Split type cold disc

Abstract

The utility model provides a split type cold disc, which relates to the technical field of etching and comprises a mounting plate, an insulating plate and a cold disc which are sequentially arranged above a base from bottom to top and are fixed through metal bolts penetrating through insulating sleeves. The mounting plate is a grounded metal mounting plate, and the outer side of the insulating plate is sleeved with a gas uniformizing disc; the outer side of the cooling disc is sleeved with an edge ring higher than the surface of the cooling disc, a cooling runner is arranged in the cooling disc, the middle of the bottom surface is connected with the upper end of the RF power line, and the bottom surface is further provided with a cooling inlet-outlet communicated with the cooling runner; pINs are evenly distributed on the top of the base in the circumferential direction, and the upper ends of the PINs sequentially penetrate through the mounting plate, the insulating plate and the cold disc and extend out of the surface of the cold disc. The cold disc, the insulating plate and the mounting plate are combined, so that disassembly and replacement are convenient, and the maintenance efficiency is improved; the height of the edge ring on the outer side of the cold disc is slightly higher than that of the cold disc, so that when the wafer is cooled, only the edge falls on the edge ring, the wafer is cooled more uniformly, and the subsequent process effect can be ensured.

Description

Technical Field

[0001] This utility model relates to the field of etching technology, and in particular to a split-type cold plate. Background Technology

[0002] Etching is a crucial step in semiconductor manufacturing, microelectronics IC manufacturing, and micro / nano manufacturing processes. It is a primary patterning process associated with photolithography. Etching is essentially photolithographic etching; first, photoresist is exposed to light using photolithography, and then other methods are used to etch away the unwanted portions. Etching is a process that selectively removes unwanted material from the surface of a silicon wafer using chemical or physical methods. Its fundamental goal is to accurately replicate the mask pattern on the coated silicon wafer.

[0003] The stage is an important component within the etching chamber, used for receiving and placing the wafer. It can also provide cooling and heating functions according to process requirements, and can ionize process gases.

[0004] Currently, existing wafer stages are typically integrated units. When internal components of the stage are damaged, they need to be sent to the manufacturer, who then disassembles the outer protective shell to replace and repair the components, which is extremely cumbersome. Furthermore, the conventional cooling method involves placing the wafer directly on the cold pad. However, because the flatness of the cold pad is difficult to achieve perfectly, the wafer is unlikely to adhere completely to the cold pad. This results in poor cooling in the areas where the wafer is not in contact, leading to uneven cooling and affecting process performance. Utility Model Content

[0005] To address the aforementioned problems, this utility model discloses a split-type cold plate.

[0006] The specific plan is as follows:

[0007] A split-type cold plate, characterized in that it comprises a mounting plate, an insulating plate, and a cold plate arranged sequentially from bottom to top above a base, wherein the mounting plate, insulating plate, and cold plate are fixed by metal bolts with insulating sleeves; the mounting plate is a grounded metal mounting plate, the bottom surface of which is connected to a cylinder; a gas distribution plate is sleeved on the outer side of the insulating plate; an edge ring higher than its surface is sleeved on the outer side of the cold plate; a cooling channel is provided inside the cold plate; the upper end of an RF power line is connected to the middle of the bottom surface of the cold plate; a cooling inlet and outlet communicating with the cooling channel is also provided on the bottom surface of the cold plate; pins are evenly distributed along the circumference of the top of the base, the upper ends of the pins sequentially passing through the mounting plate, insulating plate, and cold plate, and protruding from the surface of the cold plate.

[0008] Furthermore, the insulating sleeve is inserted into the mounting plate, and a connecting seat is provided on its lower section. The upper section of the connecting seat is threadedly connected to the bottom of the mounting plate, and the lower section is threadedly connected to a protective cover.

[0009] Furthermore, the bottom surface of the gas distribution plate is evenly distributed with air holes.

[0010] Furthermore, the bottom surface of the cold plate is provided with a fixing component.

