Offset monitoring mechanism for high-speed continuous film pasting device for chips

Abstract

The utility model relates to the technical field of chip film pasting deviation monitoring, in particular to a deviation monitoring mechanism for a chip high-speed continuous film pasting device, which comprises a film pasting device, the surfaces of two side plates of the film pasting device are fixedly connected to the surface of an outer side plate of a film pasting table, and a monitoring camera is arranged on the top surface of the film pasting device. A conveying belt is arranged in the film pasting table; the offset monitoring mechanism for the high-speed continuous chip film pasting device has the beneficial effects that the monitoring camera is firmly fixed on the surface of the film pasting device, the rectangular through hole is formed in the surface of the clamping frame, and the surface of the rectangular through hole is clamped with the surface of the compression plate, so that the monitoring camera is locked in the clamping frame, and the monitoring camera is fixed on the surface of the film pasting device; the chip body can be conveyed in the film pasting table by starting the conveying belt, so that the surface of the chip body conveyed on the top surface of the conveying belt can be pasted with a film through the film pasting device, and the chip body on the top of the conveying belt can be subjected to offset detection through the monitoring camera.

Description

Technical Field

[0001] This utility model relates to the field of chip film offset monitoring technology, specifically an offset monitoring mechanism for a high-speed continuous chip film application device. Background Technology

[0002] Chips are one of the core components of electronic devices. In addition to being sealed and packaged during production, chips also need to have a thin film adhered to their surface to improve their security performance.

[0003] For example, the invention patent publication number CN118083236B describes a continuous film-applying device for chip production. This device uses an integrated film-applying roller with a regular octagonal structure to tighten and comb the film. Combined with an adsorption component and a cutting component, it ensures the stability of the film during the chip application process. After the film is applied, it can be quickly cut. The device has a high degree of integration, is easy to use, reduces film waste, saves costs, and enables automatic continuous film application under the conveying action of the continuous feeding component, thus improving processing efficiency.

[0004] However, the aforementioned patent has its drawbacks. While it solves the problem of how to achieve a continuous chip lamination process, it is necessary to monitor whether the chips being conveyed on the conveyor belt are shifted during the lamination process in order to avoid affecting the quality of the chip surface lamination. In addition, most existing chip anti-shift measures rely on cameras to capture images of the chips on the top of the conveyor belt, which requires easy installation and removal of the cameras.

[0005] Therefore, we need an offset monitoring mechanism for a high-speed continuous chip bonding device to solve the problem of offset monitoring in the existing continuous chip bonding process, and also to facilitate the installation and removal of the camera for monitoring chip bonding. Utility Model Content

[0006] The purpose of this invention is to provide an offset monitoring mechanism for a high-speed continuous chip bonding device, which solves the problem of offset monitoring in the existing continuous chip bonding process mentioned in the background art, and also enables convenient installation and removal of the camera for monitoring chip bonding.

[0007] To achieve the above objectives, this utility model provides the following technical solution: an offset monitoring mechanism for a high-speed continuous chip lamination device, comprising a lamination device, wherein the surfaces of the two side plates of the lamination device are fixedly connected to the surface of the outer side plate of the lamination stage, a monitoring camera is provided on the top surface of the lamination device, a conveyor belt is provided inside the lamination stage, the top surface of the conveyor belt is in close contact with the bottom surface of the chip body, a frame is provided on the surface of the lamination device, the surface of the frame is engaged with the support frame surface of the monitoring camera, and a rectangular opening is provided on the surface of the frame, the surface of the rectangular opening is engaged with the surface of the compression plate.

[0008] Preferably, an activity groove is formed on the surface of the film pasting device. A moving block is movably connected to the surface of the activity groove. A clamping frame is fixedly connected to the surface of the moving block. The surface of the moving block is screwed to the surface of a bidirectional wire feed rod, and the surface of the bidirectional wire feed rod is rotatably connected to the surface of the activity groove.

[0009] Preferably, the surface of the moving block is in close contact with the surface of the activity groove. The interface of the moving block is in a "convex" shape. There are two moving blocks, and the two moving blocks are symmetrically arranged along the center point of the film pasting device.

[0010] Preferably, a groove is formed inside the film pasting device. A fixing rod is fixedly connected to the surface of the groove. The surface of the fixing rod is rotatably connected to the inside of a driving gear roller. The teeth of the driving gear roller are clamped with the teeth of a gear, and the inside of the gear is fixedly connected to the surface of the bidirectional wire feed rod.

[0011] Preferably, the cross section of the clamping frame is in a "U" shape. There are two clamping frames, and the two clamping frames are symmetrically arranged along the center point of the film pasting device.

