Lamp panel and display module

Abstract

The utility model provides a lamp panel and a display module. The lamp panel comprises a substrate, a light-emitting part and a packaging colloid. The substrate comprises a circuit board and a baffle, the circuit board is provided with a supporting surface, a plurality of spaced welding positions are arranged on the supporting surface, the baffle is arranged around the edge of the circuit board and protrudes out of the supporting surface, the baffle and the circuit board jointly define a packaging groove, and the baffle can reflect light; a plurality of light-emitting pieces are arranged, and each light-emitting piece is arranged on one welding position; the packaging colloid is filled in the packaging groove, and the hardness of the packaging colloid is smaller than that of the baffle plate. According to the lamp panel, the side edge of the packaging colloid is wrapped by the baffle in the circumferential direction, the lamp panel is not prone to being collided and damaged in the assembling and disassembling process, the baffle can reflect light rays, the situation that the light rays are refracted out of the side edge of the packaging colloid, and consequently light leakage is caused around the lamp panel is reduced or avoided, and therefore bright lines at the splicing seam of the lamp panel are reduced or eliminated.

Description

Technical Field

[0001] This utility model belongs to the field of display module technology, and in particular relates to a lamp board and a display module. Background Technology

[0002] Compared to traditional LCD screens, LED (Light Emitting Diode) displays can be assembled and spliced ​​in various sizes, offering advantages such as high-definition display and energy efficiency. They are currently widely used in advertising, transportation, commercial displays, stage performances, conferences, and command centers. With the development of LED display technology, a new product process called COB (Chipon Board) displays is gradually gaining traction in various display application areas.

[0003] COB displays use a process where mini / micro LED chips are directly soldered onto the PCB board. Compared to Mini-In-Package (MiP) packaging and Surface-Mount Device (SMD) packaging, this allows for smaller pixel pitch, higher color fidelity and display clarity, and delivers high-definition dynamic image quality.

[0004] The most mature and widely used COB (Chip-on-Board) packaging technology currently is molding, which involves molding a layer of encapsulating adhesive onto a bare die substrate after LED chip die bonding to achieve overall encapsulation of the entire LED panel. The advantages of this process are better overall hermeticity, superior protection, and stable reliability during long-term use. The encapsulating adhesive is typically made of materials such as epoxy resin. These polymer materials have advantages such as stable performance after curing, low water absorption, and low internal stress, but their disadvantage is insufficient hardness. After molding, the excess edges of the LED panel need to be trimmed to form the panel for assembly. At this point, the encapsulating adhesive layer at the edges of the panel is easily damaged by impacts during assembly and disassembly, and such damage is often extremely difficult to repair. Most panels cannot be restored to their original condition, affecting the reliability and display effect of the panel. In addition, due to the light transmittance of the encapsulating adhesive, adjacent lamp boards with a small dot pitch (such as P0.9 or less) are prone to light leakage at the edges of the lamp boards, resulting in a "bright line" between the two adjacent lamp boards in the final spliced ​​display module, which affects the display effect of the display module. Utility Model Content

[0005] The purpose of this utility model is to provide a light panel and a display module, which aims to solve the technical problems that the edge area of ​​the existing light panel is easily damaged and bright lines easily appear after being spliced ​​into a display module.

[0006] This utility model is implemented as follows: Firstly, it provides a lamp board, including a substrate, a light-emitting element, and an encapsulating colloid;

[0007] The substrate includes a circuit board and a baffle. The circuit board has a support surface and a plurality of spaced soldering positions are provided on the support surface. The baffle is disposed around the edge of the circuit board and protrudes from the support surface. The baffle and the circuit board together form an encapsulation groove. The baffle is capable of reflecting light.

[0008] Multiple light-emitting elements are provided, and each light-emitting element is disposed on one of the welding positions;

[0009] An encapsulating colloid is filled into the encapsulation groove, and the hardness of the encapsulating colloid is less than the hardness of the baffle.

[0010] As one of the possible implementations of the first aspect, the baffle is integrally formed with the circuit board.

