Welding tool for circuit board

Abstract

The utility model discloses a welding tool for a circuit board. The welding tool comprises a base, a support, a first pressure applying assembly and a second pressure applying assembly. The base is used for bearing and limiting a substrate of the circuit board. The support is fixedly arranged on the base and located on one side of the base plate. The first pressure applying assembly is arranged on the support and applies pressure to the first connecting column of the circuit board so that the first connecting column and the substrate can be jointly pressed on the base, and the first connecting column is kept to be located at a first preset position of the substrate. The second pressure applying assembly is arranged on the support and applies pressure to a second connecting column of the circuit board so that the second connecting column and the substrate can be jointly pressed on the base, and the second connecting column is kept to be located at a second preset position of the substrate. According to the welding tool, the first connecting column and the second connecting column can be accurately positioned on the substrate of the circuit board, the height difference between the first connecting column and the second connecting column is maintained to reach the expectation, it is easy to guarantee that the first connecting column and the second connecting column can be accurately welded to the substrate, and therefore the reject ratio of the circuit board is reduced.

Description

Technical Field

[0001] The embodiments of this utility model relate to the field of circuit board welding technology, and more specifically, this utility model relates to a welding tool for circuit boards. Background Technology

[0002] With the rapid development of electronic technology, the integration level of electronic devices is constantly increasing, and the manufacturing requirements for circuit boards are becoming increasingly stringent. In the process of manufacturing circuit boards, it is often necessary to solder first connecting posts and second connecting posts onto the circuit board substrate, and use them to connect the substrate to the casing or other components of the electronic device.

[0003] The existing method of mounting the first and second connecting posts onto the circuit board substrate has some shortcomings. After soldering, if the perpendicularity between the first and second connecting posts and the substrate is not up to standard, or if the height difference between the first and second connecting posts after soldering to the substrate does not meet the assembly requirements, then the circuit board will not be able to effectively connect the electronic device's casing or other components to the circuit board via the first and second connecting posts. This situation will render the circuit board with the first and second connecting posts unusable. Utility Model Content

[0004] To address one or more of the technical problems mentioned above, this utility model provides a soldering tool for circuit boards, which can accurately position the first connecting post and the second connecting post on the substrate of the circuit board and maintain the height difference between them as expected. This makes it easy to ensure that the first connecting post and the second connecting post can be accurately soldered to the substrate of the circuit board, thereby reducing the defect rate of the circuit board.

[0005] This utility model embodiment provides a welding tool for welding circuit boards, including:

[0006] A base, which serves to support and limit the circuit board;

[0007] A bracket, which is fixedly mounted on the base and located on one side of the substrate;

[0008] A first pressure-applying component is disposed on the bracket, which applies pressure to the first connecting post of the circuit board to press the first connecting post and the substrate together onto the base, and keeps the first connecting post in a first predetermined position on the substrate.

[0009] A second pressure-applying component, disposed on the bracket, applies pressure to the second connecting post of the circuit board to press the second connecting post and the substrate together onto the base, and to keep the second connecting post in a second predetermined position on the substrate.

[0010] Furthermore, the first pressure-applying assembly includes a first push rod that passes through the bracket and has a first flange, and a first spring that is sleeved on the first push rod and located between the first flange and the bracket, the first spring being used to drive the first push rod to apply pressure to the first connecting post; the second pressure-applying assembly includes a second push rod that passes through the bracket and has a second flange, and a second spring that is sleeved on the second push rod and located between the second flange and the bracket, the second spring being used to drive the second push rod to apply pressure to the second connecting post.

[0011] Furthermore, the first pressure-applying component includes a first handle fixed to one end of the first push rod away from the base, and the second pressure-applying component includes a second handle fixed to one end of the second push rod away from the base.

[0012] Furthermore, the first handle and the second handle are made of plastic or wood.

[0013] Furthermore, the first push rod is provided with a plurality of first heat dissipation holes arranged at intervals along its axial direction, and the second push rod is provided with a plurality of second heat dissipation holes arranged at intervals along its axial direction.

