Electronic device

Abstract

The electronic device includes: a display layer; a sensor layer defining a sensing region including a first region and a second region spaced apart from the first region in a first direction; and a sensor driver. The sensor layer includes a plurality of first-first electrodes, a plurality of second-first electrodes, a plurality of first-second electrodes, a plurality of second-second electrodes, a plurality of first lines, and a plurality of second lines. The plurality of first lines includes: a first sub-line connected to one of the plurality of first-first electrodes and one of the plurality of first-second electrodes; and a second sub-line connected to another one of the plurality of first-first electrodes or another one of the plurality of first-second electrodes.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0008107, filed on January 18, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] Some aspects of embodiments of this disclosure relate to electronic devices with relatively improved touch reliability. Background Technology

[0004] Multimedia electronic devices such as televisions, mobile phones, tablet computers, car navigation units, and game consoles include electronic devices for displaying images. In addition to traditional input methods such as buttons, keyboards, and mice, electronic devices may also include input sensors that provide touch-based input methods that allow users to intuitively and easily input information or instructions.

[0005] The information disclosed in this background section is only intended to enhance the understanding of the background art, and therefore the information discussed in this background section does not necessarily constitute prior art. Utility Model Content

[0006] Some aspects of embodiments of this disclosure include electronic devices with relatively improved touch reliability.

[0007] According to some embodiments, an electronic device includes: a display layer; a sensor layer on the display layer and defining a sensing area, the sensing area including a first area and a second area spaced apart from the first area in a first direction; and a sensor driver for driving the sensor layer. The sensor layer includes: a plurality of first-first electrodes arranged in the first area and in the first direction, each of the plurality of first-first electrodes extending in a second direction intersecting the first direction; a plurality of second-first electrodes arranged in the first area and in the second direction, each of the plurality of second-first electrodes extending in the first direction; a plurality of first-second electrodes arranged in the second area and in the first direction, each of the plurality of first-second electrodes extending in the second direction; a plurality of second-second electrodes arranged in the second area and in the second direction, each of the plurality of second-second electrodes extending in the first direction; a plurality of first lines connected to the plurality of first-first electrodes and the plurality of first-second electrodes; and a plurality of second lines connected to the plurality of second-first electrodes and the plurality of second-second electrodes. The multiple first lines include: a first sub-line connected to one of the multiple first-first electrodes and one of the multiple first-second electrodes; and a second sub-line connected to another of the multiple first-first electrodes.

[0008] According to some embodiments, a plurality of first-first electrodes may cross a plurality of second-first electrodes while being insulated from a plurality of second-first electrodes respectively, and a plurality of first-second electrodes may cross a plurality of second-second electrodes while being insulated from a plurality of second-second electrodes respectively.

[0009] According to some embodiments, a first sub-line may include multiple first sub-lines, and a second sub-line may be located between multiple first sub-lines.

[0010] According to some embodiments, the first sub-line can be connected to at least two of a plurality of first-first electrodes and a plurality of first-second electrodes, and the second sub-line can be connected to one of a plurality of first-first electrodes and a plurality of first-second electrodes.

[0011] According to some embodiments, the sensing area may further include a boundary region between the first region and the second region, and the sensor layer may further include a protective electrode in the boundary region.

[0012] According to some embodiments, grounding voltage can be supplied to the protective electrode.

[0013] According to some embodiments, the protection electrode can be in a floating state.

[0014] According to some embodiments, the second sub-line can be connected to one of the plurality of first-first electrodes and the plurality of first-second electrodes that is adjacent to the protection electrode.

[0015] According to some embodiments, multiple first lines and multiple second lines can be electrically connected to a sensor driver.

[0016] According to some embodiments, the plurality of first lines may further include a third sub-line spaced apart from the first sub-line, and a second sub-line is located between the third sub-line and the first sub-line.

[0017] According to some embodiments, the third sub-line can be connected to another of the plurality of first-first electrodes and another of the plurality of first-second electrodes.

[0018] According to some embodiments, the third sub-line may be connected to another of one or more of the first-second electrodes among a plurality of first-first electrodes.

[0019] According to some embodiments, the number of first lines connected to the first region may be different from the number of first lines connected to the second region.

[0020] According to some embodiments, an electronic device includes: a display layer; a sensor layer on the display layer and defining a sensing area, the sensing area including a first area and a second area spaced apart from the first area in a first direction; and a sensor driver for driving the sensor layer. The sensor layer includes: a plurality of first electrodes in the first and second areas; a plurality of second electrodes in the first and second areas and intersecting the plurality of first electrodes while being insulated from and respectively from the plurality of first electrodes; a plurality of first sub-wires, each of the plurality of first sub-wires being connected to at least two of the plurality of first electrodes; a plurality of second sub-wires, each of the plurality of second sub-wires being connected to one of the plurality of first electrodes; and a plurality of second lines electrically connected to the plurality of second electrodes respectively.

[0021] According to some embodiments, each of the plurality of second sub-lines may be located between the plurality of first sub-lines.

[0022] According to some embodiments, the sensing area may further include a boundary region between the first region and the second region, and the sensor layer may further include a protective electrode in the boundary region.

[0023] According to some embodiments, multiple second sub-lines can be connected to one of the multiple first electrodes that is adjacent to the protection electrode.

[0024] According to some embodiments, the sensor layer may further include a third sub-line between multiple second sub-lines.

[0025] According to some embodiments, the third sub-line may be connected to one of the plurality of first electrodes that is spaced apart from each other and has a protection electrode in between.

[0026] According to some embodiments, the third sub-line may be connected to one of the plurality of first electrodes that is adjacent to the protection electrode. Attached Figure Description

[0027] The above and other aspects and features of this disclosure will become apparent from a more detailed description of some embodiments thereof with reference to the accompanying drawings.

[0028] Figure 1 This is a perspective view of an electronic device according to some embodiments of the present disclosure.

[0029] Figure 2 This is an exploded perspective view of an electronic device according to some embodiments of the present disclosure.

[0030] Figure 3 This is a schematic cross-sectional view of a display module according to some embodiments of the present disclosure.

[0031] Figure 4 This is a cross-sectional view of an electronic device according to some embodiments of the present disclosure.

[0032] Figure 5 This is a block diagram illustrating a portion of an electronic device according to some embodiments of the present disclosure.

[0033] Figure 6 This is a block diagram illustrating a portion of an electronic device according to some embodiments of the present disclosure.

[0034] Figure 7 The illustrations are of some embodiments according to this disclosure. Figure 6 An enlarged plan view of one of the districts.

[0035] Figure 8 It is according to some embodiments of this disclosure along Figure 7 The cross-sectional view of the sensor layer taken by line I-I' in the diagram.

[0036] Figure 9 The illustrations are of some embodiments according to this disclosure. Figure 6 An enlarged plan view of one of the districts.

