Threading sealing structure and atomization device

Abstract

The embodiment of the utility model belongs to the technical field of atomization devices, and relates to a threading sealing structure and an atomization device. The threading sealing structure comprises a PCB (Printed Circuit Board) provided with a threading bulge; the support is provided with a containing groove, and a second through hole is formed in the bottom of the containing groove; at least part of the sealing part is located in the containing groove, the sealing part is provided with a first through hole, the orthographic projection of the first through hole on the support is located in the range of the second through hole, one end of the sealing part abuts against the PCB, the other end of the sealing part abuts against the interior of the containing groove, and the threading protrusion penetrates through the first through hole. The sealing piece is tightly attached to the inner wall of the containing groove and the PCB. At the moment, the threading protrusion is located in the first through hole, equivalently, the sealing piece surrounds the threading protrusion and seals the connecting position of the threading protrusion and the PCB, and even if a plurality of threading protrusions exist, the assembling step does not need to be added. The other end of the sealing piece abuts against the interior of the containing groove, so that the sealing piece is attached to the groove bottom and the side wall of the containing groove to form a sealing path, and the effect of improving the sealing performance can be achieved.

Description

Technical Field

[0001] This application relates to the field of atomizing device technology, and more specifically, to a threaded sealing structure and an atomizing device. Background Technology

[0002] Existing atomizing devices typically include a PCB board and various internal components connected to the PCB board. The PCB board usually has a wire guide protrusion, on which a wire is mounted. The other end of the wire is connected to internal components such as a battery. To prevent leakage at the location of the wire guide protrusion, it needs to be sealed.

[0003] Existing technologies typically use adhesive to seal the wire-passing protrusions, that is, applying adhesive to the connection between the wire-passing protrusion and the PCB board. In existing technologies, when the PCB board has multiple wire-passing protrusions, multiple applications of adhesive are required. This adhesive sealing method is complex to operate and has low sealing efficiency. Furthermore, in some atomizing devices, maintaining a tight seal is necessary to preserve internal negative pressure and prevent oil leakage from the liquid reservoir. However, the adhesive sealing method in existing technologies has poor sealing performance, easily leading to seal failure and oil leakage, thus affecting the lifespan of the atomizing device. Therefore, existing technologies for sealing wire-passing protrusions suffer from low sealing efficiency and poor sealing performance. Utility Model Content

[0004] To solve the above-mentioned technical problems, the embodiments of this application adopt the following solutions:

[0005] A threaded sealing structure, the threaded sealing structure comprising:

[0006] PCB board, wherein the PCB board is provided with wire protrusions;

[0007] The bracket is provided with a receiving groove, and a second through hole is provided at the bottom of the receiving groove;

[0008] The sealing element, at least a portion of which is located within the receiving groove, has a first through hole. The first through hole is projected onto the bracket within the range of a second through hole. One end of the sealing element abuts against the PCB board, and the other end abuts against the receiving groove. The wire protrusion passes through the first through hole.

[0009] Furthermore, the PCB board is connected to the bracket and presses the sealing member toward the bottom of the receiving groove. The sealing member is an elastic member and is interference-fitted with the receiving groove.

[0010] Furthermore, the sealing element is interference-fitted with the PCB board, and a first sealing ring is provided on the side facing the PCB board. The first sealing ring abuts against the PCB board, and the wire protrusion is located inside the first sealing ring.

[0011] Furthermore, a second sealing ring is provided on the side of the sealing element facing the bottom of the receiving groove.

[0012] Furthermore, a third sealing ring is provided on the side wall of the sealing element, the third sealing ring abutting against the inner side wall of the receiving groove and being interference-fitted with the receiving groove.

[0013] Furthermore, the bracket is provided with a receiving protrusion, and the receiving groove is provided on the side of the receiving protrusion facing the PCB board;

[0014] The sealing element includes a sealing part and a mounting part connected to each other. The sealing part is located in the receiving groove. The mounting part includes a first sub-mounting part and ribs located on both sides of the first sub-mounting part. The ribs and the sealing part define a snap-fit ​​gap, and the receiving protruding sidewall is snapped into the snap-fit ​​gap.

[0015] Accordingly, this application also provides an atomizing device, which includes the threaded sealing structure described in any one of the above embodiments.

[0016] Furthermore, the atomizing device also includes a microphone kit and a microphone, the microphone being mounted on the PCB board, and the microphone kit being fitted onto the microphone to seal the microphone, the sealing element being integrally formed with the microphone kit.

