Adapter plate and testing device
By designing an integrated structure of the adapter board and the test chip, the problem of insufficient convenience and accuracy in testing chip test particles on the motherboard is solved, the risk of motherboard damage is reduced, and an efficient testing process is achieved.
Patent Information
- Application Number
- CN202422777497.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-11-14
AI Technical Summary
In existing technologies, testing chip test particles on the motherboard is not convenient or accurate enough, and the risk of motherboard damage is high.
Design an adapter board that connects the motherboard and the test socket. The test chip passes through the adapter board and protrudes to a certain height. The test chip is embedded in the motherboard chip area and is electrically connected using the test socket. This avoids collisions with other electronic components on the motherboard and allows for direct disassembly after testing.
It improves the convenience and accuracy of testing chip components on the motherboard, reduces the risk of motherboard damage, adapts to different motherboard specifications, and improves testing efficiency.
Smart Images
Figure CN223551765U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of chips, and more particularly to an adapter board and a testing device. Background Technology
[0002] For new product verification, a testing platform is needed to perform performance tests. For example, a watch needs to use memory chips with EPOP (Embedded Package on Package) packaging technology as storage space. If it is necessary to verify many EPOP chips produced, it is impossible to solder them onto the motherboard one by one for verification, because repeatedly soldering and verifying the chips and then removing them will lead to the risk of motherboard damage.
[0003] Therefore, improving the convenience and accuracy of testing chip components on the motherboard and reducing the risk of motherboard damage has become an urgent problem to be solved in this field. Utility Model Content
[0004] The purpose of this application is to provide an adapter board and a testing device to improve the convenience and accuracy of testing chip components on the motherboard and reduce the risk of motherboard damage.
[0005] This application discloses an adapter board connected between a motherboard and a test socket. The adapter board includes a connecting board and a test chip. The connecting board includes a mounting area, and the test chip is disposed in the mounting area and penetrates through the connecting board. One side of the test chip protrudes from the connecting board by a predetermined height. The test chip has a test area, and multiple test particles are disposed in the test area. The two ends of the multiple test particles are respectively exposed on the side of the test chip near the test socket and on the side of the test chip near the motherboard.
[0006] Optionally, the test chip protrudes at a preset height relative to the connecting plate within a range of 1.7 mm to 1.9 mm.
[0007] Optionally, the mounting area is located in the middle of the connecting plate, the area of the test chip is smaller than the area of the connecting plate, and the portion of the test chip protruding from the connecting plate forms a stepped shape with the connecting plate.
[0008] Optionally, the connecting plate is provided with a plurality of connecting parts for connecting with the test socket, and at least two of the connecting parts are located diagonally opposite each other on the connecting plate.
[0009] Optionally, the edge of the mounting area is provided with positioning holes that penetrate the connecting plate and partially expose the edge of the test chip.
[0010] Optionally, there are four positioning holes, which are located at the four corners of the mounting area, and expose the four corners of the test chip.
[0011] Optionally, the test chip has openings at its four corners corresponding to the positions of the positioning holes to avoid the positioning holes.
[0012] Optionally, the thickness of the connecting plate ranges from 0.9 mm to 1.1 mm.
[0013] Optionally, the connection board is further provided with multiple signal lines, which are connected to the test chip; each signal line includes a test end, and the connection board is further provided with multiple detection holes, each detection hole being used to expose the test end of each signal line.
[0014] This application also discloses a testing device, including a test socket, and the testing device further includes the aforementioned adapter plate, which is connected to the test socket.