[0037] Figure 10 It is according to some embodiments of this disclosure along Figure 9 The cross-sectional view taken from line II-II' in the diagram.

[0038] Figure 11 This is a block diagram illustrating a portion of an electronic device according to some embodiments of the present disclosure.

[0039] Figure 12 This is a block diagram illustrating a portion of an electronic device according to some embodiments of the present disclosure. Detailed Implementation

[0040] In this specification, when a component (or area, layer, part, etc.) is referred to as being "on" another component, "connected to" or "coupled to" another component, it means that the component may be directly on, directly connected to or directly coupled to the other component, or that a third component may be present therein.

[0041] The same reference numerals refer to the same parts. Additionally, in the drawings, the thickness, scale, and dimensions of parts are exaggerated for effective description. As used herein, the term "and / or" includes all of one or more combinations defined by the relevant parts.

[0042] Terms such as “first” and “second” may be used to describe various components, but these components should not be limited by these terms. These terms may be used only to distinguish one component from other components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the scope of this disclosure. Unless otherwise specified, singular terms may include plural forms.

[0043] Additionally, terms such as "below," "under," "above," and "above" are used to describe the relationships between the components illustrated in the accompanying drawings. These terms are relative concepts and are described based on the orientation shown in the accompanying drawings.

[0044] It should be understood that when terms such as “comprising,” “including,” and “having” are used herein, they indicate the presence of the described features, quantities, steps, operations, components, parts, or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, steps, operations, components, parts, or combinations thereof.

[0045] Unless otherwise defined, all terms used herein (including technical or scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms as defined in common dictionaries shall be interpreted as having the same meaning as in the context of the relevant technical field and shall not be interpreted as having an ideal or overly formal meaning unless expressly defined as such in this application.

[0046] In the following description, aspects of some embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0047] Figure 1 These are perspective views of electronic devices according to some embodiments of the present disclosure, and Figure 2 This is an exploded perspective view of an electronic device according to some embodiments of the present disclosure.

[0048] refer to Figure 1 and Figure 2The electronic device 1000 may be a device activated by an electrical signal. The electronic device 1000 according to this disclosure may be a large electronic device such as a television or monitor, or a small to medium-sized electronic device such as a mobile phone, tablet computer, laptop computer, car navigation unit, vehicle dashboard, or game console. These electronic devices are merely illustrative, and the electronic device 1000 may include other forms of electronic devices without departing from the spirit and scope of the embodiments according to this disclosure. The electronic device 1000 may have a rectangular shape having a long side in a first direction DR1 and a short side in a second direction DR2 intersecting the first direction DR1. However, it is not limited thereto, and the electronic device 1000 may have various shapes. The electronic device 1000 may display an image IM on a display surface IS parallel to the first direction DR1 and the second direction DR2, and on a third direction DR3. The third direction DR3 may intersect the first direction DR1 and the second direction DR2. The display surface IS displaying the image IM may correspond to the front surface of the electronic device 1000.

[0049] In these embodiments, the front (or upper) and rear (or lower) surfaces of the component can be defined based on the orientation of the displayed image IM. The front and rear surfaces can be opposite each other on a third direction DR3, and the normal directions of the front and rear surfaces can be parallel to the third direction DR3.

[0050] The separation distance between the front and rear surfaces of the electronic device 1000 in the third direction DR3 can correspond to the thickness of the electronic device 1000 in the third direction DR3. Meanwhile, the directions indicated from the first direction to the third directions DR1, DR2, and DR3 can be relative concepts and can be changed to other directions.

[0051] Electronic device 1000 can sense external input applied from the outside. External input can include various forms of input provided from outside the electronic device 1000. According to some embodiments of this disclosure, electronic device 1000 can sense external input from a user applied from the outside. The user's external input can be one of various forms of external input, such as a part of the user's body, light, heat, gaze, and pressure, or combinations thereof. Additionally, depending on the structure of electronic device 1000, electronic device 1000 can sense external input from a user applied to a side or rear surface of electronic device 1000, and is not limited to any one embodiment. According to some embodiments of this disclosure, external input can include input from an input device PN. The input device PN can be referred to as a pen PN. For example, the pen PN can include a passive pen such as a stylus.

[0052] The display surface IS of the electronic device 1000 can be divided into a display area DA and a non-display area NDA. The display area DA can be the area where an image IM is displayed. The user can visually identify the image IM displayed at the display area DA. In these embodiments, the display area DA is illustrated as having a generally rectangular shape (e.g., with rounded corners). However, this is illustrative, and the display area DA can have various shapes and is not limited to any one embodiment (e.g., circular, elliptical, polygonal, irregular, etc.).

[0053] The non-display area NDA may be adjacent to the display area DA. The non-display area NDA may have a specific color. The non-display area NDA may surround the display area DA. Accordingly, the shape of the display area DA may be substantially defined by the non-display area NDA. However, this is illustrative, and the non-display area NDA may be disposed adjacent to only one side of the display area DA, or it may be omitted. The electronic device 1000 according to some embodiments of this disclosure may include various embodiments and is not limited to any one embodiment.

[0054] The electronic device 1000 may include a display module DM, a main circuit board MCB, a flexible circuit film D-FCB, multiple data drive circuits DIC, and a window WM.

[0055] The display module DM may include a display layer 100 and a sensor layer 200.

[0056] The display layer 100 according to some embodiments of this disclosure may be an emissive display panel. For example, the display layer 100 may be an organic light-emitting display layer, an inorganic light-emitting display layer, or a quantum dot light-emitting display layer. The emissive layer of an organic light-emitting display layer may include organic light-emitting materials. The emissive layer of an inorganic light-emitting display layer may include inorganic light-emitting materials. For example, the emissive layer of an inorganic light-emitting display layer may include micron-LEDs or nano-LEDs. The emissive layer of a quantum dot light-emitting display layer may include quantum dots and quantum rods, etc. In these embodiments, the display layer 100 is illustrated as an organic light-emitting display panel.

[0057] Display layer 100 can output image IM, and the output image IM can be displayed through display surface IS.

[0058] Sensor layer 200 can sense external input. Sensor layer 200 can be located on display layer 100. For example, sensor layer 200 can be located directly on display layer 100.

[0059] A window (WM) can be formed from a transparent material through which an image (IM) can be output. For example, a window (WM) can be formed from glass, sapphire, or plastic. Although a window (WM) is illustrated as a single layer, it is not limited to this and can include multiple layers.

[0060] According to some embodiments, the window WM may include a light-shielding pattern for defining the non-display area NDA. The light-shielding pattern may be a colored organic film. For example, the light-shielding pattern may be formed by coating.

[0061] The window WM can be bonded to the display module DM via an adhesive film. According to some embodiments of this disclosure, the adhesive film may include an optically clear adhesive (OCA) film. However, it is not limited thereto, and the adhesive film may include conventional adhesives or sticky substances. For example, the adhesive film may include an optically clear resin (OCR) or a pressure-sensitive adhesive (PSA) film.