[0017] Furthermore, the microphone assembly is provided with a first positioning hole, which is located at the connection between the seal and the microphone assembly, and a second positioning hole is provided at the end of the seal away from the microphone assembly;

[0018] The bracket is provided with a first positioning post and a second positioning post, and the first positioning hole and the second positioning post are respectively inserted into the first positioning hole and the second positioning hole.

[0019] Furthermore, the atomizing device also includes a battery and a battery wire, the battery wire passing through the second through hole, one end of which is connected to the wire protrusion, and the other end of which is soldered to the battery.

[0020] Compared with the prior art, the embodiments of this application have the following main advantages:

[0021] Because one end of the seal abuts against the PCB board and the other end abuts against the receiving groove, the seal fits tightly against the inner wall of the receiving groove and the PCB board. At this time, the wire-passing protrusion is located inside the first through hole, which is equivalent to the seal surrounding the wire-passing protrusion and sealing the connection between the wire-passing protrusion and the PCB board. Even if there are multiple wire-passing protrusions, no additional assembly steps are required. At the same time, because the other end of the seal abuts against the receiving groove, the seal fits against the bottom and side walls of the receiving groove to form an L-shaped sealing path, which can further improve the sealing performance. Attached Figure Description

[0022] To more clearly illustrate the solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the wire-sealing structure and some parts in the atomizing device of this application embodiment;

[0024] Figure 2 yes Figure 1 Enlarged view of point A in the middle;

[0025] Figure 3 This is a cross-sectional view of the wiring structure and battery in the atomizing device according to an embodiment of this application;

[0026] Figure 4 yes Figure 3 Enlarged view of point B in the middle;

[0027] Figure 5a This is a schematic diagram of the microphone kit and seal according to an embodiment of this application;

[0028] Figure 5b This is another structural schematic diagram of the microphone kit and seal according to an embodiment of this application;

[0029] Figure 6a This is a schematic diagram of the structure of a sealing element with a third sealing ring according to an embodiment of this application;

[0030] Figure 6b This is another structural schematic diagram of a sealing element with a third sealing ring according to an embodiment of this application;

[0031] Figure 7a This is a schematic diagram of the structure of a sealing element including a sealing part and a mounting part according to an embodiment of this application;

[0032] Figure 7b This is another structural schematic diagram of a sealing element including a sealing part and a mounting part, according to an embodiment of this application.

[0033] Figure label:

[0034] Screw 10, battery 20, seal 100, second positioning hole 101, first sealing ring 110, second sealing ring 120, third sealing ring 130, first through hole 140, sealing part 150, mounting part 160, first sub-mounting part, rib plate 162, snap-fit ​​gap 170, PCB board 200, wire threading protrusion 210, bracket 300, first positioning post 301, second positioning post 302, receiving protrusion 310, receiving groove 311, second through hole 312, microphone kit 400, first positioning hole 410. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application.

[0036] In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in its actual use or operating state, specifically the orientation shown in the accompanying drawings; while "inner" and "outer" refer to the outline of the device. Furthermore, in the description of this application, the term "comprising" means "including but not limited to". The terms first, second, third, etc., are used merely as illustrative purposes and do not impose numerical requirements or establish a numerical order.

[0037] In this application, "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. A and B can be singular or plural.

[0038] In this application, "at least one" means one or more, and "more than one" means two or more. "At least one," "at least one of the following," or similar expressions refer to any combination of these items, including any combination of single or multiple items. For example, "at least one of a, b, or c," or "at least one of a, b, and c," can both mean: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, and c can be single or multiple.

[0039] Various embodiments of this application may exist in the form of a range; it should be understood that the description in the form of a range is merely for convenience and brevity and should not be construed as a hard limitation on the scope of this application; therefore, it should be considered that the range description has specifically disclosed all possible sub-ranges and single numerical values ​​within that range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub-ranges such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., and single numbers within the range, such as 1, 2, 3, 4, 5, and 6, regardless of the range. Furthermore, whenever a numerical range is referred to herein, it means including any referenced number (fraction or integer) within the referred range.

[0040] Please refer to Figures 1 to 5b This application provides a threading sealing structure, which includes:

[0041] PCB board 200, with wire protrusions 210 provided on the PCB board 200;

[0042] The bracket 300 is provided with a receiving groove 311, and a second through hole 312 is provided at the bottom of the receiving groove 311;

[0043] The seal 100, at least a portion of which is located within the receiving groove 311, has a first through hole 140. The first through hole 140 is projected onto the bracket 300 within the range of the second through hole 312. One end of the seal 100 abuts against the PCB board 200, and the other end abuts against the receiving groove 311. The wire protrusion 210 passes through the first through hole 140.