[0014] Furthermore, the base includes a base body and a slot formed on the base body for accommodating and limiting the substrate, the slot having an opening for the substrate to slide into or out of the slot.

[0015] Furthermore, the base also includes a positioning groove disposed on the base body and located within the slot, the positioning groove being used to accommodate and support the connector of the circuit board and to make the connector fit tightly against the substrate, thereby exposing each pin of the connector from the side of the substrate facing away from the base body.

[0016] Furthermore, the bracket includes a support plate vertically connected to the base, and a bearing wall vertically connected to the end of the support plate away from the base, the bearing wall having a first through hole and a second through hole through which the first push rod and the second push rod pass in sequence.

[0017] Furthermore, the supporting wall has a clearance notch for the welding torch to pass through.

[0018] Furthermore, the support plate is connected to the base by a first bolt, and the bearing wall is also connected to the support plate by a second bolt.

[0019] This embodiment provides a soldering tool for circuit boards. A first and second pressing component, supported by a bracket, presses a first connecting post, a second connecting post, and a substrate together onto a base, maintaining the first and second connecting posts in a first predetermined position and a second predetermined position on the substrate, respectively. In this way, the first and second connecting posts can be accurately positioned on the circuit board substrate, and their height difference is forced to reach the expected value during the pressing process. This facilitates precise and reliable soldering of the first and second connecting posts onto the circuit board substrate in subsequent processes, reducing the defect rate of the circuit board. Attached Figure Description

[0020] The above and other objects, features, and advantages of the present invention will become readily understood by reading the following detailed description of exemplary embodiments with reference to the accompanying drawings. In the drawings, several embodiments of the present invention are shown by way of example and not limitation, and like or corresponding reference numerals denote like or corresponding parts, wherein:

[0021] Figure 1 This illustration shows a soldering tool for circuit boards provided in an embodiment of the present invention, as well as a structural schematic diagram of the circuit board involved in the embodiment of the present invention.

[0022] Figure 2 A schematic diagram of the structure of a soldering tool for circuit boards provided in an embodiment of the present invention is shown.

[0023] In the picture:

[0024] 1. Base; 11. Base body; 111. Slot; 112. Positioning groove;

[0025] 2. Bracket; 21. Support plate; 221. First through hole; 222. Second through hole; 223. Clearance notch; 22. Bearing wall;

[0026] 3. First pressure-applying component; 31. First push rod; 311. First flange; 312. First heat dissipation hole; 32. First spring; 33. First handle;

[0027] 4. Second pressure-applying component; 41. Second push rod; 411. Second flange; 412. Second heat dissipation hole; 42. Second spring; 43. Second handle;

[0028] 100. Circuit board; 101. Substrate; 102. First connecting post; 103. Second connecting post; 104. Connector. Detailed Implementation

[0029] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0030] Figure 1 This illustration shows a soldering tool for a circuit board 100 provided in this embodiment, as well as a structural schematic diagram of the circuit board 100 involved in this embodiment. Figure 1 As shown, this embodiment provides a soldering tool for a circuit board 100, including a base 1, a bracket 2, a first pressure-applying component 3, and a second pressure-applying component 4. The base 1 supports and limits the substrate 101 of the circuit board 100. The bracket 2 is fixedly mounted on the base 1 and located on one side of the substrate 101. The first pressure-applying component 3 is mounted on the bracket 2 and applies pressure to the first connecting post 102 of the circuit board 100 to align the first connecting post 102 with a first predetermined position on the substrate 101 and press them together onto the base 1, maintaining the first connecting post 102 in the first predetermined position on the substrate 101. The second pressure-applying component 4 is mounted on the bracket 2 and applies pressure to the second connecting post 103 of the circuit board 100 to align the second connecting post 103 with a second predetermined position on the substrate 101 and press them together onto the base 1, maintaining the second connecting post 103 in the second predetermined position on the substrate 101.

