High-temperature-resistant upper cover plate for printed circuit board

Abstract

The utility model discloses a high-temperature-resistant upper cover plate for a printed circuit board, which belongs to the technical field of cover plates and comprises a cover frame, a plurality of supporting blocks are fixedly arranged in the cover frame, a ceramic heat insulation plate is arranged on the supporting blocks, a top metal plate is fixedly arranged on the cover frame, and the top metal plate is arranged on the top of the cover frame. The space between the top metal plate and the ceramic heat insulation plate is a heat insulation cavity; according to the utility model, the ceramic heat insulation plate is arranged, the plurality of supporting blocks are used for bearing the ceramic heat insulation plate, so that the ceramic heat insulation plate is stably placed, the ceramic heat insulation plate effectively prevents external heat from being conducted to the circuit board by utilizing the characteristic of low heat conductivity, the influence caused by heat conduction is greatly reduced, and the top metal plate not only can bear external mechanical impact, but also can bear external heat; the internal structure and the circuit board are protected, part of absorbed heat can be dissipated to the outside due to the heat radiation characteristic, heat transmitted to the heat insulation cavity and the circuit board is reduced, air in the heat insulation cavity serves as a poor conductor of heat, heat convection is limited, and heat is further prevented from being transmitted to the circuit board.

Description

Technical Field

[0001] This utility model belongs to the field of cover plate technology, specifically relating to a high-temperature resistant cover plate for printed circuit boards. Background Technology

[0002] With the rapid development of modern electronic technology, printed circuit boards (PCBs) are increasingly used in various high-temperature environments, such as aerospace, industrial automation, and automotive electronics. Under these high-temperature conditions, PCBs face severe thermal challenges; high temperatures can lead to performance degradation, component damage, or even system failure.

[0003] Traditional printed circuit board (PCB) protective covers often use only a single material or a simple structure, making it difficult to effectively cope with high-temperature environments. For example, some ordinary plastic covers are prone to softening and deformation at high temperatures, rendering them unable to provide reliable physical protection and heat insulation for the PCB. Although metal covers have good strength, in high-temperature environments, heat transfer mainly occurs through three methods: heat conduction, heat convection, and heat radiation. For PCB covers, heat conduction is the primary heat transfer pathway, and the high thermal conductivity of metal may directly expose the PCB to the effects of high external temperatures. To overcome the shortcomings of traditional covers, a high-temperature resistant PCB cover is needed to address these issues. Utility Model Content

[0004] The purpose of this invention is to provide a high-temperature resistant top cover for printed circuit boards to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a high-temperature resistant top cover for printed circuit boards, comprising a cover frame, wherein a plurality of support blocks are fixedly disposed within the cover frame, and ceramic heat insulation plates are disposed on the plurality of support blocks, and a top metal plate is fixedly disposed on the cover frame, wherein the space between the top metal plate and the ceramic heat insulation plates is a heat insulation cavity.

[0006] By incorporating a ceramic heat insulation plate, supported by multiple brackets, the plate is placed securely. The ceramic heat insulation plate, with its low thermal conductivity, effectively blocks external heat from being conducted to the circuit board, significantly reducing the impact of heat conduction. The top metal plate not only withstands external mechanical impacts, protecting the internal structure and circuit board, but its thermal radiation properties also dissipate some of the absorbed heat to the outside, reducing the heat transferred to the insulation cavity and circuit board. The air inside the insulation cavity, as a poor conductor of heat, restricts heat convection, further preventing heat transfer to the circuit board. This top cover structure, consisting of a cover frame, brackets, a ceramic heat insulation plate, a top metal plate, and an insulation cavity, through the synergistic effect of a three-layer heat-resistant design, greatly improves the stability of the printed circuit board in high-temperature environments. It effectively avoids performance degradation and component damage caused by high temperatures, ensuring the reliable operation of electronic systems under high-temperature conditions.

[0007] In a preferred embodiment, two connecting plates are fixedly provided on both the front and back of the cover frame.

[0008] In a preferred embodiment, the cover frame has multiple slots, which are connected to the heat insulation cavity.

[0009] In a preferred embodiment, the lower surface of the top metal plate is inserted into a positioning slot on the cover frame via four positioning blocks.

[0010] In a preferred embodiment, multiple fixing blocks are fixedly provided on both sides of the cover frame, and each fixing block is located at the edge of one of the slots on one side.

[0011] In a preferred embodiment, each of the fixing blocks is bolted to the extension of the corresponding positioning block.