[0015] This application integrates the test chip and the adapter board by directly mounting the test chip on the adapter board. When testing the test chip's components on the motherboard is required, the test chip is simply installed with the protruding side of the adapter board aligned with the chip area on the motherboard. This ensures the test area of the test chip is aligned with the chip area on the motherboard, and the test components on the test chip are embedded in the chip mounting positions on the motherboard, thus electrically connecting the test chip to the motherboard. The test chip protrudes from the adapter board by a predetermined height, creating a predetermined distance between the test chip and the motherboard. This ensures that after the test chip is installed on the motherboard... The connector board avoids collisions with other electronic components on the motherboard, allowing it to accommodate motherboards of different sizes. The test chip on the other side is electrically connected to the test socket's test terminals for testing. This makes the connector board a bridge between the test chip, the motherboard, and the test socket. After testing, the motherboard and test chip can be easily separated without having to remove each test chip individually, improving the convenience and accuracy of testing the chip on the motherboard and effectively preventing motherboard damage. Attached Figure Description
[0016] The accompanying drawings are provided to further illustrate the embodiments of this application and form part of the specification. They serve to demonstrate implementation methods of this application and, together with the textual description, explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort. In the drawings:
[0017] Figure 1 This is a schematic diagram of the first embodiment of the adapter board of this application;
[0018] Figure 2 This is a schematic diagram of the bottom surface of the adapter plate in the first embodiment of the adapter plate of this application;
[0019] Figure 3 This is a schematic diagram of the top surface of the adapter plate in the first embodiment of the adapter plate of this application;
[0020] Figure 4 This is a schematic diagram of the top surface of the adapter plate in the second embodiment of the adapter plate of this application;
[0021] Figure 5 This is a schematic diagram of the test chip in the second embodiment of the adapter board of this application;
[0022] Figure 6 This is a schematic diagram of the top surface of the adapter plate in the third embodiment of the adapter plate of this application;
[0023] Figure 7 This is a schematic diagram of one embodiment of the test apparatus of this application.
[0024] Among them, 10 is the testing device; 200 is the testing base; 300 is the main board; 110 is the connecting board; 111 is the mounting area; 112 is the positioning hole; 113 is the connecting part; 114 is the signal line; 115 is the testing end; 116 is the detection hole; 120 is the testing chip; 121 is the testing area; 122 is the testing particle; and 123 is the opening. Detailed Implementation
[0025] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0026] Figure 1 This is a schematic diagram of the first embodiment of the adapter board of this application. Figure 2 This is a schematic diagram of the bottom surface of the adapter plate in the first embodiment of the adapter plate of this application; Figure 3 This is a schematic diagram of the top surface of the adapter plate in the first embodiment of the adapter plate of this application; as shown Figures 1 to 3As shown in the figure, this application discloses an adapter board 100, which is connected between the motherboard 300 and the test socket 200. The adapter board 100 includes a connecting board 110 and a test chip 120. The connecting board 110 includes a mounting area 111. The test chip 120 is disposed in the mounting area 111 and passes through the connecting board 110. One side of the test chip 120 protrudes from the connecting board 110 by a preset height. A test area 121 is provided on the test chip 120. A plurality of test particles 122 are provided in the test area 121. The two ends of the plurality of test particles 122 are respectively exposed on the side of the test chip 120 near the test socket 200 and the side of the test chip 120 near the motherboard 300.
[0027] This application integrates the test chip 120 with the adapter board 100 by directly mounting the test chip 120 onto the adapter board 100. When testing the test chip 122 of the test chip 120 on the motherboard 300 is required, the test chip 120 is simply installed with the side of the test chip 120 protruding from the connector board 110 corresponding to the chip area on the motherboard 300. This aligns the test area 121 of the test chip 120 with the chip area of the motherboard 300, and embeds the test chip 122 on the test chip 120 into the chip mounting position on the motherboard 300, thereby electrically connecting the test chip 120 to the motherboard 300. The test chip 120 protrudes from the connector board 110 by a predetermined height, creating a predetermined distance between the test chip 120 and the motherboard 300. After the board 300 is installed, it avoids collisions between the connecting board 110 and other electronic components on the motherboard 300, thus allowing the adapter board 100 to accommodate motherboards 300 of different specifications. Then, the test chip 122 on the other side of the test chip 120 is electrically connected to the test terminal 115 of the test socket 200, and the test socket 200 is used for testing. In this way, the connecting board 110 becomes a bridge connecting the test chip 120 to the motherboard 300 and the test socket 200 respectively. After the test is completed, the motherboard 300 and the test chip 120 can be separated and removed without having to remove the test chips 122 one by one. This improves the convenience and accuracy of testing the test chips 122 on the motherboard 300 and effectively avoids damage to the motherboard 300.
[0028] It should be noted that in the actual testing process, the motherboard 300 used for testing does not have memory chips, but only retains the chip mounting position. This ensures that after the test chip 120 on the adapter board 100 is installed in alignment with the chip area of the motherboard 300, the test chip 122 of the test chip 120 can be directly embedded into the chip mounting position of the motherboard 300, replacing the original chip on the motherboard 300 for testing, so as to test the performance of the test chip 122 on the motherboard 300 through the test socket 200.