[0062] The display module DM can display an image IM in response to an electrical signal. The display module DM can have a valid area AA and an invalid area NAA defined therein. The valid area AA can be defined as the area that outputs the image IM provided by the display module DM.

[0063] The invalid region NAA may be adjacent to the valid region AA. For example, the invalid region NAA may surround the valid region AA. However, this is illustrative, and the invalid region NAA may be defined in various shapes and is not limited to any one embodiment. According to some embodiments, the valid region AA of the display module DM may correspond to at least a portion of the display region DA.

[0064] The main circuit board (MCB) can be electrically connected to the display module (DM) via the flexible circuit film (D-FCB). The flexible circuit film (D-FCB) can be connected to the display module (DM) and can also electrically connect the display module (DM) and the main circuit board (MCB).

[0065] The main circuit board (MCB) may include a sensor driver (TIC) and a timing controller (TCON). The sensor driver (TIC) may include circuitry for driving the display module (DM). Multiple data drive circuits (DICs) may be mounted separately on the flexible circuit film (D-FCB).

[0066] According to some embodiments of this disclosure, the flexible circuit film D-FCB may include a first flexible circuit film D-FCB1, a second flexible circuit film D-FCB2, and a third flexible circuit film D-FCB3.

[0067] Multiple data driving circuits (DICs) may include a first data driving circuit (DIC1), a second data driving circuit (DIC2), and a third data driving circuit (DIC3).

[0068] The first to third flexible circuit films D-FCB1, D-FCB2, and D-FCB3 can be spaced apart from each other in the first direction DR1 and can be connected to the display module DM to electrically connect the display module DM and the main circuit board MCB. A first data driving circuit DIC1 can be mounted on the first flexible circuit film D-FCB1. A second data driving circuit DIC2 can be mounted on the second flexible circuit film D-FCB2. A third data driving circuit DIC3 can be mounted on the third flexible circuit film D-FCB3. However, embodiments of this disclosure are not limited thereto. For example, the display module DM can be electrically connected to the main circuit board MCB through one flexible circuit film D-FCB, and only one data driving circuit DIC can be mounted on one flexible circuit film D-FCB. Alternatively, the display module DM can be electrically connected to the main circuit board MCB through four or more flexible circuit films D-FCB, and the data driving circuits DIC can be mounted on separate flexible circuit films D-FCB.

[0069] although Figure 2 The illustration shows a structure in which the first to third data driving circuits DIC1, DIC2, and DIC3 are respectively mounted on the first to third flexible circuit films D-FCB1, D-FCB2, and D-FCB3, but this disclosure is not limited thereto. For example, the first to third data driving circuits DIC1, DIC2, and DIC3 can be directly mounted on the display module DM. In this case, the portion of the display module DM on which the first to third data driving circuits DIC1, DIC2, and DIC3 are mounted can be bent and can be located on the rear surface of the display module DM. Alternatively, the first to third data driving circuits DIC1, DIC2, and DIC3 can be directly mounted on the main circuit board MCB.

[0070] The electronic device 1000 may further include a housing EDC that houses the display module DM. The housing EDC may be integrated with the window WM and may define the appearance of the electronic device 1000. The housing EDC protects the components housed within it by absorbing externally applied impacts and preventing foreign matter / moisture from penetrating into the display module DM. Furthermore, according to some embodiments of this disclosure, the housing EDC may be provided in the form of incorporating multiple receiving components.

[0071] According to some embodiments, the electronic device 1000 may further include an electronic module containing various functional modules for operating the display module DM, a power supply module (e.g., a battery) for supplying power required for the overall operation of the electronic device 1000, and a bracket that is combined with the display module DM and / or the housing EDC and divides the internal space of the electronic device 1000.

[0072] Figure 3 This is a schematic cross-sectional view of a display module according to some embodiments of the present disclosure.

[0073] refer to Figure 3 The display module DM may include a display layer 100 and a sensor layer 200.

[0074] Display layer 100 may be a component that substantially generates an image. Display layer 100 may be an emitting display layer. For example, display layer 100 may be an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micron LED display layer, or a nano LED display layer. Display layer 100 may include a substrate layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.

[0075] The substrate 110 may be a component providing a substrate surface on which the circuit layer 120 is disposed. The substrate 110 may have a multilayer structure or a single-layer structure. The substrate 110 may be a glass substrate, a metal substrate, a silicon substrate, or a polymer substrate, but is not limited thereto.

[0076] Circuit layer 120 may be located on substrate layer 110. Circuit layer 120 may include insulating layers, semiconductor patterns, conductive patterns, and signal lines. The insulating layer, semiconductor layer, and conductive layer may be formed on substrate layer 110 by processes such as coating or deposition, and may be selectively patterned by performing photolithography processes multiple times.

[0077] The light-emitting element layer 130 may be located on the circuit layer 120. The light-emitting element layer 130 may include light-emitting elements. For example, the light-emitting element layer 130 may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micron LEDs, or nano LEDs.

[0078] The encapsulation layer 140 may be located on the light-emitting element layer 130. The encapsulation layer 140 can protect the light-emitting element layer 130 from moisture, oxygen and foreign matter such as dust particles.

[0079] Sensor layer 200 may be located on display layer 100. Sensor layer 200 can sense external input applied from the outside. Sensor layer 200 may be an integrated sensor formed continuously in the process of manufacturing display layer 100. Alternatively, sensor layer 200 may be an external sensor attached to display layer 100. Sensor layer 200 may be referred to as a sensor, input sensing layer, input sensing panel, or electronic device for sensing input coordinates.

[0080] Figure 4 This is a cross-sectional view of an electronic device according to some embodiments of the present disclosure.

[0081] refer to Figure 4At least one inorganic layer is formed on the upper surface of the substrate layer 110. The inorganic layer may include at least one of alumina, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed from multiple layers. The multiple inorganic layers may constitute a barrier layer and / or a buffer layer. According to some embodiments, the display layer 100 is illustrated to include a buffer layer BFL.

[0082] The buffer layer BFL can improve the adhesion between the substrate layer 110 and the semiconductor pattern. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may include a structure in which silicon oxide layers and silicon nitride layers are stacked alternately one after another.

[0083] The semiconductor pattern can be located on the buffer layer BFL. The semiconductor pattern can include polycrystalline silicon. However, it is not limited to this; the semiconductor pattern can include amorphous silicon, low-temperature polycrystalline silicon, or oxide semiconductor.

[0084] Figure 4 Only a portion of the semiconductor pattern is illustrated, and the semiconductor pattern may be located in other regions. The semiconductor pattern can be arranged across multiple pixels according to specific rules. Depending on whether doping is performed, the semiconductor pattern can have different electrical characteristics. The semiconductor pattern may include a first region with high conductivity and a second region with low conductivity. The first region may be doped with N-type or P-type dopant. A P-type transistor may include a doped region doped with P-type dopant, and an N-type transistor may include a doped region doped with N-type dopant. The second region may be undoped or lightly doped compared to the first region.