[0012] The multiple slots on the cover frame play a crucial role. On one hand, the slots connect with the insulation, allowing the air inside the insulation cavity to exchange with the external environment to a certain extent. In high-temperature environments, the heat absorbed by the air inside the insulation cavity can be dissipated through this connection, further optimizing the heat dissipation effect and effectively preventing heat accumulation inside the insulation cavity, thus ensuring the insulation performance of the insulation cavity. On the other hand, the lower surface of the top metal plate is inserted into the positioning slots on the cover frame through four positioning blocks. This design ensures the accuracy and stability of the installation position of the top metal plate.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This invention utilizes a ceramic heat insulation plate supported by multiple brackets to ensure its stable placement. The ceramic heat insulation plate, with its low thermal conductivity, effectively blocks external heat from being conducted to the circuit board, significantly reducing the impact of heat conduction. The top metal plate not only withstands external mechanical impacts, protecting the internal structure and circuit board, but its thermal radiation properties also dissipate some of the absorbed heat to the outside, reducing the heat transferred to the insulation cavity and circuit board. The air inside the insulation cavity, as a poor conductor of heat, restricts heat convection, further preventing heat transfer to the circuit board. This top cover structure, consisting of a cover frame, brackets, a ceramic heat insulation plate, a top metal plate, and an insulation cavity, through the synergistic effect of a three-layer heat-resistant design, greatly improves the stability of the printed circuit board in high-temperature environments. It effectively avoids performance degradation and component damage caused by high temperatures, ensuring the reliable operation of the electronic system under high-temperature conditions.

[0015] This invention plays a crucial role by providing multiple slots on the cover frame. On one hand, the slots are connected to the insulation, allowing the air inside the insulation cavity to exchange with the external environment to a certain extent. In high-temperature environments, the heat absorbed by the air inside the insulation cavity can be dissipated through this connection, further optimizing the heat dissipation effect and effectively preventing heat accumulation inside the insulation cavity, thus ensuring the insulation performance of the insulation cavity. On the other hand, the lower surface of the top metal plate is inserted into the positioning slots on the cover frame through four positioning blocks. This design ensures the accuracy and stability of the installation position of the top metal plate. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention;

[0017] Figure 2 This is a schematic diagram of the three-dimensional cross-sectional structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the three-dimensional structure of the cover frame of this utility model;

[0019] Figure 4 This is a schematic diagram of the three-dimensional structure of the top metal plate of this utility model;

[0020] Figure 5 This utility model Figure 1 A magnified schematic diagram of the three-dimensional structure at point A in the middle;

[0021] Figure 6 This is a schematic diagram of the three-dimensional structure of the ceramic heat insulation plate of this utility model from a bottom view.

[0022] In the diagram: 1. Cover frame; 2. Support block; 3. Ceramic heat insulation board; 4. Top metal plate; 5. Heat insulation cavity; 6. Connecting plate; 7. Slot; 8. Positioning block; 9. Fixing block; 10. Bolt. Detailed Implementation

[0023] The present invention will be further described below with reference to the embodiments.

[0024] The following embodiments are used to illustrate the present invention, but should not be used to limit the scope of protection of the present invention. The conditions in the embodiments can be further adjusted according to specific conditions, and simple improvements to the method of the present invention under the concept of the present invention are all within the scope of protection claimed by the present invention.

[0025] Please see Figure 1-6 This utility model provides a high-temperature resistant top cover for printed circuit boards, including a cover frame 1. Multiple support blocks 2 are fixedly disposed within the cover frame 1, and ceramic heat insulation plates 3 are disposed on the support blocks 2. A top metal plate 4 is fixedly disposed on the cover frame 1. The space between the top metal plate 4 and the ceramic heat insulation plates 3 is a heat insulation cavity 5. By setting the ceramic heat insulation plates 3, the multiple support blocks 2 support the ceramic heat insulation plates 3, ensuring their stable placement. The ceramic heat insulation plates 3 utilize their low thermal conductivity to effectively block external heat from being conducted to the circuit board, significantly reducing the impact of heat conduction. The top metal plate 4 can withstand external mechanical impacts, protecting the internal components. The thermal radiation characteristics of the internal structure and circuit board can also dissipate some of the absorbed heat to the outside, reducing the heat transferred to the heat insulation cavity 5 and the circuit board. The air in the heat insulation cavity 5, as a poor conductor of heat, restricts heat convection and further prevents heat from being transferred to the circuit board. This top cover structure, consisting of cover frame 1, support block 2, ceramic heat insulation plate 3, top metal plate 4 and heat insulation cavity 5, greatly improves the stability of printed circuit boards in high-temperature environments through the synergistic effect of three-layer heat insulation and heat resistance design. It effectively avoids problems such as performance degradation and component damage caused by high temperature, and ensures the reliable operation of electronic systems under high-temperature conditions.