[0044] In this embodiment, since one end of the sealing member 100 abuts against the PCB board 200 and the other end abuts against the receiving groove 311, the sealing member 100 is subjected to a pre-tightening force, causing it to tightly adhere to the inner wall of the receiving groove 311 and the PCB board 200. At this time, the wire-passing protrusion 210 is located within the first through hole 140, which means that the sealing member 100 surrounds the wire-passing protrusion 210 and seals the connection between the wire-passing protrusion 210 and the PCB board 200; at the same time, since the other end of the sealing member 100 abuts against the receiving groove 311, thus... Figure 4 As shown, the seal 100 fits against the bottom and sidewalls of the receiving groove 311 to form an L-shaped sealing path, which further improves the sealing performance. Finally, since the orthogonal projection of the first through hole 140 onto the bracket 300 is within the range of the second through hole 312, the wire protrusion 210 can pass through the second through hole 312, or the wire passing through the wire protrusion 210 can pass through the second through hole 312, thereby enabling the wire sealing structure to be electrically connected to external devices.

[0045] The assembly steps of the wire-passing sealing structure are as follows: First, insert the sealing element 100 into the receiving groove 311, and then press the PCB board 200 toward the bracket 300 onto the sealing element 100, so that the sealing element 100 abuts against the receiving groove 311 and the PCB board 200, thereby completing the assembly of the wire-passing sealing structure. Even if there are multiple wire-passing protrusions 210, there is no need for repeated assembly. Therefore, the assembly steps are simple and the assembly efficiency is high.

[0046] In summary, the threading sealing structure of this application, through the combination of the sealing element 100 and the receiving groove 311, achieves a sealing effect on the threading protrusion 210, thereby improving the sealing efficiency and sealing performance of the threading sealing structure. It should be understood that the bottom of the receiving groove 311 can be a smooth plane; in this case, the sealing element 100 can smoothly abut against the bottom of the groove, thus avoiding the impact of small gaps caused by protrusions or unevenness on the sealing performance of the threading sealing structure.

[0047] For further details, please refer to... Figures 1 to 3 The PCB board 200 is connected to the bracket 300 and presses the seal 100 toward the bottom of the receiving groove 311. The seal 100 is an elastic element and is interference-fitted with the receiving groove 311.

[0048] In this embodiment, the sealing element 100 is simultaneously clamped by the PCB board 200 and the bracket 300, and is subjected to clamping forces in the vertical direction. Under the action of this force, it acts as an elastic element, capable of deforming to fill the receiving groove 311 and increasing the contact area with the PCB board 200. At this time, even if there are small protrusions or grooves in the PCB board 200 and / or the receiving groove 311, the sealing element 100, as an elastic element, can fill them, thereby improving the sealing performance of the wire-passing sealing structure.

[0049] For further details, please refer to... Figures 3 to 7b The sealing element 100 is interference-fitted with the PCB board 200, and a first sealing ring 110 is provided on the side facing the PCB board 200. The first sealing ring 110 abuts against the PCB board 200, and the wire protrusion 210 is located inside the first sealing ring 110.

[0050] In this embodiment, as Figures 4 to 7b As shown, the seal 100 has at least three shapes. Because the seal 100 is interference-fitted with the PCB board 200, and a first sealing ring 110 is provided on the side facing the PCB board 200, the first sealing ring 110 can deform and improve the sealing performance with the PCB board 200 when the seal 100 is interference-fitted with the PCB board 200.

[0051] For further details, please refer to... Figures 3 to 5b , Figures 6a to 6b A second sealing ring 120 is provided on the side of the sealing element 100 facing the bottom of the receiving groove 311.

[0052] In this embodiment, the second sealing ring 120 can fit tightly against the bottom of the receiving groove 311. By deforming itself, it can effectively improve the sealing performance of the sealing member 100 and the receiving groove 311 when the elastic member and the receiving groove 311 are in an interference fit.

[0053] For further details, please refer to... Figure 6a and Figure 6b The side wall of the seal 100 is provided with a third sealing ring 130, which abuts against the inner side wall of the receiving groove 311 and is interference-fitted with the receiving groove 311.