[0029] To ensure that the connection board 110 does not come into contact with other electronic components on the motherboard 300 after the test chip 120 is connected to the motherboard 300, this application also designs the height of the test chip 120 protruding relative to the connection board 110, as follows:
[0030] The test chip 120 protrudes from the connector board 110 at a preset height ranging from 1.7 mm to 1.9 mm.
[0031] If the preset height of the test chip 120 protruding from the connecting board 110 is less than 1.7 mm, when the test chip 120 is installed on the motherboard 300, the connecting board 110 is prone to colliding with other electronic components on the motherboard 300, causing damage to these components. Conversely, if the preset height of the test chip 120 protruding from the connecting board 110 is greater than 1.9 mm, it will increase the overall thickness of the adapter board 100, lengthen the signal transmission path, and affect the test results. Therefore, setting the preset height of the test chip 120 protruding from the connecting board 110 between 1.7 mm and 1.9 mm, for example, 1.8 mm, will prevent the connecting board 110 from colliding with other electronic components on the motherboard 300 when the test chip 120 is connected to the motherboard 300, thus reducing the risk of damage to the motherboard 300. This ensures the stability of the connection between the adapter board 100 and the motherboard 300, extends the lifespan of the motherboard 300, and improves the stability of signal transmission.
[0032] Furthermore, the thickness of the connecting board 110 ranges from 0.9 mm to 1.1 mm. When the thickness of the connecting board 110 is less than 0.9 mm, the overall thickness of the connecting board 110 is relatively thin, which is not conducive to a stable connection with the test chip 120, and it is also inconvenient to lay signal lines 114 within the connecting board 110. When the thickness of the connecting board 110 is greater than 1.1 mm, it will result in a relatively thick overall thickness of the adapter board 100, which is not conducive to the stability of test signal transmission. Therefore, the thickness of the connecting board 110 is set between 0.9 mm and 1.1 mm, for example, 1 mm. This ensures both a stable connection between the connecting board 110 and the test chip 120 and the stability of signal transmission.
[0033] Furthermore, the installation area 111 is located in the middle of the connecting plate 110, the area of the test chip 120 is smaller than the area of the connecting plate 110, and the part of the test chip 120 protruding from the connecting plate 110 forms a stepped shape with the connecting plate 110.
[0034] In this embodiment, the area of the test chip 120 is smaller than the area of the connecting board 110, so that the area of the connecting board 110 is enlarged relative to the test chip 120. This makes it convenient to install the test socket 200 on the top surface of the connecting board 110, and to easily replace different particles to verify performance by using the test socket 200.
[0035] Furthermore, by increasing the area of the connecting plate, more space is available on the connecting plate 110, which facilitates the setting of other structures or positioning structures that connect to the motherboard 300 or the test socket 200 on the connecting plate 110. This helps to enhance the accuracy and stability of the connection between the adapter plate 100 and the motherboard 300 or the test socket 200.
[0036] Specifically, the connecting plate 110 is provided with a plurality of connecting parts 113, which are used to connect with the test socket 200, and at least two connecting parts 113 are located on opposite corners of the connecting plate 110.
[0037] This application provides a connecting part 113 on the connecting board 110, and connects the connecting part 113 to the test socket 200, so that when the test chip 120 is tested, the test socket 200 can be fixed on the adapter board 100 and is not easy to detach.
[0038] Two connecting parts 113 are provided on opposite corners of the connecting plate 110. After the connecting plate 110 is connected to the test base 200 by the two connecting parts 113 on opposite corners, the adapter plate 100 is less likely to shake, thus improving the stability of the connection between the test base 200 and the adapter plate 100.
[0039] In the actual testing process, the test base 200 can be either a flip-top test base or a knob-type test base. Both types of test base 200 are currently conventional structures. For example, when a flip-top test base is used, the connecting part 113 can be a screw hole. The test base 200 can also be provided with screw holes at the corresponding positions of the connecting part 113. The test base 200 and the connecting plate 110 are fixed by screwing, so that the connecting plate 110 and the test base 200 are not easily separated.
[0040] It is worth noting that when using a flip-type test socket to connect to the adapter board 100, since the screws are usually screwed on from the bottom of the connecting board 110 upwards, it is difficult to screw them on after soldering. This can cause the screws to collide with other electronic components on the motherboard 300 on the test platform, resulting in damage to the components, short circuits, and other issues.
[0041] Therefore, in order to solve the above problems, a knob-type test socket can be used. The purpose is to facilitate the installation of the test socket 200 after subsequent soldering, and to prevent it from colliding with other electronic components on the motherboard 300 during the installation process. In addition, the knob-type test socket has a smaller volume and a smaller load-bearing capacity, which can effectively improve the deformation problem of the adapter board 100.
