating with the interior of the shroud 136. A portion of the fan 40 extends into the air outlet area 133 of the corresponding circulation chamber 13 and the shroud through hole 1361 of the shroud 136. The interior of the shroud 136 is connected to the air outlet area 133 via the fan 40. The second partition 135 is provided with a through hole 1351. The heating component 50 is disposed within the air outlet area 133, the through hole 1351, and the second return air area 132, with a portion of the heating component 50 extending outside the cavity 10. The cooling component 60 is disposed within the shroud 136, the second air inlet 1352, and the second return air area 132, with a portion of the cooling component 60 extending outside the cavity 10.
[0030] With the above structure, when drying the semiconductor, the semiconductor is first placed on the tray 20, and then the heating assembly 50 and the fan 40 are started. Driven by the two fans 40, the air in the placement chamber 12 enters the first return air zone 131 through the first return air inlet 31 of the two side plates 30, and enters the second return air zone 132 through the second return air inlet 32. The air entering the first return air zone 131 enters the air hood 136 through the first air inlet of the first partition 134, and the air entering the second return air zone 132 enters the air hood 136 through the second air inlet 1352 of the second partition 135. Then the air in the air hood 136 enters the air outlet zone 133 through the fan 40. The heating assembly 50 can heat the air in the air outlet zone 133. The air is heated to form hot air, and then the hot air in the two circulating chambers 13 is blown into the placement chamber 12 through the air outlets 33 of the two side plates 30, raising the temperature in the placement chamber 12. Subsequently, the air in the placement chamber 12 enters the first return air zone 131 through the first return air inlet 31 and the second return air inlet 32 of the two side plates 30, then enters the air hood 136, and then enters the air outlet zone 133. The air in the air outlet zone 133 is then heated again by the heating component 50. Then the hot air in the two circulating chambers 13 is blown into the placement chamber 12 through the air outlets 33 of the two side plates 30. This cycle continues, thereby drying the semiconductors on the tray 20.
[0031] After the semiconductor drying is complete, the heating component 50 is stopped and the cooling component 60 is activated. Driven by the fan 40, the hot air in the placement chamber 12 enters the first return air zone 131 through the first return air inlet 31 and the second return air inlet 32 through the two side plates 30. The air entering the first return air zone 131 enters the air hood 136 through the first air inlet of the first partition 134, and the air entering the second return air zone 132 enters the air hood 136 through the second air inlet 1352 of the second partition 135. The cooling component 60 cools the hot air in the air hood 136 to form cold air, which then enters the air outlet zone 133 through the fan 40. Then, the cold air in the two circulating chambers 13 is blown into the placement chamber 12 through the air outlets 33 of the two side plates 30, thereby lowering the temperature in the placement chamber 12. Subsequently, the air in the placement chamber 12 enters the first return air zone 131 through the first return air inlet 31 and the second return air inlet 32 of the two side plates 30, and then enters the air shroud 136. The air in the air shroud 136 is cooled by the cooling component 60, and then enters the air outlet zone 133 through the fan 40. The cold air in the two circulating chambers 13 is then blown into the placement chamber 12 through the air outlets 33 of the two side plates 30. This cycle continues, thereby cooling the semiconductors on the tray 20.
[0032] This invention features two circulating chambers 13, two fans 40, and a heating assembly 50 within the circulating chambers 13. The placement chamber 12 is located between the two circulating chambers 13. The first return air inlet 31, the second return air inlet 32, and the air outlet 33 are all located on the side plate 30 between the circulating chambers 13 and the placement chamber 12, with the air outlet 33 located between the first return air inlet 31 and the second return air inlet 32. This allows for air return and air outlet on both sides of the placement chamber 12, with the air outlet and return air located on the same side. The air circulates horizontally, resulting in a small temperature difference between the upper, middle, and lower parts of the placement chamber 12. This ensures temperature uniformity within the placement chamber 12 and improves drying efficiency. Meanwhile, the cooling component 60 installed in the circulating chamber 12 can cool the dried semiconductor, thus the cavity structure of the semiconductor oven of this utility model has both drying and cooling functions. After the semiconductor is dried, the cooling operation can be carried out directly in the cavity structure of the semiconductor oven. This eliminates the need to remove the semiconductor and transfer it to other cooling equipment, making it convenient to use. Compared with the existing semiconductor oven cavity structure that only has a drying function, it greatly meets the usage requirements and improves production efficiency.