[0031] The soldering tool for a circuit board 100 provided in this embodiment utilizes a first pressing component 3 and a second pressing component 4, supported by a bracket 2, to press a first connecting post 102, a second connecting post 103, and a substrate 101 together onto a base 1, maintaining the first connecting post 102 and the second connecting post 103 in a first predetermined position and a second predetermined position on the substrate 101, respectively. In this way, the first connecting post 102 and the second connecting post 103 can be accurately positioned on the substrate 101 of the circuit board 100, and the height difference between them is forced to reach the expected value during the pressing process. This facilitates the precise and reliable soldering of the first connecting post 102 and the second connecting post 103 onto the substrate 101 of the circuit board 100 in subsequent processes, and reduces the defect rate of the circuit board 100.

[0032] It should be noted that in this embodiment, the first connecting post 102 and the second connecting post 103 are copper pillars, and both the first connecting post 102 and the second connecting post 103 have internal threaded holes. Bolts are used to pass through the casing or other components of the electronic device and engage with these internal threaded holes to mount the circuit board 100 onto the electronic device. The first predetermined position and the second predetermined position can be any position on the front or back of the substrate 101. In practice, they can be selected on the substrate 101 according to the circuit layout requirements, and their specific positions vary on different substrates 101. However, to facilitate soldering, both the first predetermined position and the second predetermined position have metal connecting pieces, so that the first connecting post 102 and the second connecting post 103 can be safely and accurately soldered onto the corresponding connecting pieces.

[0033] Furthermore, the first pressure-applying assembly 3 includes a first push rod 31 that passes through the bracket 2 and has a first flange 311, and a first spring 32 that is sleeved on the first push rod 31 and located between the first flange 311 and the bracket 2. The first spring 32 is used to drive the first push rod 31 to apply pressure to the first connecting post 102. The second pressure-applying assembly 4 includes a second push rod 41 that passes through the bracket 2 and has a second flange 411, and a second spring 42 that is sleeved on the second push rod 41 and located between the second flange 411 and the bracket 2. The second spring 42 is used to drive the second push rod 41 to apply pressure to the second connecting post 103. The first spring 32 is compressed when the user lifts the first push rod 31 in a direction away from the first connecting post 102. After the user places the substrate 101 and the first connecting post 102, the user releases the first push rod 31. The compressed first spring 32 pushes the first push rod 31 through the first flange 311 to press the first connecting post 102 and the substrate 101 onto the base 1 and continuously applies pressure to the first connecting post 102, holding the first connecting post 102 in a first predetermined position. Since the structure, operation, and function of the second pressure component 4 are basically the same as those of the first pressure component 3, they will not be described in detail here.

[0034] Furthermore, the bottom surface of the first flange 311 of the first push rod 31 can completely cover the top surface of the first connecting post 102, and the bottom surface of the second flange 411 of the second push rod 41 can completely cover the top surface of the second connecting post 103. This ensures that when the first push rod 31 applies pressure to the first connecting post 102, it maintains full contact between the first connecting post 102 and the first predetermined position, which is beneficial to improving the welding quality of the first connecting post 102. Similarly, when the second push rod 41 applies pressure to the second connecting post 103, it can also maintain full contact between the second connecting post 103 and the second predetermined position, thereby improving the welding quality of the second connecting post 103.

[0035] Preferably, the first pressure-applying component 3 includes a first handle 33 fixed to the end of the first push rod 31 away from the base 1, and the second pressure-applying component 4 includes a second handle 43 fixed to the end of the second push rod 41 away from the base 1, so that the user can lift the first push rod 31 of the first pressure-applying component 3 and the second push rod 41 of the second pressure-applying component 4 before and after welding, especially after welding, it can reduce the user from being burned by the first push rod 31 and the second push rod 41 when they are in a high-temperature state.

[0036] Specifically, the first handle 33 has a protrusion along its circumference, and the second handle 43 has a protrusion along its circumference, so that the user can pull the first push rod 31 and the second push rod 41 by pulling the protrusion. Compared with the handle without the protrusion, the handle with the protrusion is easier for the operator to grab or hold.