[0054] In this embodiment, the third sealing ring 130 can fit tightly against the sidewall of the receiving groove 311. Through its own deformation, it effectively improves the sealing performance of the sealing member 100 and the receiving groove 311 when the elastic member and the receiving groove 311 are in an interference fit. It should be understood that when the third sealing ring 130 is present, since the third sealing ring 130 has already improved the sealing performance of the sealing member 100 and the receiving groove 311, the design of the second sealing ring 120 can be omitted, thereby reducing production costs.

[0055] For further details, please refer to... Figures 1-2 , Figures 7a-7b The bracket 300 is provided with a receiving protrusion 310, and a receiving groove 311 is provided on the side of the receiving protrusion 310 facing the PCB board 200;

[0056] The seal 100 includes a sealing part 150 and a mounting part 160 connected to each other. The sealing part 150 is located in the receiving groove 311. The mounting part 160 includes a first sub-mounting part 161 and ribs 162 located on both sides of the first sub-mounting part 161. The ribs 162 and the sealing part 150 define a snap-fit ​​gap 170. The side wall of the receiving protrusion 310 is snapped in the snap-fit ​​gap 170.

[0057] In this embodiment, the first sub-mounting part 161 is fitted against the side of the receiving protrusion 310 facing the PCB board 200. The snap-fit ​​relationship between the snap-fit ​​gap 170 and the sidewall of the receiving protrusion 310 can prevent the seal 100 from shaking, thereby preventing gaps from forming during use and improving the sealing performance of the wire-passing sealing structure. At the same time, when the sidewall of the receiving protrusion 310 is interference-fitted with the snap-fit ​​gap 170, the snap-fit ​​gap 170 can also prevent external substances from entering between the sealing part 150 and the receiving groove 311 through the snap-fit ​​gap 170, thereby further improving the sealing performance of the wire-passing sealing structure.

[0058] For further details, please refer to... Figures 1 to 3The PCB board 200 and the bracket 300 can be connected by screws 10, the length of which can be greater than 3mm. This improves the connection stability between the PCB board 200 and the bracket 300, preventing changes in their spacing from affecting the sealing performance of the seal 100. When the PCB board 200 and the bracket 300 are connected by screws 10, the screws 10 can be evenly distributed around the PCB board 200, resulting in uniform stress distribution across the PCB board 200 and enhancing the stability of the wire-sealing structure.

[0059] Accordingly, please refer to Figures 1 to 4 This application also provides an atomizing device, which includes the threaded sealing structure of any of the above embodiments.

[0060] In this embodiment, since one end of the sealing member 100 abuts against the PCB board 200 and the other end abuts against the receiving groove 311, the sealing member 100 is subjected to a pre-tightening force, causing it to tightly adhere to the inner wall of the receiving groove 311 and the PCB board 200. At this time, the wire-passing protrusion 210 is located within the first through hole 140, which means that the sealing member 100 surrounds the wire-passing protrusion 210 and seals the connection between the wire-passing protrusion 210 and the PCB board 200; at the same time, since the other end of the sealing member 100 abuts against the receiving groove 311, thus... Figure 4 As shown, the seal 100 fits against the bottom and sidewall of the receiving groove 311 to form an L-shaped sealing path, which can further seal the threaded protrusion 210.

[0061] Therefore, the combination of the sealing element 100 and the receiving groove 311 in the atomizing device of this application achieves the sealing effect on the threading protrusion 210, improves the sealing performance and sealing efficiency of the atomizing device, and avoids oil leakage due to negative pressure imbalance in the atomizing device.

[0062] For further details, please refer to... Figures 1 to 3 The atomizing device also includes a microphone kit 400 and a microphone. The microphone is inserted through the PCB board 200, and the microphone kit 400 is fitted onto the microphone to seal the microphone. The sealing element 100 is integrally formed with the microphone kit 400.

[0063] In this embodiment, both the microphone kit 400 and the seal 100 are disposed between the bracket 300 and the PCB board 200, and both require fixation. In this embodiment, the microphone kit 400 and the seal 100 are integrally formed, so during the assembly of the atomizing device, the assembly of both the microphone kit 400 and the seal 100 can be completed in one step, effectively improving the assembly efficiency of the atomizing device. It is understood that since the seal 100 will ultimately abut against the receiving groove 311, the assembly between the seal 100 and the receiving groove 311 can serve to position the microphone kit 400, thereby further improving the assembly efficiency of the atomizing device.

[0064] For further details, please refer to... Figures 1 to 5b The microphone assembly 400 is provided with a first positioning hole 410, which is located at the connection between the seal 100 and the microphone assembly 400. The end of the seal 100 away from the microphone assembly 400 is provided with a second positioning hole 101.