[0033] In this embodiment, the two ends of the tray 20 are slidably connected to the two side plates 30 respectively. Specifically, the two ends of the tray 20 are respectively provided with two first sliding members 24, and the side plate 30 near the placement chamber 12 is provided with a mounting plate 23 corresponding to the tray 20. The side of the mounting plate 23 away from the side plate 30 is provided with a second sliding member 25. The length direction of the first sliding member 24, the mounting plate 23 and the second sliding member 25 are all the same as the width direction of the cavity 10. The side of the second sliding member 25 away from the side plate 30 has a sliding groove, and the two first sliding members 24 are slidably engaged with the sliding grooves of the second sliding members 25 of the two side plates 30 respectively. This structure allows for the pull-out tray 20, facilitating its removal from the placement chamber 12 for semiconductor placement and removal. Specifically, during semiconductor drying, the tray 20 is first pulled out of the placement chamber 12 through the opening 11. During this process, the two first sliding members 24 slide along the corresponding second sliding members 25 towards the side closer to the chamber 10, driven by the tray 20. The semiconductor is then placed on the tray 20, and the tray 20 is pushed back into the placement chamber 12 through the opening 11. During this process, the two first sliding members 24 slide away from the chamber 10, driven by the tray 20. This allows for semiconductor drying. After semiconductor cooling, the tray 20 is pulled out of the placement chamber 12 through the opening 11, the semiconductor is removed from the tray 20, and the tray 20 is pushed back into the placement chamber 12 through the opening 11.
[0034] A handle 21 is provided on the side of the tray 20 near the opening 11. The handle 21 facilitates pulling or pushing the tray 20.
[0035] The tray 20 has a cavity inside, and multiple tray through holes 22 are evenly distributed at the top and bottom of the tray 20, each of which communicates with the cavity. The tray through holes 22 and the cavity provide ventilation, facilitating omnidirectional drying or cooling of the semiconductor and improving drying or cooling efficiency.
[0036] In this embodiment, there are multiple trays 20, for example, three. The three trays 20 are arranged alternately from top to bottom, so that the present invention can dry and cool multiple semiconductors at one time. It can be understood that the number of trays 20 can also be other, such as one, two, four, etc., which can be set according to the actual situation.
[0037] The side panel 30, near the placement chamber 12, has a mounting area 30a corresponding to the tray 20. A mounting plate 23 is disposed in the mounting area 30a. The number of mounting areas 30a corresponds to the number of trays 20, which is also three. There are multiple first return air inlets 31, second return air inlets 32, and air outlets 33. These multiple first return air inlets 31 and second return air inlets 32 are evenly distributed, serving a rectifying function, allowing air from the placement chamber 12 to enter the first return air zone 131 and second return air zone 132 evenly. The multiple air outlets 33 are arranged in four rows. Each mounting area 30a is located between two adjacent rows of air outlets 33. The evenly distributed air outlets 33 in each row also serve a rectifying function, allowing air to be evenly blown into the placement chamber 12, improving drying or cooling efficiency. The shapes of the first return air inlets 31, second return air inlets 32, and air outlets 33 can be configured according to actual conditions.