[0011] Furthermore, the base has a fixed seat at its bottom, and the middle part of the lifting end plate of the cylinder is fixedly connected to the middle part of the bottom surface of the mounting plate through a connecting cylinder. The connecting cylinder passes through the middle of the fixed seat and the base, and a corrugated pipe is provided between the mounting plate and the fixed seat.

[0012] The beneficial effects of this invention are as follows: the structure is novel and unique, and the combination of cold plate, insulating plate and mounting plate can be easily disassembled and replaced, improving maintenance efficiency; the height of the outer edge ring of the cold plate is slightly higher than that of the cold plate, so that when the wafer is cooled, only the edge falls on the edge ring. Therefore, the flatness requirement of the edge ring does not need to be very high. Even if the flatness of the edge ring is very low, it will only cause poor edge processing effect of the wafer. The wafer will be trimmed in subsequent processes, so that the wafer not only cools more uniformly, but also ensures the effect of subsequent processes. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of this application.

[0014] Figure 2 This is a cross-sectional view of the present application. Figure 1 .

[0015] Figure 3 This is a cross-sectional view of the present application. Figure 2 .

[0016] List of reference numerals in the attached diagram:

[0017] 1-Base, 2-Mounting plate, 3-Insulating plate, 4-Cold plate, 5-Insulating sleeve, 6-Cylinder, 7-Gas distribution plate, 8-Edge ring, 9-Cooling channel, 10-RF power cable, 11-Cooling inlet and outlet, 12-PIN pin, 13-Connector, 14-Protective cover, 15-Fixing base, 16-Bellpipe, 17-Fixing component. Detailed Implementation

[0018] The present invention will be further illustrated below with reference to the accompanying drawings and specific embodiments. It should be understood that the following specific embodiments are for illustrative purposes only and are not intended to limit the scope of the invention.

[0019] As shown in the figure, this application provides a split-type cold plate, including a mounting plate 2, an insulating plate 3, and a cold plate 4 arranged sequentially above a base 1 from bottom to top. The mounting plate 2, the insulating plate 3, and the cold plate 4 are fixed by metal bolts (not shown) through which insulating sleeves 5 are inserted. The mounting plate 2 is a grounded metal mounting plate, and its bottom surface is connected to the cylinder 6. The insulating plate 3 is used to prevent the RF power of the cold plate from being conducted away and unable to ignite. A gas equalization plate 7 is sleeved on its outer side. An edge ring 8 higher than its surface is sleeved on the outer side of the cold plate 4. A cooling channel 9 is provided inside the cold plate 4. The upper end of the RF power line 10 is connected to the middle of the bottom surface of the cold plate 4. A cooling inlet and outlet 11 communicating with the cooling channel 9 is also provided on the bottom surface of the cold plate 4. PIN pins 12 are evenly distributed along the circumference on the top of the base 1. The upper ends of the PIN pins 12 pass through the mounting plate 2, the insulating plate 3, and the cold plate 4 in sequence and protrude from the surface of the cold plate 4. During cooling, the wafer is placed on the cold plate 4. Cooling medium is introduced through the cooling inlet and outlet 11 and flows into the cooling channel 9 inside the cold plate 4. Process gas is present between the wafer and the cold plate 4, serving as the heat transfer medium for the cold plate 4, thereby achieving more uniform cooling of the wafer on the cold plate 4. Those skilled in the art can also replace the cold plate 4 with a hot plate and the cooling channel 9 with a heating wire to achieve the heating function.

[0020] In this embodiment, the insulating sleeve 5 is inserted into the mounting plate 2, and a connecting seat 13 is provided on its lower section. The upper section of the connecting seat 13 is threaded to the bottom of the mounting plate 2, and the lower section is threaded to a protective cover 14. The mounting plate 2 has stepped holes, and the insulating sleeve 5 has a hollow inverted T-shaped structure. The insulating sleeve 5 can prevent the metal bolts from being electrically connected to the cold plate 4, thus conducting away the RF power of the cold plate 4. The protective cover 14 can prevent the metal bolts from being etched during the etching process.