[0085] The first region can have a higher conductivity than the second region and can essentially function as an electrode or signal line. The second region can essentially correspond to the active (or channel) region of a transistor. In other words, a portion of the semiconductor pattern can be the active region of a transistor, another portion can be the source or drain of a transistor, and other portions can be connection electrodes or connection signal lines.

[0086] Each pixel can have an equivalent circuit comprising seven transistors, a capacitor, and a light-emitting element, and the equivalent circuit of a pixel can be modified in various ways. Figure 4 The illustration shows a transistor 100PC and a light-emitting element 100PE included in a pixel as an example.

[0087] The source region SC, active region AL, and drain region DR of transistor 100PC can be formed by semiconductor patterning. The source region SC and drain region DR can extend from the active region AL in opposite directions in cross-section. Figure 4The illustration shows a portion of the connection signal line SCL formed by a semiconductor pattern. Although not shown separately, when viewed from above the plane, the connection signal line SCL can be connected to the drain region DR of transistor 100PC.

[0088] The first insulating layer 10 may be located on the buffer layer BFL. The first insulating layer 10 may commonly overlap with multiple pixels and may cover a semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. According to some embodiments, the first insulating layer 10 may be a single silicon oxide layer. Not only the first insulating layer 10, but also the insulating layers of the circuit layer 120 described below may be inorganic layers and / or organic layers, and may have a single-layer or multi-layer structure. Inorganic layers may include at least one of the foregoing materials, but are not limited thereto.

[0089] The gate GT of transistor 100PC is located on the first insulating layer 10. The gate GT may be part of a metal pattern. The gate GT overlaps with the active region AL. The gate GT may act as a mask in the process of doping semiconductor patterns.

[0090] The second insulating layer 20 may be located on the first insulating layer 10 and may cover the gate GT. The second insulating layer 20 may commonly overlap with multiple pixels. The second insulating layer 20 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multilayer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. According to some embodiments, the second insulating layer 20 may have a multilayer structure including a silicon oxide layer and a silicon nitride layer.

[0091] The third insulating layer 30 may be located on the second insulating layer 20. The third insulating layer 30 may have a single-layer structure or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0092] The first connection electrode CNE1 can be located on the third insulating layer 30. The first connection electrode CNE1 can be connected to the connection signal line SCL through the contact hole CNT-1 that penetrates the first insulating layer 10, the second insulating layer 20 and the third insulating layer 30.

[0093] The fourth insulating layer 40 may be located on the third insulating layer 30. The fourth insulating layer 40 may be a single silicon oxide layer. The fifth insulating layer 50 may be located on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0094] The second connecting electrode CNE2 can be located on the fifth insulating layer 50. The second connecting electrode CNE2 can be connected to the first connecting electrode CNE1 through the contact hole CNT-2 that penetrates the fourth insulating layer 40 and the fifth insulating layer 50.

[0095] The sixth insulating layer 60 may be located on the fifth insulating layer 50 and may cover the second connecting electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0096] The light-emitting element layer 130 may be located on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. For example, the light-emitting element layer 130 may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micron LEDs, or nano LEDs. In the following, the light-emitting element 100PE will be illustrated by example as an organic light-emitting element. However, this disclosure is not particularly limited thereto.

[0097] The light-emitting element 100PE may include a first electrode AE, an emitting layer EL, and a second electrode CE.

[0098] The first electrode AE ​​can be located on the sixth insulating layer 60. The first electrode AE ​​can be connected to the second connecting electrode CNE2 through the contact hole CNT-3 that penetrates the sixth insulating layer 60.

[0099] The pixel defining layer 70 may be located on the sixth insulating layer 60 and may cover a portion of the first electrode AE. The pixel defining layer 70 has an opening 70-OP defined therein. The opening 70-OP of the pixel defining layer 70 exposes at least a portion of the first electrode AE.

[0100] Display area DA (reference) Figure 1 The electrode may include an emitter region PXA and a non-emitter region NPXA adjacent to the emitter region PXA. The non-emitter region NPXA may surround the emitter region PXA. According to some embodiments, the emitter region PXA is defined as corresponding to the portion of the first electrode AE ​​exposed through the opening 70-OP.

[0101] The emitting layer EL can be located on the first electrode AE. The emitting layer EL can be located in the region corresponding to the opening 70-OP. That is, the emitting layer EL can be formed individually for each pixel. When the emitting layer EL is formed individually for each pixel, the emitting layer EL can each emit at least one of blue light, red light, and green light. However, it is not limited to this; the emitting layer EL can be connected to the pixel and can be publicly provided. In this case, the emitting layer EL can provide blue light or white light.

[0102] The second electrode CE can be located on the emitter layer EL. The second electrode CE can have a monolithic shape and can be arranged commonly for multiple pixels.

[0103] According to some embodiments, a hole control layer may be located between the first electrode AE ​​and the emitter layer EL. The hole control layer may be commonly arranged in the emitter region PXA and the non-emitter region NPXA. The hole control layer may include a hole transport layer and may further include a hole injection layer. An electron control layer may be located between the emitter layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may further include an electron injection layer. An aperture mask may be used to commonly form the hole control layer and the electron control layer for multiple pixels.

[0104] Encapsulation layer 140 may be located on light-emitting element layer 130. Encapsulation layer 140 may include inorganic layers, organic layers, and inorganic layers stacked sequentially one after another. However, the layers constituting encapsulation layer 140 are not limited to these. Inorganic layers may protect light-emitting element layer 130 from moisture and oxygen, and organic layers may protect light-emitting element layer 130 from foreign matter such as dust particles. Inorganic layers may include silicon nitride layers, silicon oxynitride layers, silicon oxide layers, titanium oxide layers, or aluminum oxide layers. Organic layers may include, but are not limited to, acrylic organic layers.

[0105] The sensor layer 200 may include a substrate layer 201, a first conductive layer 202, a sensing insulating layer 203, a second conductive layer 204, and a covering insulating layer 205.

[0106] The substrate 201 may be an inorganic layer comprising at least one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the substrate 201 may be an organic layer comprising an epoxy resin, an acrylic resin, or an imide resin. The substrate 201 may have a monolayer structure or may have a multilayer structure stacked on a third-direction DR3.

[0107] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure or may have a multi-layer structure stacked on the third-direction DR3.

[0108] The conductive layer having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). Alternatively, the transparent conductive layer may include conductive polymers such as PEDOT, metal nanowires, or graphene.

[0109] A conductive layer with a multilayer structure may include a metal layer. The metal layer may have a three-layer structure, such as titanium / aluminum / titanium. A conductive layer with a multilayer structure may include at least one metal layer and at least one transparent conductive layer.