[0042] Of course, the connecting part 113 can also be a snap-fit. The test socket 200 is provided with a slot corresponding to the snap-fit position, so that the adapter plate 100 and the test socket 200 are fixed by snap-fit. This application does not specifically limit the connection method between the test socket 200 and the adapter plate 100, but only uses the screw connection method as an example.
[0043] Figure 4 This is a schematic diagram of the top surface of the adapter plate in the second embodiment of the adapter plate of this application. Figure 5 This is a schematic diagram of the test chip in the second embodiment of the adapter board of this application, as shown below. Figure 4 and Figure 5 As shown, a positioning hole 112 is provided at the edge of the mounting area 111. The positioning hole 112 penetrates the connecting plate 110 and partially exposes the edge of the test chip 120.
[0044] In this embodiment, by providing a positioning hole 112 at the edge of the mounting area 111, and the positioning hole 112 penetrating the connecting plate 110, the tester can observe the position of the test chip 120 on the other side of the adapter plate 100 through the positioning hole 112 when installing the adapter plate 100 onto the motherboard 300, and align the test chip 120 with the position of the chip mounting area 111 on the motherboard 300. This can effectively improve the accuracy and stability of the connection between the test chip 120 and the motherboard 300, and reduce the likelihood of misalignment during installation. This effectively avoids the situation where the test chip 120 collides with other electronic components on the motherboard 300, causing damage to the test chip 120 or the motherboard 300.
[0045] In addition, a positioning post is provided at the position corresponding to the positioning hole 112 of the test base 200. When the test base 200 is connected to the adapter plate 100, the positioning post on the test base 200 can be inserted into the positioning post of the adapter plate 100. The positioning post prevents the adapter plate 100 from shifting, and ensures that after the positioning post of the test base 200 is inserted into the positioning hole 112 of the adapter plate 100, the test end 115 of the test base 200 can be connected to the test area 121 on the adapter plate 100. This allows the test base 200 to be quickly aligned and installed with the adapter plate 100, further improving the stability of the connection between the test base 200 and the adapter plate 100.
[0046] Specifically, there are four positioning holes 112, which are located at the four corners of the mounting area 111, and expose the four corners of the test chip 120 respectively.
[0047] In this embodiment, positioning holes 112 are provided at the four corners of the mounting area 111 of the connecting board 110, exposing the four corners of the test chip 120. When the tester installs the adapter board 100 onto the motherboard 300, it is easy to observe the position of the four corners of the test chip 120 from the position of the positioning holes 112. This makes it easier to align the four corners of the test chip 120 with the four corners of the chip mounting area 111 on the motherboard 300. This makes it easier to accurately install the test chip 120 onto a specific position on the motherboard 300, improving installation efficiency and assembly accuracy.
[0048] Furthermore, openings 123 are provided at the four corners of the test chip 120 corresponding to the positions of the positioning holes 112, to avoid obstructing the positioning holes 112. The openings 123 can be arc-shaped with a radius of 1 mm, creating concave rounded corners at the four corners of the test chip 120. This not only allows operators to easily observe the accuracy of the test chip 120's installation position through the positioning holes 112, but also avoids obstructing the positioning posts on the test socket 200, allowing the positioning posts to be easily inserted into the positioning holes 112. This facilitates the connection between the test socket 200 and the adapter board 100, preventing misalignment between the adapter board 100 and the test socket 200, which could lead to abnormal test signals.
[0049] Figure 6 This is a schematic diagram of the top surface of the adapter plate in the third embodiment of the adapter plate of this application, as shown below. Figure 6 As shown, the connection board 110 is also provided with multiple signal lines 114, which are connected to the test chip 120. The signal lines 114 include test terminals 115. The connection board 110 is also provided with multiple detection holes 116, each detection hole 116 being used to expose the test terminals 115 of each signal line 114.
[0050] The difference between this embodiment and the previous embodiment is that this embodiment also has a detection hole 116 on the connecting plate 110. The signal line 114 connected to the test chip 120 is exposed through the detection hole 116. When it is necessary to test various performance parameters of the test chip 120, the test terminal 115 of the signal line 114 in the detection hole 116 can be tested by an external testing device, thereby detecting different parameters of the test chip 120 and testing the performance of the test chip 120.