[0037] In this embodiment, the first handle 33 and the second handle 43 are made of plastic or wood to better isolate the heat of the first push rod 31 and the second push rod 41 under high temperature after welding from being conducted to the user, thereby preventing the user from directly contacting the first push rod 31 or the second push rod 41, and thus achieving the purpose of preventing the user from being burned when lifting the first push rod 31 and the second push rod 41.

[0038] Preferably, the first push rod 31 is provided with a plurality of first heat dissipation holes 312 arranged at intervals along its axial direction, and the second push rod 41 is provided with a plurality of second heat dissipation holes 412 arranged at intervals along its axial direction, so as to increase the surface area of ​​the first push rod 31 and the second push rod 41, thereby increasing the effective heat dissipation area of ​​the first push rod 31 and the second push rod 41, and thus improving the heat dissipation effect of the first push rod 31 and the second push rod 41.

[0039] Figure 2 A schematic diagram of a soldering tool for a circuit board 100 provided in this embodiment is shown. Figure 2 and combined Figure 1 As shown, the base 1 includes a base body 11 and a slot 111 formed on the base body 11 for accommodating and limiting the substrate 101. The slot 111 has an opening for the substrate 101 to slide into or out of the slot 111. When the substrate 101 slides into the slot 111, the sidewalls and bottom surface of the slot 111 can hold the substrate 101 in place to quickly position and limit the substrate 101. The method of accommodating and limiting the substrate 101 using the slot 111 not only stably limits the substrate 101 on the base body 11, but also quickly positions the substrate 101 while limiting it. Compared with the opening and closing clamping type limiting structure, the slot 111 can achieve both quick positioning and limiting, and is also easier to process, resulting in lower processing costs.

[0040] Furthermore, the base 1 also includes a positioning groove 112 disposed on the base body 11 and located within the slot 111. The positioning groove 112 is used to accommodate and support the connector 104 (e.g., a wire-to-board connector or a board-to-board connector) of the circuit board 100 and to make the connector 104 adhere to the substrate 101, thereby exposing each pin of the connector 104 from the side of the substrate 101 facing away from the base body 11. Since each pin of the connector 104 is pre-mounted on the substrate 101 before insertion (i.e., the connector 104 can only move away from the substrate 101 in the vertical direction), after the connector 104 is inserted into the positioning groove 112, the positioning groove 112 restricts the movement of the connector 104 of the circuit board 100 in the vertical direction, thereby realizing the accommodation and positioning of the connector 104. Furthermore, the method of using the positioning groove 112 for accommodating and limiting not only stably limits the connector 104 on the base body 11, but also enables the connector 104 to be quickly positioned when placed into the positioning groove 112. In addition, the positioning groove 112 is easier to process and has a lower processing cost.

[0041] Furthermore, the bracket 2 includes a support plate 21 perpendicularly connected to the base 1, and a bearing wall 22 perpendicularly connected to the end of the support plate 21 away from the base 1. The bearing wall 22 has a first through hole 221 and a second through hole 222 through which the first push rod 31 and the second push rod 41 pass in sequence. The first through hole 221 provides movement space for the first push rod 31, and its edge also provides a connection position for the first spring 32. The second through hole 222 provides movement space for the second push rod 41, and its edge also provides a connection position for the second spring 42. The support plate 21 provides support for the bearing wall 22 perpendicularly connected to it, ensuring the stability of the bearing wall 22.

[0042] Furthermore, the support wall 22 has a clearance notch 223 for the welding torch to pass through, so that the user can use the welding torch to weld the first connecting post 102 and the second connecting post 103 onto the substrate 101.

[0043] In this embodiment, the support plate 21 is connected to the base 1 by a first bolt, and the bearing wall 22 is also connected to the support plate 21 by a second bolt, so that the base 1, the support plate 21 and the bearing wall 22 can maintain good stability when they are connected together, and can be disassembled and reassembled when not in use to store the base 1, the support plate 21 and the bearing wall 22, thereby saving the user's operating space.

