Frameless packaging structure of liquid crystal display screen

Abstract

The utility model relates to the field of liquid crystal display screens, and discloses a liquid crystal display screen frameless packaging structure which comprises a U-shaped main board, a liquid crystal display module is inserted in the side wall of the inner side of the U-shaped main board, a T-shaped groove is formed in the side wall of the U-shaped main board, a T-shaped block is connected to the inner wall of the T-shaped groove in a sliding mode, a side plate is fixedly connected to the side wall of the T-shaped block, and the side plate is fixedly connected to the side wall of the T-shaped block. A limiting mechanism is arranged on the inner wall of the side plate, an L-shaped groove is formed in the side wall of the U-shaped main board, and a heat dissipation assembly is arranged on the surface of the U-shaped main board. According to the utility model, the clamping plate is clamped with or separated from the notch of the L-shaped groove, the T-shaped groove and the T-shaped block are inserted into or separated from each other, and the liquid crystal display module and the U-shaped main board are inserted into or separated from each other, so that the liquid crystal display module can be quickly packaged, an extra tool is not needed to twist a bolt for multiple times for disassembly and assembly, and the whole disassembly and assembly process is convenient and efficient; maintenance and replacement of the liquid crystal display module are greatly facilitated.

Description

Technical Field

[0001] This utility model relates to the field of liquid crystal displays, and in particular to a frameless packaging structure for liquid crystal displays. Background Technology

[0002] In modern electronic devices, LCD screens are being used more and more widely. With the continuous advancement of technology and the increasing demands of users for product appearance and visual experience, traditional framed LCD screens are gradually becoming unable to meet market needs. In order to improve the appearance and visual experience of products, frameless packaging structures are required.

[0003] A search revealed Chinese Patent Publication No. CN221446429U, which discloses a borderless packaging structure for a liquid crystal display (LCD) screen. The structure includes a packaging plate on which an LCD module is mounted. The packaging plate also includes a protective side plate A and a limiting plate, on which a protective side plate B is mounted. The limiting plate is connected to the packaging plate, allowing the protective side plates A and B to enclose the LCD module within the packaging plate. The beneficial effects of this invention are: the aforementioned protective side plates A and B achieve a borderless design for the LCD screen, thereby enhancing the visual effect of the display and providing a larger display area. This also meets the demand in modern electronic product design for narrow or borderless bezels.

[0004] In the process of using the above device, although the protective side plate A, the protective side plate B and the encapsulation plate can completely surround and provide comprehensive physical protection for the liquid crystal display module, in the actual installation operation, additional tools are required to tighten the bolts multiple times to connect the protective side plate A and the protective side plate B. If the tools or bolts are missing, the encapsulation operation of the liquid crystal display module cannot be performed. Therefore, a frameless encapsulation structure for liquid crystal display screen is proposed to solve the above problems. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a frameless packaging structure for a liquid crystal display screen, aiming to improve the problem of the inability to quickly package liquid crystal display modules in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a frameless encapsulation structure for a liquid crystal display screen, comprising a U-shaped motherboard, a liquid crystal display module inserted into the inner sidewall of the U-shaped motherboard, a T-shaped groove formed in the sidewall of the U-shaped motherboard, a T-shaped block slidably connected to the inner wall of the T-shaped groove, a side plate fixedly connected to the sidewall of the T-shaped block, a limit mechanism provided in the inner wall of the side plate, an L-shaped groove formed in the sidewall of the U-shaped motherboard, and a heat dissipation component provided on the surface of the U-shaped motherboard.

[0007] As a further description of the above technical solution:

[0008] The heat dissipation assembly includes a thermal pad, an elongated groove, and a circular groove. The thermal pad is fixedly connected to the surface of the U-shaped motherboard, the elongated groove is located at the bottom of the U-shaped motherboard, and the circular groove is located on the outer wall of the side plate.

[0009] As a further description of the above technical solution:

[0010] The top of the thermal pad is in contact with the bottom of the liquid crystal display module.

[0011] As a further description of the above technical solution:

[0012] The limiting component includes a locking plate, which is slidably connected to the inner wall of the side plate, and the top of the locking plate is elastically connected to the side plate by a return spring.

[0013] As a further description of the above technical solution:

[0014] The top of the card plate is fixedly connected to one end of the reset spring, and the other end of the reset spring is fixedly connected to the bottom inner wall of the side plate.

[0015] As a further description of the above technical solution:

[0016] The card plate is snapped onto the inner wall of the L-groove.

[0017] As a further description of the above technical solution:

[0018] The side plates are provided in two sets, and the two sets of side plates are symmetrically installed on the side wall of the U-shaped main board.

[0019] As a further description of the above technical solution:

[0020] The outer wall of the side plate is in contact with the side wall of the liquid crystal display module.