[0038] The fan 40 has an existing structure, mainly including a motor 41, a fan wheel 42, and a mounting base 43. The mounting base 43 is located between the motor 41 and the fan wheel 42. The motor 41 is fixed on the mounting base 43 and used for electrical connection with the control system. The end of the output shaft of the motor 41 passes through the through hole of the mounting base 43 and connects to the fan wheel 42. Two mounting holes 14 are provided at both ends of the cavity 10. The two fans 40 correspond to the two mounting holes 14 respectively. The mounting bases 43 and motors 41 of the two fans 40 are located outside the cavity 10. The fan wheels 42 of the two fans 40 are respectively set in the corresponding mounting holes 14, and the fan wheels 42 partially extend into the air outlet area 133 of the corresponding circulation chamber 13 and the through hole 1361 of the hood 136. The interior of the hood 136 is connected to the air outlet area 133 through the fan wheels 42 of the fans 40. The motor 41 is used to drive the fan wheel 42 to rotate. In practical applications, the control system controls the starter motor 41 to work, which drives the impeller 42 to rotate. The rotation of the impeller 42 enables the driving air to circulate between the corresponding circulation chamber 13 and the placement chamber 12.
[0039] The heating assembly 50 includes a serpentine heating tube 51. A first mounting hole 15 communicating with the second return air zone 132 is provided on the other side of the cavity 10. The serpentine heating tube 51 is disposed within the air outlet zone 133, the through hole 1351, and the second return air zone 132, with both ends of the serpentine heating tube 51 passing through the first mounting hole 15 and extending outside the cavity 10. Heating fixing plates 52 are fitted onto both ends of the serpentine heating tube 51, and the heating fixing plates 52 are fixed to the other side of the cavity 10 and cover the first mounting hole 15. Both ends of the serpentine heating tube 51 are used for electrical connection to the control system. The control system controls the serpentine heating tube 51 to be energized, thereby generating heat and heating the air in the corresponding circulation chamber 13. The heating fixing plates 52 provide mounting support for the serpentine heating tube 13.
[0040] In this embodiment, there are two heating components 50 in the circulation chamber 13. The serpentine heating tubes 13 of the two heating components 50 are located above and below the fan shroud 136, respectively. By setting two heating components 50, the heating speed can be improved. The number of through holes 1351 in the second partition 135 corresponds to the number of heating components 50, which is also two. It can be understood that the number of heating components 50 in the circulation chamber 13 can be set according to the actual situation.
[0041] The cooling assembly 60 includes a cooling heat exchanger 61, which is a conventional structure. The cooling heat exchanger 61 is disposed within the fan shroud 136, the second air inlet 1352, and the second return air zone 132. One end of the cooling heat exchanger 61 has two connecting pipes 62. The other side of the cavity 10 has a second mounting hole communicating with the second return air zone 132. The ends of the two connecting pipes 62 furthest from the cooling heat exchanger 61 pass through the second mounting hole and extend outside the cavity 10. These ends are respectively used to connect to the outlet and inlet of the cooling circulation system. Cooling fixing plates 63 are fitted over the two connecting pipes 62. The cooling fixing plates 63 are disposed on the other side of the cavity 10 and cover the second mounting hole. In practical applications, the coolant enters the connecting pipe 62 connected to the outlet of the cooling circulation system, and then enters the cooling heat exchanger 61. According to the principle of heat exchange, the coolant and the air inside the fan shroud 136 exchange heat, thus cooling the air inside the fan shroud 136. Subsequently, the coolant, after heat exchange, flows back to the cooling circulation system through the connecting pipe 62 connected to the inlet. The cooling fixing plate 63 provides support for the two connecting pipes 62 and the cooling heat exchanger 61.
[0042] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.
Claims
1. A cavity structure for a semiconductor oven, comprising a cavity and a tray for placing semiconductors, wherein a placement chamber is provided within the cavity, the tray is located within the placement chamber, and an opening is provided on one side of the cavity, the opening communicating with the placement chamber, characterized in that, The cavity also includes two circulation chambers, which are separated from the placement chamber by two side plates arranged opposite each other. The two ends of the tray are connected to the two side plates respectively. The circulation chambers are connected to the placement chambers through a first return air inlet, a second return air inlet, and an air outlet. The air outlet is located between the first and second return air inlets. The first, second, and air outlets are all located on the side plates between the circulation chambers and the placement chambers. Two fans are provided at each end of the cavity, corresponding to the two circulation chambers respectively. The fan parts extend into the corresponding circulation chambers. A heating component is provided in the circulation chamber, with part of the heating component extending out of the cavity and fixed to the other side of the cavity.