[0012] Preferably, the cross section of the groove is in a "U" shape, and the groove and the activity groove are communicated with each other.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows: By forming a rectangular through hole on the surface of the clamping frame and then clamping the surface of the compression plate to the surface of the rectangular through hole, the monitoring camera is locked inside the clamping frame. By starting the conveyor belt, the chip body can be conveyed inside the film pasting table. Therefore, the film pasting device can paste a film on the surface of the chip body conveyed on the top surface of the conveyor belt. The monitoring camera can perform offset detection on the chip body at the top of the conveyor belt. By moving the clamping frame to clamp the support legs of the monitoring camera, the monitoring camera can be firmly installed on the surface of the film pasting device; further solving the problem of offset monitoring during the continuous film pasting of the existing chips, and also realizing the convenient installation and disassembly of the camera for monitoring the film pasting of the chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic three-dimensional view of the overall structure device of the present utility model;

[0015] Figure 2 is a schematic top view of the film pasting device of the structure of the present utility model;

[0016] Figure 3 is Figure 2 the schematic cross-sectional view A-A in

[0017] Figure 4 is a schematic top view of the monitoring camera of the structure of the present utility model;

[0018] Figure 5 for Figure 4 Schematic diagram of the BB cross section;

[0019] Figure 6 This is a diagram showing the connection between the film application device and the monitoring camera;

[0020] Figure 7 for Figure 3 Enlarged diagram of point A in the middle.

[0021] In the diagram: 1. Film application table; 2. Conveyor belt; 3. Film application device; 4. Monitoring camera; 5. Movable groove; 6. Moving block; 7. Bidirectional feed rod; 8. Frame; 9. Groove; 10. Fixing rod; 11. Drive toothed roller; 12. Gear; 13. Rectangular opening; 14. Compression plate; 15. Chip body. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clear and complete, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of this utility model, and are merely used to explain the embodiments of this utility model. They are not intended to limit the embodiments of this utility model. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0023] Example 1, please refer to Figures 1-7 This utility model provides a technical solution: an offset monitoring mechanism for a high-speed continuous chip lamination device, including a lamination device 3. The two side plates of the lamination device 3 are fixedly connected to the outer side plates of the lamination table 1. A monitoring camera 4 is provided on the top surface of the lamination device 3. A conveyor belt 2 is provided inside the lamination table 1. The top surface of the conveyor belt 2 is in close contact with the bottom surface of the chip body 15. A frame 8 is provided on the surface of the lamination device 3. The surface of the frame 8 is engaged with the support frame of the monitoring camera 4. A rectangular opening 13 is provided on the surface of the frame 8. The surface of the rectangular opening 13 is engaged with the surface of a compression plate 14. By monitoring... The support leg of the monitoring camera 4 is engaged with the inside of the frame 8, thus making the monitoring camera 4 stable on the surface of the film application device 3. A rectangular opening 13 is provided on the surface of the frame 8, and then the surface of the rectangular opening 13 is engaged with the surface of the compression plate 14, thus locking the monitoring camera 4 inside the frame 8. The chip body 15 can be transported inside the film application table 1 by starting the conveyor belt 2. Therefore, the film application device 3 can apply film to the surface of the chip body 15 transported on the top surface of the conveyor belt 2, and the monitoring camera 4 can detect the offset of the chip body 15 at the top of the conveyor belt 2.

[0024] Example 2, see attached document Figures 1 to 7Based on the first embodiment, in order to make the monitoring camera 4 stably installed on the surface of the film application device 3, the surface of the film application device 3 is provided with a movable groove 5, the surface of the movable groove 5 is movably connected to a moving block 6, the surface of the moving block 6 is fixedly connected to a frame 8, the inside of the moving block 6 is screwed to the surface of a bidirectional threaded rod 7, and the surface of the bidirectional threaded rod 7 is rotatably connected to the surface of the movable groove 5.

[0025] By movably connecting the surface of the movable block 6 to the surface of the movable groove 5, and screwing the surface of the bidirectional threaded rod 7 inside the movable block 6, when the bidirectional threaded rod 7 rotates on the surface of the movable groove 5, the movable block 6 causes the clamping frame 8 to move on the surface of the film applicator 3. Therefore, the movement of the clamping frame 8 clamps the support leg of the monitoring camera 4, so that the monitoring camera 4 can be stably installed on the surface of the film applicator 3.

[0026] Example 3, refer to Appendix Figures 1 to 7 Based on Embodiment 2, in order to install and remove the monitoring camera 4 from the surface of the film application device 3, a groove 9 is provided inside the film application device 3. A fixing rod 10 is fixedly connected to the surface of the groove 9. The surface of the fixing rod 10 is rotatably connected to the inside of the drive tooth roller 11. The teeth of the drive tooth roller 11 engage with the teeth of the gear 12. The inside of the gear 12 is fixedly connected to the surface of the bidirectional feed rod 7.