[0011] As one of the possible implementations of the first aspect, the baffle protrudes from the support surface at a greater height than the top surface of the light-emitting element protrudes from the support surface, and the encapsulating colloid covers the top surface of the light-emitting element.

[0012] As one of the possible implementations of the first aspect, the thickness of the encapsulating colloid is less than or equal to the height by which the baffle protrudes from the support surface.

[0013] As one of the possible implementations of the first aspect, the baffle has a first side facing the light-emitting element and a second side facing away from the light-emitting element, the first side being parallel to the second side.

[0014] As one of the possible implementations of the first aspect, the first side is perpendicular to the supporting surface.

[0015] As one of the possible implementations of the first aspect, the thickness of the baffle in the direction from the first side to the second side is 50um-75um.

[0016] As one of the possible implementations of the first aspect, the circuit board has an outer peripheral surface surrounding the support surface, the outer peripheral surface being flush with the second side surface.

[0017] As one of the possible implementations of the first aspect, the light panel further includes a black film layer covering the upper surface of the encapsulating colloid.

[0018] Secondly, a display module is provided, comprising a plurality of light panels as described in the above embodiments, wherein the edges of the plurality of light panels are spliced ​​together.

[0019] The technical advantages of this invention compared to existing technologies are as follows: The lamp panel uses a baffle to circumferentially wrap around the side of the encapsulating colloid. During cutting, only the baffle portion is cut, avoiding contact with the encapsulating colloid. Even after cutting, the side of the encapsulating colloid layer remains encapsulated by the baffle, providing protection and preventing direct exposure. The baffle is also harder than the encapsulating colloid, making it less susceptible to damage during assembly and disassembly, thus improving the lamp panel's reliability and protective performance. Furthermore, the baffle reflects light, directing light emitted from the light-emitting components around the perimeter of the lamp panel back into the panel, reducing or preventing light leakage around the lamp panel caused by refraction from the side of the encapsulating colloid. This reduces or eliminates bright lines at the panel seams, facilitating a smaller pixel pitch in the resulting display module and achieving a higher resolution. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a cross-sectional view of the light panel in the horizontal direction in the current related technology;

[0022] Figure 2 This is a vertical cross-sectional view of the light panel in the current related technology;

[0023] Figure 3 This is a cross-sectional view of the lamp panel provided in the embodiment of this utility model in the horizontal direction;

[0024] Figure 4 This is a vertical cross-sectional view of the lamp panel provided in one embodiment of the present invention;

[0025] Figure 5 This is a vertical cross-sectional view of the lamp panel provided in another embodiment of the present invention.

[0026] Explanation of reference numerals in the attached figures:

[0027] 100' COB LED board; 10' Circuit board; 20' LED chip; 30' Encapsulating adhesive layer;

[0028] 100. Lamp board; 10. Substrate; 11. Circuit board; 12. Baffle; 101. Encapsulation groove; 111. Solder pad; 20. Light-emitting component; 21. LED chip; 30. Encapsulating colloid; 40. Film layer. Detailed Implementation

[0029] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0030] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0032] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0034] The most common and technologically mature COB packaging process currently is molding technology. This involves heating and pressing a layer of epoxy resin onto the surface of a pre-bonded COB die board (i.e., the circuit board 10' with LED chips 20' already installed) as an encapsulating layer 30', achieving full-surface encapsulation. For example... Figure 1 As shown, the thickness of the molded encapsulation on a typical 100' lamp board is about 200-300µm. After molding and cutting, as... Figure 2As shown, the encapsulating adhesive layer 30' on the side of the COB lamp board 100' forms a 90° right angle with the circuit board 10'. This side encapsulating adhesive layer 30' is exposed. Since the adhesive itself is not hard enough, the corners of the encapsulating adhesive layer 30' are easily damaged by bumps when assembling or disassembling the lamp board 100' of the display module. When the volume of the missing part at the corner of the encapsulating adhesive layer 30' is large, the LED chip 20' on the circuit board 10' will be exposed or directly knocked off, which will not only affect the appearance, but may also affect the reliability of the product and the display function.