[0051] Figure 7 This is a schematic diagram of one embodiment of the testing device of this application, as shown below. Figure 7As shown in the illustration, this application also discloses a testing device, including a test socket 200 and the aforementioned adapter plate 100, which is connected to the test socket 200. The test socket 200 and the adapter plate 100 can be connected by conductive adhesive. By connecting the test socket 200 and the adapter plate 100, it is convenient to connect to the motherboard 300 via the adapter plate 100, thereby enabling the test socket 200 to test the test particles 122 mounted on the motherboard 300.
[0052] Traditional testing methods typically involve soldering the chips onto the motherboard 300, verifying them, and then removing them from the motherboard 300. Repeated soldering and removing of chips from the motherboard 300 may damage the motherboard 300.
[0053] Based on the above problems, this application improves the adapter board 100 of the 10 test device. This application directly mounts the test chip 120 onto the adapter board 100, making the adapter board 100 and the test chip 120 an integral unit. When it is necessary to test the test chip 122 of the test chip 120 on the motherboard 300, it is only necessary to install the side of the test chip 120 protruding from the connector board 110 corresponding to the chip area on the motherboard 300, so that the test area 121 of the test chip 120 is aligned with the chip area of the motherboard 300, and the test chip 122 on the test chip 120 is embedded into the chip mounting position in the chip area of the motherboard 300, thereby electrically connecting the test chip 120 to the motherboard 300. The test chip 120 protrudes from the connector board 110 by a preset height, so that the test chip 120 sets the connector board 110 a preset distance from the motherboard 300, allowing the connector board 110 to be tested... After the chip 120 is installed on the motherboard 300, it avoids collisions with other electronic components on the motherboard 300, preventing the connector board 110 from colliding with them. This allows the adapter board 100 to accommodate motherboards 300 of different specifications. Then, the test chip 122 on the other side of the test chip 120 is electrically connected to the test terminal 115 of the test socket 200, and the test socket 200 is used for testing. In this way, the connector board 110 becomes a bridge connecting the test chip 120 to both the motherboard 300 and the test socket 200. After the test is completed, the motherboard 300 and the test chip 120 can be separated and disassembled without having to remove the test chips 122 one by one. This improves the convenience and accuracy of testing the test chips 122 on the motherboard 300, effectively avoids damage to the motherboard 300, and further improves the testing efficiency of the 10 test device.
[0054] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.
[0055] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.
Claims
1. An adapter board, connecting a motherboard and a test socket, characterized in that, The adapter board includes a connection board and a test chip. The connection board includes a mounting area, the test chip is disposed in the mounting area, and the test chip passes through the connection board; One side of the test chip protrudes from the connecting plate by a predetermined height; The test chip has a test area, and multiple test particles are arranged in the test area. The two ends of the multiple test particles are exposed on the side of the test chip near the test socket and the side of the test chip near the motherboard, respectively.
2. The adapter board as described in claim 1, characterized in that, The test chip protrudes at a preset height relative to the connector plate within the range of 1.7 mm to 1.9 mm.
3. The adapter board as described in claim 2, characterized in that, The installation area is located in the middle of the connecting plate, the area of the test chip is smaller than the area of the connecting plate, and the part of the test chip protruding from the connecting plate forms a stepped shape with the connecting plate.
4. The adapter board as described in claim 3, characterized in that, The connecting plate is provided with a plurality of connecting parts, which are used to connect with the test socket, and at least two of the connecting parts are located at opposite corners of the connecting plate.
5. The adapter board as described in claim 4, characterized in that, The edge of the mounting area is provided with positioning holes that penetrate the connecting plate and partially expose the edge of the test chip.
6. The adapter board as described in claim 5, characterized in that, There are four positioning holes, which are located at the four corners of the mounting area, and expose the four corners of the test chip.
7. The adapter board as described in claim 6, characterized in that, The test chip has openings at its four corners corresponding to the positioning holes to avoid the positioning holes.
8. The adapter board as described in claim 1, characterized in that, The thickness of the connecting plate ranges from 0.9 mm to 1.1 mm.
9. The adapter board as described in claim 1, characterized in that, The connection board is also provided with multiple signal lines, which are connected to the test chip. The signal line includes a test terminal, and the connection board is also provided with a plurality of detection holes, each of which is used to expose the test terminal of each signal line.
10. A testing apparatus, comprising a testing base, characterized in that, The testing apparatus further includes an adapter plate as described in any one of claims 1 to 9, the adapter plate being connected to the test socket.