[0027] By fixing the end of the fixing rod 10 to the surface of the groove 9, the surface of the fixing rod 10 is rotatably connected to the inside of the drive toothed roller 11, and then the teeth of the drive toothed roller 11 mesh with the teeth of the gear 12. When the knob is turned, the drive toothed roller 11 is driven by the gear 12 to rotate the bidirectional feed rod 7. Therefore, the movement of the frame 8 allows the monitoring camera 4 to be fixed on the surface of the film applicator 3, which is beneficial for installing and removing the monitoring camera 4 from the surface of the film applicator 3.

[0028] In actual use, the monitoring camera 4 is secured to the surface of the film application device 3 by engaging the support leg surface of the monitoring camera 4 with the inside of the frame 8. A rectangular opening 13 is provided on the surface of the frame 8, and the surface of the rectangular opening 13 is engaged with the surface of the compression plate 14, thus locking the monitoring camera 4 inside the frame 8. The chip body 15 can be transported inside the film application table 1 by activating the conveyor belt 2. Therefore, the film application device 3 can apply film to the surface of the chip body 15 transported on the top surface of the conveyor belt 2. The monitoring camera 4 can detect the offset of the chip body 15 at the top of the conveyor belt 2. The surface of the moving block 6 is movably connected to the surface of the moving groove 5, and a bidirectional threaded rod 7 is screwed into the inside of the moving block 6. When the bidirectional feed rod 7 rotates on the surface of the movable groove 5, the moving block 6 causes the clamping frame 8 to move on the surface of the film applicator 3. Therefore, the movement of the clamping frame 8 clamps the support leg of the monitoring camera 4, so that the monitoring camera 4 can be stably installed on the surface of the film applicator 3. By fixing the end of the fixing rod 10 to the surface of the groove 9, the surface of the fixing rod 10 is rotatably connected to the inside of the drive tooth roller 11. Then, the teeth of the drive tooth roller 11 mesh with the teeth of the gear 12. When the knob is turned, the drive tooth roller 11 causes the gear 12 to drive the bidirectional feed rod 7 to rotate. Therefore, the movement of the clamping frame 8 allows the monitoring camera 4 to be fixed on the surface of the film applicator 3, which is beneficial for installing and removing the monitoring camera 4 from the surface of the film applicator 3.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A misalignment monitoring mechanism for a high-speed continuous chip lamination device, comprising a lamination device (3), characterized in that: The surfaces of the two side plates of the film application device (3) are fixedly connected to the surfaces of the outer side plates of the film application table (1). A monitoring camera (4) is arranged on the top surface of the film application device (3). A conveyor belt (2) is arranged inside the film application table (1). The top surface of the conveyor belt (2) is closely attached to the bottom surface of the chip body (15). A clamping frame (8) is arranged on the surface of the film application device (3). The surface of the clamping frame (8) is clamped to the surface of the support frame of the monitoring camera (4). A rectangular through hole (13) is formed on the surface of the clamping frame (8). The surface of the rectangular through hole (13) is clamped to the surface of the compression plate (14).

2. The offset monitoring mechanism for a high-speed continuous chip bonding device according to claim 1, characterized in that: An activity groove (5) is formed on the surface of the film application device (3). A moving block (6) is movably connected to the surface of the activity groove (5). A clamping frame (8) is fixedly connected to the surface of the moving block (6). The surface of the moving block (6) is screwed to the surface of a bidirectional wire feed rod (7). The surface of the bidirectional wire feed rod (7) is rotatably connected to the surface of the activity groove (5).

3. The offset monitoring mechanism for a high-speed continuous chip bonding device according to claim 2, characterized in that: The surface of the moving block (6) is closely attached to the surface of the activity groove (5). The interface of the moving block (6) is in a "convex" shape. There are two moving blocks (6), and the two moving blocks (6) are symmetrically arranged along the center point of the film application device (3).

4. The offset monitoring mechanism for a high-speed continuous chip bonding device according to claim 1, characterized in that: A groove (9) is formed inside the film application device (3). A fixed rod (10) is fixedly connected to the surface of the groove (9). The surface of the fixed rod (10) is rotatably connected to the inside of a driving gear roller (11). The teeth of the driving gear roller (11) are clamped to the teeth of a gear (12). The inside of the gear (12) is fixedly connected to the surface of the bidirectional wire feed rod (7).

5. The offset monitoring mechanism for a high-speed continuous chip bonding device according to claim 1, characterized in that: The cross-section of the clamping frame (8) is in a "C" shape. There are two clamping frames (8), and the two clamping frames (8) are symmetrically arranged along the center point of the film application device (3).

6. The offset monitoring mechanism for a high-speed continuous chip bonding device according to claim 4, characterized in that: The cross-section of the groove (9) is in a "U" shape. The groove (9) and the activity groove (5) are communicated with each other.

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