[0035] Furthermore, to achieve higher display brightness, the encapsulating adhesive layer 30' generally has high light transmittance. Therefore, when the pixel pitch between COB lamp boards 100' is P0.9 or less, light leakage is prone to occur at the splicing seams after the lamp boards 100' are assembled, which is known in the industry as the "bright line" phenomenon. When a row or column of LED chips 20' near the edge of the lamp board 100' emits light, the emitted light will penetrate the encapsulating adhesive layer 30' and be refracted from its side, resulting in the phenomenon that the brightness at the splicing seam between two adjacent lamp boards 100' is higher than the overall brightness of the display module. Therefore, when the pixel pitch of the lamp boards 100' of the COB display module reaches P0.9 or less, the aforementioned splicing seams need to be shielded to avoid obvious bright lines between the boards during the overall display module assembly.

[0036] To solve the above problems, the current common practice is to add a light-shielding shell to the entire lamp panel 100' or to add a ring of edge-sealing adhesive around the lamp panel 100'. Although such solutions can achieve a certain edge protection and shield light leakage at the splicing seam, they are not lightweight enough for the overall display module, require additional processes, and are not conducive to heat dissipation of the lamp panel 100'.

[0037] Based on this, this utility model embodiment provides a light panel and a display module, wherein the display module is composed of multiple light panels spliced ​​together. The size and shape of the display module can be flexibly adjusted according to actual needs.

[0038] like Figure 3 and Figure 4 As shown, the lamp panel 100 includes a substrate 10, light-emitting elements 20, and an encapsulating colloid 30. Multiple light-emitting elements 20 are disposed on the substrate 10, and the encapsulating colloid 30 encapsulates the multiple light-emitting elements 20 to protect them.

[0039] The substrate 10 includes a circuit board 11 and a baffle 12. The circuit board 11 has a supporting surface, a bottom surface, and a peripheral surface, wherein the supporting surface and the bottom surface face away from each other, and the peripheral surface surrounds and connects to the supporting surface and the bottom surface. The baffle 12 is disposed around the edge of the circuit board 11 to form an annular shape. The baffle 12 protrudes from the supporting surface, and the baffle 12 and the circuit board 11 together form an encapsulation groove 101.

[0040] The baffle 12 can be connected to the peripheral side of the circuit board 11 or to the support surface. There are no restrictions here, as long as it can form an encapsulation layer together with the power unit.

[0041] The baffle 12 can reflect light. The baffle 12 can reflect light by its own properties, or by using a smooth surface or by spraying or attaching reflective material to the surface. There are no restrictions here.

[0042] The circuit board 11 has multiple spaced soldering positions on its support surface. These soldering positions are all located at the bottom of the encapsulation groove 101. Each soldering position has a light-emitting element 20, which can be soldered to the circuit board 11 to achieve electrical connection with the circuit board 11. The multiple soldering positions can be arranged in an array on the support surface so that the multiple light-emitting elements 20 can also be arranged in an array.

[0043] The light-emitting element 20 can be selected as an LED chip 21, in which case the light panel 100 can be selected as a display panel, which can accurately display the required image or text information. The display module formed by splicing the display panels can be more suitable for application scenarios that require frequent disassembly and assembly, such as stages, photography studios, rentals, etc.

[0044] Specifically, the circuit board 11 has several pads 111 on the soldering area. The pads 111 are made of conventional conductive electrode materials, such as copper, nickel, gold, silver, etc. Each soldering area has two pads 111, namely a positive pad 111 and a negative pad 111. The LED chip 21 has two electrodes below it, positive and negative. The electrodes are made of materials with good conductivity, such as gold, tin, etc. During processing, the positive electrode of the LED chip 21 can be soldered to the positive pad 111 and the negative electrode can be soldered to the negative pad 111 to realize the electrical connection between the LED chip 21 and the circuit board 11.

[0045] In other embodiments, the light-emitting element 20 may also be an LED chip, in which case the light panel 100 may only be used as a light source.