[0065] The bracket 300 is provided with a first positioning post 301 and a second positioning post 302, and the first positioning hole 410 and the second positioning post 302 are respectively inserted into the first positioning hole 410 and the second positioning hole 101.

[0066] In this embodiment, the cooperation of the first positioning hole 410, the second positioning hole 101, the first positioning post 301, and the second positioning post 302 can play a positioning role for the microphone assembly 400 and the sealing member 100, thereby preventing the sealing member 100 and the microphone assembly 400 from shaking before the PCB board 200 presses the sealing member 100 together, thus improving the assembly efficiency of the atomizing device. At the same time, since the first positioning hole 410 is located at the connection between the sealing member 100 and the microphone assembly 400, and the second positioning hole 101 is located at the end of the sealing member 100 away from the microphone assembly 400, the positions of the first positioning hole 410 and the second positioning hole 101 are evenly distributed, and the sealing member 100 is clamped between the two, thereby further improving the uniformity of force on the microphone assembly 400 and the sealing member 100 and preventing the sealing member 100 from slipping off.

[0067] For further details, please refer to... Figures 1 to 3 The atomizing device also includes a battery 20 and a battery wire (not shown in the figure). The battery wire passes through the second through hole 312, with one end connected to the wire protrusion 210 and the other end soldered to the battery 20.

[0068] In this embodiment, since the battery wire passes through the second through hole 312 and one end is connected to the wire protrusion 210, it will not affect the sealing performance of the wire sealing protrusion.

[0069] Obviously, the embodiments described above are only some embodiments of this application, not all embodiments. The accompanying drawings show preferred embodiments of this application, but do not limit the patent scope of this application. This application can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this application's specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the scope of patent protection of this application.

[0070] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, combinations, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A threaded sealing structure, characterized in that, The threaded sealing structure includes: PCB board, wherein the PCB board is provided with wire protrusions; The bracket is provided with a receiving groove, and a second through hole is provided at the bottom of the receiving groove; The sealing element, at least a portion of which is located within the receiving groove, has a first through hole. The first through hole is projected onto the bracket within the range of a second through hole. One end of the sealing element abuts against the PCB board, and the other end abuts against the receiving groove. The wire protrusion passes through the first through hole.

2. The threaded sealing structure according to claim 1, characterized in that, The PCB board is connected to the bracket and presses the sealing member toward the bottom of the receiving groove. The sealing member is an elastic member and is interference-fitted with the receiving groove.

3. The threaded sealing structure according to claim 2, characterized in that, The sealing element is interference-fitted with the PCB board, and a first sealing ring is provided on the side facing the PCB board. The first sealing ring abuts against the PCB board, and the wire protrusion is located inside the first sealing ring.

4. The threaded sealing structure according to claim 2, characterized in that, The sealing element has a second sealing ring on the side facing the bottom of the receiving groove.

5. The threaded sealing structure according to claim 1, characterized in that, The side wall of the seal is provided with a third sealing ring, which abuts against the inner side wall of the receiving groove and is interference-fitted with the receiving groove.

6. The threaded sealing structure according to claim 1, characterized in that, The bracket is provided with a receiving protrusion, and the receiving groove is provided on the side of the receiving protrusion facing the PCB board; The sealing element includes a sealing part and a mounting part connected to each other. The sealing part is located in the receiving groove. The mounting part includes a first sub-mounting part and ribs located on both sides of the first sub-mounting part. The ribs and the sealing part define a snap-fit ​​gap, and the receiving protruding sidewall is snapped into the snap-fit ​​gap.

7. An atomizing device, characterized in that, The atomizing device includes the threaded sealing structure described in any one of claims 1 to 6.

8. The atomizing device according to claim 7, characterized in that, The atomizing device also includes a microphone kit and a microphone. The microphone is inserted through the PCB board, and the microphone kit is fitted onto the microphone to seal the microphone. The sealing element is integrally formed with the microphone kit.

9. The atomizing device according to claim 8, characterized in that, The microphone assembly is provided with a first positioning hole, which is located at the connection between the seal and the microphone assembly. The seal is provided with a second positioning hole at the end away from the microphone assembly. The bracket is provided with a first positioning post and a second positioning post, and the first positioning hole and the second positioning post are respectively inserted into the first positioning hole and the second positioning hole.

10. The atomizing device according to claim 7, characterized in that, The atomizing device also includes a battery and a battery wire, the battery wire being inserted through the second through hole, one end of which is connected to the wire protrusion, and the other end of which is soldered to the battery.

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