[0021] This utility model has the following beneficial effects:

[0022] 1. In this utility model, by engaging or disengaging the card plate and the slot of the L-slot, the T-slot and the T-block can be connected or separated, as well as the LCD display module and the U-shaped motherboard can be connected or separated. This allows for the rapid encapsulation of the LCD display module without the need for additional tools to repeatedly twist the bolts for disassembly and assembly. The entire disassembly and assembly process is convenient and efficient, greatly facilitating the maintenance and replacement of the LCD display module.

[0023] 2. In this utility model, the heat generated by the liquid crystal display module can be transferred to the heat-conducting pad, and then quickly transferred to the U-shaped main board, allowing the heat to be discharged from the elongated groove. On the other hand, the heat is discharged from the circular groove of the side plate, while natural wind is used to dissipate heat on the surface of the U-shaped main board and the side plate. The heat dissipation channel is direct and the air flow resistance is small. This multi-path heat dissipation method can effectively reduce the operating temperature of the liquid crystal display module, improve its stability and service life, and ensure the stable performance of the display screen during long-term use. Attached Figure Description

[0024] Figure 1 This is a three-dimensional schematic diagram of the U-shaped motherboard, side plate, and liquid crystal display module of a frameless packaging structure for a liquid crystal display screen proposed in this utility model.

[0025] Figure 2 This is an exploded view of the U-shaped motherboard and side panel of the frameless packaging structure for a liquid crystal display screen proposed in this utility model;

[0026] Figure 3 This is a cross-sectional view of the side panel of a frameless encapsulation structure for a liquid crystal display screen proposed in this utility model.

[0027] Figure 4 This is an exploded view of the U-shaped motherboard and the liquid crystal display module of the frameless packaging structure of the liquid crystal display screen proposed in this utility model.

[0028] Figure 5 This is a schematic diagram showing the bottom end of a U-shaped motherboard for a frameless LCD screen packaging structure proposed in this utility model.

[0029] Legend:

[0030] 1. U-shaped main board; 2. LCD display module; 3. T-slot; 4. T-block; 5. Side plate; 6. Reset spring; 7. Card plate; 8. L-slot; 9. Thermal pad; 10. Long slot; 11. Round slot. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Reference Figures 1-3This utility model provides an embodiment of a frameless packaging structure for a liquid crystal display screen, including a U-shaped motherboard 1. The inner sidewall of the U-shaped motherboard 1 has a square protrusion that corresponds to the opening of the liquid crystal display module 2, allowing the U-shaped motherboard 1 to be inserted into the liquid crystal display module 2 for initial positioning. The liquid crystal display module 2 is inserted into the inner sidewall of the U-shaped motherboard 1, and a T-shaped groove 3 is formed on the sidewall of the U-shaped motherboard 1. Figure 4 As shown, the T-shaped groove 3 and the T-shaped block 4 are matched, and the T-shaped groove 3 is not fully opened at the right end of the U-shaped main board 1. The inner wall of the T-shaped groove 3 is slidably connected to the T-shaped block 4, and the side wall of the T-shaped block 4 is fixedly connected to the side plate 5. The side plate 5 and the U-shaped main board 1 are made of aluminum alloy, which has high thermal conductivity and can dissipate the heat on their surface by self-heating air. The inner wall of the side plate 5 is provided with a limiting mechanism. The side wall of the U-shaped main board 1 is provided with an L-shaped groove 8, which has a horizontal opening and a vertical opening. The horizontal opening allows the card plate 7 to enter, and the vertical opening allows the card plate 7 to be locked to its inner wall. The surface of the U-shaped main board 1 is provided with a heat dissipation component.

[0033] Reference Figures 3-5 The heat dissipation component includes a thermal pad 9, an elongated groove 10, and a circular groove 11. The thermal pad 9 is soft and compressible, which can fill the tiny gaps between the heat source and the heat dissipation component, reduce contact thermal resistance, and improve heat transfer efficiency. When the thermal pad 9 is subjected to a certain pressure, it will deform and fit tightly against the heat source and the heat dissipation component, forming a good heat conduction channel. This is existing technology and will not be described in detail. The thermal pad 9 is fixedly connected to the surface of the U-shaped motherboard 1. The elongated groove 10 is opened at the bottom of the U-shaped motherboard 1, and the circular groove 11 is opened on the outer wall of the side plate 5. Both the elongated groove 10 and the circular groove 11 are provided with filters, which can prevent dust and impurities from entering the U-shaped motherboard 1 and the liquid crystal display module 2. The top of the thermal pad 9 is in contact with the bottom of the liquid crystal display module 2.