[0046] like Figure 4 As shown, the encapsulating colloid 30 is filled in the encapsulation groove 101. The hardness of the encapsulating colloid 30 is less than that of the baffle 12. The material of the encapsulating colloid 30 can be epoxy resin. The encapsulating colloid 30 can be used to protect the light-emitting element 20 and the circuit on the circuit board 11, and can further diffuse the light emitted by the light-emitting element 20 evenly.

[0047] During the processing of the lamp board 100, the baffle 12 has already been processed on its substrate 10. First, the light-emitting element 20 is soldered onto the pad 111 in the soldering area. Then, a layer of epoxy resin is molded in the encapsulation groove 101 using a molding machine with a vacuum chamber and heating function. This epoxy resin can wrap the outer surface of all the light-emitting elements 20 on the circuit board 11, the electrodes of the light-emitting elements 20, the pad 111 and the circuit on the circuit board 11, and finally cure to form an encapsulating colloid 30. Finally, the process edge of the lamp board 100 is cut off according to the design requirements. This process edge is located on the baffle 12. After the process edge is cut off, the thickness of the baffle 12 is reduced, and finally the finished lamp board 100 that can be directly spliced ​​and assembled is obtained.

[0048] The light panel 100 is protected by a baffle 12 that surrounds the sides of the encapsulating colloid 30. During cutting, only the baffle 12 is cut, without contacting the encapsulating colloid 30. Even after cutting, the sides of the encapsulating colloid layer remain encapsulated by the baffle 12, thus protecting the encapsulating colloid 30 from direct exposure. The baffle 12 is harder than the encapsulating colloid 30, making it less susceptible to damage during assembly and disassembly, thus improving the reliability and protective performance of the light panel 100. Furthermore, the baffle 12 reflects light, directing light emitted from the light-emitting elements 20 around the periphery of the light panel 100 back into the light panel 100. This reduces or prevents light leakage around the light panel 100 caused by refraction from the sides of the encapsulating colloid 30, thereby reducing or eliminating bright lines at the seams of the light panel 100. This facilitates a smaller pixel pitch in the resulting display module, leading to a higher resolution display.

[0049] like Figure 2 As shown, in one embodiment, the baffle 12 is integrally formed with the circuit board 11 to facilitate the processing of the substrate 10.

[0050] like Figure 2 As shown, in one embodiment, the light-emitting element 20 has a top surface, the orientation of which is the same as that of the support surface. The baffle 12 protrudes from the support surface at a greater height than the top surface of the light-emitting element 20 protrudes from the support surface, so that when the encapsulating colloid 30 is filled into the encapsulation groove 101 in a molten state, it can cover the top surface of the light-emitting element 20 to protect the top surface of the light-emitting element 20 and to uniformly diffuse the light emitted from the top surface of the light-emitting element 20.

[0051] In one embodiment, the thickness of the encapsulating colloid 30 is less than or equal to the height of the baffle 12 protruding from the support surface. This prevents the encapsulating colloid 30 from overflowing the encapsulation groove 101, contaminating the side of the lamp board 100, and causing waste. When processing the substrate 10, the baffle 12 can be set to the same height as the design requirements for the thickness of the encapsulating colloid 30. In this case, the height of the baffle 12 can also be used as a reference for filling the encapsulating colloid 30.

[0052] In the illustrated embodiment, the height of the encapsulating colloid 30 can be selected as 200um-300um to ensure that it is higher than the top surface of the light-emitting element 20 while being flush with or lower than the baffle 12. The baffle 12 has a first side facing the light-emitting element 20 and a second side facing away from the light-emitting element 20, and the thickness direction of the baffle 12 is from the first side to the second side. Before the cutting process edge, the thickness of the baffle 12 can be selected as 100um-150um. At this thickness, the process edge can be included, and the baffle 12 can be guaranteed to maintain sufficient structural strength during the cutting process to avoid damage. After the lamp panel 100 is cut, the thickness of the baffle 12 is 50um-75um. At this thickness, black lines can be avoided at the splicing seam between adjacent lamp panels 100 in the spliced ​​display module.