[0110] At least one of the sensing insulating layer 203 and the covering insulating layer 205 may include an inorganic film. The inorganic film may include at least one of alumina, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0111] At least one of the sensing insulating layer 203 and the covering insulating layer 205 may include an organic film. The organic film may include at least one of acrylic resins, methacrylic resins, polyisoprene resins, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyimide resins, polyamide resins, and perylene resins.

[0112] Figure 5 This is a block diagram illustrating a portion of an electronic device according to some embodiments of the present disclosure.

[0113] refer to Figure 5 The electronic device 1000 may include a display layer 100, a timing controller TCON, and a data drive circuit DIC. Figure 5 Data drive circuit DIC can be Figure 2 The data drive circuit DIC shown in the figure (reference) Figure 2 )one of the.

[0114] The timing controller TCON can receive input data RGB and control signals D-CS from the processor. The processor may include a graphics processing unit. The control signals D-CS may include various signals. For example, the control signals D-CS may include an input vertical sync signal, an input horizontal sync signal, a master clock, and a data enable signal.

[0115] The timing controller TCON can generate image data DS by converting the input data RGB data format according to the specification of the interface with the data drive circuit DIC.

[0116] The timing controller TCON can generate scan control signal SCS and data control signal DCS based on the control signal D-CS.

[0117] In response to the data control signal DCS from the timing controller TCON and the image data DS, the data driver circuit DIC can output grayscale voltages to drive multiple data lines DL1 to DLm. The data driver circuit DIC can be implemented using integrated circuits. The data driver circuit DIC can be directly mounted on a specific area of ​​the display layer 100. Alternatively, the data driver circuit DIC can be mounted on a separate printed circuit board as a chip-on-film (COF) and can be electrically connected to the display layer 100. However, this disclosure is not particularly limited. For example, the data driver circuit DIC can be formed using the same process as the circuit layers in the display layer 100.

[0118] A display area AA-1 and a non-display area NAA-1 can be defined in display layer 100. Multiple pixels PX can be located in display area AA-1, and the scan drive circuit SDC can be located in non-display area NAA-1. Display area AA-1 can be separated from the effective area AA of display module DM (reference). Figure 2 The non-display area NAA-1 may overlap with the invalid area NAA of the display module DM (see reference). Figure 2 )overlapping.

[0119] Display layer 100 may include multiple scan lines SL1 to SLn, multiple data lines DL1 to DLm, multiple pixels PX, and scan driving circuit SDC. Each of the multiple pixels PX may be connected to a corresponding data line among the multiple data lines DL1 to DLm, and may be connected to a corresponding scan line among the multiple scan lines SL1 to SLn. According to some embodiments of this disclosure, display layer 100 may further include light emission control lines, and electronic device 1000 may further include light emission driving circuit that provides control signals to the light emission control lines. The construction of display layer 100 is not particularly limited.

[0120] Each of the multiple scan lines SL1 to SLn can extend parallel to the first direction DR1. The multiple scan lines SL1 to SLn can be arranged in the second direction DR2 to be spaced apart from each other. Each of the multiple data lines DL1 to DLm can extend from the data driver circuit DIC in the second direction DR2. The multiple data lines DL1 to DLm can be arranged in the first direction DR1 to be spaced apart from each other.

[0121] Multiple pixels PX can be electrically connected to multiple scan lines SL1 to SLn and multiple data lines DL1 to DLm, respectively. For example, pixels in the first row can be connected to scan line SL1, and pixels in the first column can be connected to data line DL1.

[0122] The scan driving circuit SDC can drive multiple scan lines SL1 to SLn in response to the scan control signal SCS. According to some embodiments of this disclosure, the scan driving circuit SDC can be formed using the same process as the circuit layers in the display layer 100, but is not limited thereto. For example, the scan driving circuit SDC can be implemented using an integrated circuit (IC). The scan driving circuit SDC can be directly mounted on a specific area of ​​the display layer 100. Alternatively, the scan driving circuit SDC can be mounted on a separate printed circuit board as a chip-on-film (COF) and can be electrically connected to the display layer 100.

[0123] Figure 6 This is a block diagram illustrating a portion of an electronic device according to some embodiments of the present disclosure.

[0124] refer to Figure 6 The electronic device 1000 may include a sensor layer 200 and a sensor driver TIC.

[0125] A sensing area AA-2 and a peripheral area NAA-2 can be defined in the sensor layer 200. The sensing area AA-2 can be an area activated depending on an electrical signal. The sensing area AA-2 can be an area for sensing input. The sensing area AA-2 can be related to the effective area AA of the display module DM (see reference). Figure 2 It can overlap with display layer 100 (reference). Figure 5 The display area AA-1 (reference) Figure 5 The peripheral area NAA-2 may overlap with the sensing area AA-2. The peripheral area NAA-2 may overlap with the invalid area NAA of the display module DM (reference). Figure 2 It can overlap with display layer 100 (reference). Figure 5 The non-display area NAA-1 (reference) Figure 5 )overlapping.

[0126] Sensing area AA-2 may include a first area AA1, a second area AA2, and a boundary area BA. The second area AA2 may be spaced apart from the first area AA1 in the first direction DR1. The boundary area BA may be located between the first area AA1 and the second area AA2.

[0127] The sensor layer 200 may include multiple electrodes 210 and 220, multiple first lines 230, multiple second lines 240, a protection electrode 251, and a protection line 252. The multiple electrodes 210 and 220 and the protection electrode 251 may be located in the sensing area AA-2.

[0128] The sensor layer 200 may include a plurality of first electrodes 210 and a plurality of second electrodes 220. The sensor layer 200 can obtain information about external inputs by means of changes in capacitance between the plurality of first electrodes 210 and the plurality of second electrodes 220.

[0129] The plurality of first electrodes 210 may include a plurality of first-first electrodes 210-1 and a plurality of first-second electrodes 210-2.

[0130] Multiple first-first electrodes 210-1 may be located in a first region AA1. Multiple first-first electrodes 210-1 may be arranged in a first direction DR1. Each of the multiple first-first electrodes 210-1 may extend in a second direction DR2.

[0131] Multiple first-second electrodes 210-2 may be located in the second region AA2. Multiple first-second electrodes 210-2 may be arranged in the first direction DR1. Each of the multiple first-second electrodes 210-2 may extend in the second direction DR2.

[0132] although Figure 6 The illustration shows eight first-first electrodes 210-1 and eight first-second electrodes 210-2 as an example, but the number of first-first electrodes 210-1 and the number of first-second electrodes 210-2 are not limited to this according to some embodiments of the present disclosure. For example, the number of first-first electrodes 210-1 and the number of first-second electrodes 210-2 may each be 36.

[0133] The plurality of second electrodes 220 may include a plurality of second-first electrodes 220-1 and a plurality of second-second electrodes 220-2.