[0026] Two connecting plates 6 are fixedly installed on both the front and back of the cover frame 1.

[0027] The cover frame 1 has multiple slots 7, which are connected to the heat insulation cavity 5.

[0028] The lower surface of the top metal plate 4 is inserted into the positioning slot 7 on the cover frame 1 by four positioning blocks 8.

[0029] Multiple fixing blocks 9 are fixedly installed on both sides of the cover frame 1, and each fixing block 9 is located on the edge of one of the slots 7 on one side.

[0030] Each fixing block 9 is connected to the extension of the corresponding positioning plug 8 by bolts 10. Multiple slots 7 on the cover frame 1 play a crucial role. Firstly, the slots 7 communicate with the insulation 5, allowing air exchange between the insulation cavity 5 and the external environment. In high-temperature environments, the heat absorbed by the air in the insulation cavity 5 can be dissipated through this connection, further optimizing heat dissipation and effectively preventing heat accumulation within the insulation cavity 5, thus ensuring its insulation performance. Secondly, the lower surface of the top metal plate 4 is inserted into the positioning slots 7 on the cover frame 1 via four positioning plugs 8. This design ensures the accuracy and stability of the top metal plate 4's installation position. Furthermore, the connection of each fixing block 9 to the extension of the corresponding positioning plug 8 by bolts 10 not only further enhances the fixing effect of the top metal plate 4 but also simplifies disassembly when maintenance or replacement is required, improving operational convenience and equipment maintenance efficiency, and ensuring the practicality and flexibility of the entire top cover during use.

[0031] The working principle and usage process of this utility model are as follows: First, prepare a cover frame 1. Fix multiple support blocks 2 inside the cover frame 1 by welding or other means. Place the ceramic heat insulation plate 3 on the support blocks 2 to ensure its stability. Next, set a top metal plate 4 on the cover frame 1. Insert the four positioning blocks 8 on the lower surface of the top metal plate 4 into the positioning slots 7 on the cover frame 1 to achieve initial positioning. The fixing blocks 9 on both sides of the cover frame 1 are located at the edge of the slots 7. Connect the fixing blocks 9 with the extensions of the corresponding positioning blocks 8 by bolts 10 to firmly fix the top metal plate 4. Fix two connecting plates 6 on the front and back of the cover frame 1 by welding or other means for connection with the external structure. The multiple slots 7 opened on the cover frame 1 not only facilitate the installation and positioning of the top metal plate 4, but also allow the heat insulation cavity 5 to communicate with the outside, which helps the air in the heat insulation cavity 5 to dissipate heat. In actual use, when encountering a high temperature environment, the heat first reaches the top metal plate 4, which can withstand a certain high temperature and dissipate heat through thermal radiation. The air in the heat insulation cavity 5 and the ceramic heat insulation plate 3 effectively block the heat transfer to the circuit board.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-temperature resistant top cover for printed circuit boards, comprising a cover frame (1), characterized in that: Multiple support blocks (2) are fixedly installed inside the cover frame (1), and ceramic heat insulation plates (3) are installed on the multiple support blocks (2). A top metal plate (4) is fixedly installed on the cover frame (1), and the space between the top metal plate (4) and the ceramic heat insulation plate (3) is a heat insulation cavity (5).

2. The high-temperature resistant top cover plate for printed circuit boards according to claim 1, characterized in that: Two connecting plates (6) are fixedly installed on both the front and back of the cover frame (1).

3. The high-temperature resistant top cover plate for printed circuit boards according to claim 1, characterized in that: The cover frame (1) has multiple slots (7) which are connected to the heat insulation cavity (5).

4. The high-temperature resistant top cover plate for printed circuit boards according to claim 3, characterized in that: The lower surface of the top metal plate (4) is inserted into the positioning slot (7) on the cover frame (1) by four positioning blocks (8).

5. A high-temperature resistant top cover for a printed circuit board according to claim 4, characterized in that: Multiple fixing blocks (9) are fixedly provided on both sides of the cover frame (1), and each fixing block (9) is located on the edge of one of the slots (7) on one side.

6. A high-temperature resistant top cover for a printed circuit board according to claim 5, characterized in that: Each of the fixing blocks (9) is connected to the extension of the corresponding positioning block (8) by bolts (10).

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