[0053] like Figure 2 As shown, furthermore, the upper surface of the encapsulating colloid 30 is flush with the upper surface of the baffle 12 to improve the flatness of the surface of the lamp board 100 and the surface of the spliced ​​display module, thereby improving the overall aesthetics.

[0054] like Figure 2 As shown, in one embodiment, the first side is parallel to the second side to facilitate processing. The first side may be a smooth surface to reflect light off the baffle 12.

[0055] Optionally, the first side is perpendicular to the support surface, so that the first side can reflect the light that the light source 20 is horizontally directed towards the baffle 12 back horizontally, thus avoiding excessive reflected light from affecting the clarity of the image on the display panel due to light exiting to the support surface or outside.

[0056] Optionally, the substrate 10 has an outer peripheral surface surrounding the support surface, which is flush with the second side surface to improve the aesthetics of the lamp panel 100.

[0057] In one embodiment, the baffle 12 has a smooth surface formed on the first side to reflect light, thereby reducing the impact on the display screen.

[0058] like Figure 4 As shown, in one embodiment, depending on different process and product specifications, a film layer 40 can be formed on the upper surface of the encapsulated colloid 30. This film layer 40 is black to achieve a black finish on the surface of the lamp board 100. The film layer 40 can be a black coating sprayed onto the upper surface of the encapsulated colloid 30, a black adhesive film adhered to the upper surface of the encapsulated colloid 30, or it can be integrally formed with the encapsulated colloid layer.

[0059] In other embodiments, the black agent can be directly added to the encapsulating colloid 30 without setting the film layer 40. Of course, the lamp board 100 can also be left untreated and the encapsulated and cut lamp board 100 can be used directly as the finished product.

[0060] The above are merely preferred embodiments of the present utility model, and only specifically describe the technical principles of the present utility model. These descriptions are only for explaining the principles of the present utility model and should not be construed as limiting the scope of protection of the present utility model in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model, as well as other specific embodiments of the present utility model that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present utility model.

Claims

1. A light panel, characterized in that, include: The substrate includes a circuit board and a baffle. The circuit board has a support surface and a plurality of spaced soldering positions are provided on the support surface. The baffle is disposed around the edge of the circuit board and protrudes from the support surface. The baffle and the circuit board together form an encapsulation groove. The baffle is capable of reflecting light. Multiple light-emitting elements, each of which is disposed on one of the welding positions; An encapsulating colloid is filled into the encapsulation groove, and the hardness of the encapsulating colloid is less than the hardness of the baffle.

2. The lamp panel as described in claim 1, characterized in that, The baffle is integrally formed with the circuit board.

3. The lamp panel as described in claim 1, characterized in that, The height of the baffle protruding from the support surface is greater than the height of the top surface of the light-emitting element protruding from the support surface, and the encapsulating colloid covers the top surface of the light-emitting element.

4. The lamp panel as described in claim 3, characterized in that, The thickness of the encapsulating colloid is less than or equal to the height of the baffle protruding from the supporting surface.

5. The lamp panel as described in claim 1, characterized in that, The baffle has a first side facing the light-emitting element and a second side facing away from the light-emitting element, wherein the first side is parallel to the second side.

6. The lamp panel as described in claim 5, characterized in that, The first side is perpendicular to the support surface.

7. The lamp panel as described in claim 6, characterized in that, The thickness of the baffle in the direction from the first side to the second side is 50um-75um.

8. The lamp panel as described in claim 7, characterized in that, The circuit board has an outer peripheral surface surrounding the support surface, and the outer peripheral surface is flush with the second side surface.

9. The lamp panel as described in claim 1, characterized in that, The light panel also includes a film layer covering the upper surface of the encapsulating colloid, the film layer being black.

10. A display module, characterized in that, It includes a plurality of light panels as described in any one of claims 1 to 9, wherein the edges of the plurality of light panels are joined together.

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