[0134] A plurality of second-first electrodes 220-1 may be located in the first region AA1. The plurality of second-first electrodes 220-1 may be arranged in the second direction DR2. Each of the plurality of second-first electrodes 220-1 may extend in the first direction DR1. The plurality of second-first electrodes 220-1 may be insulated from and may intersect with the plurality of first-first electrodes 210-1.

[0135] A plurality of second-second electrodes 220-2 may be located in the second region AA2. The plurality of second-second electrodes 220-2 may be arranged in the second direction DR2. Each of the plurality of second-second electrodes 220-2 may extend in the first direction DR1. The plurality of second-second electrodes 220-2 may be insulated from and may intersect with the plurality of first-second electrodes 210-2.

[0136] although Figure 6 The illustration shows seven second-first electrodes 220-1 and seven second-second electrodes 220-2 as an example, but the number of second-first electrodes 220-1 and the number of second-second electrodes 220-2 are not limited thereto according to some embodiments of the present disclosure. For example, the number of second-first electrodes 220-1 and the number of second-second electrodes 220-2 may each be 40.

[0137] Multiple first lines 230 can be electrically connected to the sensor driver TIC. Multiple first lines 230 can be located in the peripheral area NAA-2. Multiple first lines 230 can be electrically connected to multiple first-first electrodes 210-1 and multiple first-second electrodes 210-2.

[0138] Multiple first lines 230 may include multiple first sub-lines 231 and multiple second sub-lines 232.

[0139] Each of the multiple first sub-lines 231 can be connected to a corresponding one of the multiple first-first electrodes 210-1 and a corresponding one of the multiple first-second electrodes 210-2. That is, one first sub-line 231 can be connected to two first electrodes 210. For example, the first first sub-line 231 can be connected to the first first-first electrode 210-1 and the eighth first-second electrode 210-2, and the last first sub-line 231 can be connected to the seventh first-first electrode 210-1 and the second first-second electrode 210-2.

[0140] Multiple first-first electrodes 210-1 and multiple first-second electrodes 210-2 can be electrically connected via multiple first sub-wires 231. Each of the multiple first sub-wires 231 can be connected to at least two electrodes among the multiple first-first electrodes 210-1 and multiple first-second electrodes 210-2.

[0141] Multiple second sub-lines 232 may be located between multiple first sub-lines 231. Each of the multiple second sub-lines 232 may be connected to one of the multiple first-first electrodes 210-1 or one of the multiple first-second electrodes 210-2. Each of the multiple second sub-lines 232 may be connected to one of the multiple first-first electrodes 210-1 and the multiple first-second electrodes 210-2.

[0142] Each of the multiple second sub-lines 232 can be connected to one of the multiple first electrodes 210 adjacent to the boundary region BA. For example, each of the multiple second sub-lines 232 can be connected to one of the multiple first-first electrodes 210-1 and multiple first-second electrodes 210-2 adjacent to the protection electrode 251.

[0143] Multiple second sub-lines 232 may include a second-first sub-line 232-1 and a second-second sub-line 232-2.

[0144] The second-first sub-line 232-1 can be connected to one of the plurality of first-first electrodes 210-1 located in the first region AA1. The second-first sub-line 232-1 can be connected to the last first-first electrode 210-1. For example, the second-first sub-line 232-1 can be connected to the eighth first-first electrode 210-1.

[0145] The second sub-line 232-2 can be connected to one of the plurality of first-second electrodes 210-2 located in the second region AA2. The second sub-line 232-2 can also be connected to the first first-second electrode 210-2.

[0146] Multiple second lines 240 can be electrically connected to the sensor driver TIC. Multiple second lines 240 can be electrically connected to multiple second electrodes 220 respectively. Multiple second lines 240 can be located in the peripheral region NAA-2. Some of the multiple second lines 240 can be connected to multiple second-first electrodes 220-1 respectively, and other second lines 240 can be connected to multiple second-second electrodes 220-2 respectively.

[0147] The protection electrode 251 may be located in the boundary region BA. The protection electrode 251 may be spaced apart from a plurality of first electrodes 210 and a plurality of second electrodes 220. A protection line 252 may be connected to the protection electrode 251. The protection line 252 may be electrically connected to the sensor driver TIC. According to some embodiments of this disclosure, the protection line 252 may be omitted.

[0148] The sensor driver TIC can sequentially output the sensing signal Tx to multiple first lines 230.

[0149] The sensor driver TIC can provide the same sensing signal Tx to at least two first electrodes 210 connected to the first sub-line 231. For example, the same sensing signal Tx can be provided to a first first-first electrode 210-1 and an eighth first-second electrode 210-2. The at least two first electrodes 210 connected to the first sub-line 231 can share the sensing signal Tx.

[0150] The sensor driver TIC can provide a sensing signal Tx to a plurality of first electrodes 210 respectively connected to a plurality of second sub-lines 232. That is, a first line 230 can be connected to each of the first electrodes 210 adjacent to the boundary region BA, and each of the plurality of first electrodes 210 respectively connected to the plurality of second sub-lines 232 can not share the sensing signal Tx with another first electrode 210.

[0151] The sensor driver TIC can calculate the input coordinate information based on the received signals Rx1 and Rx2 received from multiple second lines 240.

[0152] The received signals Rx1 and Rx2 may include a first received signal Rx1 and a second received signal Rx2.

[0153] The first received signal Rx1 can be output from multiple second-first electrodes 220-1. The first received signal Rx1 can be generated based on the sensing signal Tx provided by multiple first-first electrodes 210-1. The sensor driver TIC can calculate the coordinate information of the first region AA1 based on the first received signal Rx1.

[0154] The second received signal Rx2 can be output from multiple second-second electrodes 220-2. The second received signal Rx2 can be generated based on the sensing signal Tx provided by multiple first-second electrodes 210-2. The sensor driver TIC can calculate the coordinate information of the second region AA2 based on the second received signal Rx2.

[0155] Unlike in this disclosure, the electronic device 1000 constituting the vehicle dashboard may have a relatively large effective area AA (refer to...). Figure 2 In this case, the number of electrodes in sensor layer 200 may increase, and therefore it may be difficult to drive sensor layer 200 with a single sensor driver TIC. However, according to this disclosure, multiple first sub-lines 231 can be connected to at least two first electrodes 210. The sensor driver TIC can transmit sensing signals Tx to at least two first electrodes 210 via the first sub-lines 231. The sensor driver TIC can transmit the same sensing signals Tx to corresponding electrode pairs in multiple first-first electrodes 210-1 and multiple first-second electrodes 210-2 via multiple first sub-lines 231, and can calculate coordinate information based on the received signals Rx1 and Rx2. The number of sensing signals Tx required to sense external input in sensing area AA-2 can be relatively reduced. Sensor layer 200 can be driven using a single sensor driver TIC. Accordingly, a reduced invalid area NAA (see reference) can be provided. Figure 2 ) an electronic device with an area of ​​1000.