[0021] In this embodiment, the bottom surface of the air distribution plate 7 is evenly distributed with air holes, which can make the air extraction more uniform.

[0022] In this embodiment, the bottom surface of the cold plate 4 is provided with a fixing member 17, which can fix the cooling inlet and outlet 11.

[0023] In this embodiment, a fixed seat 15 is provided at the bottom of the base 1. The middle part of the lifting end plate of the cylinder 6 is fixedly connected to the middle part of the bottom surface of the mounting plate 2 through a connecting cylinder, and the connecting cylinder passes through the middle of the fixed seat 15 and the base 1. A bellows 16 is provided between the mounting plate 2 and the fixed seat 15. The fixed seat 15 is fixed to the bottom surface of the process chamber, and the bellows 16 expands and contracts during lifting and lowering, which facilitates vacuum sealing.

[0024] The workflow of this application is as follows: A robotic arm delivers the wafer above the cold plate 4. The robotic arm descends, causing the wafer to fall onto the PIN pins 12. A cylinder 6 controls the cold plate 4 to rise, and the edge of the wafer falls onto the edge ring 8. Cooling medium flows to cool the wafer. After the process is completed, the cylinder 6 controls the cold plate 4 to descend, the PIN pins 12 support the wafer, and then the robotic arm removes the wafer. In this embodiment, the cold plate 4 can hold 12-inch wafers. When processing 8-inch wafers, only the smaller edge ring 8 and cold plate 4 need to be replaced. The dimensions of the cold plate 4 and edge ring 8 can be adjusted according to the size of the wafer being processed.

[0025] The technical means disclosed in this invention are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this invention, and these improvements and modifications are also considered within the scope of protection of this invention.

Claims

1. A split-type cold plate, characterized in that, The base (1) includes a mounting plate (2), an insulating plate (3), and a cold plate (4) arranged sequentially from bottom to top above the base (1). The mounting plate (2), the insulating plate (3), and the cold plate (4) are fixed by metal bolts through which insulating sleeves (5) are inserted. The mounting plate (2) is a grounded metal mounting plate, and its bottom surface is connected to the cylinder (6). The insulating plate (3) is fitted with a gas equalization plate (7) on its outer side. The cold plate (4) is fitted with an edge ring (8) higher than its surface. The cold plate (4) is provided with a cooling channel (9) inside. The bottom of the cold plate (4) is connected to the upper end of the RF power line (10). The bottom surface of the cold plate (4) is also provided with a cooling inlet and outlet (11) that communicates with the cooling channel (9). The top of the base (1) is evenly distributed with PIN pins (12) along the circumferential direction. The upper end of the PIN pins (12) passes through the mounting plate (2), the insulating plate (3), and the cold plate (4) in sequence and extends out from the surface of the cold plate (4).

2. A split-type cold plate according to claim 1, characterized in that, The insulating sleeve (5) is inserted into the mounting plate (2), and a connecting seat (13) is provided on its lower section. The upper section of the connecting seat (13) is threadedly connected to the bottom of the mounting plate (2), and the lower section is threadedly connected to a protective cover (14).

3. A split-type cold plate according to claim 1, characterized in that, The bottom surface of the gas distribution plate (7) is evenly distributed with air holes.

4. A split-type cold plate according to claim 1, characterized in that, The bottom surface of the cold plate (4) is provided with a fixing part (17).

5. A split-type cold plate according to claim 1, characterized in that, The base (1) has a fixed seat (15) at its bottom. The middle part of the lifting end plate of the cylinder (6) is fixedly connected to the middle part of the bottom surface of the mounting plate (2) through a connecting tube. The connecting tube passes through the middle part of the fixed seat (15) and the base (1). A corrugated pipe (16) is provided between the mounting plate (2) and the fixed seat (15).

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