[0044] In the foregoing description of this application, unless otherwise expressly specified and limited, the terms "fixed," "installed," "connected," or "linked" should be interpreted broadly. For example, the term "linked" can refer to a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; or it can refer to the internal communication of two components or the interaction between two components. Therefore, unless otherwise expressly limited in this application, those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0045] Based on the above description of this application, those skilled in the art will also understand that terms used, such as “upper,” “inner,” “top,” “bottom,” “axial,” or “circumferential,” which indicate orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings of this application. They are only for the purpose of facilitating the explanation of the present invention and simplifying the description, and do not explicitly or implicitly suggest that the device or element involved must have the specific orientation, or be constructed and operated in the specific orientation. Therefore, the above-mentioned orientation or positional relationship terms cannot be understood or interpreted as a limitation on the present invention.

[0046] Furthermore, the terms "first" or "second," etc., used in this application to refer to numbers or ordinal numbers are for descriptive purposes only and should not be construed as explicitly or implicitly indicating relative importance or specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, or more, unless otherwise explicitly specified.

[0047] While various embodiments of the present invention have been shown and described herein, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Many modifications, alterations, and alternatives will occur to those skilled in the art without departing from the spirit and intent of the present invention. It should be understood that various alternatives to the embodiments of the present invention described herein may be employed in the practice of the present invention. The appended claims are intended to define the scope of protection of the present invention and therefore cover equivalents or alternatives within the scope of these claims.

Claims

1. A soldering tool for circuit boards, characterized in that, include: A base, which serves to support and limit the circuit board; A bracket, which is fixedly mounted on the base and located on one side of the substrate; A first pressure-applying component is disposed on the bracket, which applies pressure to the first connecting post of the circuit board to press the first connecting post and the substrate together onto the base, and keeps the first connecting post in a first predetermined position on the substrate. A second pressure-applying component, disposed on the bracket, applies pressure to the second connecting post of the circuit board to press the second connecting post and the substrate together onto the base, and to keep the second connecting post in a second predetermined position on the substrate.

2. The welding tool according to claim 1, characterized in that, The first pressure-applying assembly includes a first push rod that passes through the bracket and has a first flange, and a first spring that is sleeved on the first push rod and located between the first flange and the bracket. The first spring is used to drive the first push rod to apply pressure to the first connecting post. The second pressure-applying assembly includes a second push rod that passes through the bracket and has a second flange, and a second spring that is sleeved on the second push rod and located between the second flange and the bracket. The second spring is used to drive the second push rod to apply pressure to the second connecting post.

3. The welding tool according to claim 2, characterized in that, The first pressure-applying component includes a first handle fixed to one end of the first push rod away from the base, and the second pressure-applying component includes a second handle fixed to one end of the second push rod away from the base.

4. The welding tool according to claim 3, characterized in that, The first handle and the second handle are made of plastic or wood.

5. The welding tool according to claim 2, characterized in that, The first push rod is provided with a plurality of first heat dissipation holes arranged at intervals along its axial direction, and the second push rod is provided with a plurality of second heat dissipation holes arranged at intervals along its axial direction.

6. The welding tool according to claim 1, characterized in that, The base includes a base body and a slot formed on the base body for accommodating and limiting the substrate. The slot has an opening for the substrate to slide into or out of the slot.

7. The welding tool according to claim 6, characterized in that, The base also includes a positioning groove disposed on the base body and located within the slot. The positioning groove is used to accommodate and support the connector of the circuit board and to make the connector fit tightly against the substrate, thereby exposing each pin of the connector from the side of the substrate facing away from the base body.

8. The welding tool according to claim 2, characterized in that, The bracket includes a support plate perpendicularly connected to the base, and a bearing wall perpendicularly connected to the end of the support plate away from the base, the bearing wall having a first through hole and a second through hole through which the first push rod and the second push rod pass in sequence.

9. The welding tool according to claim 8, characterized in that, The supporting wall has a clearance opening for the welding torch to pass through.

10. The welding tool according to claim 8, characterized in that, The support plate is connected to the base by a first bolt, and the bearing wall is connected to the support plate by a second bolt.

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