[0156] Unlike this disclosure, when the same sensing signal Tx is provided to the two first electrodes 210 adjacent to the boundary region BA via the first sub-line 231, the input of a pen PN or little finger with a relatively narrow contact area with the sensor layer 200 in the middle region of the sensing region AA-2 may not be easily recognized. For example, when the pen PN is located in the region adjacent to the boundary region BA, the sensor driver TIC receiving the received signals Rx1 and Rx2 depending on the sensing signal Tx transmitted by the first sub-line 231 may not easily calculate the accurate sensing coordinates. However, according to this disclosure, the two first electrodes 210 adjacent to the boundary region BA can receive separate sensing signals Tx via multiple second sub-lines 232. The sensor driver TIC can easily sense whether the pen PN is sensed in the middle region adjacent to the first region AA1 or whether the pen PN is sensed in the middle region adjacent to the second region AA2. Accordingly, an electronic device 1000 with improved touch reliability can be provided.

[0157] Figure 7 The illustrations are of some embodiments according to this disclosure. Figure 6 An enlarged plan view of one of the areas. In describing... Figure 7 When, refer to Figure 6The components described will be assigned the same reference numerals, and descriptions of them will be omitted.

[0158] refer to Figure 7 The cross area SU can be the area where the bridging pattern 222-1 is set.

[0159] Each of the plurality of first electrodes 210-1 may include a first portion 211-1 and a second portion 212-1. The first portion 211-1 and the second portion 212-1 may have an integral shape. According to some embodiments, the first portion 211-1 and the second portion 212-1 may be integrally formed such that they are connected to each other.

[0160] Each of the plurality of second-first electrodes 220-1 may include a sensing pattern 221-1 and a bridging pattern 222-1. Two adjacent sensing patterns 221-1 may be electrically connected to each other via two bridging patterns 222-1. However, embodiments according to this disclosure are not particularly limited thereto. The sensing pattern 221-1 may have a grid structure. An opening OP-M may be defined in the sensing pattern 221-1. An opening OP-M may be associated with a pixel defining layer 70 (reference 70). Figure 4 The openings 70-OP defined in the diagram overlap. However, this is illustrative, and one opening OP-M may overlap with multiple openings 70-OP. Each of the bridging pattern 222-1, the first portion 211-1, and the second portion 212-1 may also have a grid structure similar to that of the sensing pattern 221-1.

[0161] Two bridging patterns 222-1 can connect two sensing patterns 221-1. First connection areas CNT-A1 to fourth connection areas CNT-A4 can be provided between the two bridging patterns 222-1 and the two sensing patterns 221-1. Four contact holes CNT-I can be formed in each of the first connection areas CNT-A1 to the fourth connection areas CNT-A4. However, this is illustrative, and the two sensing patterns 221-1 can be electrically connected via one bridging pattern 222-1. Alternatively, according to some embodiments of this disclosure, the two sensing patterns 221-1 can be electrically connected via three or more bridging patterns 222-1.

[0162] exist Figure 7 The description is based on a plurality of first-first electrodes 210-1 and a plurality of second-first electrodes 220-1. However, each of the plurality of first-second electrodes 210-2 and the plurality of second-second electrodes 220-2 may also have a similar structure.

[0163] Figure 8 It is according to some embodiments of this disclosure along Figure 7The image shows a cross-sectional view of the sensor layer taken by line I-I'. In the description... Figure 8 When, refer to Figure 4 and Figure 7 The components described will be assigned the same reference numerals, and descriptions of them will be omitted.

[0164] refer to Figure 8 The sensor layer 200 may have a bottom bridging structure. For example, bridging pattern 222-1 may be included in the first conductive layer 202 (reference). Figure 4 In ), and in Part 1 211-1 (reference) Figure 7 The second part 212-1 and the sensing pattern 221-1 can be included in the second conductive layer 204 (reference). Figure 4 )middle.

[0165] The bridging pattern 222-1 can be located on the base layer 201.

[0166] The sensing insulating layer 203 may be located on the bridging pattern 222-1. The sensing insulating layer 203 may cover the bridging pattern 222-1.

[0167] Part 1 211-1 (Reference) Figure 7 The second part 212-1 and the sensing pattern 221-1 can be located on the sensing insulating layer 203. The first part 211-1 can be provided in the same layer (see reference). Figure 7 ), Part 212-1 and sensing pattern 221-1.

[0168] The sensing pattern 221-1 can be connected to the bridging pattern 222-1 through the contact hole CNT-I that penetrates the sensing insulating layer 203.

[0169] The insulating layer 205 may be located in the first part 211-1 (reference). Figure 7 The first part 211-1 (reference) and the second part 212-1 and the sensing pattern 221-1 are covered. The insulating layer 205 can cover the first part 211-1 (reference). Figure 7 ), Part 212-1 and sensing pattern 221-1.

[0170] Figure 9 The illustrations are of some embodiments according to this disclosure. Figure 6 An enlarged plan view of one of the areas, and Figure 10 It is according to some embodiments of this disclosure along Figure 9 The cross-sectional view taken from line II-II' in the diagram. (In the description) Figure 9 When, refer to Figure 6 The components described will be assigned the same reference numerals, and descriptions of them will be omitted.

[0171] refer to Figure 9 and Figure 10 The intermediate region EA can be the region where the protective electrode 251 is installed.

[0172] The protection electrode 251 may be located between a plurality of first-first electrodes 210-1 and a plurality of first-second electrodes 210-2. The protection electrode 251 may be located between a plurality of second-first electrodes 220-1 and a plurality of second-second electrodes 220-2.

[0173] The grounding voltage or protection voltage can be supplied to the protection electrode 251 through the protection line 252, or the protection electrode 251 can be in a floating state. The grounding voltage can have a voltage level different from the protection voltage.

[0174] The protection electrode 251 may be located on the sensing insulating layer 203. The protection electrode 251 may be located in the same layer as the second-first electrode 220-1. The protection electrode 251 may be located in the same layer as at least a portion of the second-second electrode 220-2.

[0175] The protective electrode 251 may have a grid structure.

[0176] Figure 11 This is a block diagram illustrating a portion of an electronic device according to some embodiments of the present disclosure. In the description... Figure 11 Time, and reference Figure 6 Components that are identical to those described will be assigned the same reference numerals, and their descriptions will be omitted.

[0177] refer to Figure 11 The electronic device 1000a may include a sensor layer 200a and a sensor driver TIC.

[0178] Multiple first lines 230a can be electrically connected to the sensor driver TIC. The multiple first lines 230a may include multiple first sub-lines 231, multiple second sub-lines 232a, and a third sub-line 233a.

[0179] Each of the plurality of second sub-lines 232a can be connected to one of the plurality of first-first electrodes 210-1 and the plurality of first-second electrodes 210-2. The plurality of second sub-lines 232a may include a second-first sub-line 232-1a and a second-second sub-line 232-2a.