2. The cavity structure of the semiconductor oven according to claim 1, characterized in that, The circulation chamber is equipped with a cooling component, which extends out of the chamber and is fixed to the other side of the chamber.
3. The cavity structure of the semiconductor oven according to claim 2, characterized in that, The circulating chamber includes a first return air zone, a second return air zone, and an air outlet zone. The air outlet zone is located between the first and second return air zones. The first and second return air zones are separated by a first partition and a second partition, respectively. The first and second partitions are arranged in a front-to-back orientation. The first return air zone is connected to the placement chamber through a first return air inlet. The second return air zone is connected to the placement chamber through a second return air inlet. The air outlet zone is connected to the placement chamber through an air outlet. An air hood is provided in the air outlet zone. The two ends of the air hood are connected to the first and second partitions, respectively. The first partition has a first air inlet, which is connected to the interior of the first return air zone and the air hood. The second partition has a second air inlet, which is connected to the interior of the second return air zone and the air hood. The side of the hood away from the placement chamber is provided with a hood through hole that communicates with the interior of the hood. The fan part extends into the air outlet area of the corresponding circulation chamber and the hood through hole. The interior of the hood is connected to the air outlet area through the fan. The second partition is provided with a through hole. The heating component is disposed in the air outlet area, the through hole and the second return air area, and the heating component part extends out of the cavity. The cooling component is disposed in the hood, the second air inlet and the second return air area, and the cooling component part extends out of the cavity.
4. The cavity structure of the semiconductor oven according to claim 3, characterized in that, The heating assembly includes a serpentine heating tube. A first mounting hole communicating with the second return air zone is provided on the other side of the cavity. The serpentine heating tube is disposed in the air outlet zone, the through hole and the second return air zone. Both ends of the serpentine heating tube pass through the first mounting hole and extend out of the cavity. Heating fixing plates are sleeved on both ends of the serpentine heating tube. The heating fixing plates are fixed on the other side of the cavity and cover the first mounting hole.
5. The cavity structure of the semiconductor oven according to claim 3, characterized in that, The cooling assembly includes a cooling heat exchanger, which is disposed within the shroud, the second air inlet, and the second return air zone. One end of the cooling heat exchanger is provided with two connecting pipes, and the other side of the cavity is provided with a second mounting hole communicating with the second return air zone. The ends of the two connecting pipes away from the cooling heat exchanger pass through the second mounting hole and extend out of the cavity. The two connecting pipes are fitted with a cooling fixing plate, which is disposed on the other side of the cavity and covers the second mounting hole.
6. The cavity structure of the semiconductor oven according to claim 1, characterized in that, There are multiple first return air inlets, multiple second return air inlets, and multiple air outlets.
7. The cavity structure of the semiconductor oven according to claim 1, characterized in that, The two ends of the tray are slidably connected to two side plates respectively; two first sliding members are provided at each end of the tray; a mounting plate corresponding to the tray is provided on the side of the side plate near the placement chamber; a second sliding member is provided on the side of the mounting plate away from the side plate; the side of the second sliding member away from the mounting plate has a groove; the two first sliding members are slidably engaged with the grooves of the second sliding members of the two side plates respectively.
8. The cavity structure of the semiconductor oven according to claim 7, characterized in that, The tray has a handle on the side near the opening.
9. The cavity structure of the semiconductor oven according to claim 1, characterized in that, The tray has a cavity inside, and multiple tray through holes are evenly distributed at the top and bottom of the tray, and the multiple tray through holes are respectively connected to the cavity.
10. The cavity structure of the semiconductor oven according to claim 4, characterized in that, The circulating chamber contains two heating components, with the serpentine heating tubes of the two components located above and below the shroud, respectively.