[0034] Reference Figures 1-3 The limiting component includes a locking plate 7, which is slidably connected to the inner wall of the side plate 5. The side plate 5 has a slot corresponding to the locking plate 7, which allows the locking plate 7 to move vertically without deviating from its trajectory. The top of the locking plate 7 is elastically connected to the side plate 5 through a reset spring 6. The top of the locking plate 7 is fixedly connected to one end of the reset spring 6. When the locking plate 7 moves upward, it will compress the reset spring 6. When resetting, the elastic force of the reset spring 6 will carry the locking plate 7 to reset. The other end of the reset spring 6 is fixedly connected to the inner wall of the bottom end of the side plate 5. The locking plate 7 is locked onto the inner wall of the L-groove 8. There are two sets of side plates 5, which are symmetrically installed on the side wall of the U-shaped main board 1. The outer wall of the side plate 5 is in contact with the side wall of the liquid crystal display module 2.

[0035] Working principle: First, to remove the encapsulation of the LCD module 2, simply move the retaining plate 7 upwards and compress the reset spring 6, allowing the retaining plate 7 to leave the vertical opening of the L-slot 8. Then, manually move the side plate 5 to the left, allowing the retaining plate 7 to move out along the horizontal opening of the L-slot 8. Once the retaining plate 7 and the horizontal opening of the L-slot 8 are separated, continue moving the side plate 5 to the left to disengage the T-block 4 from the slot of the T-slot 3. Finally, remove the LCD module 2 from the inner wall of the U-shaped main board 1. (The last sentence appears to be incomplete and possibly refers to further instructions on removing the LCD module 2.) During packaging, simply insert the LCD module 2 into the U-shaped motherboard 1, then insert the T-shaped block 4 into the T-shaped slot 3, keeping the card plate 7 at the same horizontal level as the horizontal opening of the L-slot 8. This allows the card plate 7 to enter from the horizontal opening of the L-slot 8 and be positioned above the vertical opening of the L-slot 8. When a limit is needed, simply release the card plate 7 and use the reverse elastic force of the reset spring 6 to reset the card plate 7, allowing the card plate 7 to move downwards and engage with the vertical opening of the L-slot 8, thus completing the entire frameless packaging process of the LCD module 2.

[0036] During use, the heat generated by the LCD module 2 is transferred to the heat-conducting pad 9 and then quickly transferred to the U-shaped main board 1. The heat is discharged from the elongated groove 10. At the same time, the heat generated by the LCD module 2 is discharged from the circular groove 11 of the side plate 5, and the surface of the U-shaped main board 1 and the side plate 5 are cooled by natural wind.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A frameless packaging structure for a liquid crystal display screen, comprising a U-shaped motherboard (1), characterized in that: A liquid crystal display module (2) is inserted into the inner side wall of the U-shaped motherboard (1). A T-shaped groove (3) is opened on the side wall of the U-shaped motherboard (1). A T-shaped block (4) is slidably connected to the inner wall of the T-shaped groove (3). A side plate (5) is fixedly connected to the side wall of the T-shaped block (4). A limit mechanism is provided on the inner wall of the side plate (5). An L-shaped groove (8) is opened on the side wall of the U-shaped motherboard (1). A heat dissipation component is provided on the surface of the U-shaped motherboard (1).

2. The frameless packaging structure for a liquid crystal display screen according to claim 1, characterized in that: The heat dissipation assembly includes a thermal pad (9), an elongated groove (10), and a circular groove (11). The thermal pad (9) is fixedly connected to the surface of the U-shaped motherboard (1). The elongated groove (10) is opened at the bottom end of the U-shaped motherboard (1), and the circular groove (11) is opened on the outer wall of the side plate (5).

3. The frameless packaging structure for a liquid crystal display screen according to claim 2, characterized in that: The top of the thermal pad (9) is in contact with the bottom of the liquid crystal display module (2).

4. The frameless packaging structure for a liquid crystal display screen according to claim 1, characterized in that: The limiting component includes a locking plate (7), which is slidably connected to the inner wall of the side plate (5). The top end of the locking plate (7) is elastically connected to the side plate (5) by a reset spring (6).

5. The frameless packaging structure for a liquid crystal display screen according to claim 4, characterized in that: The top end of the card plate (7) is fixedly connected to one end of the reset spring (6), and the other end of the reset spring (6) is fixedly connected to the bottom inner wall of the side plate (5).

6. The frameless packaging structure for a liquid crystal display screen according to claim 4, characterized in that: The card plate (7) is snapped onto the inner wall of the L groove (8).

7. The frameless packaging structure for a liquid crystal display screen according to claim 1, characterized in that: The side plate (5) is provided in two sets, and the two sets of side plates (5) are symmetrically installed on the side wall of the U-shaped main board (1).

8. The frameless packaging structure for a liquid crystal display screen according to claim 1, characterized in that: The outer wall of the side plate (5) is in contact with the side wall of the liquid crystal display module (2).

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