[0180] The second-first sub-line 232-1a can be connected to one of the plurality of first-first electrodes 210-1 located in the first region AA1. The second-first sub-line 232-1a can be connected to the second first-first electrode 210-1 near the boundary region BA. For example, the second-first sub-line 232-1a can be connected to the seventh first-first electrode 210-1.

[0181] The second sub-line 232-2a can be connected to one of the plurality of first-second electrodes 210-2 located in the second region AA2. The second sub-line 232-2a can be connected to a second first-second electrode 210-2 near the boundary region BA. For example, the second sub-line 232-2a can be connected to a second first-second electrode 210-2.

[0182] The third sub-line 233a may be located between multiple second sub-lines 232a. The third sub-line 233a may be spaced apart from multiple first sub-lines 231, and multiple second sub-lines 232a may be located between the third sub-line 233a and multiple first sub-lines 231.

[0183] The third sub-line 233a can be connected to one of the plurality of first-first electrodes 210-1 and one of the plurality of first-second electrodes 210-2. The third sub-line 233a can be connected to at least two first electrodes 210 adjacent to the boundary region BA. For example, the third sub-line 233a can be connected to an eighth first-first electrode 210-1 and a first first-second electrode 210-2.

[0184] The same sensing signal Tx can be provided to the eighth first-first electrode 210-1 and the first first-second electrode 210-2 via the third sub-line 233a.

[0185] Figure 12 This is a block diagram illustrating a portion of an electronic device according to some embodiments of the present disclosure. In the description... Figure 12 Time, and reference Figure 6 Components that are identical to those described will be assigned the same reference numerals, and their descriptions will be omitted.

[0186] refer to Figure 12 The electronic device 1000b may include a sensor layer 200b and a sensor driver TIC. According to some embodiments of this disclosure, the first region AA1 and the second region AA2 may have different areas. The number of first-first electrodes 210-1 located in the first region AA1 may differ from the number of first-second electrodes 210-2 located in the second region AA2.

[0187] Multiple first lines 230b can be electrically connected to the sensor driver TIC. The multiple first lines 230b may include multiple first sub-lines 231, multiple second sub-lines 232b, and a third sub-line 233b.

[0188] Each of the plurality of second sub-lines 232b can be connected to one of the plurality of first-first electrodes 210-1 and the plurality of first-second electrodes 210-2. The plurality of second sub-lines 232b may include a second-first sub-line 232-1b and a second-second sub-line 232-2b.

[0189] The second-first sub-line 232-1b can be connected to one of the plurality of first-first electrodes 210-1 located in the first region AA1. The second-first sub-line 232-1b can be connected to a second first-first electrode 210-1 near the boundary region BA. For example, the second-first sub-line 232-1b can be connected to a seventh first-first electrode 210-1.

[0190] The second sub-line 232-2b can be connected to one of the plurality of first-second electrodes 210-2 located in the second region AA2. The second sub-line 232-2b can also be connected to the first-second electrode 210-2 adjacent to the boundary region BA. For example, the second sub-line 232-2b can be connected to the first first-second electrode 210-2.

[0191] The third sub-line 233b may be located between multiple second sub-lines 232b. The third sub-line 233b may be spaced apart from multiple first sub-lines 231, and multiple second sub-lines 232b may be located between the third sub-line 233b and multiple first sub-lines 231.

[0192] The third sub-line 233b may be connected to one of the plurality of first-first electrodes 210-1. The third sub-line 233b may be connected to the last first-first electrode 210-1. For example, the third sub-line 233b may be connected to the eighth first-first electrode 210-1. However, this is illustrative, and according to some embodiments of this disclosure, the third sub-line 233b may be connected to one of the plurality of first-second electrodes 210-2 depending on the location of the boundary region BA.

[0193] As described above, the two first electrodes adjacent to the boundary region can receive separate sensing signals via multiple second sub-lines. The sensor driver can easily sense whether an object with a relatively small contact area, such as a pen or little finger, is detected in the intermediate region adjacent to the first region or the intermediate region adjacent to the second region. Accordingly, electronic devices with improved touch reliability can be provided.

[0194] Although embodiments thereof have been described with reference to this disclosure, it will be apparent to those skilled in the art that various changes and modifications may be made to this disclosure without departing from the spirit and scope of this disclosure as set forth in the claims and their equivalents.

Claims

1. An electronic device comprising: Display layer; A sensor layer, on the display layer, having a sensing area defined therein, wherein the sensing area includes a first region and a second region spaced apart from the first region in a first direction; and A sensor driver is configured to drive the sensor layer. The sensor layer includes: A plurality of first-first electrodes are arranged in the first region and in the first direction, each of the plurality of first-first electrodes extending in a second direction intersecting the first direction; A plurality of second-first electrodes are arranged in the first region and in the second direction, each of the plurality of second-first electrodes extending in the first direction; A plurality of first and second electrodes are arranged in the second region and in the first direction, each of the plurality of first and second electrodes extending in the second direction; A plurality of second-second electrodes are arranged in the second region and in the second direction, each of the plurality of second-second electrodes extending in the first direction; Multiple first lines are connected to the multiple first-first electrodes and the multiple first-second electrodes; and Multiple second lines are connected to the multiple second-first electrodes and the multiple second-second electrodes, and The plurality of first lines include: A first sub-line is connected to one of the plurality of first-first electrodes and one of the plurality of first-second electrodes; and The second sub-line is connected to another of the plurality of first-first electrodes or another of the plurality of first-second electrodes.

2. The electronic device according to claim 1, wherein, The plurality of first-first electrodes are insulated from the plurality of second-first electrodes respectively, while intersecting with the plurality of second-first electrodes, and The plurality of first-second electrodes are insulated from the plurality of second-second electrodes respectively, while crossing the plurality of second-second electrodes.

3. The electronic device according to claim 1, wherein, The first sub-line includes multiple first sub-lines, and The second sub-line is located between the plurality of first sub-lines.

4. The electronic device according to claim 1, wherein, The sensing area further includes the boundary area between the first area and the second area, and The sensor layer further includes a protective electrode in the boundary region.

5. The electronic device according to claim 4, wherein, The grounding voltage is supplied to the protective electrode.

6. The electronic device according to claim 4, wherein, The protective electrode is in a floating state.

7. The electronic device according to claim 4, wherein, The second sub-line is connected to the electrode adjacent to the protection electrode among the plurality of first-first electrodes and the plurality of first-second electrodes.

8. The electronic device according to any one of claims 1-7, wherein, The plurality of first lines and the plurality of second lines are electrically connected to the sensor driver.

9. The electronic device according to claim 1, wherein, The plurality of first lines further include a third sub-line spaced apart from the first sub-line, and the second sub-line is between the third sub-line and the first sub-line.

10. The electronic device according to claim 9, wherein, The third sub-line is connected to another of the plurality of first-first electrodes and another of the plurality of first-second electrodes.

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